CHE-314: Lecture 5. Section 2: 1D Steady-State Conduction - The Plane Walls

Chemical & Materials Engineering
Donadeo Innovation Centre for Engineering

Phone: 780-492-2881 | Email: cmeinfo@ualberta.ca
Website: www.cme.engineering.ualberta.ca
CHE-314: Heat Transfer, Fall 2018, UofA, Edmonton, Canada
CHE-314: Lecture 5. Section 2: 1D Steady-State

Conduction - The Plane Walls
Dr. P. Nikrityuk
Sep. 14th, 2018
1
Theory Resistance Concept Composite Wall Examples
The Plane Wall
Methodology of a Conduction Analysis

*T.L. Bergman, A.S. Lavine, F.P. Incropera, D.P. Dewitt. Fundamentals of Heat and
1. Specify appropriate form of the heat equation.

2. Specify appropriate boundary conditions for the heat equation.
3. Solve specified heat equation using appropriate boundary conditions.
4. Apply Fourier’s law to determine the heat flux.
Mass Transfer. 7th Ed. John Wiley & Sons. 2011.
Simplest Case: One-Dimensional, Steady-State Conduction with No Thermal Energy

Generation.
Common Geometries:
The Plane Wall: Described in rectangular (x) coordinate. Area

perpendicular to direction of heat transfer is constant (independent of x).
The Tube Wall: Radial conduction through tube wall.
The Spherical Shell: Radial conduction through shell wall.
2
The Plane Wall
The term one-dimensional (1D) refers to the fact that only one
coordinate is needed to describe the spatial variation of the
dependent variables.
T s,1
The system is characterized by steady-state conditions if the
temperature at each point is independent of time. qx
Steady-state 1D Heat Equation with no-heat generation:
T s,2

d dT
k =0 (1)
dx dx
General Solution:
T (x) = C1 x + C2 (2) x=L
C1 and C2 can be found using boundary conditions. For example, x
Heat Transfer through a plane
for Dirichlet b.c. introduced by
wall.
T (x = 0) = Ts,1 and T (x = L) = Ts,2 (3)
we have
(Ts,2 − Ts,1 )
T (x) = ·x + Ts,1 (4)
L |{z}
| {z }
C2
C1
3
The Plane Wall
For one-dimensional, steady-state conduction in a plane wall

with no heat generation and constant thermal conductivity, the
temperature varies linearly with x.

The conduction heat transfer rate can be determined using
Fourier’s law
dT kA
qx = −k A = (Ts,1 − Ts,2 ) (5)
dx L
Here, A is the area of the wall normal to the direction of heat

transfer and, for the plane wall, it is a constant independent of
x.
The heat flux is then
00 qx k
qx = = (Ts,1 − Ts,2 ) (6)
A L
4
The Plane Wall
Consider the case when a plane wall separates two fluids

T ,1
8
of different temperatures.
In this case heat transfer occurs by convection from the Ts,1

hot fluid at T∞,1 to one surface of the wall at Ts,1 , by qx
q conv q conv
conduction through the wall, and by convection from the
q cond
other surface of the wall at Ts,2 to the cold fluid at T s,2
T∞,2 .
T ,2
8
Using energy conservation equation we have:

Cold Fluid
Hot Fluid x=L
qconv ,1 = qcond = qconv ,2 = qx h1 x h2
Heat Transfer through a plane wall.
where
k
qconv ,1 = Ah1 (T∞,1 − Ts,1 ); qcond = A (Ts,1 − Ts,2 ) ; qconv ,2 = Ah2 (Ts,2 − T∞,2 )
L
Three equations and three unknown variables – qx , Ts,1 and Ts,2
1 L 1
qx · = (T∞,1 − Ts,1 ); qx · = (Ts,1 − Ts,2 ) ; qx · = (Ts,2 − T∞,2 )
A h1 Ak A h2
Adding term by term separately the left and right side of each equation gives:
5
Formulation Circuit Representation Radiatiation Resistances Contact Resistance

1 L 1
qx + + = (T∞,1 − Ts,1 ) + (Ts,1 − Ts,2 ) + (Ts,2 − T∞,2 )
A h1 Ak A h2

1 L 1
qx + + = T∞,1 − T∞,2
A h1 Ak A h2
or
T∞,1 − T∞,2 T∞,1 − T∞,2

qx = =
1
+ L
+ 1 Rtot
A h1 Ak A h2
where T∞,1 − T∞,2 is the overall temperature difference, and Rtot is the
total thermal resistance :

1 L 1 ∆T
Rtot = + + = Rt,conv ,1 + Rt,cond + Rt,conv ,2 =
A h1 Ak A h2 qx
Thermal resistance term comes from some analog to electrical conduction in the
same system (according to Ohm’s law):
φ1 − φ2
R=
I
6
Using the analogy between the electrical resistance in an electrical system and
the thermal resistance allows us to use so called circuit representation of heat
conduction problems
In particular, circuit representations provide a useful tool for both

conceptualizing and quantifying heat transfer problems.
The equivalent thermal circuit for the plane wall with convection surface conditions.

1 L 1
Rtot = + +
A h1 Ak A h2
T∞,1 − T∞,2
qx =
Rtot
Thermal Resistance for Unit Surface Area is called as the area-specific contact
resistance:
00 ∆T
Rtot = 00 = A Rtot (K m2 /W )
qx
7
Consider the same case when a plane wall separates two

T ,1
8
fluids of different temperatures. But one of the fluid is
opaque (e.g. left) and second one transmits radiation. q rad
Ts,1
In this case heat transfer occurs by convection from the qx
hot fluid at T∞,1 to one surface of the wall at Ts,1 , by q conv
conduction through the wall, by convection from the q conv
q cond
other surface of the wall at Ts,2 to the cold fluid at T s,2
T∞,2 and by radiation between the cold fluid and the T ,2
8
other surface of the wall.

Using energy conservation equation we have: Cold Fluid
Hot Fluid x=L
h1 x h2
qconv ,1 = qcond = qconv ,2 +qrad = qx Heat Transfer through a plane wall.
where
k
qx = qconv ,1 = Ah1 (T∞,1 − Ts,1 ); qx = qcond = A (Ts,1 − Ts,2 )
L
qx = qconv ,2 +qrad = Ah2 (Ts,2 − T∞,2 ) + Ahr (Ts,2 − T∞,2 )
Three equations and three unknown variables – qx , Ts,1 and Ts,2
1 L 1
qx = (T∞,1 − Ts,1 ); qx = (Ts,1 − Ts,2 ) ; qx = (Ts,2 − T∞,2 )
A h1 Ak A (h2 +hr )
Adding term by term separately the left and right side of each equation gives:8

1 L 1
qx + + = T∞,1 − T∞,2
A h1 Ak A (h2 + hr )
or
T∞,1 − T∞,2 T∞,1 − T∞,2
qx = =
1 1
+ L
+ 1 Rtot
A h1 k h2 +hr
Using1
!−1
1 1 1 1
Rt,par = 1
+ 1
=
hA hr A
A h + hr
the total thermal resistance , Rtot , can be written as:

1 L 1 ∆T
Rtot = + + = Rt,conv ,1 + Rt,cond + Rt,par =
A h1 Ak A (h2 + hr ) qx
1
here ’par’ - parallel 9
Thermal Resistances
The thermal resistance for conduction in a plane wall is

L
Rt,cond =
Ak
The thermal resistance for convection is

1
Rt,conv =
Ah
The thermal resistance for radiation is
1 1
Rt,rad = = 2 2 ) (T + T )
A hr A σ ε (Ts + Tsur s sur
10
Contact resistance refers to the complex

00000000000 q’’
111111111111111111111
0000000000
x
phenomena that occurs when two solid 00000000000
111111111110000000000
1111111111
surfaces are brought together. 00000000000

11111111111
A 0000000000
1111111111
000000000001111111111
111111111110000000000
B
000000000001111111111
111111111110000000000
Considering the micro-scale profile of the
contact area reveals that the contact surface zooomed view
is not flat, and there are some ’empty’ 1111111111
0000000000
0000000000
1111111111
spaces between two surfaces. 0000000000
1111111111
0000000000
1111111111 q’’
contact
0000000000
1111111111
To take into account this effect o called an 0000000000
1111111111
0000000000
1111111111
area-specific conatct resistance, 0000000000
1111111111
A
0000000000
1111111111
00 0000000000
1111111111 B
Rt,c (K m2 /W ), is used: 0000000000
1111111111
0000000000
1111111111
0000000000
1111111111
00
Rt,c TA − TB
0000000000
1111111111
0000000000
1111111111 q’’gap
Rt,c = = 0000000000
1111111111
0000000000
1111111111
A A qx00 0000000000
1111111111
00
0000000000
1111111111
Typical values for Rt,c (K m2 /W ) are
2 · 10−4 (K m2 /W), e.g. for surface roughness 1−10 µm
aluminum-to-aluminum (clamping pressure interstitial material
100 kPa) and surface roughness of 10 µm
00
Rt,c ≈ 3 · 10−4 (K m2 /W), where air is
interstitial material.
11
Derivation Complex Composite Wall Two Parallel Walls Series-Parallel Walls
Equivalent thermal circuits may be used

h4
effectively for complex systems, such as
T A B C T 4
composite walls . 1
8
Cold Fluid
Such walls may involve any number of series Ts,1
T2
and parallel thermal resistances due to layers
Hot Fluid
of different materials.
T3
The one-dimensional heat transfer rate for Ts,4
this system may be expressed as LA LB L C T 4
8
T 1
8
T∞,1 − T∞,4 h1
qx =
Rtot A
x
where the total thermal resistance is:

1 1 LA LB LC 1
Rtot = + + + +
A h1 kA kB kC h4 Equivalent thermal circuit for a series composite wall.
With composite systems, it is often convenient to work with an overall heat transfer
coefficient U, which is defined by an expression analogous to Newton’s law of cooling:
1
qx = U · A · ∆T ; =⇒ U =
Rtot · A
12
Complex Composite Wall:

Composite walls may also be characterized by series–parallel configurations.
Strictly speaking the heat flow is now multidimensional, but it is often
reasonable to assume one-dimensional conditions.

Generally, using this assumption two different thermal circuits (see next slides)
may be used in dependence on surfaces properties between walls.
isolated
Area, A
LF = LG LH
LE
KF F
T1 T2
KE KG KH
E G H
isolated
13
Consider the composite wall shown in the

insulation
figure, which depicts two parallel layers of A1
materials with thermal conductivities of k1 K1

and k2 . Top and bottom sides are thermally Tl Tr
isolated. K2
The thermal resistance scheme, which A2
consists of two parallel resistances, can be insulation
X
represented as shown in the figure (down).

L
The total heat transfer between left side (l)
and right side (r ) is the sum of the heat
transfers through each layer: q
1
T − Tr T − Tr
qx = q1 + q2 = l + l = Tl q R1 Tr
R1 R2
q

1 1 T − Tr R2
= (Tl − Tr ) + = l
R1 R2 Rtotal
q2
1 1 1
= + Thermal resistance scheme of two
Rtotal R1 R2
parallel layers.
1 −1

cond 1
Rparal = +
R1 R2
14
X
Now let us consider the combined insulation
series-parallel arrangements of layers, see A1
K1 A3
figure (right). Tl K3
The total heat transfer through this K2 T
8
composite system can be expressed as A2 h
convection
follows: insulation
T − T∞
qx = l L 1= L 2 L3
Rtotal
where
−1
cond cond 1 1
Rtotal = Rparal + R3 + Rconv ; Rparal = +
R1 R2
and
L1 L2 L3 1
R1 = ; R2 = ; R3 = ; Rconv =
K1 A1 K2 A2 K3 A3 h A3
q
1
R3 R convec
Tl q R1 T
8
R2 q
q2
Thermal resistance scheme of combined series-parallel layers. 15
Problem#1 Problem#2
Recall Problem#1 - Lecture#3

Humans are able to control their heat production rate and heat loss rate to
maintain a nearly constant core temperature of Tc = 37 0 C under a wide range
of environmental conditions. This process is called thermoregulation. From the

perspective of calculating heat transfer between a human body and its
surroundings, we focus on a layer of skin and fat, with its outer surface exposed
to the environment and its inner surface at a temperature slightly less than the
core temperature, Ti = 35 0 C = 308 K. Consider a person with a skin/fat layer
of thickness L = 3 mm and effective thermal conductivity k = 0.3 W/m K. The
person has a surface area A = 1.8 m2 and is dressed in a bathing suit. The
emissivity of the skin is ε = 0.95.
k=0.3 W/m K T sur= 297 K

q’’
rad
skin/fat
T i=308 K q’’
cond Air/Water
q’’
conv
T s=??
L=3 mm
T = 297 K
8
Scheme of the problem. Here hair =2 W/m2 K, hwater =200 W/m2 K.
16
Problem#1 Problem#2
New Problem based on Recall

In Problem#1, Lecture#3 we calculated the heat loss rate from a human body
in air and water environments. Now we consider the same conditions except
that the surroundings (air or water) are at 10 0 C . To reduce the heat loss rate,
the person wears special sporting gear (snow suit and wet suit) made from a
nanostructured silica aerogel insulation with an extremely low thermal
conductivity of 0.014 W/m K. The emissivity of the outer surface of the snow
and wet suits is 0.95. What thickness of aerogel insulation is needed to reduce
the heat loss rate to 100 W (a typical metabolic heat generation rate) in air and
water? What are the resulting skin temperatures?
k=0.3 W/m K
Ts kins=0.014 W/m K T sur= 10 C
ε=0.95
skin/fat
q’’
rad
T i=35 C q’’
insulation
cond
Air/Water
q’’conv
L=3 mm L ins
T = 10 C
8
Scheme of the problem. Here hair =2 W/m2 K, hwater =200 W/m2 K.

17
Problem#1 Problem#2
Thermal circuit scheme
The total thermal resistance needed to achieve the desired heat loss rate is:
Ti − T∞ 35 − 10
Rtot = = = 0.25 K /W (7)
q 100
The total thermal resistance between the inside of the skin/fat layer and the
cold surroundings includes conduction resistances for the skin/fat and insulation
layers and an effective resistance associated with convection and radiation,
which act in parallel:

L Lins 1 Lsf Lins 1
Rtot = sf + + Rt,par = + +
ksf A kins A A ksf kins h + hr
!−1
1 1 1 1
Rt,par = 1
+ 1 =
hA h A
A h + hr
r
18
Problem#1 Problem#2
Air case:
Lsf 1
Lins = kins A Rtot − −
ksf h + hr
The radiation heat transfer coefficient is approximated as having the same value
as in Example#1 Lecture#3: hr ≈ 6 W/m2 K.

0.003 1
Lins = 0.014 1.8 · 0.25 − − = 0.0044 m = 4.4 mm
0.3 2+6
Water case (radiation is neglectable):

Lsf 1
Lins = kins A Rtot − −
ksf h

0.003 1
Lins = 0.014 1.8 · 0.25 − − = 0.0061 m = 6.1 mm
0.3 200
The skin temperature can be calculated by considering conduction through the
skin/fat layer:
ksf A (Ti − Ts ) q Lsf 100 · 0.003
q= ; =⇒Ts = Ti − = 273+35− = 273+34.4 = 34.4 0 C
Lsf ksf A 0.3 · 1.8
19
Problem#1 Problem#2
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a

0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side,
and their exposed surfaces are cooled by air, which is at a temperature of 25 0 C
and provides a convection coefficient of 100 W/m2 · K. If the chip dissipates 104
W/m2 under normal conditions, will it operate below a maximum allowable
temperature of 85 0 C ?
00
Use Rt,c = 0.9 · 10−4 m2 ·K/W. (table 3.22 . course book, p. 119, we use data
for silicon chip/aluminum with 0.02 mm epoxy)
Solution: white board
o
T =25 C
Air
8
2
h =100W/m K
q’’1
Silicon chip
q’’c
Epoxy joint
(0.02 mm)
q’’2
Aluminum
L=8mm
substrate
Insulation
o Insulation
Air T =25 C
8
2
h =100W/m K
2
Thermal resistance of representative solid/solid interfaces 20
Problem#1 Problem#2
convection
1/h
Up T
8
Up
q’’
Tc 1
R’’ 1/h
q’’ t,c L/k
c T
8
Down
Down contact R q’’
2
conduction
convection
00
Use Rt,c = 0.9 · 10−4 m2 ·K/W. Neglect radiation heat exchange with surroundings. Neglect
chip thermal resistance. There is no temeparture gradient inside the
chip.k(T = 350K ) = 239W /m · K
energy balance on a control surface about the chip:
00 00 00 Tc − T∞ Tc − T∞
qc = q1 + q2 = 1
+ 00
h R t,c + kL + h1
!−1
00 1
Tc = T∞ + qc h + 00
Rt,c + kL + h1
Here k = 239 W/m K, pure aluminum Table A.1.
!−1
4 1
Tc = (273+25)+10 100 + 0.008 1
= (273+25)+50.3 = 75.3 0 C
0.9 · 10−4 + 239
+ 100
the chip will operate below its maximum allowable temperature 21

CHE-314: Lecture 5. Section 2: 1D Steady-State Conduction - The Plane Walls

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Chemical & Materials Engineering

Donadeo Innovation Centre for Engineering

CHE-314: Heat Transfer, Fall 2018, UofA, Edmonton, Canada

CHE-314: Lecture 5. Section 2: 1D Steady-State

Methodology of a Conduction Analysis

1. Specify appropriate form of the heat equation.

Simplest Case: One-Dimensional, Steady-State Conduction with No Thermal Energy

The Plane Wall: Described in rectangular (x) coordinate. Area

T (x = 0) = Ts,1 and T (x = L) = Ts,2 (3)

For one-dimensional, steady-state conduction in a plane wall

temperature varies linearly with x.

Here, A is the area of the wall normal to the direction of heat

Consider the case when a plane wall separates two fluids

In this case heat transfer occurs by convection from the Ts,1

Using energy conservation equation we have:

Three equations and three unknown variables – qx , Ts,1 and Ts,2

T∞,1 − T∞,2 T∞,1 − T∞,2

In particular, circuit representations provide a useful tool for both

Consider the same case when a plane wall separates two

other surface of the wall.

Three equations and three unknown variables – qx , Ts,1 and Ts,2

the total thermal resistance , Rtot , can be written as:

The thermal resistance for conduction in a plane wall is

The thermal resistance for convection is

Contact resistance refers to the complex

surfaces are brought together. 00000000000

Equivalent thermal circuits may be used

this system may be expressed as LA LB L C T 4

Complex Composite Wall:

reasonable to assume one-dimensional conditions.

Consider the composite wall shown in the

materials with thermal conductivities of k1 K1

represented as shown in the figure (down).

Recall Problem#1 - Lecture#3

of environmental conditions. This process is called thermoregulation. From the

k=0.3 W/m K T sur= 297 K

Scheme of the problem. Here hair =2 W/m2 K, hwater =200 W/m2 K.

New Problem based on Recall

water? What are the resulting skin temperatures?

Scheme of the problem. Here hair =2 W/m2 K, hwater =200 W/m2 K.

Thermal circuit scheme

Water case (radiation is neglectable):

A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a

the chip will operate below its maximum allowable temperature 21

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