Pre-qualification Conditions & Check Points:

Pre-Qualification Check Points

Condition

Process: Mylar Mounting, Dicing, Micro-wash ( All packages )

A, B,C,D, E,F,G,H  Critical parameters check.

 Visual check.
 Tool consumption record.
 Dummy Check.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Die Bond ( TO-92/ 126/ 220/ TO-3/ SOT-23 )

A,C, E, F,G,H,I  Critical parameters check
 Bonding diagram
 Trv. completeness with green card/ Candidate Card Visual check
 DD test.
 Tool consumption record
B  Visual check
 DD Test
 Tool consumption record
D  Critical parameters check
 Visual check

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Wire Bond ( TO-92/ 126/ 220/ 247/ TO3/ SOT23 )

A,C, E, F,G,H  Critical parameters check
 Bonding diagram
 Trv completeness with green card/ candidate card.
 Visual check
 HPT
B  Visual check
 HPT
 Tool consumption record

D  Critical parameters check

 Visual check.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Molding ( TO-92/ 126/ 220/ SOT23 )

A, E,F,G,H  Critical parameters check Molding type

 Trv completeness with green card/ candidate card
 Visual check
 Epoxy expiry date
 Epoxy date from cold stores.
B  Critical parameter check
 Visual check
 Epoxy expiry date
 Tool consumption records.
C  Critical parameter check
 Visual check
 Molding type.
D  Critical parameters check
 Visual check
These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Chemical De-flash ( TO-92/ 126/ 220/ SOT23 )

 Critical parameters check.
A, E,F,G,H
 Trv completeness.
 Visual check.
B  Critical parameters check
 Visual check
 Tool consumption records
D  Critical parameter check
 Visual check

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Plating/ Dip-soldering ( TO-92 / 126 / 220 / 247 / SOT-23 )

A, E,F,G,H  Critical parameter check
 Trv. Completeness Visual check
 IPA change frequency
B  Critical parameter check.
 Visual check.
 Solder change records.
E  Critical parameter check.
 Trv. completeness Visual check.
 Solder change frequency.
 IPA change frequency.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Cutting Dies ( TO-92 / 126 / 220 / 247 / SOT-23 )

 Trv completeness.
A, E, F,G,H
 Visual check
B  Visual check,
 Tool consumption record.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: ISB Testing ( TO3 )

 Trv completeness.
A, D, E, F
 Correct connections.
 Correct test conditions.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process: Capping ( TO3 )

 Trv completeness.
A, E, F
 Visual check
B  Visual check,
 Tool consumption record.

These Critical Parameter are Defined in Document No. M/PD/WI/ASY/08

Process : Electrical Testing (Handlers)
Condition Check Points Criteria
Machine Check Machine Platform. There should not be any device on the machine
Platform platform
Bin Check all the bins. There should not be any device in any of the bins
Check whether the connected program is according to Control Program
Program Index
Check whether the connections are according to configuration mentioned on
Connection the traveler card
Feeder There should not be any device in feeder

A, B, C, G, H Check whether the traveler card is of same device of which buy-off is being
Trv Card performed

Check few devices. There should not be any lead bend due to finger contact
Lead Bend

Check the sorter position should be Zero / specified position

Sorter Position
Good units (min
5 nos) and reject
Test these units. They must fall into correct bins. i.e. Good units in good bin
device (min 5
and reject units in reject bin
nos - open/
short)
Good units (min
5 nos) and reject
Test these units. They must fall into correct bins. i.e. Good units in good bin
E device (min 5
and reject units in reject bin
nos - open/
short)

Bin
Check all the bins. There should not be any device in any of the bins
Check whether the connected program is according to Control Program
Program
Index
Check whether the connections are according to configuration mentioned on
Connection
the traveler card
Check whether the traveler card is of same device of which buy-off is being
Trv. Card
D,F performed

Lead Bend Check few devices. There should not be any lead bend due to finger contact

Good units (min

5 nos) and reject
Test these units. They must fall into correct bins. i.e. Good units in good bin
device (min 5
and reject units in reject bin
nos - open/
short)
Sorter Position Check the sorter position should be Zero / specified position

These Critical Parameter are Defined in Document No. M/PD/WI/TST/13

Process : Marking
Condition Check Points Criteria
Machine Check Machine Platform. There should not be any device on the machine
Platform platform
Feeder There should not be any device in feeder
A, B, C, G,
H Check whether the traveller card is of same device of which buy-off is being
Trv. Card
performed
Check the marking. It should be according to WI
Marking
For ST : M/PD/WI/TST/09, CDIL : M/PD/WI/TST/03
 Bin
Check all the bins. There should not be any device in any of the bins
Machine Check Machine Platform. There should not be any device on the machine
Platform platform
D, E
Check the marking. It should be according to WI
Marking
For ST : M/PD/WI/TST/09, CDIL : M/PD/WI/TST/03

These Critical Parameter are Defined in Document No. M/PD/WI/TST/13

Process : Tubing
Check
Condition Criteria
Points
Machine
Check Machine Platform. There should not be any device on the machine platform
Platform
A, B, C, D, Feeder There should not be any device in feeder
G Bin Check all the bins. There should not be any device in any of the bins
Check whether the traveller card is of same device of which buy-off is being
Trv. Card
performed

These Critical Parameter are Defined in Document No. M/PD/WI/TST/13

Process : Taping
Condition Check Points Criteria
Check Machine Platform. There should not be any device on
Machine platform
the machine platform
Feeder There should not be any device in feeder
A, B, C, G, Trv card Check whether the traveller card is of same device of which
H buy-off is being performed
F1/F2, C1/C2 Check whether the taped 5 units are setting on the jig smoothly
Nick Check there should not be nicking in the taped units
Chop Test Test 5 Open short units, it should be chopped off
Check Machine Platform. There should not be any device on
Machine platform
B,D,E the machine platform
F1/F2, C1/C2 Check whether the taped 5 units are setting on the jig smoothly

These Critical Parameter are Defined in Document No. M/PD/WI/TST/13