PD - 9.

1408B

IRFZ48NS
l Advanced Process Technology IRFZ48NL
l Surface Mount (IRFZ48NS) HEXFET® Power MOSFET
l Low-profile through-hole (IRFZ48NL)
D
l 175°C Operating Temperature VDSS = 55V
l Fast Switching
l Fully Avalanche Rated RDS(on) = 0.014Ω
Description G
Advanced HEXFET ® Power MOSFETs from
International Rectifier utilize advanced processing ID = 64A
techniques to achieve extremely low on-resistance S
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of

accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-resistance
in any existing surface mount package. The D2Pak is
D 2 P ak T O -26 2
suitable for high current applications because of its low
internal connection resistance and can dissipate up to 2.0W
in a typical surface mount application.
The through-hole version (IRFZ48NL) is available for low-
profile applications.
Absolute Maximum Ratings
Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 64
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 45 A
IDM Pulsed Drain Current  210
PD @TA = 25°C Power Dissipation 3.8 W
PD @TC = 25°C Power Dissipation 130 W
Linear Derating Factor 0.83 W/°C
VGS Gate-to-Source Voltage ± 20 V
IAR Avalanche Current  32 A
EAR Repetitive Avalanche Energy 13 mJ
dv/dt Peak Diode Recovery dv/dt ƒ 5.0 V/ns
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Thermal Resistance
Parameter Typ. Max. Units
RqJC Junction-to-Case ––– 1.15
°C/W
RqJA Junction-to-Ambient ( PCB Mounted,steady-state)** ––– 40
www.irf.com 1
03/12/01
IRFZ48NS/IRFZ48NL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.058 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– ––– 14 mΩ VGS = 10V, ID = 32A „
VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = V GS, ID = 250µA
gfs Forward Transconductance 24 ––– ––– S VDS = 25V, ID = 32A„
––– ––– 25 VDS = 55V, VGS = 0V
IDSS Drain-to-Source Leakage Current µA
––– ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C
Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20V
IGSS nA
Gate-to-Source Reverse Leakage ––– ––– -100 VGS = -20V
Qg Total Gate Charge ––– ––– 81 ID = 32A
Qgs Gate-to-Source Charge ––– ––– 19 nC VDS = 44V
Qgd Gate-to-Drain ("Miller") Charge ––– ––– 30 VGS = 10V, See Fig. 6 and 13
td(on) Turn-On Delay Time ––– 12 ––– VDD = 28V
tr Rise Time ––– 78 ––– ID = 32A
ns
td(off) Turn-Off Delay Time ––– 34 ––– RG = 0.85Ω
tf Fall Time ––– 50 ––– VGS = 10V, See Fig. 10 „
LS Internal Source Inductance ––– 7.5 ––– nH Between lead,
and center of die contact
Ciss Input Capacitance ––– 1970 ––– VGS = 0V
Coss Output Capacitance ––– 470 ––– VDS = 25V
Crss Reverse Transfer Capacitance ––– 120 ––– pF ƒ = 1.0MHz, See Fig. 5
EAS Single Pulse Avalanche Energy‚ ––– 700… 190† mJ IAS = 32A, L = 0.37mH

Source-Drain Ratings and Characteristics

Parameter Min. Typ. Max. Units Conditions
D
IS Continuous Source Current MOSFET symbol
––– ––– 64
(Body Diode) showing the
A
I SM Pulsed Source Current integral reverse G

––– ––– 210

(Body Diode) p-n junction diode. S

VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 32A, VGS = 0V „
trr Reverse Recovery Time ––– 68 100 ns TJ = 25°C, IF = 32A
Q rr Reverse Recovery Charge ––– 220 330 nC di/dt = 100A/µs „
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Notes:
 Repetitive rating; pulse width limited by „ Pulse width ≤ 400µs; duty cycle ≤ 2%.
max. junction temperature. ( See fig. 11 ) … This is the destructive value not limited to the thermal limit.
‚ Starting TJ = 25°C, L = 0.37mH † This is the thermal limited value.
RG = 25Ω, IAS = 32A. (See Figure 12)
ƒ ISD ≤ 32A, di/dt ≤ 220A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C

** When mounted on 1" square PCB ( FR-4 or G-10 Material ).

For recommended soldering techniques refer to application note #AN-994.

2 www.irf.com
 IRFZ48NS/IRFZ48NL

 
1000 1000 VGS
VGS
TOP 15V TOP 15V
10V 10V
8.0V 8.0V
I D , Drain-to-Source Current (A)

I D , Drain-to-Source Current (A)

7.0V 7.0V
6.0V 6.0V
5.5V 5.5V
5.0V 5.0V
BOTTOM 4.5V BOTTOM 4.5V
100 100

4.5V
10 10

4.5V

20µs PULSE WIDTH 20µs PULSE WIDTH

TJ = 25 °C TJ = 175 °C
1 1
0.1 1 10 100 0.1 1 10 100
VDS , Drain-to-Source Voltage (V) VDS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

1000 2.5
ID = 64A
R DS(on) , Drain-to-Source On Resistance
I D , Drain-to-Source Current (A)

TJ = 25 ° C 2.0

100 TJ = 175 ° C
(Normalized)

1.5

1.0
10

0.5

V DS = 25V
20µs PULSE WIDTH VGS = 10V
1 0.0
4 6 8 10 12 -60 -40 -20 0 20 40 60 80 100 120 140 160 180
VGS , Gate-to-Source Voltage (V) TJ , Junction Temperature ( °C)

Fig 3. Typical Transfer Characteristics Fig 4. Normalized On-Resistance

Vs. Temperature
www.irf.com 3
IRFZ48NS/IRFZ48NL


3500 20
VGS = 0V, f = 1MHz ID = 32A
Ciss = Cgs + Cgd , Cds SHORTED VDS = 44V
Crss = Cgd

VGS , Gate-to-Source Voltage (V)

3000 VDS = 27V
Coss = Cds + Cgd 16 VDS = 11V
2500
C, Capacitance (pF)

Ciss 12
2000

1500
8

1000
Coss
4
500
Crss FOR TEST CIRCUIT
SEE FIGURE 13
0 0
1 10 100 0 20 40 60 80
VDS , Drain-to-Source Voltage (V) QG , Total Gate Charge (nC)

Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.

Drain-to-Source Voltage Gate-to-Source Voltage

1000 1000
OPERATION IN THIS AREA
LIMITED BY R DS(on)
ISD , Reverse Drain Current (A)

ID, Drain-to-Source Current (A)

100 100
TJ = 175 ° C

100µsec
10 10
1msec
TJ = 25 ° C
1 1
10msec
Tc = 25°C
Tj = 175°C
V GS = 0 V Single Pulse
0.1 0.1
0.2 0.7 1.2 1.7 2.2
1 10 100
VSD ,Source-to-Drain Voltage (V)
VDS , Drain-toSource Voltage (V)

Fig 7. Typical Source-Drain Diode Fig 8. Maximum Safe Operating Area

Forward Voltage
4 www.irf.com
 IRFZ48NS/IRFZ48NL

70 RD
V DS
60
VGS
D.U.T.
RG
I D , Drain Current (A)

50 +
-V DD

40
VGS
Pulse Width ≤ 1 µs
30 Duty Factor ≤ 0.1 %

20
Fig 10a. Switching Time Test Circuit
10 VDS
90%
0
25 50 75 100 125 150 175
TC , Case Temperature ( °C)

10%
VGS
Fig 9. Maximum Drain Current Vs.
td(on) tr t d(off) tf
Case Temperature
Fig 10b. Switching Time Waveforms

10
Thermal Response (Z thJC )

1
D = 0.50


0.20

0.10 P DM
0.1 0.05 t1
0.02 SINGLE PULSE
0.01 (THERMAL RESPONSE) t2

Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJC + TC
0.01
0.00001 0.0001 0.001 0.01 0.1
t1 , Rectangular Pulse Duration (sec)

Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case

www.irf.com 5
IRFZ48NS/IRFZ48NL


360
15 V ID

EAS , Single Pulse Avalanche Energy (mJ)

TOP 13A
300 23A
D R IV E R
BOTTOM 32A
VDS L

240
RG D .U .T +
- VD D
IA S A 180
20V
tp 0.0 1 Ω

120
Fig 12a. Unclamped Inductive Test Circuit

60
V (B R )D SS
tp
0
25 50 75 100 125 150 175
Starting TJ , Junction Temperature ( °C)

Fig 12c. Maximum Avalanche Energy

Vs. Drain Current
IAS

Fig 12b. Unclamped Inductive Waveforms

Current Regulator
Same Type as D.U.T.

50KΩ

12V .2µF
QG .3µF

VGS +
V
D.U.T. - DS
QGS QGD
VGS
VG 3mA

IG ID
Charge Current Sampling Resistors

Fig 13a. Basic Gate Charge Waveform Fig 13b. Gate Charge Test Circuit

6 www.irf.com
 IRFZ48NS/IRFZ48NL
Peak Diode Recovery dv/dt Test Circuit

+ Circuit Layout Considerations

D.U.T* • Low Stray Inductance
• Ground Plane
ƒ
• Low Leakage Inductance
Current Transformer
-

+
‚
„
- +
-


RG • dv/dt controlled by RG +
• ISD controlled by Duty Factor "D" V DD
-
• D.U.T. - Device Under Test
VGS

* Reverse Polarity of D.U.T for P-Channel

Driver Gate Drive

P.W.
Period D=
P.W. Period

[VGS=10V ] ***

D.U.T. ISD Waveform

Reverse
Recovery Body Diode Forward
Current Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
[VDD]
Re-Applied
Voltage Body Diode Forward Drop
Inductor Curent

Ripple ≤ 5% [ ISD ]

*** VGS = 5.0V for Logic Level and 3V Drive Devices

Fig 14. For N-channel HEXFET® power MOSFETs

www.irf.com 7
IRFZ48NS/IRFZ48NL
D2Pak Package Outline

1 0.54 (.4 15) -B - 1 0.16 (.4 00 )

1 0.29 (.4 05) 4.69 (.1 85) RE F.
1.4 0 (.055 ) 4.20 (.1 65)
-A- 1.3 2 (.05 2)
M AX. 1.2 2 (.04 8)
2
6.47 (.2 55 )
6.18 (.2 43 )

1.7 8 (.07 0) 15 .4 9 (.6 10) 2.7 9 (.110 )

1.2 7 (.05 0) 1 3 14 .7 3 (.5 80) 2.2 9 (.090 )

5 .28 (.20 8) 2.61 (.1 03 )

4 .78 (.18 8) 2.32 (.0 91 )

8.8 9 (.3 50 )
1.40 (.0 55) 1.3 9 (.0 5 5) R E F.
3X
1.14 (.0 45) 0 .93 (.03 7 ) 0.5 5 (.022 ) 1.1 4 (.0 4 5)
3X 0.4 6 (.018 )
0 .69 (.02 7 )
5 .08 (.20 0) 0 .25 (.01 0 ) M B A M M IN IM U M R E CO M M E ND E D F O O TP R IN T

1 1.43 (.4 50 )

NO TE S: LE A D A SS IG N M E N TS 8.89 (.3 50 )
1 D IM EN S IO N S A FTER SO L D ER D IP. 1 - G A TE
2 D IM EN S IO N IN G & TO LE RA N C IN G PE R A N S I Y1 4.5M , 198 2. 2 - D R AIN 17 .78 (.70 0)
3 - S O U RC E
3 C O N TRO L LIN G D IM EN SIO N : IN C H .
4 H E ATSINK & L EA D D IM EN S IO N S D O N O T IN C LU D E B UR R S.
3 .8 1 (.15 0)

2.5 4 (.100 )
2 .08 (.08 2) 2X
2X

Part Marking Information

D2Pak

A
IN TE R N A TIO N A L PART NUM BER
R E C T IF IE R
F530S
LO G O
9 24 6
9B 1M DATE CODE
(Y YW W )
A S S E M B LY
YY = Y E A R
LO T C O D E
W W = W EEK

8 www.irf.com
 IRFZ48NS/IRFZ48NL
Package Outline
TO-262 Outline

Part Marking Information

TO-262

www.irf.com 9
IRFZ48NS/IRFZ48NL
Tape & Reel Information
D2Pak

TR R

1 .6 0 (.0 6 3 )
1 .5 0 (.0 5 9 )
1 .60 (.06 3)
4 .1 0 (.1 6 1 ) 1 .50 (.05 9)
3 .9 0 (.1 5 3 ) 0 .3 68 (.0 1 4 5 )
0 .3 42 (.0 1 3 5 )

F E E D D IRE CTIO N 1 .8 5 (.0 7 3 ) 1 1 .6 0 (.4 5 7 )

1 .6 5 (.0 6 5 ) 1 1 .4 0 (.4 4 9 ) 2 4 .3 0 (.9 5 7 )
1 5 .4 2 (.6 0 9 )
2 3 .9 0 (.9 4 1 )
1 5 .2 2 (.6 0 1 )
TR L
1 .75 (.06 9 )
10 .9 0 (.42 9) 1 .25 (.04 9 )
10 .7 0 (.42 1) 4 .7 2 (.1 3 6)
16 .10 (.63 4 ) 4 .5 2 (.1 7 8)
15 .90 (.62 6 )

F E E D D IRE C TIO N

13.50 (.532 ) 2 7.4 0 (1.079)

12.80 (.504 ) 2 3.9 0 (.9 41)

33 0.00 60.00 (2.3 62)

(1 4.1 73) MIN .
MA X.

3 0.40 (1.1 97)

NO TES : MAX.
1. C O M F O R M S TO E IA -4 18. 26 .40 (1.03 9) 4
2. C O N TR O LLIN G D IM E N S IO N : M ILL IM ET ER . 24 .40 (.961 )
3. D IM E N S IO N ME A S U R E D @ H U B .
3
4. IN C LU D E S F LA N G E D IS TO R T IO N @ O U T E R E D G E .

Data and specifications subject to change without notice.

This product has been designed and qualified for the industrial market.
Qualification Standards can be found on IR’s Web site.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.03/01
10 www.irf.com
Note: For the most current drawings please refer to the IR website at:
http://www.irf.com/package/