Kolej Kemahiran Tinggi

MARA Balik Pulau, Pulau

Pinang.

ASSIGNMENT SHEET

COURSE : MANUFACTURING
SESSION : JAN – JUNE 2010 SEMESTER : 4
DMV 4242 ADVANCED
CODE/SUBJECT : MANUFACTURING SHEET NO : 3
PROCESSES
NO OF
WEEK : 13
STUDENTS :
DURATION : 1 WEEK VENUE : BK
LECTURER(S) : MUHAMAD SAIDI BIN MAT ALI
5. FABRICATION OF MICROELECTRONIC DEVICES
TOPIC :
6. HIGH SPEED MACHINING
Instructions:
This is INDIVIDUAL assignment. Please put your answer in handwriting.
Answer all questions

Questions:
1. Give the definition of integrated circuit (IC)
2. Describe the advantages of the ICs.
3. Draw the outline of general fabrication sequences for integrated circuits .
4. Define the following terms:
i. Czochralski process
ii. Dopant

5. Oxidation refers to the growth of an oxide layer as a result of the reaction of oxygen with
the substrate material. There are three methods of oxidation; dry oxidation, wet oxidation
and selective oxidation. Explain the three methods.
6. Distinguish between the diffusion and ion implantation process in the fabrication of
microelectronic devices.
7. State the definition of high speed machining (HSM).
8. Give five advantages of HSM.
9. List six important factors in HSM.
10. List three types of non-contact bearing and briefly explain of each type.

Submission date: 19 May 2010 before 5 p.m.