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INTRODUCTION TO AMPLIFIER DESIGN - BJT
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BJT AMPLIFIER DESIGN – SMALL SIGNAL DESIGN
➢DC AND AC CHARACTERISTIC
➢BIAS DESIGN and SMALL SIGNAL DESIGN
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BJT AMPLIFIER: DC AND AC CHARACTERISTIC
The transistor is a three-layer semiconductor
device consisting of either two n- and one p-type
layers of material or two p- and one n-type
layers of material. The former is called an npn
transistor.
The p-type material consists of majority hole
while n-type consists of electron as majority
carrier.
When VCB voltage apply (Base-Collector), all the
electron will join with hole in p-type material and
become negative ion, this negative ion will attract
to positive potential of VCB, therefore electron
move from P to N, then when VBE voltage apply
to junction NP, where all the electron in n-type
material will push by negative potential in VBE
toward to collector. As movement electron
5
From the curve clearly indicate that the approximate
to the relationship between IE and IC in the active
region is given by;
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BJT AS VOLTAGE AMPLIFIER
To obtain output voltage as voltage amplifier, is by pass
output current (ic) through output resistor (Rc or Zout) and
take voltage across the resistor as the output.
8
VTC - BJT
Biasing BJT is to obtain linear amplification from BJT.
The VBE is selected to obtain operation at a Q point on
the segment YZ of the VTC – Voltage Transfer Characteristic
(as show on figure).
9
BJT amplifier biased at a point Q with a small
voltage signal VBE.
10
MULTISIM SIMULATION BJT - VTC
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MULTISIM SIMULATION VARIOUS OF DC CURRENT GAIN (β)
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VARIOUS OF DC CURRENT GAIN (β) USING
DATASHEET
TRANSISTOR : 2N2222A
TRANSISTOR: 2N2222A
min test current max min test current max
IC(mA) 0.05 0.1 0.15 min = test current - 50% of test current IC(mA) 75 150 225 min = test current - 50% of test current
choose β = 50 max = test current + 50% of test current choose βavg = 200 max = test current + 50% of test current
VO(MAX) ;
ICSAT AC LOAD LINE
It can be determine when either between GAP A or GAP B which one is smallest gap.
Example;
If GAP A smallest gap, then VO(MAX) = (VCEQ – 0 )Vp
If GAP B smallest gap, then VO(MAX) = (VCE’ – VCEQ)Vp
Q-POINT
ICQ
DC LOAD LINE
GAP B
15
16
DETERMINE After determine IE, then calculate ib by refer in datasheet/simulation
RESISTOR R1& R2 ib =
ic
IE
VR1
R1 = ;VR1 = VCC − VR 2
iR1 17
BJT: BIAS SETUP
FIXED-BIAS SETUP
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EMITTER-STABILIZED SETUP
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VOLTAGE-DIVIDER SETUP
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HYBRID- MODEL FOR BJT
gmV = ib
IC I E
VT
r = ; where VT = 26mV
IE
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BJT AMPLIFIER: CONFIGURATION
COMMON EMITTER COMMON COLLECTOR COMMON BASE
AV HIGH (180° DIFFERENT ≈ 1 (SAME PHASE) HIGH (SAME PHASE)
PHASE)
AI HIGH HIGH ≈1
AP HIGH LOW MEDIUM
ZIN MEDIUM HIGH LOW
ZOUT MEDIUM LOW HIGH
22
Start
DESIGN CONCEPT
Standardize Simulate circuit Analyse given
component with with calculate design
IEEE standard value specification
24
BJT-COMMON EMITTER DESIGN
ZO ≤ 10kΩ INPUT
Q1
VCC
AV ≥ 40dB@100 BC107BP 20V
VCC = +20V
RE
CE
25
BC107A DC CURRENT GAIN(β)
COMMON EMITTER
AV HIGH (180° DIFFERENT
PHASE)
AI HIGH
AP HIGH
ZIN MEDIUM
ZOUT MEDIUM 26
1) Given AV = 40dB @100 then IC (mA)
RB = ZO = RC
IB
VCC − VBE − VE ZO = 1k 3
RE
RB =
IE
20 − 0.7 − 7.4
RB =
2m
290
RB = 1.73M
28
Simulate with actual value Simulate with E12 resistor value
IE = 2.08mA IE = 1.97mA
VCE = 9.62V VCE = 9.6V
29
Based on the actual and standard resistor value, the gain which produced by using Multisim EDA tool
shown slightly achieve the targeted value.
30
BJT-COMMON EMITTER DESIGN
Design Voltage Divider Bias BJT emitter stabilized which given speciation;
Transistor = 2N2222A R1 RC
CO
ZIN ≤ 10KΩ OUTPUT
AV ≥ 33dB@44.67
VCC = +25V RE
CE
VOmax ≥ 3.5Vp R2
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DC CURRENT GAIN (β)
COMMON EMITTER
AV HIGH (180° DIFFERENT
PHASE)
AI HIGH
AP HIGH
ZIN MEDIUM
ZOUT MEDIUM32
VIN VOUT IC (mA)
VT
IR 2 = A IB Zin = R1 R 2 r ; r =
IE
A is multification factor, choose A = 50,thus;
100 26m
IR 2 = 50 0.1m Zin = 2.81k 2.14k
10m
IR 2 = 5mA Zin = 214.11
VR 2 10.7 ZO = RC RL
R2 = = = 2.14k
IR 2 5m ZO = 500 ||100k
ZO = 497.51 34
Simulate with actual value Simulate with E12 resistor value
IE = 10.1mA IE = 10.5mA
VCE = 9.7V VCE = 9.5V MULTISIM SIMULATION
Simulate with actual value
35
Based on the actual and standard resistor value, the gain which produced by using Multisim EDA tool
shown slightly achieve the targeted value.
36
BJT-COMMON EMITTER DESIGN UNBYPASS
CAPACITOR
Design Voltage Divider Bias BJT emitter stabilized with un-bypass
capacitor which given speciation;
Transistor = 2N2222A
ZIN ≤1kΩ
ZO ≤10kΩ
VOmax 3.5Vp
AV ≥ 5@13.97dB
VCC = +10V
37
DC CURRENT GAIN
COMMON EMITTER
AV HIGH (180° DIFFERENT
PHASE)
AI HIGH
AP HIGH
ZIN MEDIUM
ZOUT MEDIUM38
Determine rπ from AV equation; where RC IE = VRC = VOMAX = 3.5V
− RC RL VOMAX
AV = VE = − VT
r + RE AV
VT 3.5
where r = and RC RL RC , thus; VE = − 26m
IE 5
VE = 0.674V
− RC
AV =
VT
+ RE
IE
set IE IC = 5mA
− RC VE
ac parameter analysis for given circuit; AV = ;where VT = 26mV and RE = as refer in datasheet the value of =100,thus;
VT IE
VO − RC RL + RE
AV = = IE
VIN r + RE
;
VE = IE RE
VT − RC VE 0.674
r = ; AV = RE = =134.8 and;
IE VT VE =
+ IE 5m
Zin = R1 R 2 (r + RE ); IE IE
ZO = RC RL; − RC IE
AV = VOMAX 3.5
VT + VE RC = = = 700
IE 5m
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VR 2 = VRE + VBE IR1 = IB + IR 2
VR 2 = 0.674 + 0.7 IR1 = 50u + 5m
VR 2 = 1.374V IR1 = 5.05mA
IC 5m
IB = = = 50uA VR1 = VCC − VR 2
100
IC (mA)
VR1 = 10 − 1.374
Note that Gap B << Gap A
ICSAT
IR 2 = A IB VR1 = 8.626V
AC&DC A is multification factor, choose A = 100,thus;
LOAD LINE
IR 2 = 100 50uA VR1 8.626V
R1 = = = 1.71k
IR 2 = 5mA IR1 5.05m
Q-POINT
ICQ
VR 2 1.374
10V R2 = = = 274.8
5.83V IR 2 5m
VCEQ VCE CUTOFF
VCE (V)
GAP A
GAP B
(3.5+0.674=4.17)V
40
VT
Zin = R1 R 2 (r + RE ); r =
IE
100 26m
Zin = 1.71k 274.8 (
+ 100 134.8 )
5 m
Zin = 232.82
ZO = RC RL
ZO = 700 ||100k
ZO = 695.13
41
Simulate with actual value Simulate with E12 resistor value
IE = 5.25mA IE = 5.23mA
VCE = 5.593V VCE = 5.693V MULTISIM SIMULATION
42
Based on the actual and standard resistor value, the gain which produced by using Multisim EDA tool
shown slightly achieve the targeted value.
43
BJT-COMMON COLLECTOR DESIGN
Design Voltage Divider Bias BJT emitter stabilized which given speciation;
Transistor = 2N4400
ZIN ≥ 1kΩ
ZO ≤ 500Ω
AV ≈ 1
VCC = +9V
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2N4400 DC CURRENT GAIN
COMMON COLLECTOR
AV ≈ 1 (SAME PHASE)
AI HIGH
AP LOW
ZIN HIGH
ZOUT LOW 45
VIN
RE set AV 0.98 and AV 1
AV = VT AV
gmVn
RE + r VE =
R1//R2
rn VT VE 1 − AV
where r = and RE= 26m 0.98
IE IE VE =
VE 1 − 0.98
VOUT
AV = IE VE = 1.274V
VE VT
ZIN RE
+ VE = VOMAX = 1.274V
IE IE
VE
AV =
set IE IC = 1.5mA
ZOUT
VE + VT
Gain calculation; Zin calculation where, VT thus as refer in datasheet the choosen is;
VE = ;
ie = ib move RE from base to emitter then; 1
−1 min =20,thus;
Zi = R1|| R 2 || (r + RE ) AV
Vo Vi − Vo
=
r
VT
RE VE =
1 − AV
r Zo calculation, where Vi s/c, then;
Vo + = Vi AV
RE =
VE 1.274
= = 849.33
RE Zo =
r
|| RE VT AV IE 1.5m
VE =
Vo 1 − AV
= r r
Vi + r Zo ;since RE>>
RE
Vo RE
=
Vi r + RE
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VR 2 = VRE + VBE IR1 = IB + IR 2
VR 2 = 1.274 + 0.7 IR1 = 75u + 0.75m
VR 2 = 1.974V
IR1 = 825uA
IC 1.5m
IB = = = 75uA VR1 = VCC − VR 2
20
VR1 = 9 − 1.974
IC (mA) IR 2 = A IB VR1 = 7.026V
A is multification factor, choose A = 10,thus;
ICSAT Note that Gap B << Gap A
IR 2 = 10 75uA VR1 7.026V
R1 = = = 8.52k
AC&DC
LOAD LINE
IR 2 = 0.75mA IR1 825u
VR 2 1.974
Q-POINT R2 = = = 2.632k
ICQ IR 2 0.75m
7.726V 9V
VCEQ VCE CUTOFF
VCE (V)
GAP A
1.274V
GAP B
47
Zin = R1 R 2 (r + RE ); r =
VT r
ZO = || RE
IE
20 26m
Zin = 8.52k 2.632k (
+ 20 849.33 ) where in the calculation the approximation
1.5 m
has been made, where;
Zin = 1.80k
r r
ZO ;since RE
check;
r 346.67
= = 17.33
20
RE = 849.33, thus;
r
ZO
ZO 17.33
48
Simulate with actual value Simulate with E12 resistor value IE = 1.87mA
IE = 1.69mA MULTISIM SIMULATION VCE = 7.46V
VCE = 7.56V
49
Based on the actual and standard resistor value, the gain which produced by using Multisim EDA tool
shown slightly achieve the targeted value.
50
BJT-COMMON BASE DESIGN
Design Voltage Divider Bias BJT emitter stabilized which given speciation;
Transistor = 2N3019
ZIN ≤ 1k0Ω
ZO ≥ 10k0Ω
AV 150
VCC = +15V
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2N3019 DC CURRENT GAIN (DATASHEET)
COMMON BASE
AV HIGH (SAME PHASE)
AI ≈1
AP MEDIUM
ZIN LOW
ZOUT HIGH
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2N3019 DC CURRENT GAIN (SIMULATION)
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IC (mA)
from AV equation;
AC&DC
RC LOAD LINE
AV =
r
VT
where r = , thus; ICQ
Q-POINT
IE
ac parameter analysis for given circuit;
15V
RC 7.5V
VCE CUTOFF
VO − RC VT AV =
VCEQ
VCE (V)
AV = = ; r = VT
VIN r IE GAP A
IE
GAP B
r r RC IE
Zin = RE ; RE AV = ; where VT = 26mV (3.9+3.5=7.5)V
VT
r RC IE For common base the DC&AC will overlap
Zin 150 =
26m each other.
3.9 = RC IE; where RC IE = VRC
ZO RC ; RC RL VRC = 3.9V
set IE IC = 0.12mA refer in the simulation
VRC 3.9
RC = = = 32.5k
IE 0.12m
54
VRE = VCC − VRC − VCE
IR1 = IB + IR 2
VRE = 15 − 3.9 − 7.5
IR1 = 0.83u + 83u
VRE = 3.6V
IR1 = 83.83uA
VRE 3.6
RE = = = 30k
IE 0.12m
VR1 = VCC − VR 2
VR 2 = VRE + VBE VR1 = 15 − 4.3
VR 2 = 3.6 + 0.7 VR1 = 10.7V
VR 2 = 4.3V
VR1 10.7
R1 = = = 127.64k
By using simulation, = 144 IR1 83.83u
IC 0.12m
IB = = = 0.83uA r r
144 Zin ; where RE
IR 2 = A IB 26m 1
Zin
A is multification factor, choose A = 100,thus; 0.12m
IR 2 = 100 0.83u Zin 216.67
IR 2 = 83uA
ZO RC
VR 2 4.3 ZO = 32.5k
R2 = = = 51.81k 55
IR 2 83u
Simulate with actual value Simulate with E12 resistor value IE = 0.134mA
IE = 0.124mA MULTISIM SIMULATION VCE = 4.4V
VCE = 4.0V
56
57
FET AMPLIFIER DESIGN – SMALL SIGNAL DESIGN
➢DC AND AC CHARACTERISTIC
➢BIAS DESIGN and SMALL SIGNAL DESIGN
58
FET AMPLIFIER: DC AND AC CHARACTERISTIC
FET vs BJT
❑ FETs are voltage controlled devices where BJTs are current controlled devices
❑ FETs also have a higher input impedance, but BJTs have higher gain
❑ FETs are less sensitive to temperature variations and because their construction
they are more easily integrated on ICs.
59
FET
JFET
D/E - MOSFET
N-Channel N-Channel
P-Channel P-Channel
60
JFET OPERATION
VGS = 0V and VDS less than “pinch off” voltage
61
When a VDS voltage applied, current flow and the VGS from zero to some negative value and
channel react like a conventional resistor. When VDS VDS above “pinch off” voltage
increase toward “pinch-off” voltage the drain current
also increase and initially transistor working in the
“ohmic region”.
However as VDS increase, the depletion layer at the
gate junctions are also becoming thicker and
narrowing the N-type channel available for
conduction. Then come a point, know as “pinch-off”
where the conducting channel become narrow enough
to cancel out the effect of current increasing with the
applied voltage VDS which shown in figure.
Above the ohmic point, there is little further increase
in drain current and the transitor is said to operating
in "saturation mode“. With this effect, the JFET biased
in this way, a small change in VGS can be used to
control the current through the source−drain channel
from its maximum(saturated) value to zero current
62
JFET OUTPUT CHARACTERISTIC
As shown in figure, the drain current ID shows
very little change, and the curves are very
nearly horizontal at voltages greater than
the pinch off voltage. Almost all of the
expected increase in current, due to the
increase in voltage between Source and
Drain (VDS), is offset by the narrowing of the
conducting channel due to the growing
depletion layers.
63
JFET TRANSFER CHARACTERISTIC
The transfer characteristics defined by
Shockley’s equation are unaffected by the
network in which the device is employed
Schockley’s Equation
64
D-MOSFET OPERATION
The drain (D) and source (S) connect to the n-doped regions. These n-
doped regions are connected via an n-channel. This n-channel is
connected to the gate (G) via a thin insulating layer of SiO2. The n-
doped material lies on a p-doped substrate that may have an
additional terminal connection called substrate (SS).
The positive voltage applied on the gate and attracts more free
electrons into the conducing channel, while at the same time repelling
holes down into the P type substrate. The more positive the gate
potential, the deeper, and lower resistance is the channel. Increasing
positive bias therefore increases current flow. This useful
depletion/enhancement version has the disadvantage that, as the
gate area is increased, the gate capacitance is also larger than true
depletion types. This can present difficulties at higher frequencies.
65
D-MOSFET TRANSFER CHARACTERISTIC
Drain and transfer characteristic for an n-channel
depletion type MOSFET.
66
E-MOSFET OPERATION
The drain (D) and source (S) connect to the to n-doped regions. These n-
doped regions are connected via an n-channel. The gate (G) connects
to the p-doped substrate via a thin insulating layer of SiO2. There is no
physical channel. The n-doped material lies on a p-doped substrate
that may have an additional terminal connection called the substrate
(SS).
At VGS=0 V or VGS<VGS(TH)
ID = IS = 0, no current flow.
67
At VGS > VTH
▪ Density of free electrons in the induce channel will increase.
▪ If VGS is constant and increase the level of VDS, the ID will reach
saturation
▪ Therefore, VD(sat) = VGS - VTH
68
E-MOSFET TRANSFER CHARACTERISTIC
Drain and transfer characteristic for an n-
channel depletion type E-MOSFET.
69
FET AS VOLTAGE AMPLIFIER
To obtain output voltage as voltage amplifier, is by pass
output current (id) through output resistor (RD or Zout) and
take voltage across the resistor as the output.
70
VTC - FET
Biasing FET is to obtain linear amplification from FET transistor.
The VGS is selected to obtain operation at a Q point on
the segment AB of the VTC (as show on figure).
71
The FET amplifier with a small time-varying
signal vgs(t) superimposed on the dc bias
voltage VGS.
The MOSFET operates on a short almost-linear
segment of the VTC around the bias point Q
and provides an output voltage;
VDS = AV(VGS)
72
Determine VTC by Graphical Analysis
ID (mA)
VO(MAX) ;
It can be determine when either between GAP A or GAP B which one is smallest gap.
IDSAT AC LOAD LINE Example;
If GAP A smallest gap, then VO(MAX) = (VDSQ – 0 )Vp
If GAP B smallest gap, then VO(MAX) = (VDS’ – VDSQ)Vp
Q-POINT
IDQ
DC LOAD LINE
GAP B
73
MULTISIM SIMULATION FET - VTC
R1
10kΩ
VDS VDS
20V
Q1
PN4416
VGS
5V
74
DETERMINE IDSS AND VP BASED ON SIMULATION
75
Q1
PN4416 VDS
VGS
76
77
Choosing method;
VPAVG =
( −3.0 ) + ( −0.3) = (−1.65V )
2
Example;
set R1+R2 10M
R2
VR 2 = VCC ;VR 2 = VG
R1 + R 2
VR 2 ( R1 + R 2)
R2 =
VCC
R1 = RT − R 2
79
FET-GENERAL RELATIONSHIPS DC PARAMTERS
For all FETs family; For E-MOSFET
IG 0 A I D = k (VGS − VT ) 2
ID IS
where k ;
For JFET and D-MOSFET I D (ON )
k=
V
2
(VGS (ON ) − VT )2
I D = I DSS 1 − GS
VP
80
FET-GENERAL RELATIONSHIPS AC PARAMTERS
The change in drain current that will result from a change in
gate-to-source voltage can be determined using the
transconductance factor “gm”
I D
gm =
VGS
The prefix trans - in the terminology applied to g m reveals that
it establishes a relationship between an output and an input
quantity.
The root word conductance was chosen because “gm” is
determined by a current-to-voltage ratio similar to the ratio that
defines the conductance of a resistor
81
From figure (as graphical method), the “gm” is actually the
slope of the characteristics at the point of operation
y ID
gm = m = =
x VGS
2 IDSS VGS
gm = 1 − Vp Applicable for JFET and D-MOSFET
Vp
gm = 2k (VGS(ON) − VTH )
where;
Applicable for E-MOSFET
I D (ON )
k=
(VGS (ON ) − VTH ) 2
82
Input impedance;
Zin =
Output impedance;
1
Zout = rd =
yos
where yos is output admittance equivalentcircuit parameter which listed in FET datasheet
83
FET: BIAS SETUP
FIXED-BIAS SETUP
FET configurations that can be solved just
as directly using either a mathematical or
a graphical approach. Note that at
source, the resistor effect is neglected.
I G 0A
VRG = 0V
VGS = (−VGG ) Plotting Shockley’s equation Fixed-bias configuration to
determine Q-Point
84
SELF-BIAS SETUP
Self-bias configurations eliminated two(2)
dc supplies. The controlling gate-to-source
voltage is now determined by the voltage
across a resistor RS introduced in the
source leg of the configuration.
VRG = 0V
VGS = (− I D R S )
VDS = VDD − I D ( RS + RD )
R2
VG = VDD
R1 + R2 Voltage divider-bias configuration Effect of RS on the resulting Q-Point
to determine Q-Point.
86
FET AMPLIFIER: CONFIGURATION
COMMON SOURCE COMMON DRAIN COMMON GATE
AV MEDIUM (180° ≈ 1 (SAME PHASE) HIGH (SAME PHASE)
DIFFERENT PHASE)
AI MEDIUM HIGH LOW
AP HIGH MEDIUM LOW
ZIN MEDIUM HIGH LOW
ZOUT MEDIUM LOW HIGH
87
FET-COMMON SOURCE DESIGN
Transistor = 2N5556
ZO ≥ 1KΩ
ZIN ≥ 1MΩ
COMMON
AV ≥ 10dB@3.16
SOURCE
VCC = Between +10V to +20V
Vomax 2.5Vp AV MEDIUM (180°
DIFFERENT PHASE)
AI MEDIUM
AP HIGH
ZIN MEDIUM
ZOUT MEDIUM
88
2N5556 ELECTRICAL CHARACTERISTICS
90
Determine ID where VGS = (-0.525V), thus;
2 VOMAX VGS
2
VGS = 1 − VP ID = IDSS 1 −
AV Vp VP
−0.525
2
2 VOMAX ID = 1.5m 1 −
Where = 1 − −2.1
ID (mA)
AV Vp
ID = 0.84mA
VGS = VP
VOMAX = VRD = 2.5V
set = 0.25 where value of cannot 1 Note that Gap B << Gap A
VGS = 0.25 VP VRD 2.5
RD = = = 2.98k
ID 0.84m IDSAT AC LOAD LINE
VGS = 0.25 ( −2.1)
VGS = ( −0.525V )
VGS = (−0.525V )
determine how much gain required;
if VG 0V
Q-POINT
2 VOMAX VGS = VG − VS IDQ
= 1 −
AV Vp VS = VG − VGS
2 VOMAX VS = 0 − (−0.525) DC LOAD LINE
0.25 = 1 −
AV Vp VS = 0.525V 11.98V 14.47V 15V
VDSQ VDS VDS CUTOFF
2 VOMAX Where VS = VLOSSES VDS (V)
AV =
1 − Vp VRS = VLOSSES = 0.525V GAP A 2.5V
2 2.5 GAP B 0.535V
AV = VRS 0.525
RS = = = 625
1 − 0.25 2.1 ID 0.84m
LOSSESS
92
93
With same specification in self-bias, compute paramater
required for voltage divider bias;
VRS VS 5 ID (mA)
RS = = = = 5.95k
ID = 0.84mA ID ID 0.84m
VGS = (−0.525V ) then;
VG = VR 2 = 4.475V
ZO RD
ZO 2.98k 94
Simulate with actual value ID = 0.8mA
Simulate with standard value VDS = 8.31V
ID = 0.8mA
VDS = 7.95V MULTISIM SIMULATION
95
96
FET-COMMON SOURCE DESIGN EXERCISE
Transistor = 2N5556
ZIN ≥ 10kΩ
ZO ≥ 10kΩ
AV ≥ 25dB
VCC = +20V
Vomax ≥ 2Vp
Modify self-bias into voltage divider bias and
compute all required parameters
97
FET-COMMON DRAIN DESIGN
Transistor = PN4416
ZIN ≥ 2MΩ
ZO ≤ 5kΩ
AV 1 COMMON DRAIN
VCC ≥ +20V
AV ≈ 1 (SAME PHASE)
AI HIGH
AP MEDIUM
ZIN HIGH
ZOUT LOW
105
PN4416 ELECTRICAL CHARACTERISTICS
R4 R3 VO
gmVgs1 RS
R1 R2
gmVgs rds RS
ZIN ZO
output impedance
input impedance set Vin → s/c and RS<<rds RS
ZIN = R1 R 2 ZO =
VO
io
Gain calculation; VO
VO − io − gmVGS = 0
AV = RS
VIN 1
VO io = VO + gm
− gmVGS = 0 RS
RS
VO 1
VO =
− gm VO − VIN = 0 io 1
RS RS + gm
1
VO + gm = gmVIN VO 1
RS ZO = = RS
io gm
VO gm
= 1 1
VIN 1
+ gm ZO ; RS
RS gm gm
VO gm( RS )
=
VIN 1 + gm(RS) 107
gm( RS )
AV =
1 + gm(RS) 2
AV (1 + gmRS ) = gmRS VGS
2 VS ID = IDSS 1 −
AV + ( AV gmRS ) = gmRS Where = 1 − and cannot 1, thus; VP
AV Vp
−2.125
2
AV = gmRS (1 − AV ) 1 − AV ID = 10m 1 −
AV −4.25
gmRS =
1 − AV choose = 0.5; ID = 2.5mA
VGS = VP
2 IDSS VGS VGS = 0.5 −4.25
where gm = 1 − Vp VS 20.19
Vp RS = = = 8.08k
2 VGS = ( −2.125V ) ID 2.5m
VGS
and ID = IDSS 1 − ,thus;
VP
Determine VS, where = 0.5 and AV = 0.95, thus;
AV VS
= gm
1 − AV ID
2 VS
AV
=
2 IDSS VGS
1−
VS = 1 −
1 − AV Vp Vp VGS
2
AV
Vp
IDSS 1 −
VP 1 − AV
AV 2 VS AV
=
1 − AV Vp VGS (1 − ) Vp
1 − VP VS = 1 − AV
2
AV 2 VS
= 0.95
1 − AV VGS
Vp 1 − (1 − 0.5) 4.25
VP VS = 1 − 0.95
2
2 VS VS = 20.19V
VGS = 1 − VP
AV Vp 108
1 − AV
ID (mA)
VDS = VCC − VS set R1+R2 20M
GAP B << GAP A VDS = 50 − 20.19
VR 2 ( R1 + R 2)
VDS = 29.81V R2 =
VDD
IDSAT
18.065 (20M )
R2 =
50
VGS = VG − VS R 2 = 7.226M
Q-POINT VG = VGS + VS
IDQ R1 = 20M − R 2;( R1 + R 2 = 20M )
VG = −2.125 + 20.19
R1 = 20M − 7.226M
VG = 18.065V R1 = 12.774M
DC&AC LOAD LINE
VG = VR 2 = 18.065V
50V
VDSQ VDS CUTOFF
VDS (V)
29.81V
GAP A 20.19V
GAP B
109
ZIN = R1 R 2
ZIN = 12.774M || 7.226M
ZIN = 4.62M
1
ZO
gm
where;
VGS
2 IDSS
gm = 1 − Vp
Vp
2 10m −2.125
gm = 1−
4.25 −4.25
gm = 2.35mS
1
ZO
gm
1
ZO
2.35m
ZO 425.53 110
MULTISIM SIMULATION
ID = 2.48mA ID = 2.46mA
VDS = 29.8V VDS = 29.8V
111
112
FET-COMMON GATE DESIGN
Choose;
VTH = 1.5V (typ)
To determine k choose;
IDON = 1.7 A at VGSON = 10V
if the datasheet is not given the IDON ,
then only choose VDSON row, then
choose the given of IDON & VGSON 114
AV = gmRD
given that;
ID = k (VGS − VTH ) 2
IDON
k=
(VGSON − VTH ) 2
gm = 2k (VGS − VTH )
then;
VIN VO VO AV = gmRD
ZIN = ZO = where vin is s/c AV =
in in VIN AV = 2k (VGS − VTH ) RD
VRD
and RD = , then;
VIN ID
−in + − gmVgs = 0 −io +
VO
+ gmVgs = 0 VO
RS RD + gmVgs = 0 AV = 2k (VGS − VTH ) RD
VRD
VIN RD ID
in = − gm(Vg − Vs ) VO
io = + gm(Vg − Vs ) VO
RS
RD = − gm(Vg − Vs ) AV = 2k (VGS − VTH ) RD
VRD
in =
VIN
− gm(0 − VIN )
RD k (VGS − VTH ) 2
VO
RS io = + gm(Vg − VIN ) VO
RD = − gm(0 − VIN ) 2 VRD
VIN 1 AV =
= RS || VO RD (VGS − VTH )
in gm io = + gm(0 − 0) VO
RD = gmRD 2 VRD
1 VGS = VTH +
ZIN = RS || VO VIN AV
gm = RD
io
1 1
ZIN ; RS 115
gm gm
Set AV = 20@26.02dB and VRD = 6V ; VRD ID (mA)
RD =
2 VRD ID
VGS = VTH +
AV 6
RD =
2 6 8.47m
VGS = 1.5 +
20 RD = 708.38
VGS = 2.1V (VGS >> VTH;statisfy) IDSAT
VRS
IDON RS =
k= ID
(VGSON − VTH ) 2 Q-POINT
3 IDQ
k=
1.7 RS =
(10 − 1.5) 2 8.47m
A RS = 354.19 DC&AC LOAD LINE
k = 23.53m 2
V
20V
VDSQ VDS CUTOFF
ID = k (VGS − VTH ) 2 VDS (V)
11V
ID = 23.53m(2.1 − 1.5) 2
GAP A (6+3=9)V
ID = 8.47mA GAP B
116
VGS = VG − VS 1
ZIN ,where;
VG = VGS + VS gm
VG = 2.1 + 3 gm = 2k (VGS − VTH )
VG = 5.1V gm = 2(23.53m)(2.1 − 1.5)
VG = VR 2 = 5.1V gm = 28.24mS
117
MULTISIM SIMULATION
ID = 8.41mA
ID = 8.75mA VDS = 11.52V
VDS = 10.7V
118
119
SIMPLE MULTISTAGE AMPLIFIER DESIGN
❑ Multistage amplifier consists of two or more amplifiers
cascode to form a single amplifier with the desired
characteristic.
❑ In discrete form it could be BJT‐BJT, BiFET, FETFET or some
other combinations.
❑ In IC design it’s always be a combinations of single type of
transistors.
120
AVT = AV1 AV2 AV3 AVn
AVT = 5 10 6 8
AVT = 2400
Then;
VO = AVT VIN
VO = 2400 5mV
VO = 12V
121
Purposes of multistage
❑ Increasing the gain beyond the single stage amplifier gain.
❑ Modifying the impedance parameter.
Type of Multistage Amplifier
❑ BJT‐BJT cascode for pre-amplifiers.
❑ BiFET cascode for a good linear amplifier.
122
Coupling
❑ Purpose : The circuitry used to connect the output of one
stage to the input of the next stage in multistage amplifier.
Types of coupling
❑ Capacitive coupling/RC coupling
✓ Adv ‐ to block the flow of dc current
✓ Disadv – It affects the lower frequency response of the
amplifier
123
❑ Direct coupling
✓ Adv ‐ to reduction in the number of components
❑ Transformer coupling
✓ Adv ‐ low power dissipation
✓ Disadv - poor frequency response characteristics
124
CASCODE CONNECTION
❑ Cascade connections provides stages in series which is a
popular connection.
❑ The output of one amplifier stage is connected to the input
of another amplifier stages.
❑ There are 2 types;
✓ BJT & BJT
✓ BiFET
125
CASCODE-BJT&BJT DESIGN
Transistor Q1 = 2N2222A
Transistor Q2 = BC107B
ZIN ≥ 1kΩ
ZO ≤ 1kΩ
AV = 500 – 2000
Vomax = 0.5Vp – 2.5Vp
VCC = +10V
126
VIN VOUT
R11//R12 gmVn2
RC1 R21//R22 rn2 RC1
rn1 gmVn1
ZIN ZOUT
− 1( RC1 R 21 R 22 r 2) AVT = AV 1 AV 2
AV 1 = ZO = RC 2
r 1 AVT
Set RC1<< R 21 R 22 r 2, RC1, thus; AV 2 = ;Set AVT = 1000@60dB
AV 1
− 1 RC1 1000
AV 1 = AV 2 = = 52 and
r 1 19.23
VO 2MAX = AV 2 VT
VO 2MAX = 52 26m
VO 2MAX = 1.352V for AV2 127
BC107A DC CURRENT GAIN(β)
128
IC (mA)
129
2N2222A DC CURRENT GAIN(β)
130
As refer in datasheet(2N2222A), IC = 10mA and = 100
VO1MAX VRC1 0.5
RC1 = = = = 50
IC1 IC1 10m
IC1 10m
IB1 = = = 100uA
1 100
ICSAT AC LOAD LINE
IR11 = IR 21 + IB
IR 21 = A IB1
IR11 = 5m + 100u
A is multification factor, choose A = 50,thus;
IR 21 = 50 100u IR11 = 5.1mA
Q-POINT
ICQ IR 21 = 5mA
VR11 = VCC − VR 21
DC LOAD LINE VR 21 = VRE1 + VBE1 VR11 = 10 − 5.2
5V 10V VR 21 = 4.5 + 0.7 VR11 = 4.8V
VCEQ VCE 5.5V VCE CUTOFF
VCE (V) VR 21 = 5.2V VR11 4.8
GAP A R11 = = = 941.18
VR 21 5.2 IR11 5.1m
0.5V R 21 = = = 1.04k
4.5V IR 21 5m
GAP B
LOSSES
131
ACTUAL VALUE
132
STANDARD VALUE
133
134
CASCODE-BJT&FET (BIFET) DESIGN
Transistor Q1 = 2N4400
Transistor Q2 = JN310
ZIN ≥ 5kΩ
ZO ≥ 1kΩ
AV = 1000 – 5,000
VCC = Choose correct power supply
135
AV 2 = gm( RD) To determine gain distribution for each stage, the AV1
stage must be set to minima gain in order to archieve
− 1( RC R 21 R 22) the lowest RC value.
AV 1 =
r
Set RC1<< R 21 R 22 RC , thus; AV 1 =
VOMAX
;set VO1MAX = 0.65 for AV1
VT
− 1 RC
AV 1 = 0.65
r AV 1 = = 25
26m
ZO = RD AVT = AV 1 AV 2
AVT
AV 2 = ; Set AVT = 1,000@60dB
ZIN = R11|| R 21|| r AV 1
1000
AV 2 = = 40
25
136
JN310 DATASHEET
IDSS = 42mA
VP = (−4.25)
137
2 VOMAX VOMAX = VRD = 17V VG = VR 2 = 1.6VE;Set voltage source = 45V
VGS = 1 − VP
AV 2 Vp VRD 17
RD = = = 10.12k set R12+R22 15M
2 VOMAX ID 1.68m
Where = 1 −
AV 2 Vp VGS = (−3.4V ) R 22 =
VR 22 ( R12 + R 22)
VGS = VP VDD
VGS = VG − VS 1.6 (15M )
set = 0.25 where value of cannot 1 R 22 =
VG = VGS + VS ;VS = VLOSSES VGS 45
VGS = 0.80 VP R 22 = 533.33k
VG = (−3.4) + 5
VGS = 0.80 ( −4.25 )
VG = 1.6V
VGS = ( −3.4V ) R12 = 15M − R 22;( R12 + R 22 = 15M )
R12 = 15M − 533.33k
determine how much VOMAX required;
VRS = VLOSSES = 5V R12 = 14.47 M
2 VOMAX
= 1 − RS =
VRS
=
5
= 2.98k
ID (mA)
AV 2 Vp ID 1.68m ZO RD
(1 − ) ( AV 2 Vp ) ZO 10.12k
VOMAX =
2
(1 − 0.8) ( 40 4.25 )
IDSAT AC LOAD LINE Note that Gap B << Gap A
VOMAX =
2
VOMAX = 17V
Q-POINT
IDQ
139
IC (mA)
As refer in datasheet(2N4400), IC = 1mA and = 20
VOMAX VRC 0.65
RC = = = = 650
IC IC 1m
IC 1m
Q-POINT IB = = = 50uA
ICQ 20
IR 22 = A IB 2
DC LOAD LINE IR11 = IR 22 + IB
A is multification factor, choose A = 50,thus;
IR11 = 2.5m + 50u
29V 45V IR 22 = 50 50u
VCEQ VCE 29.65V VCE CUTOFF IR11 = 2.55mA
VCE (V) IR 22 = 2.5mA
GAP A
0.5V VR 21 = VRE + VBE VR11 = VCC − VR 22
15.35V
GAP B VR 21 = 15.35 + 0.7 VR11 = 45 − 16.05
LOSSES
VR 21 = 16.05V VR11 = 28.95V
VR 21 16.05 VR11 28.95
R 22 = = = 6.42k R11 = = = 11.35k
IR 21 2.5m IR11 2.55m
140
141
ACTUAL VALUE
STANDARD VALUE
142
143