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MOSFET
Figure 4.1 Physical structure of the enhancement-type NMOS transistor: (a) perspective view; (b) cross-section. Typically L = 0.1 to 3 mm, W = 0.2 to
100 mm, and the thickness of the oxide layer (tox) is in the range of 2 to 50 nm.
3
Photo-Lithographic Process
optical
mask
oxidation
Rabaey
4
5
6
7
Aplicando Voltage en Gate vgs (Compuerta)
Figure 4.2 The enhancement-type NMOS transistor with a positive voltage applied to the gate. An n channel is induced at
the top of the substrate beneath the gate.
Figure 4.3 An NMOS transistor with vGS > Vt and with a small vDS applied. The device acts as a resistance whose value is
determined by vGS. Specifically, the channel conductance is proportional to vGS Vt and thus iD is proportional to (vGS Vt) vDS.
Note that the depletion region is not shown (for simplicity).
Figure 4.5 Operation of the enhancement NMOS transistor as vDS is increased. The induced channel
acquires a tapered shape, and its resistance increases as vDS is increased. Here, vGS is kept constant at a
value > Vt.
Microelectronic Circuits - Fifth Edition
10
Sedra/Smith
Curva Caracterstica
del MOSFET (Id Vds)
Figure 4.6 The drain current iD versus the drain-to-source voltage vDS for an enhancement-type NMOS transistor operated with vGS > Vt.
La corriente es la misma en todos los puntos, por tanto, corriente en Drain es:
13
La Corriente se mantiene
constante
14
15
Resistencia dependiente de Vgs
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Vgs
Figure 4.12 The iDvGS characteristic for an enhancement-type NMOS transistor in saturation (Vt = 1 V, kn W/L = 1.0
mA/V2).
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Figure 4.10 (a) Circuit symbol for the n-channel enhancement-type MOSFET. (b) Modified circuit symbol with an
arrowhead on the source terminal to distinguish it from the drain and to indicate device polarity (i.e., n channel). (c)
Simplified circuit symbol to be used when the source is connected to the body or when the effect of the body on device
operation is unimportant.
Figure 4.11 (a) An n-channel enhancement-type MOSFET with vGS and vDS applied and with the normal directions of
current flow indicated. (b) The iDvDS characteristics for a device with kn (W/L) = 1.0 mA/V2.
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Figure 4.13 Large-signal equivalent-circuit model of an n-channel MOSFET operating in the saturation region.
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Figure 4.14 The relative levels of the terminal voltages of the enhancement NMOS transistor for operation in the triode
region and in the saturation region.
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Modulacin del Canal
Figure 4.15 Increasing vDS beyond vDSsat causes the channel pinch-off point to move slightly away from the drain, thus
reducing the effective channel length (by DL).
23
24
Figure 4.16 Effect of vDS on iD in the saturation region. The MOSFET parameter VA depends on the process technology
and, for a given process, is proportional to the channel length L.
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Figure 4.17 Large-signal equivalent circuit model of the n-channel MOSFET in saturation, incorporating the output
resistance ro. The output resistance models the linear dependence of iD on vDS and is given by Eq. (4.22).
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Mosfet Canal P
Figure 4.18 (a) Circuit symbol for the p-channel enhancement-type MOSFET. (b) Modified symbol with an arrowhead on the source
lead. (c) Simplified circuit symbol for the case where the source is connected to the body. (d) The MOSFET with voltages applied and
the directions of current flow indicated. Note that vGS and vDS are negative and iD flows out of the drain terminal.
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Figure 4.19 The relative levels of the terminal voltages of the enhancement-type PMOS transistor for operation in the triode region
and in the saturation region.
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Modelo Nmos y Pmos
Table 4.1
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mA L 1mm
Vgs-Vt mnCox 100
V2 W 32 mm
Vt 0.7V 0
VD VS VG VS Vt
VD VG Vt
VD VG Vt
VDG Vt Disear para ID=0.4mA VD=+0.5V
Figure 4.20 Circuit for Example 4.2.
30
Disear el circuito para ID=80uA. Calcular R en encontrar VD
Mosfet Saturado
31
Si Q1=Q2 y R=25k Calcular Id2 y Vd2
Figure E4.12
32
Vt =1V, Kn(W/L) = 1mA/V
Se quiere que Vd= +0.1V, calcular RD
33
Figure 4.23 (a) Circuit for Example 4.5. (b) The circuit with some of the analysis details shown.
34
Figure 4.24 Circuit for Example 4.6.
35
Figure 4.25 Circuits for Example 4.7.
36
Figure 4.9 Cross-section of a CMOS integrated circuit. Note that the PMOS transistor is
formed in a separate n-type region, known as an n well. Another arrangement is also
possible in which an n-type body is used and the n device is formed in a p well. Not shown
Figure E4.16 are the connections made to the p-type body and to the n well; the latter functions as the
body terminal for the p-channel device.
Figure 4.26 (a) Basic structure of the common-source amplifier. (b) Graphical construction to determine the transfer characteristic of
the amplifier in (a).
rds pequea
Figure 4.27 Two load lines and corresponding bias points. Bias point Q1 does not leave sufficient room for positive signal
swing at the drain (too close to VDD). Bias point Q2 is too close to the boundary of the triode region and might not allow for
sufficient negative signal swing.
41
=10V
Kn=1mA/V Ejemplo
Vt=1V
RD=18k
Saturacin-Triodo
Segmento BC - Regin Trodo
Si vds=vo es pequea
Figure 4.28 Example 4.8
45
Figure 4.29 The use of fixed bias (constant VGS) can result in a large variability in the value of ID. Devices 1 and 2
represent extremes among units of the same type.
46
Variabilidad de la polarizacin con el
cambio de dispositivo
Figure 4.30 Biasing using a fixed voltage at the gate, VG, and a resistance in the source lead, RS: (a) basic arrangement; (b)
reduced variability in ID; (c) practical implementation using a single supply; (d) coupling of a signal source to the gate
using a capacitor CC1; (e) practical implementation using two supplies.
47
Algunas formas prcticas de Polarizacin
Figure 4.31 Circuit for Example 4.9.
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Polarizacin con resistencia de realimentacin
Ejemplo:
VDD=+5V, Kn(W/L)=1mA/V, Vt=1V
Figure 4.32 Biasing the MOSFET using a large drain-to-gate feedback resistance, RG.
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Polarizacin con Fuente de Corriente
Figure 4.33 (a) Biasing the MOSFET using a constant-current source I. (b) Implementation of the constant-current source I
using a current mirror.
51
Amplificador de seal pequea
Seal
Polarizacin
Figure 4.34 Conceptual circuit utilized to study the operation of the MOSFET as a small-signal amplifier.
52
Transconductancia para seal pequea
53
Trasnconductancia gm
Polarizacin + Seal
Valor instantneo de iD
Seal
Modelo para seal pequea con =0 y 0
Figure 4.37 Small-signal models for the MOSFET: (a) neglecting the dependence of iD on vDS in saturation (the channel-length
modulation effect); and (b) including the effect of channel-length modulation, modeled by output resistance ro = |VA| /ID.
56
Howe and Sodini 57
Howe and Sodini 58
Para Diseo VLSI
Ganancia de Voltaje
Polarizacin a la
entrada
Limite por
corte
Aproximacin
Polarizacin a la salida Lineal
Es vlida?
Figure 4.36 Total instantaneous voltages vGS and vD for the circuit in Fig. 4.34. 60
.
2 2
0.9mA Kn 0.01V 2 por tanto: 90mA / V 2 Kn
Por que?
Punto de polarizacin: Q, Vds=3.2V Id=0.45mA
1
Vov VDD KnVov RD
2
2
RD
KnVov Vov VDD 0
2
2
Resolviendo la ecuacin cuadrtica:
1 1 2RDVDD K n
Vov
RD K n
Para el caso con Kn=90mA/V, VDD=5V , RD=4k, Vov=0.164V, con Vt=1V
Vgsmax=1.164 o lmite de manejo a la entrada
Funcin de Transferencia Vds Vs Vgs
(Gran Seal)
R1
4k
Vt M2
Modelo Real
V1
VOFF = 0 V4 5Vdc
1Vdc Mbreakn
VAMPL = 0.01
FREQ = 1k
1.1Vdc V2
R2
4k
0.009*((V(%IN) -1.0495))
Modelo Ideal
Agregando Limitacin de manejo al modelo ideal
R1
4k
Vt M2
V1
VOFF = 0 V4 5Vdc
1Vdc Mbreakn
VAMPL = 0.05
FREQ = 1k
1.1Vdc V2
0 0 0
R2
4k
0.009*((V(%IN) -1.0495)) 5
1
0
R3
1k
0 0
Ideal en Verde.
Real en Rojo
iD
iD g m vgs vds ro
Figure 4.38 Example 4.10: (a) amplifier circuit; (b) equivalent-circuit model.
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MODELO T
Figure 4.39 Development of the T equivalent-circuit model for the MOSFET. For simplicity, ro has been omitted but can
be added between D and S in the T model of (d).
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Modelo T y ro
ig=0
Figure 4.40 (a) The T model of the MOSFET augmented with the drain-to-source resistance ro. (b) An alternative
representation of the T model.
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Efecto Cuerpo (Body Effect)
Figure 4.41 Small-signal equivalent-circuit model of a MOSFET in which the source is not connected to the body.
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MODELOS y T
Table 4.2
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El Mosfet como Amplificador
Figure 4.42 Basic structure of the circuit used to realize single-stage discrete-circuit MOS amplifier configurations.
1 'W
Vgs Vt 1mA / V Vov 0.5mA
1
Id kn
2 2 2
2 L 2
Vsig=10mV Se mide:
Para RL vo=90mV
Para RL=10k vo=70mV
Para RL
Rsig=100k Se mide:
vo 90mV
Para RL vi=9mV Avo 10V V
vi 9mV
Para RL=10k vi=8mV vo 90mV
Gvo RL 9V V
vsig 10mV
Ri Ri
Gvo Avo 10V V
Ri Rsig Ri Rsig
Para RL=10k
vo 70mV
Av 8.75V V
vi 8mV
vo 70mV
Gv 7V V
vsig 10mV
Modelo Unilateral
RL
Av Avo 8.75V V
RL Ro
Ro 1.43k
Circuito no unilateral
- RL modifica la R
entrada.
- Rsig Modifica la R
Salida
Circuito unilateral
- RL No modifica la R
entrada
- Rsig No Modifica la R
Salida
Tres configuraciones: SC, DC, GC
Figure 4.43 (a) Common-source amplifier based on the circuit of Fig. 4.42. (b) Equivalent circuit of the
amplifier for small-signal analysis. (c) Small-signal analysis performed directly on the amplifier circuit with the
MOSFET model implicitly utilized.
Rout
Amplificador Source Comn con resistencia de source
Con ro despreciable
Figure 4.44 (a) Common-source amplifier with a resistance RS in the source lead. (b) Small-signal equivalent
circuit with ro neglected.
RL RD
Av
1 gm RS
Amplificador Source Comn con Rs, efecto Body y de ro (Seccin 6.9.1)
Figure 6.47 (a) A CS amplifier with a source-degeneration resistance Rs. (b) Circuit for small-signal analysis. (c) Circuit with the output open
to determine Avo. (d) Output equivalent circuit. (e) Another output equivalent circuit in terms of Gm.
Modelo T
Norton
Figure 4.45 (a) A common-gate amplifier based on the circuit of Fig. 4.42. (b) A small-signal equivalent circuit
of the amplifier in (a). (c) The common-gate amplifier fed with a current-signal input.
Figure 6.27 (a) Active-loaded common-gate amplifier. (b) MOSFET equivalent circuit for the CG case in which the body and gate terminals are
connected to ground. (c) Small-signal analysis performed directly on the circuit diagram with the T model of (b) used implicitly. (d) Operation with
the output open-circuited.
Microelectronic Circuits - Fifth
92
Edition Sedra/Smith
Gate Comn con efecto de ro,
carga activa y efecto Body cont..
Ganancia de i =1
ii
Rin
vi
Ntese el efecto en Ro si
de alguna manera se
cambia VGS
Variar
-Vs
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Impedancia de salida GATE COMUN
con Rs
Determinacin de Rout
visto desde Drain
Rout=V/I=30k
Figure 6.28 (a) The output resistance Ro is found by setting vi = 0. (b) The output resistance Rout is obtained by setting vsig =0.
Figure 4.46 (a) A common-drain or source-follower amplifier. (b) Small-signal equivalent-circuit model. (c)
Small-signal analysis performed directly on the circuit. (d) Circuit for determining the output resistance Rout of
the source follower.
Microelectronic Circuits - Fifth Edition Sedra/Smith 101
Amplificador Drain Comn cont
Amplificador Drain Comn cont
Seguidor de Source
RESUMEN
Source Comn
Table 4.4
Gate Comn
Seguidor de Source
Concepto de Manejo
Funcin de transferencia Ideal y Real (se aplica una rampa a la entrada entre 0V y 0.9V
Mientras Vin no supere V el transistor est cortado y la salida es la fuente 10V
Se ve la diferencia del modelo ideal que, adems de ser lineal, recorta perfectamente la salida (se aplica la
aproximacin de seal pequea y se extiende linealmente a seal grande). El modelo real de seal grande,
que corresponde a una exponencial para BJT, no llega a recortar la seal (por corte) en este caso, pues la
ganancia disminuye cuando la seal llega a valores cercanos a V
Seales de salida, modelo ideal y real.
Si bien estrictamente ninguna de las dos seales est recortada, se ve claramente que las amplitudes, al llegar a los
extremos de la seal se diferencian bastante, lo que no ocurre alrededor del punto de polarizacin.
Figure 6.36 (a) The MOS cascode amplifier. (b) The circuit prepared for small-signal analysis with various input and output resistances
indicated. (c) The cascode with the output open-circuited.
Cox Cov
Capacitancia de Oxido, Capacitancia de Overlap
por unidad de rea por unidad de longitud
Howe Sodini
115
Figure 4.47 (a) High-frequency equivalent circuit model for the MOSFET. (b) The equivalent circuit for the case
in which the source is connected to the substrate (body). (c) The equivalent circuit model of (b) with Cdb
neglected (to simplify analysis).
125
Interruptor Analgico - requiere acceso al Bulk
Mosfet Cortados
cambiando lo Vgate
126
MOSFET DE AGOTAMIENTO (DEPLETION)
Figure 4.59 (a) Circuit symbol for the n-channel depletion-type MOSFET. (b) Simplified circuit symbol
applicable for the case the substrate (B) is connected to the source (S).
Si Q1 = Q2
Con = 0
Para Q1 y Q2 permanezcan en
saturacin:
Por tanto:
Entonces para vgs1
Donde:
O sea en polarizacin
Figure 7.4 The MOS differential pair with a differential input signal vid applied. With vid positive: vGS1 vGS2, iD1 iD2, and vD1 < vD2; thus
(vD2 vD1) will be positive. With vid negative: vGS1 < vGS2, iD1 < iD2, and vD1 vD2; thus (vD2 vD1) will be negative.
Mientras Q1 y Q2 saturados y =0
Por tanto:
Figure 7.5 The MOSFET differential pair for the purpose of deriving the transfer characteristics, iD1 and iD2 versus vid vG1 vG2.
135
Circuito bsico para obtener Funcin de
Transferencia (Gran Seal) Cont
Pero:
Elevando al cuadrado
1 W 2 Para ID2 se tiene lo mismo
I D1 2 I D1 I D 2 I D 2 k n ' vid
2 L
Circuito bsico para obtener Funcin de Transferencia (Gran Seal) Cont
Remplazando e
Normalizada a
Funcin de Transferencia (Gran Seal)
Figure 7.6 Normalized plots of the currents in a MOSFET differential pair. Note that VOV is the overdrive voltage at which Q1 and Q2
operate when conducting drain currents equal to I/2.
147