PD - 94752

AUTOMOTIVE MOSFET IRFR4105Z

IRFU4105Z
HEXFET® Power MOSFET
Features D
● Advanced Process Technology VDSS = 55V
● Ultra Low On-Resistance
● 175°C Operating Temperature
● Fast Switching RDS(on) = 24.5mΩ
G
● Repetitive Avalanche Allowed up to Tjmax
ID = 30A
S

Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to
achieve extremely low on-resistance per silicon area. Additional
features of this design are a 175°C junction operating tempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an extremely
efficient and reliable device for use in Automotive applications and D-Pak I-Pak
a wide variety of other applications. IRFR4105Z IRFU4105Z

Absolute Maximum Ratings

Parameter Max. Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited) 30
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 21 A
IDM Pulsed Drain Current c 120
PD @TC = 25°C Power Dissipation 48 W
Linear Derating Factor 0.32 W/°C
VGS Gate-to-Source Voltage ± 20 V
EAS (Thermally limited) Single Pulse Avalanche Energy d 29 mJ
EAS (Tested ) Single Pulse Avalanche Energy Tested Value h 46
IAR Avalanche Current c See Fig.12a, 12b, 15, 16 A
EAR Repetitive Avalanche Energy g mJ
TJ Operating Junction and -55 to + 175
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
Mounting Torque, 6-32 or M3 screw y
10 lbf in (1.1N m)y
Thermal Resistance
Parameter Typ. Max. Units
RθJC Junction-to-Case ––– 3.12
RθJA Junction-to-Ambient (PCB mount) i ––– 40 °C/W
RθJA Junction-to-Ambient ––– 110

HEXFET® is a registered trademark of International Rectifier.

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IRFR/U4105Z
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.053 ––– V/°C Reference to 25°C, ID = 1mA
RDS(on) Static Drain-to-Source On-Resistance ––– 19 24.5 mΩ VGS = 10V, ID = 18A e
VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µA
gfs Forward Transconductance 16 ––– ––– S VDS = 15V, ID = 18A
IDSS Drain-to-Source Leakage Current ––– ––– 20 µA VDS = 55V, VGS = 0V
––– ––– 250 VDS = 55V, VGS = 0V, TJ = 125°C
IGSS Gate-to-Source Forward Leakage ––– ––– 200 nA VGS = 20V
Gate-to-Source Reverse Leakage ––– ––– -200 VGS = -20V
Qg Total Gate Charge ––– 18 27 ID = 18A
Qgs Gate-to-Source Charge ––– 5.3 ––– nC VDS = 44V
Qgd Gate-to-Drain ("Miller") Charge ––– 7.0 ––– VGS = 10V e
td(on) Turn-On Delay Time ––– 10 ––– VDD = 28V
tr Rise Time ––– 40 ––– ID = 18A
td(off) Turn-Off Delay Time ––– 26 ––– ns RG = 24.5 Ω
tf Fall Time ––– 24 ––– VGS = 10V e
LD Internal Drain Inductance ––– 4.5 ––– Between lead, D

nH 6mm (0.25in.)
LS Internal Source Inductance ––– 7.5 ––– from package G

and center of die contact S

Ciss Input Capacitance ––– 740 ––– VGS = 0V

Coss Output Capacitance ––– 140 ––– VDS = 25V
Crss Reverse Transfer Capacitance ––– 74 ––– pF ƒ = 1.0MHz
Coss Output Capacitance ––– 450 ––– VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz
Coss Output Capacitance ––– 110 ––– VGS = 0V, VDS = 44V, ƒ = 1.0MHz
Coss eff. Effective Output Capacitance ––– 180 ––– VGS = 0V, VDS = 0V to 44V f
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
IS Continuous Source Current ––– ––– 30 MOSFET symbol
(Body Diode) A showing the
ISM Pulsed Source Current ––– ––– 120 integral reverse
(Body Diode) c p-n junction diode.
VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 18A, VGS = 0V e
trr Reverse Recovery Time ––– 19 29 ns TJ = 25°C, IF = 18A, VDD = 28V
Qrr Reverse Recovery Charge ––– 14 21 nC di/dt = 100A/µs e
ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

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1000 1000
VGS VGS
TOP 15V TOP 15V
10V 10V
ID, Drain-to-Source Current (A)

ID, Drain-to-Source Current (A)

8.0V 8.0V
7.0V 7.0V
100
6.0V 6.0V
5.5V 100 5.5V
5.0V 5.0V
BOTTOM 4.5V BOTTOM 4.5V

10

10
1 4.5V
4.5V
60µs PULSE WIDTH 60µs PULSE WIDTH
Tj = 25°C Tj = 175°C
0.1 1
0.1
0 1 10 100
100 0.1
0 1 10 100
100
VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

1000 30
T J = 175°C
Gfs, Forward Transconductance (S)
ID, Drain-to-Source Current (Α)

25
100

T J = 175°C 20

10
15 T J = 25°C

T J = 25°C
10
1

VDS = 25V 5 VDS = 8.0V

60µs PULSE WIDTH
0 380µs PULSE WIDTH
4 5 6 7 8 9 10 0
0 10 20 30 40
VGS, Gate-to-Source Voltage (V)
ID, Drain-to-Source Current (A)

Fig 3. Typical Transfer Characteristics Fig 4. Typical Forward Transconductance

Vs. Drain Current
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IRFR/U4105Z

1200 20
VGS = 0V, f = 1 MHZ ID= 18A
C iss = C gs + C gd, C ds SHORTED
VDS= 44V

VGS, Gate-to-Source Voltage (V)

1000 C rss = C gd
16 VDS= 28V
C oss = C ds + C gd
VDS= 11V
C, Capacitance (pF)

800
Ciss
12

600

8
400

Coss 4
200
FOR TEST CIRCUIT
Crss SEE FIGURE 13
0
0
1 10 100 0 5 10 15 20 25 30
QG Total Gate Charge (nC)
VDS, Drain-to-Source Voltage (V)

Fig 5. Typical Capacitance Vs. Fig 6. Typical Gate Charge Vs.

Drain-to-Source Voltage Gate-to-Source Voltage

1000.0 1000
OPERATION IN THIS AREA
LIMITED BY R DS(on)
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)

100.0 100

T J = 175°C
10.0 10
100µsec

T J = 25°C 1
1.0
1msec
Tc = 25°C
VGS = 0V Tj = 175°C 10msec
Single Pulse
0.1 0.1
0.0 0.5 1.0 1.5 2.0 1 10 100 1000
VSD, Source-toDrain Voltage (V) VDS , Drain-toSource Voltage (V)

Fig 7. Typical Source-Drain Diode Fig 8. Maximum Safe Operating Area

Forward Voltage
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30 2.5

RDS(on) , Drain-to-Source On Resistance

ID = 18A
VGS = 10V
25
2.0
ID , Drain Current (A)

20

(Normalized)
15 1.5

10
1.0
5

0 0.5
25 50 75 100 125 150 175 -60 -40 -20 0 20 40 60 80 100 120 140 160 180

T J , Junction Temperature (°C) T J , Junction Temperature (°C)

Fig 9. Maximum Drain Current Vs. Fig 10. Normalized On-Resistance

Case Temperature Vs. Temperature

10

D = 0.50
Thermal Response ( Z thJC )

1
0.20
0.10
0.05
Ri (°C/W) τi (sec)
R1 R2 R3
0.1 R1 R2 R3
0.02 τJ τC 1.100 0.000174
0.01 τJ τ
τ1 τ2 τ3
τ1 τ2 τ3 1.601 0.000552
0.01 Ci= τi/Ri 0.418 0.007193
SINGLE PULSE Ci i/Ri
( THERMAL RESPONSE ) Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-006 1E-005 0.0001 0.001 0.01

t1 , Rectangular Pulse Duration (sec)

Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case

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IRFR/U4105Z

120
15V

EAS, Single Pulse Avalanche Energy (mJ)

ID
TOP 2.0A
100
3.5A
L DRIVER BOTTOM 18A
VDS

80
RG D.U.T +
V
- DD
IAS A 60
20V
VGS
tp 0.01Ω
40
Fig 12a. Unclamped Inductive Test Circuit
V(BR)DSS 20
tp

0
25 50 75 100 125 150 175

Starting T J, Junction Temperature (°C)

I AS
Fig 12c. Maximum Avalanche Energy
Fig 12b. Unclamped Inductive Waveforms
Vs. Drain Current
QG

10 V
QGS QGD 4.5
VGS(th) Gate threshold Voltage (V)

VG
4.0

Charge 3.5
Fig 13a. Basic Gate Charge Waveform ID = 250µA
Current Regulator
Same Type as D.U.T. 3.0

50KΩ

12V .2µF 2.5

.3µF

+
V
D.U.T. - DS
2.0
VGS -75 -50 -25 0 25 50 75 100 125 150 175
3mA T J , Temperature ( °C )

IG ID
Current Sampling Resistors

Fig 13b. Gate Charge Test Circuit Fig 14. Threshold Voltage Vs. Temperature
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 IRFR/U4105Z

100
Duty Cycle = Single Pulse

Allowed avalanche Current vs

Avalanche Current (A)

10 0.01 avalanche pulsewidth, tav

assuming ∆ Tj = 25°C due to
avalanche losses. Note: In no
0.05
case should Tj be allowed to
0.10 exceed Tjmax

0.1
1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01

tav (sec)

Fig 15. Typical Avalanche Current Vs.Pulsewidth

30 Notes on Repetitive Avalanche Curves , Figures 15, 16:

TOP Single Pulse (For further info, see AN-1005 at www.irf.com)
BOTTOM 1% Duty Cycle 1. Avalanche failures assumption:
25 ID = 18A Purely a thermal phenomenon and failure occurs at a
EAR , Avalanche Energy (mJ)

temperature far in excess of T jmax. This is validated for

every part type.
20 2. Safe operation in Avalanche is allowed as long asTjmax is
not exceeded.
3. Equation below based on circuit and waveforms shown in
15
Figures 12a, 12b.
4. PD (ave) = Average power dissipation per single
10 avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for
voltage increase during avalanche).
5 6. I av = Allowable avalanche current.
7. ∆T = Allowable rise in junction temperature, not to exceed
Tjmax (assumed as 25°C in Figure 15, 16).
0 tav = Average time in avalanche.
25 50 75 100 125 150 175 D = Duty cycle in avalanche = tav ·f
Starting T J , Junction Temperature (°C) ZthJC(D, tav ) = Transient thermal resistance, see figure 11)

PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC

Fig 16. Maximum Avalanche Energy Iav = 2DT/ [1.3·BV·Zth]
Vs. Temperature EAS (AR) = PD (ave)·tav
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IRFR/U4105Z

Driver Gate Drive

D.U.T Period D=
P.W.
Period
+ P.W.

ƒ
*
VGS=10V
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
- • Low Leakage Inductance D.U.T. ISD Waveform
Current Transformer
+
‚ Reverse
Recovery Body Diode Forward
- „ + Current Current
- di/dt
D.U.T. VDS Waveform
Diode Recovery
 dv/dt
VDD

RG • dv/dt controlled by RG VDD Re-Applied

• Driver same type as D.U.T. + Voltage Body Diode Forward Drop
• I SD controlled by Duty Factor "D" - Inductor Curent
• D.U.T. - Device Under Test

Ripple ≤ 5% ISD

* VGS = 5V for Logic Level Devices

Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel
HEXFET® Power MOSFETs

RD
V DS

VGS
D.U.T.
RG
+
-VDD

10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %

Fig 18a. Switching Time Test Circuit

VDS
90%

10%
VGS
td(on) tr t d(off) tf

Fig 18b. Switching Time Waveforms

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 IRFR/U4105Z
D-Pak (TO-252AA) Package Outline
Dimensions are shown in millimeters (inches)

2.38 (.094)
6.73 (.265) 2.19 (.086)
6.35 (.250) 1.14 (.045)
0.89 (.035)
-A-
5.46 (.215) 1.27 (.050) 0.58 (.023)
5.21 (.205) 0.88 (.035) 0.46 (.018)

6.45 (.245)
5.68 (.224)
6.22 (.245)
5.97 (.235) 10.42 (.410)
1.02 (.040) 9.40 (.370) LEAD ASSIGNMENTS
1.64 (.025) 1 2 3
1 - GATE
0.51 (.020) 2 - DRAIN
-B- MIN. 3 - SOURCE
1.52 (.060) 4 - DRAIN
1.15 (.045)
0.89 (.035)
3X
0.64 (.025) 0.58 (.023)
1.14 (.045) 0.46 (.018)
2X 0.25 (.010) M A M B
0.76 (.030)

2.28 (.090) NOTES:

1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
4.57 (.180) 2 CONTROLLING DIMENSION : INCH.
3 CONFORMS TO JEDEC OUTLINE TO-252AA.
4 DIMENSIONS SHOWN ARE BEFORE SOLDER DIP,
SOLDER DIP MAX. +0.16 (.006).

D-Pak (TO-252AA) Part Marking Information

Notes : T his part marking information applies to devices produced before 02/26/2001
EXAMPLE: T HIS IS AN IRFR120
WIT H AS S EMBLY
LOT CODE 9U1P INT ERNATIONAL DAT E CODE
RECTIFIER IRFU120
YEAR = 0
LOGO 016
WEEK = 16
9U 1P

ASS EMBLY
LOT CODE

Notes : T his part marking information applies to devices produced after 02/26/2001

EXAMPLE: T HIS IS AN IRFR120

PART NUMBER
WIT H AS S EMBLY INT ERNATIONAL
LOT CODE 1234 RECTIFIER IRFU120 DATE CODE
AS SEMBLED ON WW 16, 1999 LOGO 916A YEAR 9 = 1999
IN T HE AS SEMBLY LINE "A" 12 34 WEEK 16
LINE A
ASS EMBLY
LOT CODE

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IRFR/U4105Z
I-Pak (TO-251AA) Package Outline
Dimensions are shown in millimeters (inches)

6.73 (.265) 2.38 (.094)

6.35 (.250) 2.19 (.086)
-A-
1.27 (.050) 0.58 (.023)
5.46 (.215)
0.88 (.035) 0.46 (.018)
5.21 (.205)
LEAD ASSIGNMENTS
4 1 - GATE
6.45 (.245) 2 - DRAIN
5.68 (.224) 3 - SOURCE
1.52 (.060) 6.22 (.245) 4 - DRAIN
1.15 (.045) 5.97 (.235)

1 2 3

-B- NOTES:
1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982.
2.28 (.090) 9.65 (.380) 2 CONTROLLING DIMENSION : INCH.
1.91 (.075) 8.89 (.350) 3 CONFORMS TO JEDEC OUTLINE TO-252AA.
4 DIMENSIONS SHOWN ARE BEFORE SOLDER DIP,
SOLDER DIP MAX. +0.16 (.006).

1.14 (.045) 1.14 (.045)

3X 0.89 (.035)
0.76 (.030) 3X 0.89 (.035)
0.64 (.025)

2.28 (.090) 0.25 (.010) M A M B 0.58 (.023)

0.46 (.018)
2X

I-Pak (TO-251AA) Part Marking Information

Notes : T his part marking information applies to devices produced before 02/26/2001

EXAMPLE: T HIS IS AN IRFR120

INT ERNAT IONAL DAT E CODE
WIT H AS SEMBLY
RECT IFIER IRFU120
LOT CODE 9U1P YEAR = 0
LOGO 016
WEEK = 16
9U 1P

AS S EMBLY
LOT CODE

Notes : T his part marking information applies to devices produced after 02/26/2001

EXAMPLE: T HIS IS AN IRFR120 PART NUMBER

INTERNATIONAL
WIT H AS SEMBLY
RECT IFIER IRFU120 DAT E CODE
LOT CODE 5678
LOGO 919A YEAR 9 = 1999
AS SEMBLED ON WW 19, 1999
56 78 WEEK 19
IN T HE ASS EMBLY LINE "A"
LINE A
ASS EMBLY
LOT CODE

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 IRFR/U4105Z
D-Pak (TO-252AA) Tape & Reel Information
Dimensions are shown in millimeters (inches)
TR TRR TRL

16.3 ( .641 ) 16.3 ( .641 )

15.7 ( .619 ) 15.7 ( .619 )

12.1 ( .476 ) 8.1 ( .318 )

FEED DIRECTION FEED DIRECTION
11.9 ( .469 ) 7.9 ( .312 )

NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.

13 INCH

16 mm
NOTES :
1. OUTLINE CONFORMS TO EIA-481.

Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
‚ Limited by TJmax, starting TJ = 25°C, L = 0.18mH … Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive
RG = 25Ω, IAS = 18A, VGS =10V. Part not
recommended for use above this value.
ƒ Pulse width ≤ 1.0ms; duty cycle ≤ 2%.
„ Coss eff. is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS .
avalanche performance.
† This value determined from sample failure population. 100%
tested to this value in production.
‡ When mounted on 1" square PCB (FR-4 or G-10 Material) .
For recommended footprint and soldering techniques refer to
application note #AN-994

Data and specifications subject to change without notice.

This product has been designed and qualified for the Automotive [Q101] market.
Qualification Standards can be found on IR’s Web site.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.8/03
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