MEMS C-3 - End Sem Exam, Dec.-2020

12/4/2020 MEMS C-3/End Sem Exam, Dec.
-2020
MEMS C-3/End Sem Exam, Dec.-2020

1.Total time of the quiz is 45 (5+35+5) minutes. Maximum marks are 30 . It contains 21
questions of the different marks (indicated).
2. You must submit your Quiz after the completion
3. Avoid last minute submission as it gets delayed due to server problem etc. Submit at
least 1 minute before so that it comes under 'submitted in time'
4.Quiz end time is 06:45 PM. Late submission will have consequences. Maximum, 10
minutes late will be allowed. If you submit late (from 1-5 minutes), 5 marks will be added
into Maximum Marks (MM). Similarly, If you submit late (from 6-10 minutes), 10 marks will
be added into Maximum Marks (MM). So, your marks will be (actual marks/Your-MM), finally
scaled from 30; which may be further re-scaled as per class type (New or Old ordinance).
The same will be communicated later wherever required
5. No quiz will be entertained after 10 minutes late, for reason whatsoever.
6. You will get the results of the quiz on the same or the next day, possibly.
Note: Queries during the exam time will not be entertained. Whatever is given in the
question and options should be considered at your own understanding
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Which of the following is not a drawback of Glassfrit Bonding? * 1 point
Tool damages by sodium
Process development is time consuming
Small Process Window
Dirty Process
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12/4/2020 MEMS C-3/End Sem Exam, Dec.-2020
Assertion (A): Eutectic bonding describes a heterogeneous solid mix of 2 points
atomic/chemical species, forming a joint super-lattice by striking a unique

atomic percentage ratio between the components; Reason (R): The
eutectic metals (in eutectic bonding) are alloys that transform directly
from solid to liquid or liquid to solid state at several compositions. *
Both A and R are true and R is the correct explanation of A.
A is true but, R is false.
Both A and R are true but, R is not the correct explanation of A.
A is false but, R is true.
Both A and R are false.
Draw the top and cross-sectional view of the SLSP etched profile. Assume 2 points
the etch rate in <111> direction is zero. *
Option 2 Option 3
None of the given
Option 2
Which among the given Reynolds number would indicate Laminar flow? * 1 point
10 thousand
1 million
10 million
10
Which light detection material has good response over the visible range? * 1 point
Silicon
Polymer
InGaAs
Gold
Match the following correctly: * 2 points
A – (i), B – (iii), C – (ii) and D – (iv)
A – (ii), B – (i), C – (iv) and D – (iii)
A – (ii), B – (iii), C - (iv) and D – (i)
A – (iii), B – (iv), C – (i) and D – (ii)
In the given diagram which are the profile of Self-limiting stable cavity 2 points
(SLSP)? *
D and E
C and D
B and E
A and E
A Newtonian fluid with a density of 1000 Kg/m^3, flows through a 30mm 2 points
diameter pipe with a velocity of 2.6 m/s and viscosity of 0.38 N-s/m^2.
Determine Reynolds number: *
205
215
155
185
Gold cap is used for Microreservoir Drug Delivery System because (most 1 point
appropriate answer): *
It does not corrode easily
Its oxidation with chloride makes a soluble complex which is not harmful for body
Gold is strongest material for such applications
It is not oxidised eaily
Which of the following statement is correct? * 1 point
Wet etching is generally conducted using electrical bias to the wafer under specific
ambient conditions.
In heavily doped silicon the etching rate is highly diminished for KOH and EDP.
The etch rate for silicon nitride (LPCVD) using KOH is much higher than EDP.
The etch rate on silicon oxide (thermally grown) using EDP is much higher than KOH.
IR light used for telecom applications because of (most appropriate 1 point
answer) *
Cheaper optics
Low attenuation in glass
Faster light speed
Easier alignment
What type of flow happens when an electric field moves ions at surfaces of 1 point
a water-filled capillary? *
Joule flow
Capillary flow
Electro-magnetic flow
Electro-osmotic flow
Which of the following arrangement is true with respect to processing 2 points
temperature value in bonding techniques?
Anodic bonding < Silicon direct bonding < Eutectic bonding < Fusion bonding
Anodic bonding < Silicon direct bonding < Fusion bonding < Eutectic bonding
Silicon direct bonding < Anodic bonding < Eutectic bonding < Fusion bonding
Silicon direct bonding < Eutectic bonding < Anodic bonding < Fusion bonding
In micro motor fabrication process the rotor and hub are not in tight 1 point
contact at all the times. If the rotor and the hub are separated by an in-
plane gap then which of the following factor is used to determine the size
of the gap? *
Thickness of dielectric insulating thin film layer
Thickness of the photoresist layer
Thickness of the second sacrificial layer
Contact area between rotor and the substrate
Which of the following statement is true for DNA addressing using 1 point
microeletrodes: *
No effect of electrode biasing on DNA addressing process
Negative bias is used for electrodes to attract DNA capture probe
Positive bias is used for electrodes to attract DNA capture probe
None of the given statement is true
Which of the following material is not suitable for anodic bonding? * 1 point
Option 1 Option 3
Option 2 Option 4
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Which is the correct cross-sectional view of the SLSP etched profile? 3 points
Assume the etch rate in <111> direction is 1/100th that in the <100>
direction. *
Option 4 Option 3
Option 2 Option 1
Which is the correct cross-sectional view of the SLSP profile? Assume the 2 points
etch rate in direction <111> is zero. *
Option 3 Option 2
None of the given
Option 1
What actuation method does the TI DMD mirror use? * 1 point
Thermal
Magnetic
Piezoelectric
Electrostatic
Which statement is not true for fusion bonding? * 1 point
Fast Process (due to batch annealing)
Small process window
Free choice for wafer material (Relatively)
High Cleanliness and wafer surface quality required
Which statement is not true for LIGA process? * 1 point
Complex 3D is difficult
High Aspect Ratio microstructure is costly
Integration difficult
Good for small parts
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12/4/2020 MEMS C-3/End Sem Exam, Dec.

MEMS C-3/End Sem Exam, Dec.-2020

Which of the following is not a drawback of Glassfrit Bonding? * 1 point

Tool damages by sodium

Process development is time consuming

Small Process Window

Assertion (A): Eutectic bonding describes a heterogeneous solid mix of 2 points

atomic/chemical species, forming a joint super-lattice by striking a unique

Both A and R are true and R is the correct explanation of A.

A is true but, R is false.

Both A and R are true but, R is not the correct explanation of A.

A is false but, R is true.

Both A and R are false.

the etch rate in <111> direction is zero. *

None of the given

Match the following correctly: * 2 points

A – (i), B – (iii), C – (ii) and D – (iv)

A – (ii), B – (i), C – (iv) and D – (iii)

A – (ii), B – (iii), C - (iv) and D – (i)

A – (iii), B – (iv), C – (i) and D – (ii)

It does not corrode easily

Gold is strongest material for such applications

It is not oxidised eaily

Which of the following statement is correct? * 1 point

IR light used for telecom applications because of (most appropriate 1 point

Low attenuation in glass

Faster light speed

Which of the following arrangement is true with respect to processing 2 points

temperature value in bonding techniques?

Thickness of dielectric insulating thin film layer

Thickness of the photoresist layer

Thickness of the second sacrificial layer

Contact area between rotor and the substrate

No effect of electrode biasing on DNA addressing process

Negative bias is used for electrodes to attract DNA capture probe

Positive bias is used for electrodes to attract DNA capture probe

None of the given statement is true

etch rate in direction <111> is zero. *

None of the given

What actuation method does the TI DMD mirror use? * 1 point

Which statement is not true for fusion bonding? * 1 point

Fast Process (due to batch annealing)

Small process window

Free choice for wafer material (Relatively)

High Cleanliness and wafer surface quality required

Which statement is not true for LIGA process? * 1 point

High Aspect Ratio microstructure is costly

Good for small parts

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