1552
Phased-Array and Radar
Astounding Breakthroughs An Update
Dr. Eli Brookner, Life Fellow IEEE
Abstract-In recent years phased arrays have seen
breakthroughs that lead to capabilities not possible in the past.
This is exemplified by the development of GaAs integrated
microwave circuits called monolithic microwave integrated
circuits (MMIC). This integration has reached the point where it
is possible to now build a low cost 35 GHz phased array for a
missile seeker costing $30/element (total cost of array including
all electronics divided by number of elements). This is made
possible here because integration allows the whole TIR module to
be put on a single chip. For some application it will be possible in
the near future to put multiple receivers or transmitters on a
single chip now. The advances provided by Moore's Law has
now made it is feasible to do digital beam forming (DBF) with all
its numerous advantages. It is now possible to do DBF for a 2,500
element array at the element level, a major breakthrough. Also
covered will be: the potential for GaN and SiC chips which have
the capability of a factor of ten or more higher peak power than
GaAs chips; arrays with instantaneous bandwidths of up to 33:1;
SiGe low cost TIR modules; low cost MEMS passive arrays; a
real radar application for Multiple-Input Multiple-Output
(MIMO) as opposed to fantasy has been demonstrated by
Lincoln Lab MIT which allows coherent combining of two
radars to achieve a 9 dB increase in sensitivity; MIMO also
makes possible the optimum removal of clutter in OTH and
airborne radars by permitting adaptive control of the transmit
antenna pattern in the receiver.
Index Terms-Radar, active-phased arrays, monolithic
microwave integrated circuits, MMIC, MEMS, TIR nodule,
phased array, AESA, electronic scanning, ESA, SBX, XBR,
GBR-P, AN/APG-79, F/A-18EIF, low-cost AESA, GaAs, GaN,
SiC, SiGe, CMOS, digital beam forming, DBF, ELIM-2248, MF-
STAR, digital signal processing, adaptive arrays, sidelobe
canceler, SLC, STAP, Ultra-Wideband Antenna, Space-Based
Radar, SBR, VED, tube, Vacuum Electron Device, traveling
wave tube, TWT, packaging, Haystack Radar, Multiple-Input
Multiple-Output, MIMO, SAR, ISAR.
I. INTRODUCTION
The areas of breakthroughs covered are: 1) GaAs MIMIC, 2)
Sea-Based X-band (SBX) radar; 3) 35 GHz $19k active phased
array; 4) Low cost MEMS phased array, 5) GaN, SiC, 6) SiGe,
CMOS, 7) Digital beam fonning, 8) Digital signal processing, 9)
Adaptive arrays, 10) Space-time adaptive processing (STAP), 11)
Packaging and assembly, 12) MIMO, 13) Ultra wideband arrays,
14) Tube advancements, 15)Solid State "bottle" radars; 16)
RadarCon-2008, May, 26-30, 2008, Rome, Italy Eli Brookner is with
Raytheon Company in Sudbury, Massachusetts 01776 (Phone: 978-440-4007;
e-mail: EliBrookner@raytheon.com).
1-4244-1539-X/08/$25.00 ©2008 IEEE
Software for the design of phased arrays.
This paper is an updated version of [2].
II. GaAs MMIC TIR MODULES
Monolithic Microwave Integrated Circuits (MMICS), i.e.,
microwave integrated circuits [22,33], has extensively
successfully been applied to active electronically steered
arrays (AESAs) over the last decade providing lower cost,
more reliable, lighter weight, smaller volume systems
[1,29,30,33]; see Fig. 1. The MMIC APG-79 AESA radar on
the F/A-18 ElF allows simultaneous. air-to-air and air-to-
ground modes. This means it can defend itself while at the same
time deliver it weapon to the target. This is achieved with only a
small increase in cost of the radar over the older mechanically
scanned system [25]. AESA has permitted the Wedgetail MESA
AESA L-band arrays to be placed on the top of a Boeing 737-300
without the need of a rotodome as used on AWACS system; see
Fig. 1. It has 360° coverage, the 2 back-to-back dorsal arrays
provide ±60° coverage broadside while the antenna above them
provides endfire coverage of ±30°.
III. SEA-BASED X-BAND (SBX) RADAR [26]
The Sea Based X-Band (SBX) 24-story-high phased-array
radar, shown in Figs. 1 (lower right hand comer) is a NEW
WONDER OF THE WORLD [26]. It is the most powerful
phased-array radar in the world. It is placed on an oil platform
built in St. Petersburg Russia for this USA tracking and
discrimination Ground-Based Radar. The radome is 103 ft high,
120 ft in diameter. It is 65% populated with 45,056 T /R modules.
It has 352 subarrays with 128 T/R modules each. The subarrays
are clocked to suppress grating lobes. It uses time delay steering
at the subarray level.
IV. LOW COST PHASED ARRAYS
Who said AESAs have to be expensive? On DARPA funding
the feasibility of a low-cost, $19 K, 35-GHz seeker AESA was
demonstrated by Raytheon [52]. It consisted of --600 notch
radiating elements. The low cost was made possible because the
whole T/R module could be placed on a single MMIC chip. This
in tum was made possible because the peak power per element
only needed to be 40 mW. This results in a low cost of
$30/element when the cost of the whole array is divided by the
number of elements. DARPA also funded development of $10 X-
band, 10's mW, single chip T/R module [4].
A 76 GHz photoetched Rotman Lens array costing only a few
1552
dollars was developed for automotive cruise control [8].
V. LOW COST ME MS PHASED ARRAYS
If only we had a low loss phase shifter. Then we could go back
to the passive architecture electronic scanned phased array with
one module feeding many phase shifters, like 10. This could
potentially reduce the cost of an electronically scanned phased
array by a factor of about 10. Micro-ElectroMechanical systems
(MEMS) offer this promise. MEMS switches have improved their
reliability by 3 orders of magnitude over what was reported Oct.
2003 in [4] to a life of 600 billion switches [53, 5]. There is still
need for improvement in the loss. The loss through a 4-bit phase
shifter used in a 1-D scanned RADANT space-fed lens antenna is
--1.25 dB. Two lenses are needed for 2-D scan so that the two-
way loss for a 2-D scanned RADANT array would be --5 dB, but
progress is being made [5].
VI. GAN, SIC
Wide bandgap GaN and SiC MMIC chips offer the potential
of one to two orders increase in T/R module power. SiC is
primarily for frequencies below S-band while GaN will go
from L-band to 50 GHz; see Fig. 2 [50]. These technologies
would make it possible to upgrade an existing AESA by
replacing the GaAs T/R modules with GaN or SiC T/R
modules having 10 times the power. This provides a 78
percent increase in track range [28]. The major advantages of
GaN [44, 27] are: It has highest power density of any existing
technology (3-6 W/mm for GaN versus 0.5-1.5 for GaAs).
This permits smaller chip size and lower cost for a given
power. Smaller FET size permits wider bandwidth because of
higher impedance. It uses higher operating voltage (28-48V
for GaN vs 5-20V for GaAs) leading to more efficient power
system. It has a superior thermal conductivity (170 W/m2-K
for GaN vs 47 for GaAs; it is 490 for SiC) which permits
higher power for a given channel temperature. A phenomenal
900W peak has been demonstrated with a single GaN
transistor package [51, 49]. Some venders have achieved 80-
90% efficiencies with --lOW output power using hybrid GaN
devices in class E amplifiers [50]. CREE provides commercial
SiC hybrid devices putting out 10-60W for up to 4 GHz and
GaN hybrid devices putting out 15-120W from UHF to 40
GHz [16]. Their goal is to provide in one package 550 W
peak and 30-40 W average linear using a single stage FET.
CREE supports the design of MMIC SiC and GaN chips. For
GaN MMIC they provide 60 W saturated from 2.5-4 GHz and
25 W saturated from 5-6 GHz. See [16-18,49,50,51] for
detailed surveys of state-of-the-art on GaN and SiC.
VII. SIGE
SiGe has the advantage of using Si as a substrate, the
technology of the low-cost, commercial integrated-circuit
industry and whose extensive resources can be draw upon. It
offers the potential of higher perfonnance at low cost. SiGe does
not compete with GaAs with respect to microwave output power
or noise figure. It offers low cost and the ability to integrate many
functions on a single chip. On one chip in addition to microwave
power amplifiers and low noise figure receiver, it can have AIDs
and digital circuitry. It can have CMOS on the same chip, Si
2
CMOS; see Sect. VIII. GTRI is developing a SiGe single chip
T/R module for use in an AESA radar. Its initial design had a
peak power of --50 mW using a 2 stage power amplifier (PA).
Work is under way to achieve 1 W peak by using 3 stages [19].
The cost per element of an AESA using such a module is
expected to be 1/1OOth that of GaAs array using high power T/R
modules [19]. The low power per module is made up for in a
radar by using a larger array, one that possibly folds on itself.
VIII. CMOS
CMOS now operates at microwave frequencies. It too uses a Si
substrate and is the technology widely used in the computer
industry. It holds the promise of low cost and low power for the
receiver parts of T/R modules. Like SiGe, it has the advantage of
allowing the integration of many functions on a single chip, even
more so than SiGe. One chip can have RF, IF, baseband,
microprocessor, memory, tunable filters and AIDs - a system on
a chip (SOC). It can be combined with GaAs or GaN for the
microwave power amplifier and low noise figure receiver. Using
GaN has the advantage of being robust enough that a limiter may
not be needed. Si together with CMOS offer the possibility of the
integration of many receiver and/or transmit channels on a single
chip; see Sect. XIII.
IX. DIGITAL BEAM FORMING (DBF)
DBF has arrived for microwave AESAs radars. We see it on
the SMART-L, SMART-S, SMARTELLO, MESAR-1 and -2,
SAMPSON, AMSAR, MEADS UHF and X-band search and fire
control radars, ROTHER, OTH, and S4R [1-3]. DBF provides
many significant advantages over analog beam fonning
[1,2,3,29,30]. For large arrays I used to say DBF is only being
done at subarray. This is no longer true, Elta is doing it at the
element level for their 2,500 element EL/M-2248, a major
breakthrough; see Fig. 3. Four such Multi-Function Surveillance
Track and Guidance Radars (MF-STARs) are being placed on
Elta's new generation military ship to provide 3600 coverage [48,
49]. It is their "AEGIS" ship. It is an S-band solid-state AESA.
Using DBF eliminates the analog combining hardware, analog
down-converting and all the errors associated with them. This in
tum will lead to ultra-low sidelobes. It will allow the
implementation of multiple beams pointing in completely
different directions. It will enable the adaptive use of different
parts of the antenna for different applications at the same time. It
permits simultaneous reduction by a factor of almost 2 of the
transmit RF average search power and search occupancy [6]. The
cost savings gained from these simultaneous reductions will be
far greater than the increased cost in signal processing incurred.
At the same time the search angle accuracy is improved by about
40 percent [6]. DBF will also pennit better adaptive array
processing; see Sect. X. Fig. 3 also shows the Chinese "AEGIS".
No information is available on it.
X. DIGITAL SIGNAL PROCESSING (DSP)
DBF is made possible in part by the advances in DSP.
Moore's Law still marches on. Moore himself expects it to go
another 10-15 years. DSP in some cases is moving forward
faster than expected. Back in 2000 the DSP road map
2
1552
predicted 600 GFLOPS on a 9U board (-13in by 14 in) by the
year 2016. Mercury Computer Systems provides a processor
rd
that gives>180 GFLOPS in a box roughly 1/3 the size of a
9U board consuming 225 W. The processor uses one IBM cell
chip developed for the Sony Play Station. Three of these
would produce 540 GFLOPS - the year 2016 is here today.
Sept. 2007 Intel demonstrated a 12 inch wafer consisting of
chips with 1.9 billion transistors using 35 nm line widths.
IBM announced Dec. 2007 they now know how to build on Si
chips optical modulators 1/100-1/1000 the size possible with
existing technology - a major breakthrough. Data would
transfer at 100 times speed (10 Gb/s modulation) at 1110th the
power (5 pj/bit) offered with wires. Potential for 100-1 OOOs
cores on a future single chip, a super-computer on a chip [54].
Fig. 4 shows the state-of-the-art of AIDs. The venders are
Analog Devices, Linear Technology, and Atmel-Grenoble for the
'01-'05 points, AKM, Maxim, Rockwell and Analog Devices for
'96-'00. Moore's Law for AIDs is 0.28 bits/yr from '99-05.
XI. ADAPTIVE ARRAY PROCESSING
The development of adaptive array processing represents a
major step forward in increasing the usefulness of phased arrays.
It started with the invention by P. W. Howells of the sidelobe
canceller (SLC). The SLC nulls out jammers whose signals enter
the main antenna through its sidelobes. It nulls out the jammer by
using auxiliary antennas placed close to the main antenna. These
auxiliary antennas receive the jammed signals that are received
through the main antenna side lobes. By appropriate processing
of the auxiliary antenna signals it is possible to generate jammer
signals having the same amplitude and phase as those coming in
through the main beam side lobes. By subtracting these signals
from the jammed signals in the main channel the jammer
interference is cancelled. If a phased array is used to form the
main beam, elements forming the array can be used as auxiliary
antennas thus serving dual use. It is useful to look at the side lobe
canceller physically from another point of view. Specifically the
combination of the main antenna and the auxiliary elements with
its processing can be view as a new antenna system. As such its
antenna side lobe pattern will have nulls in the directions of the
jammers while it also has its main beam pointing in the direction
for which targets are to be detected. Very little is published re
radars using SLC because of the sensitivity of such information.
For a phased array there exists another more effective way for
canceling jammers coming in through the side lobes and even in
through the main lobe. It is to adjust adaptively the amplitude and
phase weights of the array so as to put nulls in the directions of
the jammers while maintaining the main beam pointing in the
direction for which targets are to be detected. These amplitude
and phase weight adjustments are made based on the jammed
signals seen by the array. These jammer signals let the array
processor know the directions of the jammers and in tum the
weights to be applied to put nulls in the direction of the jammers
are determined. This type of adaptive processing is known as a
fully adaptive array processor. Here again it is useful to view the
fully adaptive array from another physical point of view. We can
view the fully adaptive array processor as a SLC; see [9, 40].
Fully adaptive arrays have been too difficult to implement for
large arrays up to now, the hardware and the processing load
3
being too great. To reduce the complexity adaptive array
processing has been done at the subarray level. This reduces the
number of elements from like 1,000- 10,000 to a few tens. This is
what is done on the MESAR and AMSAR radars [41].
With the advances on DBF it is now possible to think of
achieving the performance of fully adaptive processing
without its complexity. In fact, the equivalent jammer
suppression of a fully adaptive array without its computation
and transient penalties can be achieved. This can be
accomplished with Adaptive-Adaptive Array processing [7].
This involves no more than locating digitally where the
jammers are, then pointing beam at these jammers (these
beams are effectively eigenbeams [9,10,24,36,40]) and using
these beams as sidelobe cancellers for the main beam; see
Fig. 5 ). For a 3,000-element array having to cope with 10
jammers we now have to invert an 10xl0 matrix instead of a
3,000x3,000 matrix and the transient time is reduced by a
factor of 300. In a classical fully adaptive array one does not
make use of the location of the jammers. But we can easily
determine their location rather than to put on blinders. This
method is equivalent to the method of Principal Components
[9]. The jammers can easily be located by doing a Fast Fourier
Transform across the array. This will not locate jammers less
than a beamwidth apart but for many applications it may be
good enough. If better jammer cancellation is needed, then
two squinted beams about 3/4 of a beamwidth apart can be
used for each located jammer. This is because for closely
spaced jammers, less than a beamwidth apart, the eigenbeams
are a sum and difference beams [10]. Alternately the Music
algorithm can be used; see [13]. Adaptive-Adaptive Array
Processing is in the same spirit as the knowledge aided
techniques DARPA has been recently funding known as
KASSPER (Knowledge Aided Sensor Signal Processor &
Expert System) [42,56] which they have applied to STAP
processing discussed in next section.
XII. SPACE-TIME ADAPTIVE PROCESSING (STAP)
STAP is adaptive array processing for when a pulse doppler
waveform is used. It provides adaptive nulling of ground clutter
and jammers on a moving platform where it places a 2-D
Doppler-angle null where the clutter is [9]. It can also be used to
cancel out ground clutter for a ground based pulse Doppler radar
[37]. STAP is being used on the new aircraft carriers based
Hawkeye E2-D surveillance AN/APY-9 radar shown in Fig. 3
[39]. It uses a linear passive electronically scanned array (ESA)
having 18 elements which can either be rotating (4, 5, 6 rpm) or
stationary with the array electronically steered [39]. It is used in
the littoral environment [39]. Ref. [56] gives techniques for
reducing the number of reference signal samples needed to do
STAP.
XIII. PACKAGING AND ASSEMBLY
It is now possible to package and assemble active phased
arrays having low cost, light weight, small volumes. The
technique involves the use of commercial Printed Circuit Boards
(PCB) and no packages for individual T/R modules. An X-band
building block array of 128 elements and TIR modules was built
having a size of 7.4xl0.1xO.21 in. [20,57]. Its T/R module chips
3
1552
are flip-chip mounted on the back side of the PCB. No case is
used for the modules. Small light weight circulators e.g. being
developed by [55] could be used. A packaging approach using
low and high temperature cofired ceramic (LTCC/HTCC) for the
multilayer board is presented in [21]. The ultimate in packaging
and RF integration is the placement of many receivers or
transmitter channels, or both, on a single chip together with their
combiner. This was done with 8 receiver channels integrated onto
a single chip [23]. This should be possible for some radar
applications in the near future. FutlIre plans are to integrate 16 to
32 receiver channels on a single chip and 16 transmit channels on
a single chip operating from 30-50 GHz [23].
XIV. MIMO
Lincoln Lab MIT demonstrated one can coherently combine 2
identical radars to achieve a 9 dB increase in sensitivity [11].
They first transmit from each radar orthogonal waveforms at the
same carrier frequency to achieve the coherence on receive. They
next use identical waveforms and vary the phase and delays of the
transmitted waveforms to achieve coherence on transmit on the
target as well as coherence on receive. This provides a 9 dB
increase in sensitivity over single radar. By combining N radars
they get an increase in sensitivity of N 3 • Another application for
MIMO is for OTH, airborne and ground radars. With MIMO it is
possible by transmitting orthogonal waveforms from separate
transmit elements or subarrays to identify and isolate the signals
from each transmit element or subarray. This then permits the
adaptive control at the receiver of the transmitter pattern so as to
achieve optimum clutter rejection [15]. Fig. 6 shows this for the
case where an array is used for transmit and a single element
antenna is used on receive. By using an array on receive as well
as on transmit both the transmit and receive antennas patterns can
be adaptively controlled for optimum clutter rejection. Nulls can
be placed on the transmit antenna pattern as well as the receive
pattern in the direction of strong clutter scatterers.
XV. ULTRA WIDEBANDARRAYS
Ultra wideband array technology is here. This technology allows
use of one antenna for many different applications at different
bands. Raytheon has developed a dual polarized notch radiating
element that has an instantaneous bandwidth from 1.8 to 18 GHz [4,
43]. Georgia Tech. Research Inst. (GTRI) is developing array
having 33:1 instantaneous bandwidth with potential of 100:1 [38].
XVI. TUBE ADVANCEMENTS
Tubes are making major advances [12, 14, 3]. The availability
of powerful software now allows the design of tubes without the
need for trial and error. It has been recently shown that it is
feasible to build an active 2-D phased array at X-band using
TWTS that fit within the array lattice, one TWT per element [12].
XVII. SOLID STATE "BOTTLE" PHASED-ARRAY
AND REFLECTOR RADARS
The new E-2D radar of Fig. 3 uses a solid state "bottle"
transmitter. Its range is 350 nmi [39]. Kevin Hughes (of England)
and New Japan Radio are now offering low cost marine radars
which replace the magnetron transmitters with low power solid
state transmitters at S-band. They are using pulse compression to
4
achieve low peak power. Raytheon has developed a solid state
replacement for the airport surface surveillance radar at X-band,
the ASDE-X [45].
XVIII. SOFTWARE FOR THE DESIGN OF PHASED
ARRAYS
Powerful software is available now {like HFSS, PARANA,
and CST) that allows the prediction of the performance of
antennas to very high accuracy without the need for costly
trial and error constructions and measurements. An array
designed in the mid '70's required much trial-and-error and
measurements. Today it can be designed without trial-and -
error to a small fraction of a dB using Ansoft's HFSS.
XIX..OTHER BREAKTHROUGHS WORTH MENTIONING
1) SAR rectangular to polar transformation; 2) SAR with 4 in.
resolution at 6.5 Km; Fig. 7, [46]; 3) Interferometer SAR [34]; 4)
Carabas; 5) Maximum entropy methods; 6) Parabolic equation for
propagation analysis (TEMPER, AREPS); [31,35]; 7) Haystack
upgrade to 3cm (-1 in.) ISAR image resolution; Fig. 8, [47].
ACKNOWLEDGMENT
I thank Raymond Hale, Colin Whelan and John DeFalco of
Raytheon for their inputs on GaN, SiC, SiGe and CMOS. I thank
Carl Scheffres, Publisher of the Microwave Journal, for giving
me permission to use material from Ref. 2 for this paper.
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1 10
* GaN 2010

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[43] Trot, K, R. Cummings, et aI, Intern. Symposium on Phased
Array Systems and Technology, Boston MA, Oct. '03. Other Phased Array Systems
[44] Brierley, S., Raytheon Company Developed or Under Development
[45] Lanzkron, P. and E. Brookner, "Solid State X-Band Airport
ELTAEur.t.2248MF~8T~ NORTHROP,GRUMIIAN E2·D

2."""",AC_
Surface Surveillance Radar," RadarCon-2007, pp. 670-676.
[46] Wells, L., et aI, IEEE Aerospace Conf., "4 in. SAR", MT, 3/03 AlIA, "ACI8'~,
[47] Usoff, 1. RadarCon-2007
[48] ELTA Systems Ltd. web page
[49] Lupa, I., "Phased Array - Technology and Trends,"
International Radar Symposium India 2007 (lRSI-2007)
[50] Aethercomm, GaN Transistors for Radar, Microwave 1., 1/08
[51] Mitani, M., et aI, "800 W AIGaN/GaN HEMT S-band
Transistor," MANTECH Conf.,5114-17/07, Austin, Texas
[52] Clark, T., "Low-cost Cruise Missile Defense (LCCMD)",
DARPA Website, Aug. 24, 2005.
[53] Corey, L, GTRI, Private communication.
[54] Green, 1. et aI., Optics Express, 12/10/07
[55] Harris, V. G., Next Generation Ferrite Material for Circulators,"
Fig. 3 Elta EL/M2248, Northrop-Grumman E2-D, Chinese "AEGIS.
Military Radar Conf., June 26-27, 2007

5
1552 6

SANDIA LABS. Ku-BAND SAR IMAGES

17.3° DEPRESION ANGLE

20 ~--------------
1986·1990
~ ~.,... /, 1/2 bltA
.c ~ ······..~!'!.!rtna'OCta~e .1991·1995
~ 16. ••••••• !'Oisel
o • ....••/ 1 .. 1996·2000
'- • ••••••••• reb/ito
~:::s 12 • .., •• '~"~~;~~~~"e-
• •••• ~/I1'Y)
.2001·2005

c
Q)
8 +------------=.=---r-nl·r···-.:--,
A. •••••••
>
~ 4 +-- .A...__----j

:!
W
O+----~---r---.----,.-------j

0.1 10 100 1000 10000

Fig. 7. 4in. Resolution at 6.5 Km [46]
Sampling rate (million samples/sec)

SIMULA1ID··UPGRADED
Fig. 4. Highest-performance COTS (commercial off-the-shelf) ADCs HAYST~CK,"Aft..IMAGI.
(analog-to-digital converters), 1986-2005. From [32]

;1 i
~ i ROTATION

Adaptive-Adaptive
Arra
~ <I • HAYSTACK HUSIR
DOPPLER RES X-BAND 95 GHZ
Equivalent to ARc=A/(2A8) COMPACT RANGE DATA
Eigenbeams (J. USOFF, RADARCON·2007, BOSTON, MA)

.....__........__._N +-- Array Fig. 8. Simulated Upgraded Haystack ISAR Images [47]

Dr. Eli Brookner received his BEE from The

OBF: FORMS J BEAMS City College of the City of New York, '53,
POINTING AT JAMMER SLC MEE and DrSc from Columbia University' 55
and '62.
Output
& ONE AT TARGET He has been at the Raytheon Company
since 1962, where he is a Principal
Engineering Fellow. There he has worked on
the ASDE-X radar, ASTOR Air Surveillance
Fig. 5. Adaptive-Adaptive Array [7].
Radar, RADARSAT II, Affordable Ground
Based Radar (AGBR), major Space Based
Radar programs, NAVSPASUR S-Band
opnlllZATIONOFTRANSMIT BEAM upgrade, CJR, COBRA DANE, PAVE PAWS,
AT RECEIVIR FOR MAX SIC MSR, COBRA JUDY, THAAD, Brazilian
SIVAM, SPY-3, AEGIS, BMEWS, UEWR,

~-~. Surveillance Radar Program (SRP), and COBRA DANE Upgrade. Prior to
Raytheon he worked on radar at Columbia University Electronics Research
TRANSMITTE Lab. [now RRI], Nicolet and Rome AF Lab.
ARRAY He received the IEEE 2006 Dennis 1. Picard Medal for Radar Technology
& Application "For Pioneering Contributions to Phased Array Radar System
Designs, to Radar Signal Processing Designs, and to Continuing Education
Programs for Radar Engineers"; IEEE '03 Warren White Award; Journal of
AT RECENIiR c~ SCAN TRANS. the Franklin Institute Premium Award for best paper award for 1966; IEEE
BEAM INAZ'~P'()R~HAR Wheeler Prize for Best Applications Paper for 1998. He is a Fellow of the
TRANS. ARRAY TOLOC~tE IEEE, AIAA, and MSS.
TARGETS IN EL a A1,;ALTlRlMTlVEL He has published four books: Tracking and Kalman Filtering Made Easy,
GENERATE STAeKlO''-CIIVI John Wiley and Sons, Inc., 1998; Practical Phased Array Antenna Systems
WHICH COVER ReGIQN·I,U.IJMINATED (1991), Aspects of Modem Radar (1988), and Radar Technology (1977),
ON TRANIMITIOASNOT TO ADJUSTS Ai & 8iOF Artech House. He gives courses on Radar, Phased Arrays and Tracking
WASTE TRANS. ARRAY AT REC. around the world (22 countries). Over 10,000 have attended these courses. He
TO MAXIMIZE SIC was banquet speaker and keynote speaker six times. He has over 110 papers,
talks and correspondences to his credit. In addition, he has over 80 invited
talks and papers.
Fig. 6 Optimization of Transmit Beam at Receiver for Max SIC