Professional Documents
Culture Documents
Nov. 2002
THERMAL CHARACTERISTICS
Thermal Resistance, Junction-to-Case RįJC 4.0 C/W
Thermal Resistance, Junction-to-Ambient RįJA 50 C/W
6-12
CED3055LA/CEU3055LA
ELECTRICAL CHARACTERISTICS (TC= 25 C unless otherwise noted)
C
4
Parameter Symbol Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage BVDSS VGS = 0V, ID=250µA 30 V
Zero Gate Voltage Drain Current IDSS VDS = 30V, VGS = 0V 1 µA 6
Gate-Body Leakage IGSS VGS =Ć 20V, VDS = 0V Ć100 nA
ON CHARACTERISTICS a
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250µA 0.8 2.5 V
VGS = 10V, ID = 12A 45 60 mΩ
Drain-Source On-State Resistance RDS(ON)
VGS = 5.0V, ID =12A 70 90 mΩ
On-State Drain Current ID(ON) VDS = 10V, VGS = 10V 12 A
Forward Transconductance gFS VDS = 10V, ID = 12A 20 S
b
DYNAMIC CHARACTERISTICS
Input Capacitance CISS 364 PF
VDS =15V, VGS = 0V
Output Capacitance COSS 197 PF
f =1.0MHZ
Reverse Transfer Capacitance CRSS 62 PF
b
SWITCHING CHARACTERISTICS
Turn-On Delay Time tD(ON) VDD = 15V, 12 25 ns
Rise Time tr ID = 12A 5 15 ns
VGS = 10V,
Turn-Off Delay Time tD(OFF) RGEN =2.5Ω 14 30 ns
Fall Time tf 14 30 ns
Total Gate Charge Qg VDS = 15V,ID = 6A 10 15 nC
Gate-Source Charge Qgs VGS = 10V 2 nC
Gate-Drain Charge Qgd 3 nC
6-13
CED3055LA/CEU3055LA
ELECTRICAL CHARACTERISTICS (TC=25 C unless otherwise noted)
Parameter Symbol Condition Min Typ Max Unit
DRAIN-SOURCE DIODE CHARACTERISTICS a
Diode Forward Voltage VSD VGS = 0V, Is = 12A 0.9 1.3 V
6
Notes
a.Pulse Test:Pulse Width ś 300ijs, Duty Cycle ś 2%.
b.Guaranteed by design, not subject to production testing.
30 50
VGS=10,9,8,7,6V 25 C
25
40
VGS=5V
ID, Drain Current (A)
20
30
15
VGS=4V 20
10 -55 C
Tj=125 C
10
5
VGS=3V
0 0
0 1 2 3 4 5 6
0 0.5 1.0 1.5 2.0 2.5 3.0
600 1.80
RDS(ON), On-Resistance(Ohms)
ID=12A
VGS=10V
500 1.60
RDS(ON), Normalized
C, Capacitance (pF)
400 1.40
Ciss
300 1.20
Coss
200 1.00
100 0.80
Crss
0
0 5 10 15 20 25 30
0.60
-50 -25 0 25 50 75 100 125 150
6-14
CED3055LA/CEU3055LA
1.30 1.15
VDS=VGS ID=250ijA
1.20 1.10
ID=250ijA
1.10
BVDSS, Normalized
1.05
Vth, Normalized
1.00
1.00
0.90
0.95
0.80
0.90
0.70
0.60 0.85 6
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
40
Is, Source-drain current (A)
10
30
20 1.0
VDS=10V
10
0 0.1
0 5 10 15 20 0.6 0.8 1.0 1.2 1.4 1.6
IDS, Drain-Source Current (A) VSD, Body Diode Forward Voltage (V)
Figure 7. Transconductance Variation Figure 8. Body Diode Forward Voltage
with Drain Current Variation with Source Current
10 70
VGS, Gate to Source Voltage (V)
it
VDS=15V ) Lim 10
0ij
8 ID=6A ( ON s
DS
ID, Drain Current (A)
20 R 1m
s
10
6 10 ms
DC
VGS=10V
2 Single Pulse
1
Tc=25 C
0 0.5
0 3 6 9 12 1 10 30 100
4
VDD
t on toff
RL td(on) tr td(off) tf
V IN 90%
90%
D VOUT
VGS VOUT 10% INVERTED 10%
RGEN
6 G
90%
50% 50%
S VIN
10%
PULSE WIDTH
1
Transient Thermal Impedance
D=0.5
r(t),Normalized Effective
0.2
0.1
0.1 PDM
0.05
t1
0.02 t2
0.01 1. RįJC (t)=r (t) * RįJC
Single Pulse 2. RįJC=See Datasheet
3. TJM-TC = P* RįJC (t)
4. Duty Cycle, D=t1/t2
0.01
-5 -4 -3 -2 -1
10 10 10 10 10 1 10
6-16