Transistor

2SC4767
Silicon NPN epitaxial planer type

For high-frequency power amplification

Unit: mm

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5.0±0.2 4.0±0.2

■ Features

8.0±0.2
0.7±0.2
● High transition frequency fT.

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● Output of 0.6W is obtained in the VHF band (f=175MHz).

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0.7±0.1

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13.5±0.5
■ Absolute Maximum Ratings

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(Ta=25˚C)
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Parameter Symbol Ratings Unit

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+0.15 +0.15
Collector to base voltage VCBO 36 V 0.45 –0.1 0.45 –0.1

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Collector to emitter voltage VCEO 16 V 1.27 1.27

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2.3±0.2
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Emitter to base voltage VEBO 3 V
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Peak collector current ICP 0.5

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A
1:Emitter

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1 2 3

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Collector current IC 0.3 A 2:Collector

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2.54±0.15
3:Base
Collector power dissipation PC 1 W

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TO–92NL Package

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Junction temperature Tj 150 ˚C
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Storage temperature Tstg –55 ~ +150 ˚C
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■ Electrical Characteristics
M

(Ta=25˚C)
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Parameter Symbol Conditions min typ max Unit

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p

Collector cutoff current ICBO VCB = 20V, IE = 0 10 µA

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Forward current transfer ratio hFE VCE = 13.5V, IC = 100mA** 50

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Collector to emitter saturation voltage VCE(sat) IC = 100mA, IB = 10mA 1 V

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Transition frequency fT VCB = 10V, IE = –100mA, f = 200MHz 1.5 2 GHz

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Collector output capacitance Cob VCB = 10V, IE = 0, f = 1MHz 4 8 pF

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High-frequency output PO * VCC = 13.5V, Pi = 0.03W, f = 175MHz 0.6 0.9 W

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Overall efficiency VCC = 13.5V, Pi = 0.03W, f = 175MHz 60 %

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*Refer to the PO measurment circuit ** Pulse measurement

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 Transistor 2SC4767

The high-frequency output measurement circuit at 175MHz

15pF

L2
Output
20pF 30pF L1 50Ω
Input 30pF

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50Ω
15pF
RFC2

RFC1

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30pF 25pF
30pF

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47Ω
1000pF

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Circuit constants
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L1: φ2mm silver plated copper wire, 0.5T, D = 15
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L2: φ1.5mm silver plated copper wire, 2T, D = 15

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RFC1: φ1.0mm enameled, 15T, D = 7

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RFC2: φ1.5mm silver plated copper wire, 5T, D = 8
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tin
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PC — Ta IC — VCE IC — VBE
on
sc

1.2 160 400

VCE=13.5V
p
Di

Ta=25˚C
Ta=25˚C
Collector power dissipation PC (W)

140 350
e/

1.0
nc

Collector current IC (mA)

Collector current IC (mA)

IB=4.0mA
120 300
3.5mA
na

tp t f

0.8
100 250
ht visi
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3.0mA
ain

0.6 80 2.5mA 200

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2.0mA
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60 150
0.4
Pl

1.5mA
40 100
1.0mA
0.2
20 0.5mA 50

0 0 0
0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12 0 0.2 0.4 0.6 0.8 1.0 1.2
Ambient temperature Ta (˚C) Collector to emitter voltage VCE (V) Base to emitter voltage VBE (V)

2
 Collector output capacitance Cob (pF) Collector to emitter saturation voltage VCE(sat) (V)
M

0
2
4
6
8
10
12
0.001
0.003
0.01
0.03
0.1
0.3
1
3
10

1
M

3
Transistor

ain
te

10
0.001 0.003 0.01 0.03
na

Cob — VCB
0.1
VCE(sat) — IC

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30
Di ain
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0.3

IE=0
Collector current IC (A)
IC/IB=5
Ta=25˚C

f=1MHz
Di

Ta=25˚C
1

Collector to base voltage VCB (V)

100
sc
on
sc te
tin
ue Output power Po (W) Forward current transfer ratio hFE

0
0.4
0.8
1.2
1.6
2.0
0
20
40
60
80
100
120
140
160

0
1
Pl p d
3

40
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10
on na
p ed lud

80
30

ht visi lan m m es PO — Pi
hFE — IC

120
tp t f ed ain ain foll
100

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160
Input power Pi (mW)
ww lo is is na n i
300
Collector current IC (mA)
Ta=25˚C

Ta=25˚C
tin nc
VCE=13.5V

f=175MHz
VCC=13.5V

w. win con con nce anc ng f

200
1000

se g U tin tin t e ou
m R ue ue yp typ r P
e Transition frequency fT (GHz)
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0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0

–1

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fT — I E

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Emitter current IE (mA)

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Ta=25˚C
VCB=10V

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3
2SC4767

–100 –300 –1000

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 Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

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systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.

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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

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provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

sta
Standards in advance to make sure that the latest specifications satisfy your requirements.

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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

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(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
on na

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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.

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Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

du
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

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or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
se g U tin tin t e ou
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita

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Electric Industrial Co., Ltd.
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