UNIT 8: Fundamentals of

Heat Transfer

Heat Transfer
Cambridge University Press
 Summary:
o 1.Heat transfer mechanics
o 1.1. Conduction
o 1.2.Thermal Resistence Concept
o 1.3. Thermal convection
o 1.4. Contact Resistence
o 1.5. Thermal Radiation
o 1.6. Radiation Resistence
o 2.Two-Dimensional Conduction
Problems.
o 3. Extended Surfaces
 1. Heat Transfer Mechanics
1.1.- Thermal conduction:
conduction energy transfer due to the interactions of micro-scale energy
carriers within a material
• high energy (fast moving, high temperature) carriers collide with
lower energy (slower moving, lower temperature) carriers
• this process leads to a transfer of energy from high T to low T

Fourier’s Law j = −k ⋅ ∇ T

K=Thermal conductivity[Wm-1K-1; kcal h-1m-1ºC-1]

 Differential equation of the
temperature field
1.- 1st Principle

2.- ρ , cp independent of time

3.- Fourier’s Law

Differential equation of the temperatura field

 a) Problem geometry

Cartesian coordinates Cylindrical Coordinates

Spherical Coordinates
b) Establishment of the boundary condition

 a.- Dirichlet boundary condition (fixed boundary conditions)

The temperature function on the limit surfaces of the system is known.
𝑇𝑇𝑠𝑠 = 𝑇𝑇𝑆𝑆 (𝑟𝑟⃗0 , 𝑡𝑡0 )
 b.- Neumann bounday condition The condition specifies the values in
which the derivative of a solution is applied within the boundary of the
domain. 𝛻𝛻𝑇𝑇 = −⃗𝚥𝚥/𝑘𝑘
 c.- Robin boundary condition: it is a specification of a linear combination
of the values of a function and the values of its derivative on the boundary
𝜕𝜕𝑇𝑇 ℎ
of the domain. =− 𝑇𝑇𝑆𝑆 − 𝑇𝑇∞
𝜕𝜕𝑛𝑛 𝑠𝑠 𝑘𝑘
 Particular Cases:
a.- Constant Thermal conductivity b.- Constant thermal conductivity without
independent internal heat generation

Fourier’s Law for conduction. Heat Diffusion

d.- Constant thermal

c.- Constant Thermal conductivity, Steady conductivity, Steady state,
State without internal heat
generation

Laplace’s Equation
General Solutions
L a) Pared plana
TH

b) Pared cilíndrica
x TC

c) Pared esférica

TH TC

rin
rout
 1.2. Thermal Resistence Concept
L

TH

x TC

L
plane wall: R pw =
k Ac

r 
ln  out 
cylindrical shell: Rcyl =  rin 
2π L k
TH TC
1 1 
 − 
=  in out 
rin
r r
spherical shell: Rsph
rout 4π k
 1.3. Thermal convection
Convection refers to heat transfer
between a surface and a moving fluid T∞
qconv As, Ts

Newton's law of cooling is the rate

equation that characterizes convection

qconv convection heat

• the heat transfer coefficient is NOT
a material or fluid property
• the heat transfer coefficient is a
complex function of geometry, fluid
properties, and flow conditions
1 Ts surface temperature (K)
Rconv =
h As
transfer rate (W)
h average heat transfer
coefficient (W/m 2 -K)
As surface area exposed to
fluid (m 2 )
T∞ fluid temperature (K)
 1.4. Contact Resistence
Contact resistance characterizes the resistance that is present at the
interface between two solids
• imperfect surface (non-flatness at the micro-scale)
• different types of energy carriers

temperature change at interface:

∆T
Rc′′
contact resistance: Rc = q
As

solid A
solid B
area-specific contact resistance
depends on:
• materials
• surface preparation
• interstitial material
• clamping pressure
 Contact Resistence
Area-specific contact resistance is typically measured and values for
specific combinations are available in tables and handbooks (Table 1-1)
• these are only meant to provide a means for you to estimate the importance
of contact resistance for your application
 1.5. Thermal Radiation
Radiation heat transfer due to the
emission and absorption of
electromagnetic waves
• complex interaction between many
surfaces
• for a single surface interacting with
uniform temperature surroundings:
must use absolute temperature
Tsur
qrad
qrad radiation heat
transfer rate (W)
ε emissivity of the surface (-)
σ Stefan-Boltzmann constant
(5.67x10-8 W/m 2 -K 4 )
As surface area (m 2 )
Ts surface temperature (K)
Tsur temperature of surroundings (K)
ε, As, Ts
1.6. Radiation Resistence

1
Rrad =
As σ ε (Ts2 + Tsur
2
)(Ts + Tsur )
1 Ts + Tsur
Rrad ≈ where T =
As σ ε 4 T 3 2
Resistance Formulae
2. Two-Dimensional
Conduction Problems
 Temperature varies in two dimensions (e.g., x and y) rather than just one.

 Analytical solutions require that partial differential equations (PDEs) be

solved rather than ODEs

 Numerical solutions require that a larger set of algebraic equations be

considered

 In either case, the solutions are more complex than the 1-D problems
previously considered

 Shape factors provide a convenient method for tabulating solutions that

have already been developed so that they can be applied easily to other
problems.
2.1. Shape Factors
 Shape factors are defined for conduction between two surfaces at
temperaturas T1. and T2 separated by a medium of conductivity k.
T2
 The rate of heat transfer between the surfaces is:
q
𝑄𝑄̇ = 𝑘𝑘𝑘𝑘 𝑇𝑇1 − 𝑇𝑇2 W

 where S is the shape factor (m). D

 Equation can be rewritten as: T1

𝑇𝑇1 − 𝑇𝑇2 𝑇𝑇1 − 𝑇𝑇2

𝑄𝑄̇ = 𝑄𝑄̇ =
𝑘𝑘𝑘𝑘 −1 𝑅𝑅𝑆𝑆𝑆𝑆
Shape Factors Table
 Ex. Square Extrusion
conductivity, k = 1.2 W/m-K
=
TH 150 C°
hH = 50 W/m -K
2

L=1m
Determine the rate of heat b = 5 cm
transfer per unit length
a = 10 cm
b = 5 cm

TC = 20°C
a = 10 cm
hC = 20 W/m -K
2
 Resistance Network

TH
1
Rcond =
q Sk
Rconv,H

Rcond

Rconv,C

TC

S = 10.57 m
 Heat Transfer
TH = 150°C
hH = 50 W/m -K
2
TH L=1m
1
Rconv , H = b = 5 cm
Rconv,H q hH 4 b L
a = 10 cm
1 b = 5 cm
Rconv ,C =
hC 4 a L TC = 20°C
Rcond a = 10 cm
hC = 20 W/m -K
2

Rconv,C

TC
2.2. Isothermal and Adiabatic Limits

There are natural limiting, 1-D models that can obtain an estimate of the
thermal resistance of a complex, multi-dimensional problem.

Let the x-direction be the primary direction of heat flow (the single
direction that will be considered in the 1-D model).

Isothermal limit - allows heat to "spread" in the y- and z-directions (i.e.,

the directions perpendicular to the primary heat flow) with no penalty
• provides a lower limit on the thermal resistance (an upper limit on the
heat transfer rate)
• is equivalent to setting ky and kz to infinity

Adiabatic limit - allows no heat "spreading" in the y- and z-directions

• provides an upper limit on the thermal resistance (a lower limit on the
heat transfer rate)
• is equivalent to setting ky and kz to zero
Example
This is clearly a 2-D problem:
W
k A = 10
m-K LD= 1 cm

W
kB = 1
1 cm m-K
TC = 0°C TH = 100°C
2 cm W
h = 500
W
2
y
kC = 100
W h = 500 2
m -K 1 cm m-K m -K
x
W
LA= 1 cm k D = 10
m-K
LB = LC = 2 cm

width into page is W = 1 m

Finite Element Solution
Solution from FEHT:

Heat transfer rate = 281.9 W

 1-D solution Case a: Isothermal Model
W
k A = 10
m-K LD= 1 cm

W
kB = 1
1 cm m-K
TC = 0°C TH = 100°C
2 cm W
h = 500
W
2
y
kC = 100
W h = 500 2
m -K m-K m -K
1 cm
x
W
LA= 1 cm k D = 10
m-K
LB = LC = 2 cm
K
2.0
W

K K 2 LB K K
0.1 0.05 Rcond , B = 0.05 0.1
TC = 0°C W W k B Ac W W T = 100°C
H

1 LA K LD 1
Rconv = Rcond , A = 0.02 Rcond , D = Rconv =
h Ac k A Ac W k D Ac h Ac
Riso = 0.32 K/W
2 LC
Rcond ,C =
kC Ac
qiso = 313 W
 1-D solution Case b: Adiabatic Model
W
k A = 10
m-K LD= 1 cm

W
kB = 1
1 cm m-K
TC = 0°C TH = 100°C
2 cm W
h = 500
W
2
y
kC = 100
W h = 500 2
m -K m-K m -K
1 cm
x
W
LA= 1 cm k D = 10
m-K
LB = LC = 2 cm
K K K K K
0.2 0.1 2.0 0.1 0.2
W W W W W

2 2 LA 2 LB 2 LD 2
Rconv ,1 = Rcond , A,1 = Rcond , B = Rcond , D ,1 = Rconv ,1 =
TC = 0°C h Ac k A Ac k B Ac k D Ac h Ac TH = 100°C

K K K K K
0.2 0.1 0.02 0.1 0.2
W W W W W
Rad = 0.50 K/W
2 2 LA 2 LC 2 LD 2 qiso = 200 W
Rconv ,2 = Rcond , A,2 = Rcond ,C = Rcond , D ,2 = Rconv ,2 =
h Ac k A Ac kC Ac k D Ac h Ac
3. Extended surfaces
𝑄𝑄̇ = ℎ𝐴𝐴 𝑇𝑇𝑆𝑆 − 𝑇𝑇∞

To increase the heat transfer from the surface

when the temperatures are fixed, there are
two possibilities:
a) Modify h. Than means changing the flow
conditions (mainly velocity) or
b) Modify the size of the surface: add
additional surfaces=fins
3.1. Governing thermal
resistences
W  This problem cannot be solved using
thermal resistances
 However, it can be understood using
thermal resistances
y T∞, h  Thermal resistances that govern this
x
problem are:
Tb L
th
L
resistance to conduction in x-direction: Rcond , x =
kW th
th
resistance to conduction in y -direction: Rcond , y =
4 kW L
1
resistance to convection from surface: Rconv =
2h W L
 Understanding the problem
 By comparing the magnitudes of these resistances, you can
anticipate and understand the solution
 Temperature change is proportional to resistance
 You can identify a temperature change due to each of these
resistances Tb
Temperature (arbitrary units)

W x / L = 0.25

x / L = 0.5 ∆Tcond , y

y T∞, h x / L = 0.75
x
Tb L x /L = 1
th T∞
∆Tconv
0 (center) 1 (edge)
Normalized y position
 3.2. Extended Surface aproximation
 What happens if Rcond,y / Rconv << 1?
 ∆Tcond,y / ∆Tconv << 1 this is the extended surface approximation:
 temperature drop due to conduction from center of fin to its surface will
be small relative to the temperature drop from the surface of the fin to
the surroundings.
 temperature at every y-location will be approximately uniform.

 temperature is approximately only a function of x:T(x,y) ~ T(x)

 Tb
Tb

Temperature (arbitrary units)

Temperature (arbitrary units)

x / L = 0.25
x / L = 0.25
x / L = 0.5 ∆Tcond , y
x / L = 0.5

x / L = 0.75
x / L = 0.75
x /L = 1
x /L = 1
T∞ T∞
∆Tconv
0 (center) 1 (edge) 0 (center) 1 (edge)
Normalized y position Normalized y position
Biot number
 The extended surface approximation is justified by the Biot number

Rcond , y th 2 h W L th h
=
Biot number: Bi = =
Rconv 4 kW L 1 2k

 If Bi << 1 then the extended surface approximation is valid

• temperature is ~ only a function of x
• a thin, conductive member with a small heat transfer coefficient
 The appropriate Biot number will not always be the same, in
general:
resistance to conduction in direction to "remove"
Bi =
resistance from surface

resistance to neglect in your model

Bi =
resistance to consider in your model
3.3. Governing equations
General Solution:
Ac=cte; k=cte:

𝑑𝑑 2 𝑇𝑇 ℎ𝑝𝑝 𝑑𝑑 2 𝜃𝜃
− (𝑇𝑇 − 𝑇𝑇∞ ) = 0 − 𝑚𝑚 2
𝜃𝜃 = 0
𝑑𝑑𝑥𝑥 2 𝑘𝑘𝐴𝐴𝑐𝑐 𝑑𝑑𝑥𝑥 2

𝜃𝜃 = 𝑇𝑇 − 𝑇𝑇∞ 𝜃𝜃 𝑥𝑥 = 𝐶𝐶1 𝑒𝑒 𝑚𝑚𝑚𝑚 + 𝐶𝐶2 𝑒𝑒 −𝑚𝑚𝑚𝑚

𝜃𝜃𝑏𝑏 = 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞

C1 and C2 are determined from the values of the difference of

temperature in the base (𝜃𝜃𝑏𝑏 ) and in the tip (𝜃𝜃𝐿𝐿 ).
Cases:
a) 𝑇𝑇𝐿𝐿 = 𝑇𝑇∞ : infinitely long fin
b) 𝑄𝑄̇ 𝐿𝐿 = 0: adiabatic tip fin
c) 𝑇𝑇𝐿𝐿 =cte: fixed tip temperature
d) 𝑄𝑄̇ 𝐿𝐿 ≠ 0 : convection from tip
3.4. Solutions for constant cross
section extended surfaces:

Infinitely long fin

𝑇𝑇 𝑥𝑥 − 𝑇𝑇∞
= 𝑒𝑒 −𝑥𝑥 ℎ𝑝𝑝⁄𝑘𝑘𝐴𝐴𝑐𝑐
𝑇𝑇𝑏𝑏 − 𝑇𝑇∞
𝑑𝑑𝑑𝑑
̇
𝑄𝑄𝐿𝐿~∞ = −𝑘𝑘𝐴𝐴𝑐𝑐 � = (𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ ) ℎ𝑝𝑝𝑝𝑝𝐴𝐴𝑐𝑐
𝑑𝑑𝑑𝑑 𝑥𝑥=0

Adiabatic tip fin 𝑇𝑇 𝑥𝑥 − 𝑇𝑇∞ cosh 𝑚𝑚(𝐿𝐿 − 𝑥𝑥)

=
𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ cosh(𝑚𝑚𝑚𝑚)

𝑄𝑄̇ 𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎 = (𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ ) ℎ𝑝𝑝𝑝𝑝𝐴𝐴𝑐𝑐 tanh(𝑚𝑚𝑚𝑚)

Solutions for constant cross section
extended surfaces (cont.)

Specified tip temper. 𝑇𝑇𝐿𝐿 − 𝑇𝑇∞

𝑇𝑇 𝑥𝑥 − 𝑇𝑇∞ 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ senh 𝑚𝑚𝑚𝑚 + 𝑠𝑠𝑠𝑠𝑠𝑠𝑠 𝑚𝑚(𝐿𝐿 − 𝑥𝑥)
=
𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ senh(𝑚𝑚𝑚𝑚)
𝑇𝑇 − 𝑇𝑇∞
cosh 𝑚𝑚𝑚𝑚 − 𝐿𝐿
̇ 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞
𝑄𝑄𝑇𝑇=𝑐𝑐𝑐𝑐𝑐𝑐 = (𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ ) ℎ𝑝𝑝𝑝𝑝𝐴𝐴𝑐𝑐
senh(𝑚𝑚𝑚𝑚)

ℎ
Convection from tip
𝑇𝑇 𝑥𝑥 − 𝑇𝑇∞ 𝑐𝑐𝑐𝑐𝑐𝑐𝑐 𝑚𝑚 𝐿𝐿 − 𝑥𝑥 + 𝑠𝑠𝑠𝑠𝑠𝑠𝑠 𝑚𝑚(𝐿𝐿 − 𝑥𝑥)
= 𝑚𝑚𝑚𝑚
𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ ℎ
cosh 𝑚𝑚𝑚𝑚 + 𝑠𝑠𝑠𝑠𝑠𝑠𝑠 𝑚𝑚𝑚𝑚
𝑚𝑚𝑚𝑚
ℎ
senh 𝑚𝑚𝑚𝑚 + cosh 𝑚𝑚𝑚𝑚
𝑄𝑄̇ 𝑐𝑐𝑐𝑐𝑐𝑐𝑐𝑐 = (𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ ) ℎ𝑝𝑝𝑝𝑝𝐴𝐴𝑐𝑐 𝑚𝑚𝑚𝑚
ℎ
cosh 𝑚𝑚𝑚𝑚 + 𝑠𝑠𝑠𝑠𝑠𝑠𝑠 𝑚𝑚𝑚𝑚
𝑚𝑚𝑚𝑚
Aproximation
 Instead the use of the exact expression for fin
with convection from tip, a good
approximation could be the use of the
expression for a fin with adiabatic tip,
changing the lengh of the fin for a “modified
lengh” as follows:
𝐴𝐴𝐶𝐶
𝐿𝐿𝑐𝑐 = 𝐿𝐿 +
𝑝𝑝
3.5. Fin efficiency
 Fin solutions are recorded as a fin efficiency:

fin heat transfer

fin efficiency =
heat transfer to a "perfect" fin ( k → ∞ )

 The heat transfer is normalized by the heat transfer to a fin with

infinite conductivity
• this ideal limit corresponds to Rcond,x = 0 so the fin is isothermal at the
base temperature
q fin
η fin =
h As , fin

(Tb − T∞ )
surface area of
fin exposed to fluid

• definition is the same for any fin geometry

 Fin Resistance

The fin resistance provides a convenient method of incorporating fin solutions

into a larger engineering problem

η fin =
q fin =q fin η fin h As , fin (Tb − T∞ )

h As , fin (Tb − T∞ ) 1
R fin

another resistance-type equation

=q fin
(=
Tb − T∞ )
where R
1
R fin
fin
η fin h As , fin

Note that Rfin incorporates the effect of both convection and conduction
• Rfin will be greater than Rconv = 1/(h As,fin) because ηfin < 1
• Rfin is evaluated using the appropriate fin efficiency solution
• Rfin can be inserted into a resistance network
3.6. Fin Efficiency for various fins
tanh(𝑚𝑚𝐿𝐿𝑐𝑐 )
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 = 𝑡𝑡𝑡
𝑚𝑚𝐿𝐿𝑐𝑐 𝐿𝐿𝑐𝑐 = 𝐿𝐿 +
2
𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 2𝑊𝑊𝐿𝐿𝑐𝑐
𝐼𝐼1 (2𝑚𝑚𝑚𝑚) 𝑡𝑡𝑡 2
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 = ; 𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 2𝑊𝑊 𝐿𝐿2 +
(𝑚𝑚𝑚𝑚)𝐼𝐼0 (2𝑚𝑚𝑚𝑚) 2

2
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 =
4 𝑚𝑚𝑚𝑚 2. +1+1
𝐿𝐿2 𝑡𝑡𝑡 𝑡𝑡𝑡 2
𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 𝑤𝑤 𝐶𝐶1 𝐿𝐿 + 𝑙𝑙𝑙𝑙 + 𝐶𝐶1 ; 𝐶𝐶1 = 1+
𝑡𝑡𝑡 𝐿𝐿 𝐿𝐿
tanh(𝑚𝑚𝐿𝐿𝑐𝑐 )
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 =
𝑚𝑚𝐿𝐿𝑐𝑐
𝐷𝐷
𝐿𝐿𝑐𝑐 = 𝐿𝐿 +
4
4ℎ
𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 𝜋𝜋𝜋𝜋𝐿𝐿𝑐𝑐 ; 𝑚𝑚𝐿𝐿𝑐𝑐 = 𝐿𝐿
𝑘𝑘𝑘𝑘 𝑐𝑐
Fin Efficiency for various fins
2 𝐼𝐼2 (2𝑚𝑚𝑚𝑚)
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 =
(𝑚𝑚𝑚𝑚)𝐼𝐼1 (2𝑚𝑚𝑚𝑚)
𝜋𝜋𝜋𝜋 𝐷𝐷 2 4ℎ
𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 𝐿𝐿2 + 𝑚𝑚𝑚𝑚 = 𝐿𝐿
2 2 𝑘𝑘𝑘𝑘
𝐼𝐼2 𝑥𝑥 = 𝐼𝐼0 𝑥𝑥 − 2⁄𝑥𝑥 𝐼𝐼1 𝑥𝑥
2 2
𝐴𝐴𝑠𝑠,𝑓𝑓𝑓𝑓𝑓𝑓 = 2𝜋𝜋 𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 − 𝑟𝑟𝑖𝑖𝑖𝑖

2ℎ 2 2ℎ 2
𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 = 𝑟𝑟 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 = 𝑟𝑟
𝑘𝑘𝑘𝑘𝑘 𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 𝑘𝑘𝑘𝑘𝑘 𝑖𝑖𝑖𝑖

𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 =𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜 + 𝑡𝑡𝑡⁄2

2𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 𝐾𝐾1 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 𝐼𝐼1 𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 − 𝐼𝐼1 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 𝐾𝐾1 𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐

𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 = 2
𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 − 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 2 [𝐼𝐼0 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 𝐾𝐾1 𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 + 𝐾𝐾𝑂𝑂 𝑚𝑚𝑟𝑟𝑖𝑖𝑖𝑖 𝐼𝐼1 𝑚𝑚𝑟𝑟𝑜𝑜𝑜𝑜𝑜𝑜,𝑐𝑐 ]
First and Second Modified
Bessel functions
𝒙𝒙 𝒆𝒆−𝒙𝒙 𝑰𝑰𝟎𝟎 (𝒙𝒙) 𝒆𝒆−𝒙𝒙 𝑰𝑰𝟏𝟏 (𝒙𝒙) 𝒆𝒆𝒙𝒙 𝑲𝑲𝟎𝟎 (𝒙𝒙) 𝒆𝒆𝒙𝒙 𝑲𝑲𝟏𝟏 (𝒙𝒙) 𝒙𝒙 𝒆𝒆−𝒙𝒙 𝑰𝑰𝟎𝟎 (𝒙𝒙) 𝒆𝒆−𝒙𝒙 𝑰𝑰𝟏𝟏 (𝒙𝒙) 𝒆𝒆𝒙𝒙 𝑲𝑲𝟎𝟎 (𝒙𝒙) 𝒆𝒆𝒙𝒙 𝑲𝑲𝟏𝟏 (𝒙𝒙)

0.0 0.0000 0.0000 5.0 0.1835 0.1640 0.5478 0.6003

0.2 0.8269 0.0823 2.1408 5.8334 5.2 0.1797 0.1614 0.5376 0.5872
0.4 0.6974 0.1368 1.6627 3.2587 5.4 0.1762 0.1589 0.5280 0.5749
0.6 0.5993 0.1722 1.4167 2.3739 5.6 0.1728 0.1565 0.5188 0.5634
0.8 0.5241 0.1945 1.2582 1.9179 5.8 0.1697 0.1542 0.5101 0.5525
1.0 0.4658 0.2079 1.1445 1.6362 6.0 0.1667 0.1521 0.5019 0.5422
1.2 0.4198 0.2153 1.0575 1.4429 6.2 0.1638 0.1499 0.4940 0.5324
1.4 0.3831 0.2185 0.9881 1.3011 6.4 0.1611 0.1479 0.4865 0.5232
1.6 0.3533 0.2190 0.9309 1.1919 6.6 0.1585 0.1460 0.4793 0.5144
1.8 0.3289 0.2177 0.8828 1.1048 6.8 0.1561 0.1441 0.4724 0.5060
2.0 0.3085 0.2153 0.8416 1.0335 7.0 0.1537 0.1423 0.4658 0.4981
2.2 0.2913 0.2121 0.8057 0.9738 7.2 0.1515 0.1405 0.4595 0.4905
2.4 0.2766 0.2085 0.7740 0.9229 7.4 0.1494 0.1389 0.4535 0.4832
2.6 0.2639 0.2047 0.7459 0.8790 7.6 0.1473 0.1372 0.4476 0.4762
2.8 0.2528 0.2007 0.7206 0.8405 7.8 0.1453 0.1357 0.4420 0.4696
3.0 0.2430 0.1968 0.6978 0.8066 8.0 0.1434 0.1341 0.4366 0.4631
3.2 0.2343 0.1930 0.6770 0.7763 8.2 0.1416 0.1327 0.4314 0.4570
3.4 0.2264 0.1892 0.6580 0.7491 8.4 0.1399 0.1312 0.4264 0.4511
3.6 0.2193 0.1856 0.6405 0.7245 8.6 0.1382 0.1299 0.4215 0.4454
3.8 0.2129 0.1821 0.6243 0.7021 8.8 0.1365 0.1285 0.4168 0.4399
4.0 0.2070 0.1788 0.6093 0.6816 9.0 0.1350 0.1272 0.4123 0.4346
4.2 0.2016 0.1755 0.5953 0.6627 9.2 0.1334 0.1260 0.4079 0.4295
4.4 0.1966 0.1725 0.5823 0.6454 9.4 0.1320 0.1247 0.4036 0.4246
4.6 0.1919 0.1695 0.5701 0.6292 9.8 0.1292 0.1224 0.3955 0.4152
4.8 0.1876 0.1667 0.5586 0.6143 10.0 0.1278 0.1213 0.3916 0.4108

𝐼𝐼𝑛𝑛+1 𝑥𝑥 = 𝐼𝐼𝑛𝑛−1 𝑥𝑥 − 2𝑛𝑛⁄𝑥𝑥 𝐼𝐼𝑛𝑛 𝑥𝑥

 D=10 mm
L= 2.5 cm 2 𝐼𝐼2 (2𝑚𝑚𝑚𝑚)
𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 =
Ex: h= 200 W/m2 K
k= 300 W/mK
(𝑚𝑚𝑚𝑚)𝐼𝐼1 (2𝑚𝑚𝑚𝑚)

4ℎ𝐿𝐿2 4 ×200×12.5× 10−4

𝑎𝑎) 𝑚𝑚𝑚𝑚 = = = 𝟎𝟎. 𝟒𝟒𝟒𝟒𝟒𝟒𝟒𝟒 𝐼𝐼1 (2𝑚𝑚𝑚𝑚)=𝐼𝐼1 0.8165
𝑘𝑘𝑘𝑘 300×10−3 ×10×10−3

𝑏𝑏) 𝒆𝒆−0.81650 𝑰𝑰𝟏𝟏 0.8165 = 0.1959 = 0.442 𝑰𝑰𝟏𝟏 0.8165

𝑰𝑰𝟏𝟏 0.8165 =0.1959/0.442= 0.4432
c) 𝒆𝒆−0.8165 𝑰𝑰0 0.8165 = 0.5188=0.442𝑰𝑰0 0.8165
𝑰𝑰0 0.8165 =0.5188/0.442= 1.1738
2
𝑑𝑑) 𝐼𝐼2 2𝑚𝑚𝑚𝑚 = 𝐼𝐼0 2𝑚𝑚𝑚𝑚 − 2⁄2𝑚𝑚𝑚𝑚 𝐼𝐼1 2𝑚𝑚𝑚𝑚 ; 𝐼𝐼2 2𝑚𝑚𝑚𝑚 = 1.1738 − 0.4432 = 𝟎𝟎. 𝟎𝟎𝟎𝟎𝟎𝟎𝟎𝟎
0.8165

2 𝐼𝐼2 (2𝑚𝑚𝑚𝑚) 2 × 0.0882

𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 = = = 0.975
(𝑚𝑚𝑚𝑚)𝐼𝐼1 (2𝑚𝑚𝑚𝑚) 0.4082 × 0.4432
Considerations in fin design
 When L↑↑, the fin area increases and also the
heat transfer

 Cost-efficiency commitment

 When L↑↑, ηfin↓↓ (T decreases with L).

 𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓,𝑚𝑚𝑚𝑚𝑚𝑚 ≅ 60%; 𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓,𝑜𝑜𝑜𝑜 ≥ 90%

Fin Performance
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓
 𝜖𝜖𝑓𝑓𝑓𝑓𝑓𝑓 = =
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 ℎ𝐴𝐴𝑏𝑏 (𝑇𝑇𝑏𝑏 −𝑇𝑇∞ )

 Ab=base fin area

𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓

 𝜖𝜖𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎 = = 𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 𝐴𝐴𝑏𝑏

 𝜖𝜖𝑓𝑓𝑓𝑓𝑓𝑓 =1 fin does not improve the heat transfer

 𝜖𝜖𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎 <1 fin worsens the heat transfer

 𝜖𝜖𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎 >1 fin improves the heat transfer

 Surface with n fins
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 = 𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 𝑓𝑓𝑓𝑓𝑓𝑓 𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑠 + 𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 = ℎ𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ + 𝜂𝜂𝑓𝑓𝑓𝑓𝑓𝑓 ℎ𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 (𝑇𝑇𝑏𝑏 −

𝑄𝑄̇ 𝑓𝑓𝑖𝑖𝑖𝑖𝑖𝑖
𝜀𝜀𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 =
𝑄𝑄̇ 𝑓𝑓𝑟𝑟𝑟𝑟𝑟𝑟

𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 + 𝜂𝜂𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎𝑎 𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓

𝜀𝜀𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓 =
𝐴𝐴𝑓𝑓𝑓𝑓𝑓𝑓𝑓𝑓

Afin=n*Afin
Afree=Atotal-n*Afin
Atotal=complete Surface=W*L
Optimal fin lengh
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓 ℎ𝑝𝑝𝐴𝐴𝑐𝑐 𝑘𝑘 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞ tanh 𝑚𝑚𝑚𝑚
= = tanh 𝑚𝑚𝑚𝑚
𝑄𝑄̇ 𝑓𝑓𝑓𝑓𝑓𝑓,𝐿𝐿∞ ℎ𝑝𝑝𝐴𝐴𝑐𝑐 𝑘𝑘 𝑇𝑇𝑏𝑏 − 𝑇𝑇∞