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The basic construction of the n-channel JFET is shown in Fig. 3.1. Note that the major part of
the structure is the n-type material. A channel is formed between the two embedded layers of
p-type, and this channel is of n-type and that’s why the name n-channel JFET.
The JFET has four ohmic contacts. But the physical device has only three terminals as like
BJT.
The top of the n-type channel is connected through an ohmic contact to a terminal referred to
as the Drain (D), whereas the lower end of the same material is connected through an ohmic
contact to a terminal referred as the Source (S). The drain and the source are connected to the
ends of the n-type channel. The two p-type materials are connected together and referred as
Gate (G) terminal.
The JFET device has two p-n junctions at no-bias condition. And thus have two depletion
regions as shown in RED colour of Fig.3.1. As we know the depletion region (in a p-n junction
diode) is depleted of free charge carriers or no free charges are available. So, it will not help in
conduction.
Working of JFET:
The working of JFET can be divided for the purpose of understanding in two-part (i) VGS = 0
and (ii) VGS < 0. But for both these cases VDS > 0.
Fig. 3.2. JFET connected as per case (i) i.e. VGS = 0 and VDS > 0
The Gate to Source terminal is short circuited to ground for achieving VGS = 0 condition
whereas VDS is kept positive. A depletion region will be formed (as in Fig. 3.1) similar to the
Diode in no-bias condition as the voltage is still not applied at any terminals.
The instant the voltage VDD (=VDS) is applied, the electrons are drawn to the drain terminal,
establishing the conventional current ID with the defined direction of Fig. 3.2. The path of
charge flow clearly reveals that the drain and source currents are equivalent (ID = IS). Under
the conditions in Fig. 3.2, the flow of charge is relatively unstoppable and is only limited by
the resistance of the n-channel between drain and source.
However, the depletion layer width will also get affected. At the bottom of the transistor the
width of depletion region will remain same but at the top, it will increase as shown in Fig 3.2.
The reason for such a depletion region is the resistance offered by the n-channel to the flow of
current ID.
This can be understood by considering the n-channel, a combination of resistance (let’s say
four resistances of equal magnitude) connected in series as shown in Fig. 3.3. Also assume that
the Voltage VDS is 2 V. Then the voltage across the channel length will be distributed like 2V,
1.5V, 1.0V, 0.5V and 0. As the potential at the Gate terminal is 0V which means that the p-
Fig. 3.3. Voltage (VDS = 2V) variation across the n-channel JFET
The fact that the p-n junction is reverse-biased for the length of the channel results in a Gate
current of ZERO amperes (IG = 0 A), as shown in the Fig. 3.3. The fact that IG = 0 A is an
important characteristic of the JFET.
As we applied little voltage across Drain to Source, a current ID will start to flow in the n-
channel. With the increase of VDS the current ID will also increases as per Ohm’s Law, but as
the VDS approaches to a voltage level Vp, the current ID will maintain a saturation level defined
as IDSS as shown in Fig. 3.4. It is the maximum drain current of the JFET when VGS = 0.
The term pinch-off is little misleading as it suggests that the current ID is pinched off and drops
to 0 A whereas the current ID maintains a saturation level current (IDSS) and does not drop off
to ZERO as shown in Fig. 3.4. This is due to the existence of a very narrow channel along the
depletion region, with a current of very high density.
This can be understood as the absence of a drain current (ID) would remove the possibility of
different potential levels (i.e. 1.5V, 1.0, 0.5 V, 0V) through the n-channel material to establish
the varying levels of reverse bias along the p–n junction. The result would be a loss of the
depletion region distribution that caused the very pinch-off in the first place.
If we go on increasing VDS, the current ID will not always remain equal to IDSS because the n-
channel will have the breakdown. It means the n-channel will not be able to withstand the high
potential difference across Drain and Source, this large voltage VDSmax causes high drain
current to flow through n-channel, where VDSmax is breakdown voltage of n-channel. It means
ID = IDSS holds true when VP < VDS < VDSmax.
By bringing the drain current in saturation level, does not mean that the ID becomes equal to
IDSS. Because IDSS is the maximum drain current when VGS = 0. And in this case, we are not
putting VGS to zero so, that level of current cannot be achieve. The VDS in this case is less as
compared to case (i), so inorder to make the width of depletion layer same we need to put VGS
negative.
The further explanation of the JFET working is remain the same as in case (i).
But it can be noted that by applying negative bias to the Gate, the saturation level will be reach
at lower level of Drain to Source voltage (VDS)
The base current IB is the input current and a controlling current that controls the output current
IC in CE configuration of BJT. Similarly, the VGS is the controlling voltage that controls the
drain current (ID). In n-channel JFET VGS < 0 and p-channel JFET VGS > 0.
Let us consider we are trying to obtain the Drain Characteristic or Output Characteristic of n-
channel JFET with IDSS = 8 mA and VP = -4V.
For bringing JFET into maximum Drain current i.e. IDSS = 8 mA, VGS must put to Zero and VDS
should be greater than |VP| i.e.
[VGS = 0 and VDS ˃ |VP|]
When VDS = 0 V, then the electron present in n-channel will not be get drifted toward drain
and the current is zero. Now, if we increase VDS, ID will increase linearly and follow the Ohm’s
law upto the point ‘A’ in Fig. 3.7. If we keep on increasing the VDS, the depletion regions will
also increase and after some time it will appear that the two depletion regions touching each
other and when this happens (at point ‘B’) corresponding VGS is known as Pinch-off Voltage
(VP). At this moment the drain current ID will become constant known as IDSS because the
channel will become very narrow.
Now when VGS = -1V, (and VDS ˃ 0 V) it means that the Gate terminal is at negative potential
and so the p-type material connected to negative potential as Gate is connected to p-type
If you are making VGS more and more negative, it means you are applying more negative
potential to the p-type material, and this will increase reverse biasing. When reverse biasing
increases, this implies the width of depletion layer will also increase. So the pinch off will be
achieved at lower value of VGS. It means that making VGS more and more negative will help in
achieving the pinch-off more and more earlier as the two depletion layers will appear to touch
each other at lower VDS voltage.
The above explanation is valid for VGS = -2 V or -3V. For VGS = -4V, which is equal to Pinch-
off Voltage (VP). When you have VGS = VP, there is no need to apply VDS. When VDS is equal
to zero, means that the potential difference across the n-channel is zero even in that case also
the two depletion regions will touch each other. So if you increase VDS there will be no current.
The VP is not a constant quantity rather it depends on the VGS. But in Datasheet, the
manufacturers only provide one value for pinch-off voltage. Why?
Region of JFET
(i) Ohmic Region: In this region the ID is directly proportional to VDS. In the region JFET
behave like a constant resistance. Thus, the n-channel JFET is acting like a linear
device. It is also known as Voltage controlled Resistor Region. In this region JFET can
be used as variable resistor. As the slope (resistor) in this region is a function of
controlling voltage VGS.
𝒓𝟎
𝒓𝒅 = (𝟏)
𝑽𝑮𝑺 𝟐
(𝟏 − 𝑽 )
𝑷
r0 → Resistance at VGS = 0 V
rd → Resistance at particular VGS
Ex: If ro = 10 kΩ (VGS = 0 V, VP = -6 V), At VGS = -3 V, resistance will be ? (40k)
The transfer Characteristic is ID verses VGS plot keeping VDS constant. Transfer curve is
between Output current (ID) and input Voltage (VGS) keeping the output voltage (VDS) constant.
It is important to observe that Drain characteristic relates two output quantity whereas Transfer
Characteristic relates Output quantity with input-controlling quantity.
In BJT the Output Current (IC) is a function of Input current (IB) which is also a controlling
current, IC = f(IB) i.e. IC = βIB. This relationship is linear as β is constant. But in case JFET
there is no linear relationship between the Output current (ID) and controlling voltage or input
voltage VGS. The relationship between ID and VGS is defined by Shockley’s Equation as:
𝑽𝑮𝑺 𝟐
𝑰𝑫 = 𝑰𝑫𝑺𝑺 (𝟏 − ) (𝟐)
𝑽𝑷
The Eq.(2) is non-linear because of the Square term. If VGS is reduced the ID will increase and
that too exponentially. There are two ways to obtain Transfer Characteristic the first is through
Eq(2) and second is by Output Characteristic or Drain Characterise Curve.
SYMBOL
Q: The device parameter of n-channel JFET are: Maxm Drain current (IDSS) = 10 mA and Pinch-
off Voltage (VP) = -4 V. Calculate the drain current for VGS = 0V; -1V; -4V
Q: A JFET produces a Gate current of 2nA when Gate is reverse biased with 8V. Determine
the resistance between Gate and Source.
Q: The Pinch-off voltage for n-channel JFET is 4 V, then Pinch-off occurs for VDS, when VGS
= -1 V is (a) 1V (b) 3 V (c) 4V (d) 5V
MOSFET is another type of Field Effect Transistor. MOSFET is an active device (like BJT,
JFET) because it can amplify the signals or can control the flow of current. Passive Device
examples are Diode, Capacitor, Transformer. MOSFETs are of two types: Depletion type and
Enhancement type.
Depletion type and Enhancement type MOSFET are almost have same type of construction.
The only difference is the existence of channel between Drain and Source. Enhancement type
MOSFET do not have channels from the beginning whereas Depletion type do have.
A slab of p -type material also known as substrate is the foundation of n-channel MOSFET.
Substrate is a material on which a device or sensor is normally constructed/fabricated. The
substrate is denoted or labelled as SS. The two n-type wells are formed on the p-type substrate.
The one n-type-well through metal contact is connected to Drain terminal and other with
Source terminal. The Drain and Source are connected through the n-channel (n-doped regions)
as shown in Fig. 3.10. The Gate terminal is also connected to a metal contact surface but
remains insulated from the n -channel. A very thin silicon dioxide (SiO2) layer is provided to
act as insulator or dielectric. The SiO2 layer is kept very thin to control the surface near the
It is the insulating layer of SiO2 in the MOSFET construction that accounts for the very
desirable high input impedance of the device. Because of the very high input impedance, the
Gate current (IG) is essentially 0 A for DC biased configurations. MOSFET is also known as
IGFET due to the insulating layer between the Gate and the channel.
The working of n-channel Depletion type MOSFET is somewhat similar to n-channel JFET.
But there is one extra feature in D-MOFET in comparison to JFET. It will be cover in the
lecture shortly.
MOSFET is 4 terminal devices, However, the Substrate terminal (SS) is generally shorted
internally to the Source terminal. The n-channel is there from the beginning in both the D-
MOSFET as well as JFET. As the channel is already there like JFET so we can start our
discussion from VGS = 0 V. A positive voltage VDS is applied across Drain and Source terminal
as Shown in Fig. 3.11.
(i) Case I: VGS = 0 V
Fig 3.11. (a) n-channel D-MOSFET with VGS = 0, and (b) n-channel D-MOSFET with VGS = 0, and
applied VDS applied VDS1 (VDS1> VDS)
On increasing voltage VDS What will happen to current ID. As the Voltage VDS is increasing.
means we are making Drain terminal more positive. It means more electrons attracted toward
the Drain terminal so the drain current (ID) will increase. But after some time, the drain current
will become constant, after this even if you increase voltage VDS, ID will remain the same.
Let us try to understand why the current (ID) become constant. As the drain terminal becoming
more positive due to increase of voltage VDS. The positive potential at n-type material is
increasing, it means that the p-n junction is becoming more reverse bias. So the width of
depletion region will increase and due to this the n-channel will become narrow. If we go on
increasing the VDS, the channel will become very narrow and only limited amount of electron
will pass so the current ID will become constant. This effect is like JFET. If we increase VDS,
In JFET VGS ≤ 0V, because for positive value of VGS it cannot work whereas MOSFET can.
This is the extra feature of MOSFET as compared to JFET.
So the MOSFET have three cases to understand (i) VGS = 0V (ii) VGS < 0V (iii) VGS > 0V.
The case (i) has already been discussed above whereas in case (ii) VGS become negative or less
than zero which means the Gate terminal subjected to negative potential. The negative potential
will set up electric field in reverse direction. The field will push the electrons present in the n-
channel toward the p-type substrate and also attract the holes present in the p-type material of
substrate toward the Gate terminal as shown in Fig 3.12.
There are two actions which are happening at VGS < 0V, first is the pushing of electrons from
the n-channel and second attraction of holes toward the Gate. Because of this the recombination
of electrons and holes will take place. This recombination will reduce the number of electrons
available in n-channel for conduction and thus reduces the drain current ID.
The positive potential at the Gate will draw the additional electrons from the p-type substrate,
the minority charge carrier (electrons) is there in the substrate and the collision will also occur
between the accelerating particles and a new carrier will be established, due to this drain current
ID will increase rapidly. In this scenario we must take care of the maximum drain current. The
voltage VDS must be increased with utmost care (upto safe level) because small change in VDS
will cause large change in ID.
If we keep VGS = 0 V and apply a positive voltage across Drain to Source, there will be no flow
of current ID as the channel is not there as shown in Fig. 3.14.
Non-formation of Channel result in zero drain current instead putting positive voltage VDS.
How is the n-channel formed is explain below?
Actually, the substrate, which is p-type, is the body of the MOSFET having minority charge
carrier as electrons. Initially when VGS is low, electrons will accumulate near the surface of p-
type material. But if we increase VGS, then uncovering of negative immobile ions (negative
immobile ions have holes too) will take place because of which holes will be pushed down.
Now the surface near the SiO2 (inside p-type substrate) will become less p-type and then
become n-type due to excess charge due to negative immobile ions. This process is known as
INVERSION. In Inversion the p-type region inverted to n-type by keeping Gate terminal more
positive as compared to substrate. In this way an n-channel is formed as shown in Fig. 3.15. It
means increasing the VGS will lead to increase in channel width/depth.
Fig. 3.15. Formation of n-channel When VGS > 0 and VDS > 0
Now if we increase VGS the channel width will also increase and at a particular VGS the channel
width is sufficient to allow significant flow of current, the current will be the drain current ID,
this particular VGS is known as Threshold Voltage (VT). The voltage that results in a
significant amount of current flow from Drain to Source (ID) is known as VT.
However, if we hold VGS constant and increase the level of VDS , the drain current will
eventually reach a saturation level as occurred for the JFET and depletion-type MOSFET. The
saturation of ID is due to the pinching-off process due to the narrowing down of induced channel
at the Drain end.
For understanding the processes of pinch-off in Enhancement type MOSFET, the effect of
Voltage VDS on depletion layer is to be understood. For this purpose, the voltage VGD have to
be find out. 𝑽𝑮𝑫 = 𝑽𝑮 − 𝑽𝑫 = 𝑽𝑮𝑺 − 𝑽𝑫𝑺
The above expression implied that the voltage across Gate to Source becomes equal to voltage
across Gate to Drain if the Drain to Source is short circuited i.e. VDS = 0. In this situation, the
potential across the two p-n junctions become equal and thus the width of depletion layer will
be uniform as shown in Fig. 3.16. The two p-n junction region are shown by Region 1 and
Region 2.
Let us suppose that the VT = 1V and applied VGS = 2V, and Drain to Source is short circuited,
It implies that VGD will also become equal to 2V. If this is the situation, then the channel width
become sufficient to establish the Drain current as VGS ˃ VT. The width of established channel
will be corresponding to the Excess Voltage.
𝐸𝑥𝑐𝑒𝑠𝑠 𝑉𝑜𝑙𝑎𝑡𝑔𝑒 𝑜𝑟 𝐸𝑓𝑓𝑒𝑐𝑡𝑖𝑣𝑒 𝑉𝑜𝑙𝑎𝑡𝑔𝑒 = 𝑉𝐺𝑆 − 𝑉𝑇
The Excess Voltage determines the width of depletion region in Case I. (when 𝑽𝑮𝑫 = 𝑽𝑮𝑺 )
Again, keeping VGS fixed as in Case I for the purpose of comparison, If VDS is increased, it
implies from above equation that VGD will decrease. It means that Drain is becoming more
positive in comparison to Case I. As, the VGD ≠ VGS which implies that the depletion layer will
no longer be uniform as shown in Fig 3.17.
Let us assume now VDS = 1.5 V then 𝑽𝑮𝑫 = 𝟎. 𝟓 𝑽, earlier it was 2V when VDS = 0V in
Case I, whereas VGS is still equal to 2 V as it was fixed.
The Region 1 in Fig. 3.17 will having less positive voltage as compared to Region 2. Because
of this, the width of n-channel will reduce, and width of depletion region will increase and this
is happening because there is reduction in the attraction forces for the negative charges and due
to this width of depletion region will increase in Region 1.
If the Voltage across VDS is varied in such a way that above condition satisfy, then the Pinch-
off occurs. At this voltage the channel will be reduced to the point of pinch-off and a saturation
condition will be established as described earlier for the JFET and depletion-type MOSFET.
In other words, any further increase in VDS at the fixed value of VGS will not affect the saturation
level of ID until breakdown conditions are encountered.
A plot between the Output Current ID and Output voltage VDS for various levels of control
variable or control voltage VGS which is the Input voltage. In case of E-MOSFET Threshold
voltage (VT) and constant ‘k’ is given.
Let us suppose a E-MOSFET with VT = 2 V and k = 0.278 x 10-3 A/V2. Now we need to plot
the Drain Characteristic for VGS1 = 8V; VGS2 = 7V; VGS3 = 6V; VGS4 = 5V; VGS5 = 4V, VGS6 =
3V.
We know that the channel width depends upon the excess voltage = V GS -VT. If the VDS
become equal to this excess voltage, then the pinch-off condition occur, and the current ID
become constant as shown in Fig. 3.18.
𝐼𝐷 = 𝑘(𝑉𝐺𝑆 − 𝑉𝑇 )2
𝐼𝐷 = 0
Q: Does the current of an E-MOSFET increases at same rate as a D-MOSFET for conduction
region?
There are three types of FET we have discussed and namely JFET, D-MOSFET and E-
MOSFET.
The BJT DC analysis involves the DC biasing of BJT to fix the operating point or Q-point at
which BJT works. Precisely finding the ICQ and VCEQ (in case of CE Configuration). There are
two approaches or method to find or determine the Q-point. (i) Mathematical approach and (ii)
Graphical approach.
Although we had discussed both the approaches, but mainly mathematical approach has been
followed to obtain the Q-point. The mathematical approach is suitable for linear devices but in
non-linear devices (or device with non-linear characteristic curve) the mathematical approach
may increase the complexity of the solution process. So, in those situation Graphical method
make our path easy to obtain the Q-point.