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The Metallic Bond

- In a metallic structure there are many atoms surrounding any one atom. The valence electrons are
therefore mutually attracted to many nuclei. This gives rise to a situation where the positive nuclei
appear to be immersed in a sea of mobile electrons. The mobile electrons in the structure are said to be
delocalised.

- Metallic bond therefore consists the electrostatic forces of attraction between the positively charged
nuclei and the negatively charged delocalised electrons.
- Metallic bonds are strong bonds. The pattern is repeated many times resulting in a giant metallic
structure.

Physical Properties of Giant Metallic Structures


1. Metals are good conductors of electricity in both solid and molten/liquid states. This is because they
have delocalised electrons in their structures. The higher the number of delocalised electrons, the
higher the electrical conductivity.
Question:
Compare and explain the electrical conductivities of aluminium and magnesium.

2. Metals have high melting and boiling points. This is due to the strong metallic bonds in the giant
metallic structures hence more heat is required to break them.
The melting and boiling points depends on;
I. Size of the atoms – the smaller the size of the atoms the stronger the metallic bonds hence the
higher the melting and boiling points.
Question:
Compare and explain the melting points of lithium and potassium

II. The number of delocalised electrons – the more the number of delocalised electrons, the stronger
the metallic bonds hence the higher the melting and boiling points.
Question:
Compare and explain the melting and boiling points of magnesium and aluminium.

3. Most metals are ductile while others are malleable.


Ductility – is the ability to be drawn (stretched) into wires
Malleability – is the ability to be hammered into sheets/ability to be molded into various shapes

NB:
Reasons why aluminium is used in making overhead cables:
- Has high electrical conductivity
- Has less density/it is light
- Not easily corroded due to the protective oxide layer
- It is ductile
Comparison on Structure and Bonding

Bond Structure Melting Electrical conductivity in


and boiling Solid state Molten/liquid/
points solution state
Ionic bond Giant ionic High Poor Good
structure
Metallic bond Giant High Good Good
metallic
structure
Covalent bond Simple Low Poor Poor
molecular
structure
Giant atomic High Poor Poor
(covalent)
structure

Bond Structure Forces broken during melting


and boiling
Ionic bond Giant ionic structure Strong ionic bonds
Metallic bond Giant metallic structure Strong metallic bonds
Covalent bond Giant covalent (atomic) Strong covalent structure
structure
Simple molecular structure Weak van der Waal’s forces
(hydrogen bonds for water and
water family compounds,
sulphuric acid, nitric acid)
Sample questions
1. The table below gives some properties of substances A to D. Study it and answer the questions that
follow.

Substance Melting point (oC) Boiling point (oC) Electrical conductivity


Solid Molten
A 791 1872 Conducts Conducts
B 1207 2324 Does not conduct Conducts
C -180 -144 Does not conduct Does not conduct
D 2156 3678 Does not conduct Does not conduct
E -46 78 Does not conduct Does not conduct

a) Identify the type of bond in substances:


A ……………………………………………………………………………………………………...
B ……………………………………………………………………………………………………...
C ……………………………………………………………………………………………………...

D ……………………………………………………………………………………………………...
b) With reasons, state the type of structure in the following substances:
A ……………………………………………………………………………………………………...
……………………………………………………………………………………………………...
B ……………………………………………………………………………………………………...
……………………………………………………………………………………………………...
C ……………………………………………………………………………………………………...
……………………………………………………………………………………………………...
D ……………………………………………………………………………………………………...
……………………………………………………………………………………………………...
c) With reasons, identify the substance that is:
I. A gas at room temperature
……………………………………………………………………………………………………
…….……………………………………………………………………………………………...
II. A liquid at room temperature
……………………………………………………………………………………………………
…….………………………………………………………………………………………………
III. A solid at room temperature

………………………………………………………………………………………………
………………………………………………………………………………………………

2. Identify the bond and structure of the following substances:

Substance Bond Structure


Water
Sodium chloride
Magnesium chloride
Silicon (IV) oxide
Silicon (IV) chloride
Aluminium metal
Carbon (IV) oxide
Hydrogen sulphide

3. In terms of structure and bonding, explain why:


a) Sodium chloride has a higher melting point than silicon (IV) chloride
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
b) Hydrogen sulphide is a gas while water is a liquid
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
c) Silicon (IV) oxide is a solid while silicon (IV) chloride is a liquid
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
d) Silicon (IV) oxide has a higher melting point than silicon (IV) chloride
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
e) Diamond is hard while graphite is slippery
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
f) Graphite is a good conductor of electricity while diamond is not
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….
………………………………………………………………………………………………………….

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