1BGA(ball grid array)

LSI
(PAC)200LSI
QFP()1.5mm 360 BGA 31mm 0.5mm 304 QFP
40mm BGA QFP Motorola
BGA ()1.5mm225 LSI
500 BGABGA
Motorola OMPAC
GPAC(OMPAC GPAC)
2BQFP(quad flat package with bumper)
QFP ()
ASIC 0.635mm84 196 (QFP)
3PGA(butt joint pin grid array)
PGA (PGA)
4C(ceramic)
CDIP DIP
5Cerdip
ECL RAMDSP() Cerdip EPROM
EPROM 2.54mm8 42japanDIPG(G )

6Cerquad
QFPDSP LSI Cerquad EPROM
QFP 1. 5 2W QFP 35 1.27mm0.8mm0.65mm
0.5mm 0.4mm 32 368
7CLCC(ceramic leaded chip carrier)
EPROM
EPROM QFJQFJG(QFJ)
8COB(chip on board)

COB
TAB
9DFP(dual flat package)
SOP (SOP)
10DIC(dual in-line ceramic package)
DIP()(DIP).
11DIL(dual in-line)
DIP (DIP)

12DIP(dual in-line package)

DIP
ICLSI 2.54mm6 6415.2mm7.52mm 10.16mm
skinny DIP slim DIP(DIP)DIP
DIP cerdip(cerdip)
13DSO(dual small out-lint)
SOP (SOP)
14DICP(dual tape carrier package)
TCP() TAB()
LSI 0.5mm LSI japan
EIAJ(japan )DICP DTP
15DIP(dual tape carrier package)
japanDTCP (DTCP)
16FP(flat package)
QFP SOP(QFP SOP)
17flip-chip
LSI

 LSI
LSI
18FQFP(fine pitch quad flat package)
QFP0.65mm QFP(QFP)
19CPAC(globe top pad array carrier)
Motorola BGA (BGA)
20CQFP(quad fiat package with guard ring)
QFP LSI
(L ) Motorola 0.5mm208

21H-(with heat sink)

HSOP SOP
22pin grid array(surface mount type)
PGAPGA 3.4mmPGA 1.5mm 2.0mm
PGA1.27mmPGA
(250528)LSI

23JLCC(J-leaded chip carrier)

J CLCC QFJ (CLCC QFJ)
24LCC(Leadless chip carrier)
ICQFN QFN
C(QFN)
25LGA(land grid array)
227 (1.27mm )447
(2.54mm )LGA LSI LGA QFP
LSI

26LOC(lead on chip)
LSI
1mm
27LQFP(low profile quad flat package)
QFP1.4mm QFPjapanQFP
28LQUAD
QFP 78
LSI W3208 (0.5mm )160

 (0.65mm )LSI 1993 10

29MCM(multi-chip module)
MCMLMCMC MCMD MCM
L MCMC
() IC MCML
MCMD ()SiAl

30MFP(mini flat package)

SOP SSOP (SOP SSOP)
31MQFP(metric quad flat package)
JEDEC()QFP 0.65mm3.8mm2.0mm QFP(
QFP)
32MQUAD(metal quad)
Olin QFP 2.5W2.8W japan
1993
33MSP(mini square package)
QFI (QFI)MSPQFI japan

34OPMAC(over molded pad array carrier)

Motorola BGA ( BGA)
35P(plastic)
PDIP DIP
36PAC(pad array carrier)
BGA (BGA)
37PCLP(printed circuit board leadless package)
japanQFN(LCC)(QFN)
0.55mm 0.4mm
38PFPF(plastic flat package)
QFP (QFP)LSI
39PGA(pin grid array)

PGA LSI 2.54mm64 447
64256 PG A 1.27mm
PGA(PGA)( PGA)
40piggy back

DIPQFPQFN EPROM

41PLCC(plastic leaded chip carrier)

64k DRAM 256kDRAM LSIDLD()1.27mm18 84
J QFP PLCC LCC(QFN)
J (LCCPC LPP LCC )
japan1988 J QFJ
QFN(QFJ QFN)
42PLCC(plastic teadless chip carrier)(plastic leaded chip currier)
QFJ QFN(LCC)(QFJ QFN)LSI PLCC PLCC

43QFH(quad flat high package)

QFP QFP (QFP)
44QFI(quad flat I-leaded packgac)
I I MSP(MSP)
QFP IC japanMotorola
PLL IC 1.27mm18 68

45QFJ(quad flat J-leaded package)

J J japan
1.27mm
QFJ PLCC(PLCC) DRAMASSPOTP 18 84
QFJ CLCCJLCC(CLCC)EPROM EPROM 32 84
46QFN(quad flat non-leaded package)
LCCQFN japan
QFP QFP
QFP 14 100 LCC QFN
1.27mm
QFN 1.27mm 0.65mm 0.5mm
LCCPCLCPLCC
47QFP(quad flat package)
(L)
QFPQFP LSI
LSI VTRLSI 1.0mm0.8mm 0.65mm0.5mm
0.4mm0.3mm 0.65mm 304
japan0.65mm QFP QFP(FP)japanQFP
QFP(2.0mm3.6mm )LQFP(1.4mm )TQFP(1.0mm )
LSI 0.5mm QFP QFP SQFPVQFP0.65mm 0.4mm
QFP SQFP QFP 0.65mm

QFP BQFP(BQFP) GQFP(GQFP)

TPQFP(TPQFP)LSI
QFP 0.4mm348 QFP(Gerqa d)
48QFP(FP)(QFP fine pitch)
QFPjapan0.55mm0.4mm0.3mm 0.65mm QFP(QFP)
49QIC(quad in-line ceramic package)
QFP (QFPCerquad)
50QIP(quad in-line plastic package)
QFP (QFP)
51QTCP(quad tape carrier package)
TCP TAB (TABTCP)
52QTP(quad tape carrier package)
japan1993 4 QTCP (TCP)
53QUIL(quad in-line)
QUIP (QUIP)
54QUIP(quad in-line package)

 1.27mm
2.5mm DIP japan
64
55SDIP (shrink dual in-line package)
DIPDIP (1.778mm)DIP(2.54 mm)
14 90SHDIP
56SHDIP(shrink dual in-line package)
SDIP
57SIL(single in-line)
SIP (SIP)SIL
58SIMM(single in-line memory module)
SIMM 2.54mm
30 1.27mm 72 SOJ 1 4 DRAM SIMM
3040DRAM SIMM
59SIP(single in-line package)
2.54mm
2 23 ZIP SIP

60SKDIP(skinny dual in-line package)

DIP 7.62mm2.54mm DIPDIP( DIP)
61SLDIP(slim dual in-line package)
DIP 10.16mm2.54mm DIPDIP
62SMD(surface mount devices)
SOP SMD(SOP)
63SO(small out-line)
SOP (SOP)
64SOI(small out-line I-leaded package)
I I 1.27mmSOP
IC(IC) 26
65SOIC(small out-line integrated circuit)
SOP (SOP)
66SOJ(Small Out-Line J-Leaded Package)
J J DRAM SRAM
LSI DRAMSO J DRAM SIMM 1.27mm20 40(
SIMM )

67SQL(Small Out-Line L-leaded package)

JEDEC()SOP (SOP)
68SONF(Small Out-Line Non-Fin)
SOPSOP IC NF(non-fin)
(SOP)
69SOF(small Out-Line package)
(L ) SOL DFP
SOP LSI ASSP 1040 SOP
1.27mm8 44 1.27mm SOP SSOP1.27mm SOP
TSOP(SSOPTSOP)SOP
70SOW (Small Outline Package(Wide-Jype)
SOP