CG3043 - GM C1YX-2 HUD - DV1 - PATAC - Signature

GM WORLDWIDE ENGINEERING STANDARDS GMW3172 Component
Environmental Test Plan
GMW3172 Component Environmental Test Plan (CG3043)
Component Name (no abbreviations): Revision Date: Revision Number:

Display ASM-HEAD UP 07/04/2022 0.4
CEMENT Family Name: Component Manufacturer:

2023_C1YX-2_HUD_Continental Continental Automotive Guadalajara México,
S.A. de C.V.
Periférico Sur #7999-D
Note: The family name needs to be agreed C.P. 45601. Tlaquepaque Jalisco, México
upon by the GM DRE, GM CVE, GMW3172
ENV SME, and EMC SME.
Component Part Number(s): Project:
C1YX: 84996460 First vehicle application: MY2023 C1YX-2
Mounting Location in Vehicle: Dash
Prepared by (Supplier): Test Plan Approved by GM Responsible

Erick Rangel Engineer:
erick.salvador.rangel.tirado@continental- GMW3172 ENV SME: (TBD) approves
corporation.com GMW3172 procedures.
GM Validation Engineer:
Dingyu Xu, dingyu_xu@patac.cn
2022/7/12
Approved by (Supplier): Test Results Will be Approved by GM
Marco Romero Responsible Engineer:
marco.romero@continental- ☒ Validation Engineer (typically)
corporation.com ☐ GMW3172 ENV SME
+52 33 3283 6740
April 2018 v2 Page 1 of 160
Internal
Revision History
Date Revisio Test Description (include changes made to the Test Plan, as well as Author
n Iteration changes to the design and/or manufacturing processes)
Number (e.g.,
DV01,
DV02,
PV01, etc.)
12/15/ 0.1 DV01 Initial draft ER

2021
19/01/ 0.2 DV01 Added Visual Change Document ER

2022
06/06/ 0.3 DV01 Updated Checklist and Visual Change Document ER
2022
Visual Change
document-previewed.pptx
28/06/ 0.4 DV01 Updated according QL comments ER

2022
This Test Plan is approved with the following corrections and/or added conditions:
Internal
Test Plan Purpose:

DV testing for HUD MY23 C1YX-2
For changes made between different iterations of the Test Plan, consider the following items:
1. Were there any parts (e.g., resistors, capacitors, etc.) that changed or were added to the circuit
board including supplier changes?
2. Did DV use a different circuit board than PV? For example, sometimes DV uses a "quick-turn"
board. And PV uses a production board.
3. Did DV use the same solder line(s) as PV? For example, are all solder processes from the same
production line, in the same location, using the same solder profile?
4. Were any changes made to the housing design between DV and PV (e.g., snap fits, attachment
point to vehicle, structural ribs, other dimensions, etc.)? Did DV use the same injection molding
process as PV for the component housing? For example, is it from the same supplier, in the same
location, using the same injection molding machine and same tools? For example, did DV use soft
tools and PV use hard tools?
5. Were design changes made to address previous test iteration issues?
Shown below is an example that describes examples of changes. Changes can be shown in
any format as a table or as an embedded document.
Example: Description of changes between DV and PV

1 Added capacitors C102 and C105 to improve BCI performance.
2 Changed EEPROM to add more memory.
3 Added fan to improve PCB cooling.
4 Added conformal coating to address moisture issues.
5 Production soldering process
Internal
1 INTRODUCTION ............................................................................................................................ 7
1.1 PURPOSE ............................................................................................................................... 7
1.2 GUIDELINES FOR TEST DESCRIPTIONS ........................................................................... 7
1.3 QUOTING REQUIREMENTS ................................................................................................. 8
1.4 PARAMETER AND TOLERANCE REQUIREMENTS ........................................................... 9
1.5 TEST REQUIREMENTS ....................................................................................................... 10
1.5.1 TEST REQUIREMENTS TABLE ................................................................................... 10
1.5.2 PROCEDURE PLANNING TOOLS ............................................................................... 13
1.6 TEST FLOWS ....................................................................................................................... 14
1.6.1 DEVELOPMENT ............................................................................................................ 14
1.6.2 DESIGN VALIDATION DV01 ......................................................................................... 15
PRODUCT VALIDATION PV01 ................................................................................................... 16
2 COMPONENT DESCRIPTION .................................................................................................... 17
2.1 COMPONENT FAMILY DESCRIPTION ............................................................................... 17
2.2 ENVIRONMENTAL HARDWARE DESIGN REVIEW CHECKLIST .................................... 17
2.3 COMPONENT PHYSICAL DESCRIPTION .......................................................................... 18
2.4 COMPONENT FUNCTIONAL DESCRIPTION ..................................................................... 22
2.5 OPERATING TYPES ............................................................................................................ 26
2.6 FUNCTIONAL STATUS CLASSIFICATION (FSC) ............................................................. 27
3 TEST SETUP AND COMPONENT VERIFICATION ................................................................... 28
3.1 1-POINT FUNCTIONAL/PARAMETRIC CHECK ................................................................. 28
3.2 5-POINT FUNCTIONAL/PARAMETRIC CHECK ................................................................. 31
3.3 CONTINUOUS MONITORING.............................................................................................. 33
3.4 FUNCTIONAL CYCLING ...................................................................................................... 34
3.5 SIMULATION AND LOADS ................................................................................................. 36
3.6 VISUAL INSPECTION AND DISSECTION – DRBTR ......................................................... 37
3.7 CROSS SECTION AND INSPECTION ................................................................................ 41
3.8 DIMENSIONAL CHECK ....................................................................................................... 49
3.9 VIBRATION TRANSMISSIBILITY DEMONSTRATION ....................................................... 50
3.10 THERMAL PROFILE CYCLE DEVELOPMENT .................................................................. 55
3.11 TEST HARNESS REQUIREMENTS .................................................................................... 56
4 ANALYSIS ................................................................................................................................... 57
4.1 ELECTRICAL........................................................................................................................ 57
4.1.1 NOMINAL AND WORST CASE PERFORMANCE ANALYSIS ..................................... 57
4.1.2 SHORT/OPEN CIRCUIT ANALYSIS ............................................................................. 58
4.2 MECHANICAL ...................................................................................................................... 58
4.2.1 RESONANT FREQUENCY ANALYSIS ......................................................................... 58
4.2.2 HIGH ALTITUDE SHIPPING PRESSURE EFFECT ANALYSIS (NON-APPLICABLE) 59
4.2.3 PLASTIC SNAP FIT FASTENER ANALYSIS (NON-APPLICABLE) ............................. 59
4.2.4 CRUSH ANALYSIS (NON-APPLICABLE) ..................................................................... 60
4.3 CLIMATIC ............................................................................................................................. 60
4.3.1 HIGH ALTITUDE OPERATION OVERHEATING ANALYSIS ....................................... 60
4.3.2 THERMAL FATIGUE ANALYSIS .................................................................................. 62
Internal
4.4 MATERIAL ............................................................................................................................ 62

4.4.1 LEAD-FREE SOLDER ANALYSIS (NON-APPLICABLE) ............................................. 62
5 DEVELOPMENT .......................................................................................................................... 63
5.1 ELECTRICAL........................................................................................................................ 63
5.1.1 JUMP START ................................................................................................................ 63
5.1.2 REVERSE POLARITY ................................................................................................... 64
5.1.3 OVER VOLTAGE ........................................................................................................... 65
5.1.4 STATE CHANGE WAVEFORM CHARACTERIZATION ............................................... 67
5.1.5 GROUND PATH INDUCTANCE SENSITIVITY............................................................. 68
5.2 MECHANICAL ...................................................................................................................... 69
5.2.1 HIGHLY ACCELERATED LIFE TEST (HALT) (NON-APPLICABLE) ........................... 69
5.3 CLIMATIC ............................................................................................................................. 70
5.3.1 TEMPERATURE MEASUREMENT ............................................................................... 70
5.3.2 LOW TEMPERATURE WAKEUP .................................................................................. 71
5.3.3 FROST ........................................................................................................................... 72
5.3.4 HIGHLY ACCELERATED STRESS TEST (HAST) (NON-APPLICABLE) .................... 75
6 DESIGN VALIDATION (DV) ........................................................................................................ 75
6.1 ELECTRICAL........................................................................................................................ 75
6.1.1 PARASITIC CURRENT ................................................................................................. 75
6.1.2 POWER SUPPLY INTERRUPTIONS ............................................................................ 77
6.1.3 BATTERY VOLTAGE DROPOUT ................................................................................. 78
6.1.4 SINUSOIDAL SUPERIMPOSED VOLTAGE ................................................................. 81
6.1.5 PULSE SUPERIMPOSED VOLTAGE ........................................................................... 82
6.1.6 INTERMITTENT SHORT CIRCUIT TO BATTERY AND TO GROUND FOR
INPUT/OUTPUT ........................................................................................................................... 85
6.1.7 CONTINUOUS SHORT CIRCUIT TO BATTERY AND TO GROUND FOR
INPUT/OUTPUT ........................................................................................................................... 86
6.1.8 MULTIPLE POWER AND MULTIPLE GROUND SHORT CIRCUITS INCLUDING PASS
THROUGH(NON-APPLICABLE).................................................................................................. 88
6.1.9 OPEN CIRCUIT – SINGLE LINE INTERRUPTION ....................................................... 91
6.1.10 OPEN CIRCUIT – MULTIPLE LINE INTERRUPTION .................................................. 91
6.1.11 GROUND OFFSET (NON-APPLICBLE) ....................................................................... 92
6.1.12 POWER OFFSET (NON-APPLICABLE) ....................................................................... 93
6.1.13 DISCRETE DIGITAL INPUT THRESHOLD VOLTAGE (NON-APPLICABLE) .............. 94
6.1.14 OVER LOAD – ALL CIRCUITS (NON-APPLICABLE) ................................................... 97
6.1.15 OVER LOAD – FUSE PROTECTED CIRCUITS (NON-APPLICABLE) ........................ 98
6.1.16 INSULATION RESISTANCE (NON-APPLICABLE) ...................................................... 99
6.1.17 CRANK PULSE CAPABILITY AND DURABILITY ....................................................... 100
6.1.18 SWITCHED BATTERY LINES (NON-APPLICABLE) .................................................. 103
6.1.19 BATTERY LINE TRANSIENTS ................................................................................... 106
6.2 MECHANICAL .................................................................................................................... 107
6.2.1 VIBRATION WITH THERMAL CYCLING .................................................................... 107
6.2.2 MECHANICAL SHOCK – POTHOLE .......................................................................... 110
Internal
6.2.3 MECHANICAL SHOCK – COLLISION ........................................................................ 112

6.2.4 MECHANICAL SHOCK – CLOSURE SLAM – (NON-APPLICABLE) ......................... 114
6.2.5 CRUSH FOR HOUSING – ELBOW LOAD (NON-APPLICABLE) ............................... 117
6.2.6 CRUSH FOR HOUSING – FOOT LOAD – (NON-APPLICABLE) ............................... 118
6.2.7 GMW3191 CONNECTOR TESTS: TERMINAL PUSH-OUT FORCE ......................... 119
6.2.8 GMW3191 CONNECTOR TESTS: CONNECTOR-TO-CONNECTOR ENGAGEMENT
FORCE 120
6.2.9 GMW3191 CONNECTOR TESTS: LOCKED CONNECTOR DISENGAGEMENT
FORCE 120
6.2.10 GMW3191 CONNECTOR TESTS: UNLOCKED CONNECTOR DISENGAGEMENT
FORCE 121
6.2.11 CONNECTOR INSTALLATION ABUSE – SIDE FORCE ............................................ 121
6.2.12 CONNECTOR INSTALLATION ABUSE – FOOT LOAD – N/A, MODULE NOT
EXPOSED TO FOOT LOADS DURING ASSEMBLY (NON-APPLICABLE) ............................. 122
6.2.13 FREE FALL .................................................................................................................. 123
6.2.14 FRETTING CORROSION DEGRADATION ................................................................ 124
6.3 CLIMATIC ........................................................................................................................... 126
6.3.1 HIGH TEMPERATURE DEGRADATION .................................................................... 126
6.3.2 THERMAL SHOCK AIR-TO-AIR (TS) ......................................................................... 128
6.3.3 POWER TEMPERATURE CYCLE (PTC) ................................................................... 130
6.3.4 THERMAL SHOCK/WATER SPLASH – N/A PER CLIMATIC CODE LETTER “D”
(NON-APPLICABLE) .................................................................................................................. 133
6.3.5 HUMID HEAT CYCLIC (HHC) ..................................................................................... 134
6.3.6 HUMID HEAT CONSTANT (HHCO) ............................................................................ 137
6.3.7 SALT MIST .................................................................................................................. 139
6.3.8 SALT SPRAY (NON-APPLICABLE) ............................................................................ 142
6.3.9 MINIMUM NON-OPERATING TEMPERATURE ......................................................... 143
6.4 ENCLOSURE ...................................................................................................................... 144
6.4.1 DUST ........................................................................................................................... 144
6.4.2 WATER ........................................................................................................................ 145
6.4.3 SEAL (NON-APPLICABLE) ......................................................................................... 146
6.4.4 LEAKAGE CHECK (NON-APPLICABLE) .................................................................... 148
6.4.5 WATER FREEZE (NON-APPLICABLE) ...................................................................... 149
6.4.6 SUGAR WATER FUNCTION IMPAIRMENT (NON-APPLICABLE) ............................ 150
7 PRODUCT VALIDATION (PV) .................................................................................................. 150
7.1 MECHANICAL .................................................................................................................... 150
7.1.1 SHIPPING VIBRATION ............................................................................................... 150
8 ADDITIONAL ACTIVITIES ........................................................................................................ 152
8.1 SQUEAK AND RATTLE ..................................................................................................... 152
8.2 IMAGE POSITION MOTOR NOISE ................................................................................... 153
9 APPENDIX ................................................................................................................................. 159
9.1 APPENDIX TEST SUMMARY FOR QL TECHNICIANS ................................................... 159
9.2 APPENDIX HUD MIRROR POSITION ............................................................................... 160
Internal
1 Introduction
This Test Plan shall be completed by the supplier and submitted to GM 6 weeks after supplier sourcing
for approval by the GMW3172 ENV SME (Environmental Subject Matter Expert). All sections shall be
included as stated in the outline, only additions of new sections are allowed. If a section is not
applicable, this shall be stated in this Test Plan along with supporting justification in the relevant section
description.
1.1 Purpose
The purpose of this Test Plan documents the component operation and test procedures for all tests
according to GMW3172. It describes all test set-ups and the procedures to verify the
environmental/durability robustness of the design.
1.2 Guidelines for Test Descriptions
Provide specific test set-up information and information to the component, including block diagrams,
photographs, etc. indicating component connections to the facility and test equipment. Do not include
copies of generic set-up diagrams from IEC/ISO/SAE or other standards as long as you refer to the
documents.
All sections shall be completed by the supplier using the following guidelines:
• The information inside each section shall include as much detailed information as necessary for
the completion of the test and its traceability/repeatability.
• Sections as shown in the template shall stay in the same order. Sections shall not be deleted.
• The supplier shall modify areas marked (TBD) or shown in Bold Blue font, or as needed to
customize the Test Plan for their application.
• All supplier inputs shall appear in Bold Blue font.
• If a test section is not applicable to the component or the Test Plan, provide a technical reason as
shown below in the example for Crush for Housing – Foot Load:
6.2.6 Crush for Housing – Foot Load
N/A - The Mechanical Load code for this component does not require this test.
Internal
1.3 Quoting Requirements

According to the Component Technical Specification (CTS), Component Technical Requirements and
Specifications (CTRS), or the Subsystem Technical Specification (SSTS), the GMW3172 Code Letters
are defined as follows:
Electrical Mechanical Temperature Climatic Chemical Dust and Water

Loads Loads Loads Loads Loads Protection
C C C D A IP5K2
The Code Letter definitions are referenced in GMW3172 (April 2018).

Define “Z” codes here if applicable: N/A – No “Z” code designations
This Classification results in following Parameters:

Umin = 9.0 ± 0.1 V Tmin = -40 ± 3 °C
UA = 14.0 ± 0.1 V Tmax = +85 ± 3 °C
UB = 12.0 ± 0.1 V TPH = N/A
Umax = 16.0 ± 0.1 V TRPS = +95 ± 3 °C
Deviations from the above mentioned requirements shall be agreed by the responsible GMW3172 ENV
SME and need to be described in this document.
Additional requirements:
Vehicle type (car, truck, or heavy duty truck): car
Test Reliability/Confidence requirement: R99/C50
Internal
1.4 Parameter and Tolerance Requirements

Unless stated otherwise, the following shall define the test environment parameters and tolerances to
be used for all validation testing:
Parameter Tolerance
Ambient Temperature Spec. ± 3 °C
Room Temperature Troom = +23 ± 5 °C
Test Time Spec. ± 0.5%
Room Ambient Relative Humidity (30...70)%
Chamber Humidity Spec. ± 5%
Voltage Spec. ± 0.1 V
Current Spec. ± 1%
Resistance Spec. ± 10%
Random Acceleration (GRMS) Spec. ± 20% (PSD deviations from applicable tables
are not permitted without GM approval)
Acceleration (Mechanical Shock, G) Spec. ± 10% (deviations are not permitted without
GM approval)
Frequency Spec. ± 1%
Force Spec. ± 10%
Distance (Excluding Dimensional Check) Spec. ± 5%
RMS Root Mean Square
Internal
1.5 Test Requirements

1.5.1 Test Requirements Table
Identify any non-applicable activities in the following table as “N/A”. Provide technical reasons for each
N/A in the appropriate test sections.
Analysis Development Design Validation Product Validation
Number of Number of Number of
Samples Samples Samples
Test Setup and Component Verification

Initial 5-Point Functional/Parametric N/A N/A 20 (TBD)
Check
Final 5-Point Functional/Parametric Check N/A N/A 20 (TBD)
Visual Inspection and Dissection – N/A N/A 20 (TBD)
DRBTR
Cross Section and Inspection N/A N/A 3 (TBD)
Dimensional Check N/A N/A 6 (TBD)
Vibration Transmissibility Demonstration N/A N/A 2 (TBD)
Thermal Cycle Profile Development N/A N/A N/A (TBD)
Test Harness Requirements N/A N/A N/A (TBD)
Analysis
Electrical
Nominal and Worst Case Performance DONE N/A N/A (TBD)
Analysis
Short/Open Circuit Analysis DONE N/A N/A (TBD)
Mechanical
Resonant Frequency Analysis DONE N/A N/A (TBD)
High Altitude Shipping Pressure Effect N/A N/A N/A (TBD)
Analysis
Plastic Snap Fit Fastener Analysis N/A N/A N/A (TBD)
Crush Analysis N/A N/A N/A (TBD)
Climatic
High Altitude Operation Overheating DONE N/A N/A (TBD)
Analysis
Thermal Fatigue Analysis DONE N/A N/A (TBD)
Material
Lead-Free Solder Analysis N/A N/A (TBD)
Development
Electrical
Jump Start N/A N/A (TBD)
Reverse Polarity N/A N/A (TBD)
Over Voltage N/A N/A (TBD)
Internal

State Change Waveform Characterization N/A N/A (TBD)
Ground Path Inductance Sensitivity N/A N/A (TBD)
Mechanical
Highly Accelerated Life Test (HALT) N/A N/A (TBD)
Climatic
Temperature Measurement N/A 9 (TBD)
Low Temperature Wakeup N/A N/A (TBD)
Frost N/A N/A (TBD)
Highly Accelerated Stress Test (HAST) N/A N/A (TBD)
Design Validation (DV)

Electrical
Parasitic Current N/A (TBD)
Power Supply Interruptions N/A (TBD)
Battery Voltage Dropout N/A (TBD)
Sinusoidal Superimposed Voltage N/A (TBD)
Pulse Superimposed Voltage N/A (TBD)
Intermittent Short Circuit to Battery and to N/A (TBD)
Ground
Continuous Short Circuit to Battery and to N/A (TBD)
Ground
Multiple Power and Multiple Ground Short N/A (TBD)
Circuits Including Pass Through
Open Circuit – Single Line Interruption N/A (TBD)
Open Circuit – Multiple Line Interruption N/A (TBD)
Ground Offset N/A (TBD)
Power Offset N/A (TBD)
Discrete Digital Input Threshold Voltage N/A (TBD)
Over Load – All Circuits N/A (TBD)
Over Load – Fuse Protected Circuits N/A (TBD)
Insulation Resistance N/A (TBD)

Crank Pulse Capability and Durability N/A (TBD)
Switched Battery Lines N/A (TBD)
Battery Line Transients N/A (TBD)
Mechanical
Vibration With Thermal Cycling 6 (TBD)
Mechanical Shock – Pothole 6 (TBD)
Mechanical Shock – Collision 9 (TBD)
Internal

Mechanical Shock – Closure Slam N/A (TBD)
Crush For Housing – Elbow Load N/A (TBD)
Crush For Housing – Foot Load N/A (TBD)
GMW3191 Connector Tests: Terminal N/A (TBD)
Push-out Force
GMW3191 Connector Tests: Connector- N/A (TBD)
to-Connector Engagement Force
GMW3191 Connector Tests: Locked N/A (TBD)
Connector Disengagement Force
GMW3191 Connector Tests: Unlocked N/A (TBD)
Connector Disengagement Force
Connector Installation Abuse – Side Force N/A (TBD)
Connector Installation Abuse – Foot Load N/A (TBD)
Free Fall N/A (TBD)
Fretting Corrosion Degradation N/A (TBD)
Climatic
High Temperature Degradation 6 (TBD)
Thermal Shock Air-To-Air (TS) N/A (TBD)
Power Temperature Cycle (PTC) N/A (TBD)
Thermal Shock/Water Splash N/A (TBD)
Humid Heat Cyclic (HHC) N/A (TBD)
Humid Heat Constant (HHCO) N/A (TBD)
Salt Mist N/A (TBD)
Salt Spray N/A (TBD)
Minimum Non-Operating Temperature 3 (TBD)
Enclosure
Dust 3 (TBD)
Water 3 (TBD)
Seal N/A (TBD)
Leakage Check N/A (TBD)
Water Freeze N/A (TBD)
Sugar Water Function Impairment N/A (TBD)
Product Validation (PV)

Mechanical
Shipping Vibration N/A (TBD)
Additional Activities
Squeak and Rattle 3 (TBD)
Image Position Motor Noise 3 (TBD)
Internal
1.5.2 Procedure Planning Tools

Provide the Procedure Planning Tool files below.
1.5.2.1 DV01 Procedure Planning Tool
GMW3172
Procedure Planning Tool V2.1 (Apr2018).xlsx
1.5.2.2 PV01 Procedure Planning Tool

(TBD: The updated Procedure Planning Tool to be embedded here)
Internal
1.6 Test Flows

The Test Flows are embedded below as editable documents that may be customized for the Test Plan.
1.6.1 Development
NA
Internal
1.6.2 Design Validation DV01

32
Internal
Product Validation PV01

(TBD: test flow)
PV Test Flow
Mar2018 v2.pptx
Internal
2 Component Description
2.1 Component Family Description

Provide a brief component product family description, including any similarities and differences of
planned hardware and software within the family. In some cases, it may make sense to select a specific
sample for test that represents the entire component family. Please state the justification and rationale
for doing this.
A “family” is defined as a set of components that is validated by testing one of those part numbers. In
other words, testing one of those part numbers will validate the rest of the part numbers in that group
of components. Each part in a family needs to be electrically and mechanically identical. For example,
they must have the same PCB and housing design.
The GM C1YX-2 Head-up Display (HUD) is offered each one as a single project with its each
corresponding windshield.
The following carline are covered by these projects:
• C1YX-2 (GMC Traverse, Acadia, Enclave)
Only a left-hand drive version of the cars is going to be into the scope of this development.
The new GM C1YX-2 HUD are based on the previous GM HUD O1SL-2; µController (variant), TFT
Display, backlight illumination, ambient light sensor, stepper motor and its driver are reused
from it. Power supplies are from Continental’s platform also used in other HUD projects. LVDS
in general is known from GM HUD O1SL-2 and other projects. The video scaling chip and
dedicated LVDS (FPD-Link IV) chipset with I²C interface are new circuits but with a well-known
interface.
2.2 Environmental Hardware Design Review Checklist

Provide completion date of the Environmental Hardware Design Review based on the Environmental
Hardware Design Review Checklist.
Component Environmental Hardware Design Review completed on: TBD
C1YX_Environmental
Hardware Design Review Checklist.xlsx
Internal
2.3 Component Physical Description

Provide a description of the components hardware including drawings and orientation with respect to
the following vehicle axes:
X-axis: fore-aft (driving) direction (+X is vehicle forward driving direction)
Y-axis: lateral direction (+Y is left side of vehicle)
Z-axis: vertical (to road surface) direction (+Z is vertical)
Component Mounting in Vehicle. Include a CAD drawing/photos/component orientation showing X-

, Y-, and Z-axis.
Figure 1 Component orientation C1YX-2
Internal
Exploded view GM HUD C1YX-2
GM HUD C1YX-2 BOM
Pos. Designation Quantity Material Comments

Adhesive tape / Antireflex
1 1.8” TFT display module 1 PC foil
film
2 Optical plate 1 COP
3 Light guide 1 PC With coating
4 Polarizer foil 1
5 Honeycomb reflector 1 PC With coating
Internal
Pos. Designation Quantity Material Comments
6 LED cable 1
7 LED PCB 1
8 Thermal paste 1
9 Heat sink 1 Aluminium
10 Screws 3 Steel for Heat sink with PGU
11 Screws 3 Steel For Heat sink with Housing
Cold mirror, IR
12 Flat mirror 1 Glass
Transparent
13 Phase retarder 1
14 Screen 1 PC+GF30 Black paint
15 Screws 3 Steel For screen
for Ambient light conductor
16 Screws 2 Steel
cover
Ambient light conductor
17 1 PC Texture
cover
18 Ambient light conductor 1 PC
19 Light sensor PCB 1
20 Screw 1 Steel for Light sensor PCB
21 Cable light sensor 1
22 Antireflex film 1
Adhesive tape / Antireflex
23 Glass cover 1 PC foil
film
24 Adhesive tape 4
25 Clamp 4 X10CrNi18-8 for Top cover
26 Top Cover 1 PC Texture
27 Housing 1 PC+GF30
28 Main PCB 1
29 Sheet metal cover 1 Steel
30 Screws 5 Steel for Sheet metal cover
31 Adjustment unit 1
32 Screws 2 Steel for Adjustment unit
33 Aspheric Mirror 1 COC Black, coating
34 Bearing support-Fixed 1 POM Bearing support-Fixed
35 Bearing support-Free 1 POM
36 Spring clip 2 X10CrNi18-8 for Bearings
for Bearing fix & Bearing
37 Rivet 2 PA
free
Mounting Offset. If required by the CTS/CTRS, an offset to the attachment mounting surface shall be
used to create a torsional load to the component housing. This will apply to the tests that are agreed
upon between the supplier and the GMW3172 ENV SME. Describe the offset to the mounting
attachment surface and include the offset parameter in each agreed upon test.
Internal
Component Mounting on Test. Sample mounting is critical for certain tests. Describe the mounting
orientation in the parameter or procedure section of each of the following agreed upon tests:
• Vibration With Thermal Cycling, Mechanical Shock – Pothole, Mechanical Shock – Collision,
and Mechanical Shock – Closure Slam – to simulate the mechanical interface to the vehicle.
• High Temperature Degradation and Power Temperature Cycle – to check component cooling
capability when orientation can affect the cooling capability and to test the component for the
effects of material runoff when viscous materials are involved.
• Frost, HHC, HHCO, Salt Mist/Spray, Water, Water Freeze, and Sugar Water Function
Impairment – to test the effects of moisture run-off and accumulation on the circuit
board/component.
• Thermal Shock/Water Splash, Salt Spray, and Water (IP Codes 3 – 6K, 9K) – to ensure that
the water is applied in the same direction as it would when installed in the vehicle.
• Any other tests where mounting is critical.
Internal
2.4 Component Functional Description

Provide a brief overview of the component functions, including component interfaces. Use wording that
describes the component to those not familiar with the component. Define all abbreviations. Provide a
list of all used connector pins and their function. Provide an exceptions list for any functions/features
that are not available for DV.
System Overall Functionality
GM C1XY-2 HUD’s are designed to receive a video stream from the Vehicle Control Unit (VCU) via
LVDS (FPD Link IV) interface. All video/images received from the VCU are shown on an LCD TFT
(Thin Film Transistor) display which is backlighted by white LEDs. All these constitute a PGU (Picture
Generating Unit).
The image shown in the TFT display is then projected to the windshield using optical and mechanical
components.
For vertical adjustment of the virtual images, a stepper motor is used to move an aspherical mirror.
Motor is driven by a driver using PWM. The reference position of the stepper motor is known with a
Zero position switch.
All functions of the GM C1YX-2 HUD are controlled through bidirectional control channel implemented
via embedded signaling in the high-speed forward channel (serializer to deserializer) combined with
lower speed signaling in the reverse channel (deserializer to serializer).
The backlighting intensity is set by software, sent by the VCU through I 2C commands, the dimming
control module sets the target brightness for the backlight of the Head-up Display.
In order to keep the backlight intensity stable against ambient light changes, a light sensor is used as
part of the product to sense the changes in the ambient light, so the microcontroller is able to adjust
the LED current and PWM (via LED driver) that pass through the LEDs (backlight) and keep a flat
illumination.
Temperature sensor (NTC) is used to protect the critical components that are sensible to the
temperature; TFT display. Sensor communicates through I2C interface to microcontroller.
The HUD is protected against weather environment with a Housing, Glass cover and is positioned
steady to the vehicle. HUD is also protected from Sun light reflections by optics design.
Internal
Detailed Function Block Diagram (applies to C1YX-2)
Block Diagram
GM HUD A2LL-2/C1UL-2/C1YX-2
+BAT +3V3 +5V
+3V3
Vehicle Connector
Stepper motor Position

Power supply +1V1 PWM driver
Connector
PWM Stepper Motor
+1V5 Mirror
CPU
+1V8
Zero Position Adjustment
JCP2016
+5V Base Line
BAT ADC
ADC
I2C I2C
I2C I2C
KL30A
I2C ADC PWM ADC
3 x PWM
UART
+BAT Battery Sensing
PWM
Backlight Temperature
LVDS Connector
TFT Temperature
LVDS Deserializer
Backlight Error
LVDS FPD-Link-IV
I2C
Control +BAT
BackLight
+3V3 Driver
Video scaling
+1V5
LED+
LED-
GND
RGB666
+3V3
+3V3
Main PCB
Connector Connector Connector
RGB666
Ambient Light
LED Backlight
Sensor
Display TFT
LED PCB Sensor PCB
Main connector
Pinout description is list in Table 1 and Table 2
The GM C1YX-2 WHUD are connected to the vehicle with a 4-pin connector. This connector provides
the connection for power supply.
• Supplier: Molex
• Ordering code (WHUD): 34912-8040
Figure 2: C1YX-2 main connector
Internal
Table 1: Main connector X1000 pinout

Pin
Function
X1000
1 Battery
2 Ground
3 Spare
4 Spare
Internal
LVDS connector
For LVDS connection, data lines of connector are used.

• Supplier: Molex
• Ordering code (WHUD): 160063-1733
Figure 3: LVDS (FPD Link IV) connector
Table 2: LVDS (FPD-Link IV) connector pinout

Pin
Function Remark
X4000
1 No connect Not Used (AC coupled to Ground in HUD)
2 LVDS 1 (DOUT-/RIN-) Twisted Pair
3 LVDS 2 (DOUT+/RIN+) Twisted Pair
4 Pair drain AC coupled to Ground in HUD
Shell Shield AC Coupled to Ground in HUD
Internal
2.5 Operating Types

The following table reflects the electrical operating type of GMW3172. Describe the I/O states for each
Operating Type. Provide any additional clarification for component specific Electrical State as
necessary.
Operating Type Electrical State

1 No voltage is applied to the component.
1.1 Component is not connected to wiring harness.
1.2 Component is connected to wiring harness.
2 The component is electrically powered with supply voltage UB (battery voltage; generator not
active/engine shut-off) with all electrical connections made. (UB= 12v)
2.1 Component functions are not activated (i.e., serial data communications are not
active or component is OFF). (UB=12v, FPDLinkBox “Wake_CMD”
Switch in OFF position, Maximum current consumption 75µA, all
functions are not available)
2.2 Component with electric operation and control in typical operating mode.
(UB=12v, FPDLinkBox “Wake_CMD” Switch in ON position, using
VCU simulator EMC mode, Connect and select “Normal Mode”,
current consumption 800-1300 mA, all functions are available)
3 The component is electrically powered with supply voltage UA (engine/generator active) with all
electrical connections made. (UA= 14v)
3.1 Component functions are not activated (i.e., serial data communications are not
active or component is OFF). (UA= 14v, FPDLinkBox “Wake_CMD”
Switch in OFF position, Maximum current consumption 75µA, all
functions are not available)
3.2 Component with electric operation and control in typical operating mode.
(UA= 14v, FPDLinkBox “Wake_CMD” Switch in ON position, using
VCU simulator EMC mode, Connect and select “Normal Mode”,
current consumption 800-1200 mA, all functions are available)
DUT Mode Descriptions
Internal
2.6 Functional Status Classification (FSC)

The FSC defines the functional performance of the component.
Class Definition of FSC Class

A All functions of the component perform as designed during and after the test.
B All functions of the component perform as designed during the test. However, one or more of
them may go beyond the specified tolerance. All functions return automatically to within normal
limits after the test. Memory functions shall remain FSC A. GM Engineering shall specify which
function of the component shall perform as designed during the test and which function can be
beyond the specified tolerance.
FSC A is also acceptable for components that are classified as FSC B.
C One or more functions of the component do not perform as designed during the test but return
automatically to normal operation after the test.
FSC A or B are also acceptable for components that are classified as FSC C.
D One or more functions of the component do not perform as designed during the test and do not
return to normal operation after the test until the component is reset by any “operator/use” action.
FSC A, B, or C are also acceptable for components that are classified as FSC D.
E One or more functions of the component do not perform as designed during and after the test and
cannot be returned to proper operation without repairing or replacing the component.
FSC A, B, C, or D are also acceptable for components that are classified as FSC E.
Internal
3 Test Setup and Component Verification
3.1 1-Point Functional/Parametric Check

Provide details of the 1-Point Functional/Parametric Check that is used during or after tests as
defined in this Test Plan to verify full functionality of the component as defined in the CTS/CTRS
while exposed to a single temperature and single voltage.
Applicable Standard: GMW3172, April 2018, § 6.2

Operating Type: 2.1 (to confirm functionality in Sleep Mode/OFF mode) / 3.2
Monitoring: As defined in the following procedure
Parameters: Troom = +23 ± 5 °C
Unom, where Unom is UB = 12.0 ± 0.1 V for Operating Type 2.1,
and UA = 14.0 ± 0.1 V for Operating Type 3.2
Procedure:
The 1-Point Functional/Parametric Check shall be performed at (Troom, UB for Operating Type 2.1, and
UA for Operating Type 3.2), unless otherwise specified in the GMW3172 Component Environmental
Test Plan (CG3043).
The temperature shall be stabilized for at least 0.5 h prior to the 1-Point Functional/Parametric Check.
The 1-Point Functional/Parametric Check shall be conducted with actual vehicle loads or equivalent.
All loads shall be documented in the GMW3172 Component Environmental Test Plan (CG3043).
The power supply shall be capable of supplying sufficient current to avoid current limiting under high
in-rush conditions.
1) List all functions that will be verified by monitoring and recording all outputs (both hardwired and
on-vehicle data bus communications), or a subset thereof, and their states for a given set of inputs
and timing conditions. List appropriate tolerances and acceptance criteria.
The only output from the HUD is the LVDS Bus communication (with I2C protocol
implemented over the backchannel). The following signals will be monitored in this
output:
a. HUD Ambient Light Sensor
I. Ambient Light Sensor value (Message ID 0x0D), Light sensor reading of

the forward light conditions.
Ranges of Values: 1-100%, 1 byte.
b. 0
I. HUD should expect the VCU to always send LVDS signal when the HUD
is awake via the FPDLINK4 bus. HUD will read lock pin on LVDS de-
serializer to confirm data connection is set. If HUD detects lock pin is
not active and HUD is awake via the FPDLINK4 bus, HUD will set DTC.
The HUD Diagnostic DTC is evaluated by I2C message (0x13).
c. HUD Mirror position
Internal
I. The HUD mirror is adjusted to the maximum position by I2C Message

0x22 Height Slider Value Request = 100% (0x64).
2) List all parametric values, along with their tolerances, for all inputs and outputs, or a subset
thereof, that will be monitored and recorded (e.g., voltages, currents, and timing levels).
a. HUD Quiescent current (q)
I. Sleep mode 1 uA ≤ q ≤ 75 uA @12.6 VDC (-40° C to +85° C)
b. HUD operating current (A)
I. Operating 800 mA ≤ A ≤ 1.08 A @12.6 VDC (-40° C to +85° C)
3) List all non-electrical parameters, along with their tolerances, that will be monitored and recorded
(e.g., motor torque, LED brightness, color and intensity of backlighting, contrast ratio of a display,
etc.).
a. HUD test images will be sent over LVDS and evaluated visually by Reliability lab
personnel. Each image will be checked for the correct test pattern and
homogeneity.
i. Test pattern 1 RED screen ON
ii. Test pattern 1 RED screen OFF
iii. Test pattern 2 GRN screen ON
iv. Test pattern 2 GRN screen OFF
v. Test pattern 3 BLU screen ON
vi. Test pattern 3 BLU screen OFF
vii. Test pattern 4 BLACK Screen ON
viii. Test pattern 4 BLACK Screen OFF
ix. Test pattern 5 Color Bars ON
x. Test pattern 5 Color Bars OFF
xi. Test pattern 6 WHT screen ON *
xii. Test pattern 6 WHT screen OFF *
xiii. Test pattern 7 Horizontal Color Gradient ON *
xiv. Test pattern 7 Horizontal Color Gradient OFF *
xv. Test pattern 8 GM logo / text ON *
Internal
xvi. Test pattern 8 GM Logo / text OFF *
xvii. Test Pattern 9 BLK/WHT checkerboard ON *
xviii. Test Pattern 9 BLK/WHT checkerboard OFF *
* Patterns under development
b. HUD dimming level
i. The HUD dimming level is manually observed at maximum level

establishing value by I2C Message (0x20) Brightness Slider Value
Request = 100% (0x0A)
ii. The dimming value is evaluated by I2C message (0x21) Brightness

Slider Value Response with dimming value range (0% = 0x00 to 100% =
0x0A in steps of 10%)
iii. The HUD dimming level is manually observed at minimum level

establishing value by I2C Message 0x20 Brightness Slider Value
Request = 0% (0x00)
iv. The dimming value is evaluated by I2C message (0x21) Brightness

Slider Value Response with dimming value range (0% = 0x00 to 100% =
0x0A in steps of 10%)
c. HUD Mirror Position

i. The HUD mirror is adjusted to the maximum position by I2C Message
The HUD image will be observed as located in the down position as
visually observed by Reliability lab personnel.
ii. The HUD mirror position value is evaluated by I2C message (0x23)
Height Slider Value Response with mirror position range (0% = 0x00 to
100% = 0x64)
iii. The HUD mirror is adjusted to the minimum position by I2C Message
The HUD image will be observed as located in the down position as
visually observed by Reliability lab personnel.
iv. The dimming value is evaluated by I2C message (0x23) Height Slider
Value Response with mirror position range (0% = 0x00 to 100% = 0x64)
Internal
Criteria: Functional Status Classification shall be A.

MECHANICAL Evaluation
1) The integrity of the following items shall be verified: connectors, mounting tabs,
fasteners, snap fits, and filters.
2) All surfaces should be scrutinized for cracks, warpage, unwanted contact points, and
general appearance.
Results: The results for the 1-Point Functional/Parametric Check shall be included in the test results
for the following tests, or as needed according to the Test Plan, where continuous monitoring is not
performed: Insulation Resistance; Crush For Housing – Elbow Load; Crush For Housing – Foot Load;
Connector Installation Abuse – Side Force; Connector Installation Abuse – Foot Load; Free Fall;
Thermal Shock Air-to-Air; Salt Mist for Material Degradation Test; Dust.
3.2 5-Point Functional/Parametric Check

Provide details of the 5-Point Functional/Parametric Check that is used at the beginning and at the
end of all test legs to verify full functionality of the component as defined in the CTS/CTRS while
exposed to 3 temperatures and 3 voltages.

Operating Type: 2.1 (to confirm functionality in Sleep Mode/OFF mode) / 3.2
Monitoring: As defined in the following procedure
Parameters: 1. Tmin = -40 ± 3 °C, Umin = 9.0 ± 0.1 V
2. Tmin = -40 ± 3 °C, Umax = 16.0 ± 0.1 V
3. Troom = +23 ± 5 °C, Unom, where Unom is UB = 12.0 ± 0.1 V for
Operating Type 2.1, and UA = 14.0 ± 0.1 V for Operating Type 3.2
4. Tmax = +85 ± 3 °C, Umin = 9.0 ± 0.1 V
5. Tmax = +85 ± 3 °C, Umax = 16.0 ± 0.1 V
Procedure:
The temperature of the component shall be stabilized at the target temperature (+/-3 °C), for at least
0.5 h prior to the 5-Point Functional/Parametric Check.
The 5-Point Functional/Parametric Check shall be conducted with actual vehicle loads or equivalent.
All loads shall be documented in the GMW3172 Component Environmental Test Plan (CG3043).
The power supply shall be capable of supplying sufficient current to avoid current limiting under high
in-rush conditions.
1) List all functions that will be verified by monitoring and recording all outputs (both hardwired and
on-vehicle data bus communications) and their states for a given set of inputs and timing conditions.
List appropriate tolerances and acceptance criteria.
Refer to section 3.1.1
2) List all parametric values, along with their tolerances, for all inputs and outputs that will be
monitored and recorded (e.g., voltages, currents, and timing levels).
3) List all non-electrical parameters, along with their tolerances, that will be monitored and recorded
(e.g., motor torque, LED brightness, color and intensity of backlighting, contrast ratio of a display,
etc.).
Internal
4) List all selected parameters that will be measured before and after testing in order to determine
performance degradation. If degradation limits are not specified in the CTS/CTRS, the supplier, the
GMW3172 ENV SME or GM CVE, and the GM DRE shall collaborate to define the degradation
acceptance/failure criteria.
Before and after testing the HUD optical performance will be measured.
Virtual image size H (152.42-161.85 mm); V (68.57- 72.81 mm)
Brightness > 10,000 cd/m2
Contrast > 800:1
Eyebox size H (130mm); V(50mm)
Measurement ALT(-60,99) ART(60,99)

horizontal vertical
position
ALT -60 99 FMK Top
ART 60 99
79mm
LT -60 20 LT(-60,20) RT(60,20)
RT 60 20 CC(0,0)
CC 0 0 EB center
LB -60 -20
56mm
RB 60 -20 LB(-60,-20) RB(60,-20)
50mm
ALB -60 -76
ARB 60 -76
FMK Bottom
ALB(-60,-76) ARB(60.-76)
130mm
Image quality
Perfermance Customer Requirement

Aspect None
Rotation None
X_Distortion_Left 3.3°
X_Distortion_Mid 3.3°
X_Distortion_Right 3.3°
Y_Distortion_Top 3.3°
Y_Distortion_Mid 3.3°
Y_Distortion_Bottom 3.3°
Y_Trapeze None
Internal
X_Trapeze None
Smile_Vertical_Left None
Smile_Vertical_Mid None
Smile_Vertical_Right None
Smile_Horizontal_Top None
Smile_Horizontal_Mid None
Smile_Horizontal_Bottom None
Image size horizontal* 157.14 mm (+/- 3%)
Local_X_Magnif._Min None
Local_X_Magnif._Max None
Image size vertical* 70.69 mm (+/-3%)
Local_Y_Magnif._Min None
Local_Y_Magnif._Max None
5) Perform the Dimensional Check according to Section 3.8 Dimensional Check in CG3043. This
procedure shall be performed on the following samples as a baseline during the Initial 5-Point
Functional/Parametric Check, at Troom only: 2 samples from High Temperature Degradation, 2 from
HHCO, 2 from HHC, 2 from Seal, and 2 from Thermal Shock/Water Splash.
This procedure shall be performed again on the same samples during the Final 5-Point
Functional/Parametric Check, at Troom only.
MECHANICAL Evaluation
1) The integrity of the following items shall be verified: connectors, mounting tabs,
fasteners, snap fits, and filters.
2) All surfaces should be scrutinized for cracks, warpage, unwanted contact points, and
general appearance.
3.3 Continuous Monitoring

Provide details for Continuous Monitoring that shall detect the functional status of the component
during and after exposure to the test environment. Continuous Monitoring shall detect false actuation
signals, erroneous serial data messages, fault codes, or other erroneous Input/Output (I/O)
commands or states. Describe the procedure, setup, and criteria that will be used for Continuous
Monitoring.

Operating Type: As defined in each individual test.
Monitoring: Not applicable
Parameters: As defined in each individual test.
Procedure:
Internal
1) Define the outputs (both hardwired and on-vehicle data bus communications) that will be
monitored and recorded. Define the correct state for each monitored output for a given set of inputs
and timing conditions. Define the monitoring sampling rate. The sampling rate shall be fast enough to
detect intermittent functionality and errors shall be flagged automatically.
Input Output to be monitored Correct state Sample rate

ALS I2C command Values inside 1 time every 40
parameters seconds
LVDS HUD Video (Patterns) Display shows a Twice a day
Pattern
2) List the internal diagnostic codes that will be monitored and recorded.
Read services from the Diagnostic services implemented.
DiagnosticList_04-12
-2021.xlsx
3) List any specific component functionality that will be periodically observed, such as optical
monitoring of test patterns or stability of LEDs or bulbs. Define the frequency of the observations.
a. Display component.
i. Verify the patterns switching described in section 3.1.3.

Display pattern will be monitored twice a day by manual visual
inspection to corroborate that the patterns are being displayed without
abnormal distortion.
ii. Verify the dimming level described in section 3.1.1.

Dimming level will be monitored twice a day by manual visual inspection
to corroborate that the display is working without abnormal distortion
b. Stepper Motor
i. According to HUD mirror position described in section 3.1.1.

The Stepper Motor movement and position will be monitored twice a day
by manual visual inspection to corroborate that the mirror motor is
working without abnormal behaviors
3.4 Functional Cycling
Provide details for the Functional Cycling that shall simulate customer usage during and after
exposure to the test environment. List the tests where Functional Cycling will occur.

Operating Type: 2.1/2.2/3.2/3.2
Monitoring: As defined in the following procedure.
Internal
Parameters: As defined in each individual test.

Procedure:
1) List the component inputs/outputs, displays, human-interfaces, and mechanical actuations that will
be cycled and monitored for proper functional operation while the component is exposed to the test
environment. Define the cycling rate for inputs/outputs. The functional cycling scheme shall exercise
the component and allow for detection of degradation or failure. The electrical/mechanical loading
shall reflect the normal usage in the vehicle application. The input/output cycling and monitoring shall
be automatic.
See section 3.3 Continuous monitoring.
Unless noted in the Test Plan, Functional Cycling is only required to occur during the following tests in
Operating Type 3.2:
• High Temperature Degradation: The component shall be operated for as many Functional
Cycles as possible during test duration. Functional Cycling shall be applied during all
voltage levels.
• Mechanical Shock – Pothole: The component shall be operated for as many Functional
Cycles as possible during test duration
• Vibration With Thermal Cycling: The component shall be operated for as many Functional
Cycles as possible during test duration
• Power Temperature Cycling (PTC): The component shall be operated for as many
Functional Cycles as possible during PTC duration. Functional Cycling shall be applied
during all voltage levels.
• Humid Heat Cyclic: Continuous during Operating Type 3.2
• Humid Heat Constant: Continuous during Operating Type 3.2
2) If applicable, list the tests where power moding will occur. Define the Power ON/Power OFF cycle
rate.
Power Mode Cycling shall occur as defined in the following tests:
High Temperature Degradation: The component shall be transitioned to Sleep/OFF mode
(Operating Type 2.1) long enough to ensure Sleep/OFF mode, then return back to Operating
Type 3.2. This shall occur once every 4 hours.
Power Temperature Cycling (PTC): Power OFF (Operating Type 1.2) starting with the negative
thermal transition. At the beginning of the final minute of the 15-minute dwell at Tmin, by
default, begin cycling ON (Operating Type 3.2) for 100 s and Sleep/OFF (Operating Type 3.1)
for 20 s until the next negative thermal transition begins.
Humid Heat Cyclic: The component shall be cycled between ON (Operating Type 3.2, operated
in such a manner to minimize power dissipation) and Sleep/OFF (Operating Type 2.1) to avoid
local drying. The component shall be cycled between ON for 1 h and Sleep/OFF for 1 h
continuously during the 10-day test.
Humid Heat Constant The component shall be cycled between ON (Operating Type 3.2, operated
in such a manner to minimize power dissipation) and Sleep/OFF (Operating Type 2.1) to avoid
local drying. The component shall be cycled between ON for 1 h and Sleep/OFF for 1 h
continuously during the 10-day test.
Internal
3.5 Simulation and Loads

Provide an illustration (functional block diagram) showing the configuration of simulators and loads to
inputs and outputs that will simulate the vehicle environment and place the component in the desired
test mode(s). If actual vehicle loads are connected to the system, describe them by part number and
design level. In case of simulated loads, a detailed definition is needed.
Functional Diagram. Provide a functional block diagram and describe loads, such as Seat Motor –
GM Part Number 55521213A; Speaker Load Simulation – 4 Ω, 5 % tolerance, 5 W; GMLAN Simulator
– CANOE).
No simulated loads are used. FPDLinkBox is only used as LVDS video source.
Electrical tests and EMC: VLAD

Environmental tests: Life Tester (LTT)
Figure 4 PFDLinkBox Diagram
Internal
3.6 Visual Inspection and Dissection – DRBTR

Operating Type: 1.1
Monitoring: N/A
Parameters:
• Samples Submitted to GM Prior to DV/PV Testing. State the number of samples that will be
provided to GM if requested. As a default, two pre-test samples shall be provided to the GMW3172
ENV SME or GM CVE.
2 pre-test samples
• Samples Examined by Supplier After DV/PV Testing. Identify the samples that will be
inspected/dissected. As a default, use all samples, except those provided to GM if requested.
All test samples
• Samples Provided to GM After DV/PV Testing. Identify what samples will be provided to GM if
requested. As a default, the following samples shall be kept assembled and reserved for inspection
and/or dissection by the GMW3172 ENV SME or GM CVE: one sample from the Mechanical
Fatigue leg, two samples from the Thermal Fatigue leg (one from Humid Heat Constant and one
from Humid Heat Cyclic), and one sample from the Corrosion test leg.
5 samples :
1 from Leg 1 (mechanical fatigue)
2 from leg 2 ( Thermal fatigue: 1 from HHC and 1 from HHCO)
2 from leg 8 (Corrosion)
Procedure:
Perform an external inspection of the component housing. Then disassemble the component for an
internal inspection. Identify any structural faults, material/component/part degradations or residues,
and near-to-failure conditions caused by environmental testing. The inspection shall use visual aids
(e.g., magnifiers, microscopes, dyes, etc.) as necessary.
For each item listed below, describe the detailed aspects of what will be examined, and the
method(s) to do the examination:
1. Degraded Mechanical and Structural Integrity: Signs of degradation, cracks, melting,
wear, fastener failures, etc.
Examination Method(s): microscopic visual examination, x-ray, etc.
2. Solder/Part Lead Fatigue Cracks or Creep or Pad-Lift: Emphasis on large integrated

circuits (IC4000, IC4001, IC0226, IC3130 and IC8500), large massive parts or connector
terminations D1000, D1030, L1000, L1300, R4003, R4015, C1725, C1700, L1705, L1051,
C8547, C8562, C4101, D8602, L8581, T8591, X1, X1000, X3021, X3000, X3110 and X8050
(especially at the end or corner lead pins). Also, parts in high flexure areas of the
circuit board.
Examination Method(s): Microscopic visual examination, x-ray, etc.
Internal
3. Damaged Surface Mount Parts: Emphasis on surface mounted parts near circuit
board edges, supports or carrier tabs. Also, surface mounted parts located in high
flexure areas of the circuit board and near connector terminations.)
Examination Method(s): Microscopic visual examination, x-ray and cross sections if
needed.
4. Degraded Large Part Integrity and Attachment: Leaky electrolytic capacitors (C1725,
C1700, C8547, C8562 and C4101) heat sink/rail attachments, etc.
Examination Method(s): Microscopic visual examination, x-ray, etc.
5. Material Degradation, Growth, or Residues of Corrosion: Melted plastic parts, solder

masks or seals; circuit board delamination, lifted circuit board traces, corrosion,
organic growths, or environmental residues due to dust, salt, moisture, etc. All foreign
matter or residues shall be analyzed for material composition and conductivity.
needed.
6. Other Abnormal or Unexpected Conditions: Changes in appearance or smell.

Indicators of poor manufacturing processes. Objectionable squeak and rattles,
especially after vibration fatigue.
needed.
7. The Formation of Whiskers When Tin, Zinc, or Silver is Used: The GMW3172 Component
Environmental Test Plan (CG3043) provided in this document will effectively precipitate
the formation of whiskers. A close examination of the circuit boards with a magnifying
device shall occur on all components, particularly on the components that experienced
PTC. The appearance of whiskers during environmental testing will indicate the
probability of similar whisker formations occurring in the field. The formation of
whiskers poses a risk to close-pitched parts, and may result in a short-circuit situation
of parts or components that are stored for service.
If whiskers are present, they shall be measured for total axial whisker length and
whisker density range, as defined in JEDEC JESD 22-A121A, Test Method for Measuring
Whisker Growth on Tin and Tin Alloy Surface Finishes.
8. Electromigration and Dendritic Growth: The circuit board and all parts must be free of
current evidence or past evidence of electromigration and dendritic growth, as well as
ionic contamination that may lead to electromigration or dendritic growth.
Internal
9. Viscous material runoff and leaks: It’s not applicable, this product doesn´t have
viscous materials
10. Fretting Corrosion: All internal unsoldered contacts/connections (e.g., fuse holders,
press fit connections, PCB-to-PCB connections, ribbon cables, etc.) and external
connections shall be microscopically inspected for evidence of fretting corrosion (i.e.,
presence of oxidized debris or evidence of heating).
11. Sealant Integrity: : It’s not applicable, this product doesn´t have viscous materials.
12. Specific Test Inspection Items: Additionally, as described as follows in the Criteria
section, test samples shall be inspected according to the specific tests that are listed
from point 1 to point 11.
Component location in PCB
Criteria: A summary of each component’s condition shall be documented and reported to the
GMW3172 ENV SME or GM CVE, as defined in GMW16044. The supplier may be required to perform
further investigation (including cross-sectioning) to determine the degree or type of degradation. GM
Engineering will decide as to the necessity of corrective action. The pre-test and post-test samples
shall comply with the acceptance criteria according to the latest version of IPC-A-610, Acceptability of
Electronic Assemblies. Class 3 shall be applied, unless the CTS/CTRS states otherwise.
The total axial whisker length shall not exceed the acceptance criteria as stated in JEDEC JESD 201A,
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface
Finishes, for Class 2. The total whisker density range shall not exceed 45 whiskers per lead or
termination at which it was measured.
Sealant Integrity:
Seal separation can be either “cohesive” or “adhesive” by design.
Separation of components that are sealed using liquid or paste type sealant (e.g., RTV, wet-dispensed,
etc.) must show 100% “cohesive separation” of the sealant on all seal surfaces. Cohesive separation
is characterized as a splitting of the sealant such that a film of sealant remains on both of the substrate
surfaces. Lack of cohesive separation indicates an incompatibility between the sealant and substrate.
In other words, when the component housing is pulled apart, the sealant shall be capable of a 100%
cohesive separation (i.e., sealant should be on both sides of the surface, for example 50% on one side,
50% on other side).
The other type of seal separation is “adhesive separation”, which is typical of a gasket application. An
adhesive sealant is characterized by a lack of residue on the contacting substrate surface. In other
words, for adhesive separation, the seal shall remain entirely on one of the substrate surfaces that
comprise the sealing interface.
Additionally, the following are procedure-specific inspection criteria as defined by each of the
following specific tests:
Vibration With Thermal Cycling, Mechanical Shock – Pothole, Mechanical Shock – Collision,
Mechanical Shock – Closure Slam:
There shall be no evidence of structural damage.
Internal
Connector Installation Abuse – Side Force, Connector Installation Abuse – Foot Load:
There shall be no damage to the connector(s), housing, and circuit board to which the connector is
attached.
Crush for Housing – Elbow Load, Crush for Housing – Foot Load:
No contact between the case, PCB assembly, and other electrical parts shall be allowed. No damage
to the housing, connector, PCB assembly, other electrical parts, and mechanical parts shall be allowed.
Free Fall:
For components with minor visible external damage, there shall be no internal damage. For
components with significant visible external damage as judged by the GM Component Validation
Engineer, any internal damage shall be reported.
Open Circuit – Single Line Interruption, Open Circuit – Multiple Line Interruption, Intermittent
Short Circuit to Battery and to Ground for Input/Output, Continuous Short Circuit to Battery and
to Ground for Input/Output:
There shall be no evidence of overheating.
Over Load – All Circuits:
If an output is not over-current protected, then minor amounts of carbon are allowed near the open
circuit; however, amounts beyond this on the circuit board are not permitted.
Over Load – Fuse Protected Circuits:
There shall be no evidence of discoloration from overheating.
Multiple Power and Multiple Ground Short Circuits Including Pass Through:
For the Low Resistive Short test, there shall be no evidence of overheating.
For the High Resistive Short test, minor amounts of carbon may appear near the open circuit. A safety
critical behavior (e.g., smoke, fire, melted plastics …) is not allowed.
Frost, Humid Heat Cyclic (HHC), Humid Heat Constant (HHCO):
There shall be no evidence of electromigration or dendritic growth.
Thermal Shock/Water Splash:
Inspection shall be performed using a UV light.
There shall be no evidence of water ingress inside the component and the connector.
Water:
For non-sealed components, water shall never reach electric/electronic parts or connector terminals.
There shall be no drops of water on the circuit board. Additionally, water shall not accumulate within
the component housing and reach the electric/electronic parts or connector terminals.
For sealed components, no water shall pass any seal.
Salt Mist and Salt Spray:
There shall be no liquid ingress and/or internal dendrites. Also, based on the level of corrosion, GM
Engineering will decide as to the necessity of corrective action.
Dust:
For dust rating of 6K, no dust ingress is allowed. For a dust rating of 5K, the quantity and location of
dust shall be evaluated for potential risk.
Seal:
There shall be no evidence of water ingress inside the component and the connector.
Internal
3.7 Cross Section and Inspection

Applicable Standard: GMW3172, April 2018April 2018, § 6.6
Operating Type: 1.1
Monitoring: N/A
Parameters:
The supplier shall perform this activity on one sample prior to testing, 2 samples from Thermal Fatigue,
and 2 samples from Vibration with Thermal
Cycling as shown in the Test Flow. All cross-sectional pictures shall be made available to GM.
The cross section points shall be identified in the GMW3172 Component Environmental Test Plan
(CG3043), as negotiated between the supplier and GM. Different items to be cross sectioned can be
selected on each PCB. If possible try to plan section cuts to include as many features of interested as
possible, for example:
• A row of solder balls.
• A row of PTH (plated through hole) vias.
• A row of through-hole connector pins.
Solder joints to target shall be those of large mass parts, through-hole parts, as well as the corner pins
of Ball Grid Array (BGA) parts, Surface Mount Device (SMD) parts having the largest relative footprints
on the circuit board, and all leadless devices, such as Quad Flat No-Lead (QFN) and Dual Flat No-
Lead (DFN) packages. Additionally, electrical vias and thermal vias shall be targeted.
Note: Perform cross sectioning on at least one of every type of solder joint, electrical connection, and
via that exist on the PCB in both Leg 1 and Leg 2. This shall include a solder joint from each type of
solder process that applies (i.e., reflow, wave, selective, and reworked, etc.). Solder joints most at risk
include interfaces with large Coefficient of Thermal Expansion (CTE) differentials or corner pins of
surface mounted parts with large diagonal lengths. Vias most at risk are those with the smallest
diameter.
List all of the solder processes that apply to this component, e.g., reflow, wave, selective, and
reworked, etc.
• Reflow for all PCBs
• Rework process for all PCBs
Include a pictorial of the PCB board with the intended cross-sections identified, numbered, and
described.
CS1
Figure 1 PGU PCB
Internal
CS2
Figure 2 Ambient Light Sensor PCB
Figure 3 Main PCB Bottom
Internal
Figure 4 Main PCB Top
Figure 5 Detailed view cross section at CS3
Internal
Internal
Internal
Solder Joint Cross Sectional Analysis Areas:

• CS1: LED on PGU PCB (Figure 1) cross section will be taken longitudinal through
component.
• CS2: Connector terminals on ambient light sensor PCB (Figure 2) cross section will be
taken through center and across connector pins to view each pin.
• CS3: IC4000 cross section pins (Figure 5) cross section will be taken through center of
pins in a profile view of two pins at opposite sides of the chip.
• CS4: IC4001 (Figure 6) cross section will be taken through center of pins in a profile
view of two pins at opposite sides of the chip.
• CS8: X1 LVDS through-hole (Figure 10) cross section will be taken through center and
across connector pins to view each pin.
• CS9: Via on RGB interface
Applicable cross section standards are IPC-TM-650, IPC-6012, and IPC J-STD-001.
Cross section cuts shall be perpendicular to the PCB surface. The cross section cut shall be through
the center of the solder joint and through the part encapsulation. The cross section cut shall be through
the center of the PTHs and vias.
Internal
Sample selection shall be as follows:

• One sample that is not subjected to testing shall be cross-sectioned by the supplier. This shall occur
as soon as possible after the DV/PV build in order to find production issues quickly and begin the
resolution process as soon as possible. This will serve as an early indicator of production issues,
as well as a control sample to judge degradation as compared to end-of-test samples.
Attention: GM review and approval of the report is required before Mechanical and Thermal
Fatigue testing can begin.
• At the end of testing, at least four samples from the Test Flow shall be selected, two from Thermal
Fatigue and two from Vibration with Thermal Cycling.
• If testing is done to ensure production line moves or updates, one control sample shall be taken
from the existing production line and two samples shall be selected from the new production line.
The samples from the new production line shall be taken from different production shifts and
different days.
Procedure:
The following cross section procedure shall be used:
1 The component circuit board shall be removed from its housing and potting material shall be
removed if applicable. Do this in a manner that will not add additional stress to the circuit board
and solder joints.
2 Prior to cross sectioning, perform a surface examination according to IPC-TM-650, 2.1.5. Note any
pinholes, scratches, wrinkles, inclusions, or other abnormalities, or pits and dents exceeding the
point count. Provide pictures of the observations.
3 Perform cross sectioning of test samples according to IPC-TM-650, 2.1.1 and 2.1.1.2. Use IPC-
TM-650, 2.1.1.1 for ceramic parts.
4 Evaluate the test section points as negotiated between GM and the supplier to provide detailed
information as described as follows (in items 5, 6, and 7).
5 For plated through holes, including vias, measure the minimum and average copper hole plating
thicknesses, including pictures, as well as the quality of the plating, irregular plating, nodules, voids,
and cracks. Measure the roughness of the copper hole plating. Refer to criteria for an example of
via roughness.
6 Measure the average thicknesses of the intermetallic bonds (at the terminal and solder interface,
as well as the PCB and solder interface) and provide detailed pictures of the intermetallic
boundaries. (This step is required only for pre-test samples.)
7 For solder joints, record and include pictures of circuit board solder material fillets, hole fillings,
voids, cracks, etc.
8 A summary of each component’s cross section results shall be documented and reported to GM.
9 The supplier may be required to perform further investigation to determine the degree or type of
degradation.
10 If required, perform measurements of suspect areas according to IPC-TM-650, 2.2.2 and/or 2.2.5.
Internal
Criteria: A summary of each component’s condition shall be documented and reported to the
GMW3172 ENV SME or GM CVE. GM Engineering will evaluate the reports and decide as to the
necessity of corrective action.
The following criteria applies to pre-test samples only:
• No solder cracks are allowed.
• Acceptability of the solder bonding strength shall be based on an average combined thickness of
Copper-Tin intermetallic bonds of Cu3Sn and Cu6Sn5 that shall be ≥ 1 μm and ≤ 6 μm (5 μm
preferred) after all soldering procedures are completed. When Nickel-Tin systems are used, the
Ni3Sn4 intermetallic thickness after all soldering processes are completed shall be (0.25 to 0.75)
μm.
The following criteria applies to pre-test and post-test samples:
• All samples shall comply with the acceptance criteria according to the latest versions of IPC-A-
610, IPC-6012, and IPC J-STD-001, for Class 3, unless the CTS/CTRS states otherwise.
• Solder voids shall not exceed 25 % by volume in the solder joint.
• For plated through holes, including vias, the minimum average copper hole plating thickness
shall be 25 μm (0.984 mils) and the minimum thin area shall be ≥ 20 μm (0.787 mils).
• For plated through holes, including vias, the roughness of the copper hole plating shall be < 25
μm (as described in Figure 7a as follows as an example for via roughness).
Figure 7a: Via Roughness Requirement (pictorial)
The following criteria applies to post-test samples only:

• No solder cracks measuring > 25 % of the cross-sectional length across the solder joint are
allowed. The defined length of the solder joint consists of the horizontal vector of the solder joint
along the edge of the part that is parallel to the PCB plus the 45° directional vector from the bottom
corner of the part to the outer edge of the fillet. If the crack is along the side of the part, use the
parallel vectors along the bottom and the side of the part. For example, the defined length of the
solder joint is shown by the white dotted line in Figure 7b as follows. Note that the actual crack in
a solder joint might not follow the exact same path as the defined length of the solder joint. Voids
in the solder joint shall not be included in the length of the solder joint and the length of the solder
crack.
Internal
Figure 7b: Defined Length of the Solder Joint
• For QFNs and DFNs, no solder cracks measuring > 25 % of the cross-sectional length across the
solder joint are allowed. Do not include the length of the lead that is not plated (i.e., non-wettable
flank) in the length of the solder joint and the length of the solder crack. Voids in the solder joint
shall not be included in the length of the solder joint and the length of the solder crack.
• If there is evidence of a solder crack, then cross sectioning may be required at different depths on
that solder joint or additional cross sections may be required on adjacent solder joints or on similar
parts. Additionally, during the Visual Inspection and Dissection – DRBTR, if there is evidence of a
solder crack or partial PTH fill (or other concern), additional cross sectioning may be required.
3.8 Dimensional Check

Operating Type: 1.1
Monitoring: N/A
Procedure:
This procedure shall be performed on the following samples as a baseline during the Initial 5-Point
Functional/Parametric Check, at Troom only: 2 samples from High Temperature Degradation, 2 from
HHCO, 2 from HHC, 2 from Seal, and 2 from Thermal Shock/Water Splash.
This procedure shall be performed again on the same samples during the Final 5-Point
Functional/Parametric Check, at Troom only.
If this is performed as a stand-alone activity only, then the Dimensional Stability tests as defined in the
applicable following GM standards from the Material Engineering group shall be used: GMW14444 for
interior components, GMW14650 for exterior components, or GMW15725 for underhood components.
Three samples shall be tested.
All dimensions affecting the vehicle interface shall be included, e.g., mounting points, header
connectors, external dimensions, etc.
Include a pictorial of the component with the intended dimensional measurement locations and
tolerances shown.)
Internal
Criteria: Functional Status Classification is not applicable to this check. Any Dimensional
measurements that do not meet the part drawing requirements shall be considered a nonconformance.
3.9 Vibration Transmissibility Demonstration

Operating Type: 1.2
Monitoring: Accelerometer-based monitoring as described in the following
procedure
Procedure:
Component Mounting Considerations.
Components under test shall be mechanically connected to the mounting surface of the test fixture to
represent vehicle mounting orientation and attachment methods. The component’s actual integral
mounting provisions (e.g., mounting tabs, snap fits, clips, etc.) that interface to the vehicle structure
(e.g., vehicle frame, bracket, etc.) shall be utilized in the test mounting. The proper size, type of
mounting devices, attachment interfaces, mounting torque, and associated tolerance of fixing bolts or
other attachment devices shall be used.
Harness connection fixture points shall be representative of the production-intent vehicle harness
routing from the component connector up to the location of the first design-representative tie down
point. As a default, the first tie down point on the harness shall be 100 mm away from the component
connector. After that point, the harnesses shall be tied down securely so that they do not influence the
vibration input to the test samples.
Internal
Any interfacing connections to the component other than harnesses shall be in a vehicle-representative
orientation. Examples are coolant hoses, linkage cables, etc.
The component mounting orientation, the harness connection fixing points, and the attachment
methods of the component and other mechanical interfaces shall be reviewed and approved by
the GMW3172 ENV SME prior to starting the test. This information shall be included in the
GMW3172 Component Environmental Test Plan (CG3043).
The GM E2UB/o1sl HUD will be tested on a 1-up fixture. The HUD will be attached at the vehicle
mounting locations using an equivalent vehicle fastening system
Test Fixture Analysis.
Internal
If requested by the GMW3172 ENV SME, the supplier shall provide the math-model data, FEA
analysis results, and engineering drawing of the test fixture to GM in order to review and
approve prior to the building of the test fixture.
Test Fixture Transmissibility.

The test fixture, when loaded with the test samples, shall be shown to provide a vibration level (and
mechanical shock input) that is representative of the test input at the mounting locations as measured
on the test fixture.
A control accelerometer shall be mounted on the test fixture, or directly on the vibration table, to serve
as the reference point for the derivation of the control signal (as defined in IEC 60068-2-64). This
signal is used to control the level of vibration (and mechanical shock) via closed-loop feedback to the
vibration (and mechanical shock) control equipment.
A test sample accelerometer shall be mounted on the test fixture as close as possible to the fixation
point for each sample. Measure the vibration response (in the intended drive axis) for each
accelerometer. This will show that the required vibration profile (and mechanical shock input) is
replicated at each sample’s location on the fixture. Note: A test sample accelerometer cannot be
considered as the control accelerometer.
Cross-axis acceleration shall be measured at the location of the accelerometer for each sample, close
to the fixing points, to ensure that the cross-axis acceleration does not contain high, narrow peaks that
are beyond tolerance levels. The cross-axis motion is specified as the motion of the two axes that are
orthogonal to the direction of the drive axis.
The locations of the control accelerometer and the sample accelerometers for each sample, along with
the data collected from the Vibration Transmissibility Demonstration shall be reviewed and approved
by the GMW3172 ENV SME prior to starting the test. This information shall be documented in the test
report.
A picture of the loaded test fixture, including the locations for the control and test sample
accelerometers, shall be included in the GMW3172 Component Environmental Test Plan (CG3043).
Criteria:
1 The true value of the Mechanical Shock input as measured at the accelerometer for each sample,
shall be within 10% of the intended value in the drive axis.
2 The true value of the Vibration profile, as measured in each intended axis at the accelerometer for
each sample, shall be within 20% of the random vibration requirement (effective acceleration) in
GMW3172 as represented by the tolerance bands. The tolerance bands are calculated by adjusting
the PSD breakpoints by 64% (0.64 x breakpoint) for lower tolerance and 144% (1.44 x breakpoint)
for the upper tolerance. An example of how this applies to the Random Vibration for Sprung
Masses is shown as follows in Figure 8 and Tables 15 thru 17.
Internal
Figure 8: Example for Acceleration Tolerance Bands for Random Vibration - Sprung Mass Profile
Table 15: Random Vibration Profile Lower Tolerance Band for Sprung Mass Profile
FREQ PSD PSD
in Hz in (m/s2)2/Hz in g2/Hz
10 6.3519 0.0660
55 2.0680 0.0215
180 0.0800 0.0008
300 0.0800 0.0008
360 0.0431 0.0004
1000 0.0431 0.0004
Effective Acceleration = 15.7 m/s2 = 1.6 GRMS

Note: Each break point is 64% of the original.
Table 16: Random Vibration Profile Upper Tolerance Band for Sprung Mass Profile
FREQ PSD PSD
10 14.2917 0.1486
55 4.6531 0.0484
180 0.1800 0.0019
300 0.1800 0.0019
360 0.0969 0.0010
Internal
1000 0.0969 0.0010

Note: Each break point is 144% of the original.
Table 17: GMW3172 Requirement for Random Vibration Profile for Sprung Mass Profile
FREQ PSD PSD
10 9.9248 0.1032
55 3.2313 0.0336
180 0.1250 0.0013
300 0.1250 0.0013
360 0.0673 0.0007
1000 0.0673 0.0007

3 For Vibration, the cross-axis acceleration for each sample in the two axes that are orthogonal to
the direction of the drive axis shall ≤ 0.45 times the acceleration GRMS of the drive axis at any
frequency. The cross-axis acceleration upper limit is calculated by adjusting the PSD breakpoints
by 20.25% (0.2025 x breakpoint). An example of how this applies to the Random Vibration for
Sprung Masses is shown as follows in Figure 9 and Table 18.
Figure 9: Example for Cross-Axis Acceleration Upper Limit for Random Vibration - Sprung Mass
Table 18: Random Vibration Cross-Axis Acceleration Upper Limit for Sprung Mass
Internal
FREQ PSD PSD

10 2.0098 0.0209
55 0.6543 0.0068
180 0.0253 0.0003
300 0.0253 0.0003
360 0.0136 0.0001
1000 0.0136 0.0001
Note: Each break point is 20.25% of the original.
4 For Mechanical Shock, the positive or negative peak acceleration for each sample, perpendicular
to the intended shock direction, shall not exceed 30% of the value of the peak acceleration of the
nominal pulse in the intended direction.
3.10 Thermal Profile Cycle Development
Operating Type: 1.1 (TS), 1.2/3.1/3.2 (PTC)
Monitoring: Temperature logging.
Parameters: Tmin = -40 ± 3 °C, Tmax = +85 ± 3 °C
Procedure:
1 Using the same PTC chamber model number that will be used in the DV/PV test, load the PTC
chamber with the same number of samples that will be tested during PTC. Include fixturing and
harnesses.
2 Attach an internal thermocouple to a sample and position it in the center of the PTC chamber. As
a default, locate the thermocouple on the PCB. If multiple shelves will be used to hold the samples,
there shall be a thermocoupled sample from each shelf positioned in the center of the shelf.
3 Program the PTC chamber to cycle between Tmin and Tmax at a ramp rate of 1 to 15 K/minute or
°C/min) that will be used during the PTC test.
4 Apply power to all samples and apply the agreed upon functional cycling and Operating Types that
will be used in the PTC test.
5 Once the component temperature reaches Tmin +3 °C / Tmax -3 °C, dwell for 15 minutes. If multiple
samples are thermocoupled, the 15-minute dwell starts when the last sample reaches Tmin +3 °C /
Tmax -3 °C.
6 Record data for 3 consecutive cycles.
Document the PCB temperature at the end of the 15 minutes. This is the temperature to be used as
the Tmax in the TS test and shall be referred to as Tmax TS. (Example: If a component shall be tested from
(-40 to +85) °C, and generates an additional self-heating of 10 °C, then the TS test shall be performed
from (-40 to +95) °C.)
7 Using the same TS chamber model number that will be used in the DV/PV test, load the TS
chamber with the same number of samples that will be tested during TS. Include fixturing and
harnesses.
8 Using the same thermocoupled samples from PTC, place them in the center of the TS chamber. If
multiple shelves will be used to hold the samples, there shall be a thermocoupled sample from
each shelf positioned in the center of the shelf.
Internal
9 Program the TS chamber to cycle between Tmin and Tmax TS. The transfer time shall be ≤ 30 s,
according to ISO 16750-4.
10 Once the component temperature reaches Tmin +3 °C / Tmax TS -3 °C, dwell for 15 minutes. If multiple
samples are thermocoupled, the 15-minute dwell starts when the last sample reaches Tmin +3 °C /
Tmax TS -3 °C.
11 Record data for 3 consecutive cycles.
The following information shall be provided separately for TS and PTC, with items a and b on the same
graph:
a Chamber temperature profile,
b Component internal thermocouple (PCB temperature) profile,
c Photograph/drawing showing location of all components in chamber, including the
thermocouple components.
d Photograph/drawing showing location of component internal thermocouple.
Criteria: The provided thermocouple data shall demonstrate that the component dwells for 15 minutes
once it reaches Tmin +3 °C and Tmax -3 °C, for at least three (3) cycles of PTC, and dwells for 15 minutes
once it reaches Tmin +3 °C and Tmax TS -3 °C, for at least three (3) cycles of TS.
3.11 Test Harness Requirements

Operating Type: N/A
Monitoring: N/A
Parameters: N/A
Procedure: N/A
Will the test harnesses be assembled by the component supplier or purchased from the production
harness supplier?
No, it will be purchased to a harness supplier: MOLEX
Will the test harnesses meet the Test Harness requirements for construction, content, and number of
mate/unmate cycles?: Yes
If No, provide details and reasons:
Harness information
MAIN harness:
Internal
LVDS harness:
Electrical tests/disturbances must be applied at harness breakouts.
Figure 5 Battery harness 1700 mm with breakouts (200 mm)
4 Analysis
4.1 Electrical
4.1.1 Nominal and Worst Case Performance Analysis

Applicable Standard: GMW3172, April 2018, § 7.2.1
Operating Type: N/A
Monitoring: N/A
Parameters: Tmin, Tmax, Umin, Umax
Procedure:
Use a circuit analysis program to determine voltage, current, and power dissipation for each part
across the ranges of operation temperature, voltage supply, and I/O voltage/current. The circuit
analysis shall be modeled taking into account the worst-case tolerance combinations of the parts.
Criteria: Verify that the design of the circuit is capable of producing the required functions under all
conditions. The component shall meet the requirements according to CTRS or (CTS/SSTS and
GMW14082 for Global A or GB14082 for Global B).
Internal
Details available in section 2.2 Environmental Hardware Design Review Checklist
4.1.2 Short/Open Circuit Analysis

Operating Type: N/A
Monitoring: N/A
Short and open circuits will be applied to the following signals:
Connector Short to Short to Open Circuit
Signal Name
Pin Ground Battery
Example: ODL09 B02 ☒ ☐ ☒
TBD TBD ☐ ☐ ☐
Procedure:
Use a circuit analysis program to perform intermittent (default: 1 Hz to 100 Hz square wave) and
continuous conditions for short and open circuits to determine voltage, current, and power dissipation
for each part across the ranges of operation temperature, supply voltage, and I/O voltage/current. The
circuit analysis shall be modeled taking into account the worst-case tolerance combinations of the
parts.
Criteria:
Verify ability of parts to withstand intermittent and continuous short/open circuit conditions. The
analysis shall verify that the part’s operating parameters as defined by the part’s data sheet (e.g.,
temperature, voltage, current, power dissipation, etc.) shall not be exceeded. Additionally, verify that
the voltage and current levels allow setting and resetting of DTC
4.2 Mechanical
4.2.1 Resonant Frequency Analysis

Operating Type: N/A
Monitoring: N/A
Parameters: N/A
Procedure:
Considering the circuit board mounting configuration, calculate the resonant frequency of the circuit
board by using appropriate software such as Finite Element Analysis. Alternatively, if a physical
sample is available prior to DV, and the proper mounting configuration is assured, then a physical
test can be used to determine the resonant frequency (e.g., impulse hammer or sine sweep
evaluation).
Criteria:
Internal
The resonant frequency of the circuit board shall be > 150 Hz. The supplier must provide evidence of
appropriate corrective action when the resonant frequency is < 150 Hz. The corrective action shall be
reviewed with the GM Component Validation Engineer.
4.2.2 High Altitude Shipping Pressure Effect Analysis (Non-applicable)

Operating Type: N/A
Monitoring: N/A
Parameters: Paltitude : default is 11kPa
Procedure:
The following series of steps shall be taken to ensure adequate robustness of the structure under
pressure to the effects of the low pressure stress resulting from air shipment.
1 Quantify the burst pressure (Pburst) of the component (or part) under internal pressure using Finite
Element Analysis (FEA) or a comparable method. Use a worst case analysis process considering
the variation of material parameters (such as the minimum wall thickness) and the effects of
material weakening relative to temperature effects (glass transition temperatures). The glass
transition temperature (Tg) is the temperature whereupon the material properties, such as stiffness,
changes its characteristics. Therefore, perform the FEA to determine the internal burst pressure
using Tmin and Troom for the component. Select the worst-case (i.e., lowest) burst pressure from
those two scenarios.
2 Use the following equation for the analysis:
Pburst ≥ (Passembly – Paltitude) x Design Margin (DM)
where:
• Pburst: Component (or part) burst pressure
• Passembly: Internal pressure of component (or part) during assembly (this should be either the
ambient air pressure at the assembly location, or it may be a different pressure if modified by
the manufacturing process)
• Paltitude: Pressure in the freight section of the airplane at 15 240 m, use 11 kPa.
• Design Margin (DM): 4
Criteria:
The component (or part) burst pressure must exceed the resulting internal pressure during air shipment
by a factor of four (4).
4.2.3 Plastic Snap Fit Fastener Analysis (Non-applicable)

Operating Type: N/A
Monitoring: N/A
Parameters:
Provide a pictorial of the plastic snap fit locations to be evaluated:
Procedure:
Perform a Finite Element Analysis, or equivalent, of the plastic snap fit to prove the capability of the
design elements including:
Internal
1 Adequate retention force during complete vehicle life.

2 Acceptable ergonomic forces during vehicle assembly and disassembly for serviceability.
3 Presence of compliance mechanisms to prevent rattles.
4 Adequate design margin to ensure that flexing during vehicle installation does not exceed the elastic
limit of the plastic.
Criteria: Evidence that the design meets the four design elements stated in the procedure.
4.2.4 Crush Analysis (Non-applicable)

Operating Type: N/A
Monitoring: N/A
Parameters: N/A
Procedure:
Perform a Finite Element Analysis, or equivalent, to insure that the requirements for the Crush For
Housing test(s) are met. The intended load must be identified as being produced by a person’s elbow
or foot as described in the Crush For Housing – Elbow Load or Crush For Housing – Food Load, as
applicable for the component.
The loads to be applied to the component housing shall be identified in the GMW3172 Component
Environmental Test Plan (CG3043), as negotiated between the supplier and GM. Plan to include
load locations in various areas on the housing, including on top of the highest profile parts on the
circuit board and on top of parts that have the least clearance to the housing. Also, focus on the
areas of the housing that are the weakest and will deflect the most.
Load Application Location(s) for Elbow Load. Insert a picture of where the load(s) will be applied
to the component housing. If more than one surface of the test sample is tested, then provide one
picture for each surface.
Load Application Location(s) for Foot Load. Insert a picture of where the load(s) will be applied to
the component housing. If more than one surface of the test sample is tested, then provide one picture
for each surface.
Criteria: Sufficient clearance between parts of the component and housing shall be demonstrated
when the necessary forces are applied. The deflection of the component cover must not generate
forces on parts within the component or on the circuit board.
4.3 Climatic
4.3.1 High Altitude Operation Overheating Analysis

Operating Type: N/A
Monitoring: N/A
Parameters:
Tmax_part : Tambient :
Internal
Multiplieraltitude :
Procedure:
Use the following equation to determine the maximum component operating temperature at high
altitude:
Tmax_part  Taltitude = ∆Tpart_oper x Multiplieraltitude + Tambient + 10 °C
where:
• Tmax_part: Maximum allowable temperature from part data sheet.
• Taltitude: Calculated operating temperature of part at altitude.
• Tambient: Ambient temperature at altitude (4572 m). Use +35 °C as the default value.
• ∆Tpart_oper: Temperature increase of part due to operation (this is the temperature difference of the
component when the part is at sea level). This can be obtained either by Thermal Analysis of the
part or by a physical measurement of the part in the component.
• Multiplieraltitude: The Multiplier value is based on altitude and air flow. The multipliers as noted in
Table 19 are used to adjust the temperature rise for high altitude effects in the equation.
• +10 °C: This is the safety margin.
Table 19: Parameters for Overheating Analysis
Multiplier
Fan Cooled Fan Cooled Naturally Cooled

Altitude (Low Power Fan) (High Power Fan) Convection (No Fan)
0m 1 1 1
4572 m 1.77 1.58 1.33
Select ☐ ☐ ☐
Method
Note: The bolded value of (1.33) will be the most frequently used value in GM calculations.
Criteria: Tmax_part must be greater than or equal to Taltitude. Tmax_part is based on the operating
specifications for the part generating heat and other affected parts nearby.
Internal
4.3.2 Thermal Fatigue Analysis

Operating Type: N/A
Monitoring: N/A
Parameters: Tmin, Tmax
Procedure:
1 Identify the package types of all the parts of the component.
2 Identify the CTE of each package type, and all variants within the package type, of the parts of the
component.
3 Identify the differences of the CTEs for each package type of the parts and for the part to which they
are attached.
4 Perform the analysis to quantify fatigue life of the part junctions from the expansion and contraction
during temperature cycling of the component by using an appropriate method such as Finite
Element Analysis.
Criteria: The calculated fatigue life shall be three times greater than the required life of the component.
4.4 Material
4.4.1 Lead-Free Solder Analysis (Non-applicable)

Operating Type: N/A
Monitoring: N/A
Parameters: N/A
Procedure:
Use the Appendix A (Lead-Free Solder Considerations) as a reference to discuss potential impacts to
the product design and manufacturing process.
Provide full disclosure throughout the supply chain regarding risks when lead-free solder is used. All
risks are to be addressed and mitigated through the Environmental Design Review.
Criteria: The analysis shall show evidence that the lead-free solder effects are reviewed and
adjustments made to the test plans, design, and process. The part’s data sheets shall support all lead-
free solder processes.
Internal
5 Development
5.1 Electrical
5.1.1 Jump Start

Operating Type: 3.1/3.2 (with voltage as defined in procedure).
(See Jump Start test mode)
Monitoring: Continuous Monitoring.
Parameters: Troom
Inputs to apply the disturbance:

Test Temperature Troom +23 ± 5 °C
Signal Name Pin
Inputs to apply the disturbance Battery Main Connector 6
Ground Main Connector 4
Functional Status Classification (FSC) C
Test Sample Distribution
Instance Sample S/N Remarks
Qty.
A 3 DV
Procedure:
1 Soak the component un-powered until its temperature has stabilized to Troom.
2 GMW3172: “Apply 26.0 V (unless otherwise stated, e.g., PPEI requires 26.5 V) for 1 minute to
all I/O connected to vehicle battery voltage, either directly or through an external component,
while in Operating Type 3.1.”
Method (select a or b.):
a. ☐ Apply to load box power input (recommended to ensure test application to
all I/O connected to vehicle battery voltage).
b. ☒ Apply to the following DUT connector pins only:
Connector Pin Signal Name FSC = A or C
1 (Main Battery C
connector)
Voltage (select a or b.):

a. ☒ Apply default 26.0 V
b. ☐ Apply other voltage = V (provide explanation for value)
3 With the voltage level unchanged, transition to Operating Type 3.2.
4 Remain in Operating Type 3.2 for 1 minute.
Internal
5 Remain in Operating Type 3.2 and transition voltage from 26.0 V to UA.
Criteria: Functional Status Classification shall be C. All functions needed to start the engine must meet
Class A during the test, if not stated differently in the CTS/CTRS.
a. ☒ This device does not contain functions required to start the engine.
b. ☐ This device contains the following functions, which are required to start the
engine:
Function
NA
5.1.2 Reverse Polarity

Operating Type: 3.1/3.2 (with voltage as defined in procedure)
(See Reverse Polarity test mode)
Monitoring: Continuous Monitoring
Parameters: Troom

Signal Name Pin
Qty.
A 3 DV
Procedure:
1 Connect the component to a power supply.
2 Apply -13.5 V for 2 minutes to all I/O connected to vehicle battery voltage, either directly or through
an external component, while in Operating Type 3.1.
Connector Pin Signal Name
1 (Main Battery
connector)
2 (Main Ground
connector)
Internal
3 With the voltage level unchanged, transition to Operating Type 3.2.

4 Remain in Operating Type 3.2 for 2 minutes.
5 Remain in Operating Type 3.2 and transition voltage from -13.5 V to UA.
Note: This test shall be performed with all of the battery voltage supplied loads.
Criteria: Functional Status Classification shall be C.
5.1.3 Over Voltage

Operating Type: 3.1/3.2 (with voltage as defined in Table 20).
Parameters: Tmax – 20 ° = 65 °

Signal Name Pin
Qty.
A 3 DV
Procedure:
1 Connect the power supply to the battery inputs of the component and to all loads that have battery
inputs.
1 (Main Battery
connector)
2 (Main Ground
connector)
2 Raise ambient temperature to (Tmax – 20 °C) and stabilize the component at this temperature.
3 Turn on the power supply and subject the component to the required test voltage for the required
test time as noted in TableT_OverVoltage 20 with Operating Type 3.1.
4 Repeat steps (2) and (3) with Operating Type 3.2.
Internal
Table 20: Over Voltage Requirements

Select Component Type Test Voltage Test Time
method
☒ Components which contain over voltage Continuously sweep 60 minutes
protection circuits that switch off power between +16 V and +18 V
consumption in the range of (+16 to +18) V. at 1 V/minute Note 1.
☐ Components which do not contain over Provide a constant +18 V. 60 minutes
voltage protection circuits that switch off
power consumption.
Note 1: Over voltage protected components will experience worst case power consumption during
sweeping the supply voltage. This simulates voltage variation caused by the generator (due to
changes of engine speed) or caused by the battery charging device (especially with high current
pulses).
Internal
5.1.4 State Change Waveform Characterization

Operating Type: All transitions between possible operating types (e.g., 1.2 to 3.2 and
3.2 to 1.2), including internal state changes (e.g., shutdown phase,
wakeup phase).
(See State Change Waveform Characterization test mode)
Monitoring: Continuous Monitoring. Especially, the voltage and current levels of
output signals are reviewed in graphical form with an oscilloscope or
other equivalent measurement tool.
Parameters: Troom
Signal lines to be monitored:

Signal Name Pin
Signal lines to be monitored Battery Main Connector 6
Functional Status Classification (FSC) A
Qty.
A 3 DV
Procedure:
1 Change operation state.
From To Mode Transition Instructions
1.2 2.1 Electrically power the DUT and “Wake CMD” switch must be in OFF position
2.1 2.2 With FPDLinkBox set “Wake CMD” switch in ON position and using VCU
Simulator EMC mode, connect and select “Normal Mode”
2.2 3.2 “Wake CMD” switch in ON position, Update UB to UA
3.2 2.2 “Wake CMD” switch in ON position, Update UA to UB
2.2 2.1 With FPDLinkBox set “Wake CMD” switch in OFF position
2.1 3.1 “Wake CMD” switch in OFF position, Update UB to UA
3.1 2.1 “Wake CMD” switch in OFF position, Update UA to UB
2.1 1.2 Remove voltage applied while “Wake CMD” switch in OFF position
2 Record all waveforms of output signals during the entire transition phase (before, during, and after
state changes). Evaluate integrity of monitored output signals for proper performance.
a. Monitored Signals:
Connector Pin Signal Name Criteria
1 (Main connector) Battery Monitor Current consumption of DUT.
Internal
1.2 Mode 0 mA
2.1/3.1 Mode 0.075 mA (Maximum)
2.2/3.2 Mode 800-1300 mA (Approx)
3 Repeat steps (1) and (2) for all other possible state changes.
Criteria: Functional Status Classification shall be A. Transients that occur as a result of state change
transitions shall not produce disruptive levels of disturbance to downstream components. One
consideration in analyzing the waveform is to detect inadvertent actuation of outputs and floating
inputs.
Lab Instruction: Any transients that occur as a result of state change transitions shall be captured, and
reported as a non-conformance, by the test laboratory. These events are then to be reviewed by the
project team and OEM to determine potential for disruption to downstream components and to make
the final test conformance determination.
5.1.5 Ground Path Inductance Sensitivity

Operating Type: 3.2
(See Ground Path Inductance Sensitivity test mode)
Monitoring: Continuous Monitoring. Additionally, recording of ground path and
input/output signals with an oscilloscope or other equivalent
measurement tool.
Parameters: Troom
Ground lines to apply the inductance:
Signal Name Connector Pin
Ground 2 (Main
connector)
Procedure:
1 Place a 5 µH inductor in the ground path of a bench test setup. (Lab Instruction: record part number
of inductor in test report).
Internal
2 Operate the component to create the maximum current change rate at the highest frequency
possible in the ground path. This may be achieved by simultaneously activating all inputs to the
component that will generate switching events at the maximum rate of change. PWM duty cycle
shall be chosen worst case to produce maximum current change rate.
Scenario Instructions for Achieving Maximum Current Change Rate Signal(s) Affected
1 Set FPDLinkBox “Wake CMD” switch in ON position, Battery current

in VCU Simulator EMC mode, connect and select consumption
“Normal Mode 1b” to set the backlight to 80% and 800-1100 mA
move the stepper motor
Criteria: Functional Status Classification shall be A. Additionally, evaluate input/output signals and
ground path integrity for proper performance.
5.2 Mechanical
5.2.1 Highly Accelerated Life Test (HALT) (Non-applicable)

Operating Type: 3.2
Parameters: Per procedure
Procedure:
Use the test methods according to GMW8287.
HALT is a form of Stepped Stress testing consisting of the following tests:
1 Cold Step
2 Hot Step
3 Rapid Thermal Transitions
4 Vibration Step
5 Combined Rapid Thermal Transitions with Vibration Step
Describe the various tests listed above in items #1 to 5 in detail below. Include temperature and
vibration profiles and details of the functional testing that will be performed.
(TBD: provide details to address the items described above)
Note: Refer to GMW3172 item 6.8 “Vibration Transmissibility Demonstration” for component mounting
instructions.
After weaknesses are identified during HALT, root-cause analysis is then performed to establish the
failure mechanism and understand the physics of the failure. Based on this knowledge, a design
change can be made to remove the failure mechanism. A subsequent HALT test should be performed
to verify that the design change removed the failure mechanism and that no new failure modes were
injected.
Criteria: Test anomalies and failure analysis shall be reviewed by GM Engineering and the supplier to
determine if corrective actions are required.
Internal
Note: Stress temperatures used in this test may be above the effective glass transition temperature of
certain plastic materials and may lead to unrealistic failure mechanisms, which may not be relevant to
the application of the component.
5.3 Climatic
5.3.1 Temperature Measurement

Operating Type: 3.2
Monitoring: The operating stabilization temperatures are to be monitored during
the measurement.
Parameters:
Evaluations to perform:
Select Component Type Test
method Temperature
Tair_ambient
☐ Low Temperature Evaluation. - 40°C
☐ High Temperature Evaluation. + 85°C
☐ Room Temperature Thermal Equilibrium Evaluation. + 23°C
☐ Occupant Accessible Control Surface Temperature + 23°C

Evaluation.
☐ Peak Temperature Evaluation With Worst-Case Loading. + 85°C
☐ IR Evaluation of Short Circuits + 23°C
☐ Thermal Measurements at Specific Points (e.g., critical + 23°C

ICs, power resistors, board areas, etc.)
• Specific Point to measure: LED PGU PCB
Qty.
A 1 DV
Internal
Procedure:
Perform the measurement in the highest power consumption scenario possible. This shall be done
using infrared imaging or thermocouple measurements according to the procedure in GMW8288.
The completed GMW8288 Test Plan shall be reviewed and approved by the GMW3172 ENV SME
prior to starting the test.
Quantify temperatures and evaluate design margin using the following equation:
Tpart_max_spec  Tpart + (Tmax – Tair_ambient) + DM
where:
• Tpart_max_spec: Maximum allowable temperature from part/material data sheet. Use Tmax values from
section 4.3.1
• Tpart: Temperature of part measured at maximum load.
• Tmax: Maximum temperature from Temperature Code rating in this document.
• Tair_ambient: Temperature of ambient air in test chamber according to GMW8288.
• DM: Design Margin, +10 °C minimum (or as agreed upon by GM and supplier). Use +10°C
Criteria:
Functional Status Classification is not applicable to this test. The part shall meet the maximum
allowable temperature with the Design Margin.
5.3.2 Low Temperature Wakeup

Operating Type: 1.2/3.2 as shown in Figure 10.
Monitoring: Continuous Monitoring during Operating Type 3.2 phases.
Parameters: Troom = +23 ± 5 °C, Tmin = -40 ± 3 °C, UA = 14.0 ± 0.1 V
Test Temperature Troom + 23 ± 5 °C

Test Temperature Tmin - 40°± 3 C
Test Voltage Unom + 14.0 ± 0.1 V
Signal Name Pin
Functional Status Classification A
Qty.
A 47 DV
Procedure:
Use the test methods according to IEC 60068-2-1, Test Ab, Cold. Tmin of the operating temperature
range is the low temperature that shall be used.
Internal
1 Prior to the start of a 24 h cycle, the component shall be energized at T room for 2 minutes and
evaluated for proper function at Unom.
2 The component shall then be soaked at Tmin for 24 h at Operating Type 1.2.
Note: The time at Tmin may be reduced, per the GMW3172 ENV SME, for components with low
thermal mass. The component shall be stabilized at Tmin for 1 h minimum.
3 At the end of the cold soak, and while still at Tmin, the component shall be turned ON and
evaluated for proper function for 1 h at Operating Type 3.2.
Figure 10: Low Temperature Wakeup Profile
5.3.3 Frost
Operating Type: 1.2 during cold phase; 3.2 during exposure to high humidity.
Monitoring: Continuous Monitoring during the time the component is energized.
Parameters:
Figure 11: Frost Profile
Internal
Table 21: Frost Test Requirements

Select # of Component Type Number of cycles
cycles performed
☐ Sealed components with or without a
10
pressure exchange membrane
Non-Sealed components without vent
Applicable 1
openings
Non-Sealed components with vent
☐ 0
openings
Sample Mounting Orientation. Insert a description of the sample orientation. e.g., refer to the vehicle
orientation as defined in Section 2.3 Component Physical Description of CG3043. Or specify the
mounting orientation if different than defined in Section 2.3 Component Physical Description of
CG3043, or if multiple mounting angles are used. If needed, insert a picture or drawing of how the
samples will be mounted in the test chamber.
Note: The samples shall be oriented in the vehicle orientation to test for the effects of moisture run-off
and accumulation on the circuit board.
Internal
Procedure:
Use the test methods according to IEC 60068-2-30, Test Db, Damp heat, cyclic, with the temperature
and humidity profile defined in Figure 11.
1 Soak the component in a cold chamber (-20 °C) for a 2 h minimum, while in Operating Type 1.2.
2 Transfer the component to a hot chamber maintained at +45 °C and 95% relative humidity within
3 minutes. Configure for Operating Type 3.2.
3 Perform Continuous Monitoring while the component is in the hot chamber for 4 h. Steps 1 through
3 constitutes one cycle. Transfer the component into the cold chamber (-20°C) for each additional
required cycle within 3 minutes.
4 Repeat steps 1 through 3 for the remaining cycles as required by Table 21.
Criteria: Functional Status Classification shall be A. Additionally, during the Visual Inspection and
Dissection – DRBTR, there shall be no evidence of electromigration or dendritic growth.
Internal
5.3.4 Highly Accelerated Stress Test (HAST) (Non-applicable)

Operating Type: 3.2, with the component at Umax, operated in such a manner to
minimize power dissipation.
Monitoring: Continuous Monitoring during intermediate and final 1-Point
Functional/Parametric Checks at Troom/Umax (i.e., readouts, per JEDEC
JESD22-A110D). Intermediate readouts shall be performed at 50%
and 75% of test duration.
Parameters: Umax
Temperature/Humidity/Duration:
Relative Vapor Duration
Temperature Temperature
Test Conditions Humidity Pressure (hours)
(dry bulb °C) (wet bulb, °C)
(%) (psia/kPa)
☐ 130 ± 2 85 ± 5 124.7 33.3/230 96 (-0, +2)
☐ 110 ± 2 85 ± 5 105.2 17.7/122 264 (-0, +2)
Bias Configuration:
Bias ON/OFF
Test Conditions
Configuration Duration
☐ Continuous Bias N/A
Cycled Bias
☐ TBD
(50% duty)
Procedure:
Use the test methods according to JEDEC JESD 22-A110D, Highly-Accelerated Temperature and
Humidity Stress Test (HAST).
Criteria: Functional Status Classification shall be A. Test anomalies and failure analysis shall be
reviewed by GM Engineering and the supplier to determine if corrective actions are required.
Note: Stress temperatures used in this test may be above the effective glass transition temperature
of certain plastic materials and may lead to unrealistic failure mechanisms, which may not be relevant
to the application of the component.
6 Design Validation (DV)
6.1 Electrical
6.1.1 Parasitic Current

Operating Type: 2.1/2.2
Internal
Monitoring: The current is measured in the various states of OFF Asleep

(Operating Type 2.1) and OFF Awake (Operating Type 2.2). The
current value shall be stored graphically.
Parameters: Troom
I/O to monitor current:
Battery 1 (Main
connector)
Procedure:
Measure the current in all of the component supply lines. The current measuring device must have a
sampling rate that is ten times higher than the shortest current peak duration that the component
creates. All inputs and outputs shall be electrically connected to their original load (or equivalent).
1 Connect the component to a variable power supply and adjust the input voltage to U B. The
component shall be at Troom.
2 Place the component into OFF Asleep mode.
3 Use a measurement device that is capable of integrating measured current over time. Measure a
minimum of five internal wakeup events for components that wake up (i.e., transition from OFF
Asleep to OFF Awake, without external triggers). For components that do not wake up, wait in OFF
Asleep mode for 10 minutes. While waiting, watch the current value for random fluctuations, then if
stable, measure current for 10 s. Calculate the average current over the measured period. In case
of random current fluctuations this behavior shall be documented.
a. ☐ Device has internal wakeup events. Measure 5 events.
b. ☒ Device has no internal wakeup events. Wait / monitor for 10 minutes.
4 Decrease the supply voltage at a linear slope until 11.5 V. Measure the current according to step
(3).
(3).
(3).
(3).
This ramp down shall include at least 2 internal wakeup events, if applicable, with a maximum slope
of 0.5 V/minute.
Criteria: Functional Status Classification is not applicable to this test. The maximum allowable average
parasitic current shall be 0.125 mA if not provided in the CTS/CTRS. Analyze the stored current
waveforms for any random fluctuations. Unintentional wakeups are not allowed.
Acceptance Criteria:
a. ☐ Default current value 0.125 mA.
b. ☒ CTS/CTRS specified value (Maximum) = 75 µA
Internal
6.1.2 Power Supply Interruptions

Operating Type: 3.2
Parameters: Tmin, Tmax, Umin

Test Temperature Tmin °- 40°± 3 C
Test Temperature Tmax + 85 ± 3 °C
Test Voltage Umin + 9.0 ± 0.1 V
Voltage decrease 5%
Signal Name Pin
Functional Status Classification (FSC) A @ Umin C during test
Qty.
a 3 DV
Procedure:
Use the test methods according to ISO 16750-2, Reset behaviour at voltage drop.
Figure 12: Power Supply Interruptions Profile
Figure 12: Power Supply Interruptions Profile shows the execution of the procedure.
1 Stabilize the component at Tmin. Apply Umin to the component.
2 Apply the test pulse to all supply voltage inputs simultaneously. Decrease the voltage by 5% and
hold this decreased voltage for 5 s.
3 After each test pulse return to 100% Umin and verify proper functionality.
4 Repeat steps (2) and (3) with a further decrease of 5% Umin. Repeat this until 0% Umin is reached.
Internal
5 Repeat steps (2) to (4) with a test pulse hold time of 50 ms at each decreased voltage.
6 Repeat steps (2) to (5) for each supply voltage input separately in case of multiple supply voltage
inputs, while maintaining the untested inputs at Umin.
7 Repeat steps (2) to (6) with the component at Tmax.
Criteria: Functional Status Classification shall be A after returning to U min following each voltage drop
and C elsewhere.
6.1.3 Battery Voltage Dropout

Operating Type: 2.1 from T2 through T3 for FSC C periods. 3.2 for FSC A periods.
(See Battery Voltage Dropout test mode)
Parameters: Tmin, Tmax
Test Temperature Tmin °- 40°± 3 C

Nominal Battery Voltage UA + 14 ± 0.1 V
Signal Name Pin
Functional Status Classification (FSC) A ≥ Umin C < Umin
Qty.
a 3 DV
Procedure:
1 Set up the battery voltage dropout profile as shown in Figure 13.
2 Soak the component un-powered until its temperature has stabilized to Tmin.
3 Power up the component and inject the battery voltage dropout test profile with the following
parameters from variation “A” in Table 22.
a. ☐ Apply to load box power input (recommended to ensure
test application to all I/O connected to vehicle battery
voltage).
Internal
onnector Pin Signal Name
1 (Main Battery
connector)
2 (Main Ground
connector)
4 Repeat step (3) three additional times with the variations “B”, “C”, and “D”.
5 Repeat steps (2) through (4) at Tmax.
Figure 13: Battery Voltage Dropout Profile
Table 22: Battery Voltage Dropout Values
Time
Variations
T1 T2 T3
A 0.01 s 10 s 1s
B 0.1 s 600 s 10 s
C 0.5 s 3600 s 120 s
D 1s 28 800 s 7200 s
Notes:
• Stabilize at the voltage levels defined in regions E1, E2, and E3 for enough time to perform
Functional Evaluations (i.e., to allow Continuous Monitoring to verify correct functionality).
• The duration at 1.0 V shall be for a minimum of 1.0 minute in order to force the component to
reset during following voltage increase.
Criteria: Functional Status Classification shall be as shown depending on the zone per Figure 13.
There shall be no inadvertent behavior during the transitions.
Internal
Internal
6.1.4 Sinusoidal Superimposed Voltage

Operating Type: 3.2, with voltage levels as defined in ISO 16750-2, superimposed
alternating voltage, Severity Level 2.
(See Sinusoidal Superimposed Voltage test mode)
Parameters: Troom

Test Voltage UA + 12 ± 0.1 V
Superimposed A/C Voltage VA/C 4.0 ± 0.1 Vp-p
Minimum Sweep Frequency fsweep_min 50 Hz ± 1%
Maximum Sweep Frequency fsweep_max 25 kHz ± 1%
Sweep Cycle Duration tsweep 2 minutes
Total Test Duration 5 sweep cycles
Signal Name Pin
Qty.
a 3 DV
Procedure:
Use the test methods according to ISO 16750-2, superimposed alternating voltage, Severity Level 2
(4 Vp-p).
a. ☐ Apply to load box power input (recommended to
ensure test application to all I/O connected to
vehicle battery voltage).
1 (Main Battery
connector)
2 (Main Ground
connector)
Internal
6.1.5 Pulse Superimposed Voltage

Operating Type: 3.2
(See Pulse Superimposed Voltage test mode)
Parameters: Troom, Umin, Umax

Test Voltage Umin + 9 ± 0.1 V
Test Voltage Umax + 16 ± 0.1 V
Signal Name Pin
Qty.
a 3 DV
Procedure:
Refer to Figure 14.
1 Connect the component to the Uo output.
a. ☐ Apply to load box power input (recommended to ensure test application to all I/O
connected to vehicle battery voltage).
1 (Main Battery
connector)
2 (Main Ground
connector)
2 Stabilize component at temperature Troom.

3 Set Us = Umax - 2 V.
4 Perform 5 continuous frequency sweep cycles while continuously monitoring for intermittent faults.
5 Decrease Us by 1 V.
Internal
6 Repeat steps (4) and (5) until (Us = Umin + 2 V).
Figure 14: Pulse Superimposed Voltage Setup
Test Setup Definitions/Parameters:

• U0 = U s + U p
• Us = (Umin + 2 V) to (Umax - 2 V) DC voltage

• Up = Square wave -1 V to +1 V 50% duty cycle (2 Vp-p)
• Up frequency sweep range: 1 Hz to 4 kHz

• Frequency sweep type: Logarithmic
• Frequency sweep duration for one cycle: 120 s for 1 Hz to 4 kHz to 1 Hz

Notes:
• The test shall be performed with real or equivalent loads connected (Load_1 to Load_n) and the
output currents driven in the full range from I_load_min to I_load_max for each Us step.
Instructions for Driving Output Currents from I_load_min to Signal(s) Affected
Scenario
I_load_max
1 Set FPDLinkBox “Wake CMD” switch in ON position, Battery current

in VCU Simulator EMC mode, connect and select consumption
“Normal Mode 1b” to set the backlight to 80% and 800-1100 mA
move the stepper motor (I_Max)
2 With FPDLinkBox set “Wake CMD” switch in OFF Battery current
position consumption
max 75 uA
(I_Min)
Internal
• The U0 waveform will depend on the frequency. Figure 15 shows examples of the following
frequencies: 1 Hz, 100 Hz and 4 kHz (Us = +14 V, Up = +1 V / -1 V).
Figure 15: Examples for Pulse Waveforms
As an example, the Pulse Superimposed Voltage test setup can be realized as shown in the electrical
schematic of Figure 16: Example for Pulse Superimposed Voltage Test Setup, verified with SPICE
simulation.
Figure 16: Example for Pulse Superimposed Voltage Test Setup
Internal
6.1.6 Intermittent Short Circuit to Battery and to Ground for Input/Output

Operating Type:
2.1/3.1/2.2/3.2 (with steady-state loads continuously on, PWM loads at minimum duty cycle for 5
cycles, 50% duty cycle for 5 cycles and maximum duty cycle for 5 cycles).
The following steady-state loads will be: 1.2A
The following PWM loads will be: This HUD application has not PWM input or outputs
(See Intermittent Short Circuits test mode)

Test Temperature Tmin - 40 ± 3 °C

Test Voltage Umin +9 ± 0.1 V
Test Voltage Umax +16 ± 0.1V
Signal Name Pin Short to
Inputs to be shorted
LVDS Shield LVDS Braid Battery
LVDS Harness:
To reduce test time, the signals will be simultaneously shorted in the following groups:
Group 1 - I/O to be shorted:
Connector Short to Short to
Signal Name
Pin Ground Battery

Signal Name
Pin Ground Battery
Internal
Procedure:
1 Lower and stabilize the chamber temperature to Tmin.
2 Apply Umax to the component.
3 At t = 0 s, switch the Operating Type from 2.1/3.1 (OFF) to 2.2/3.2 (ON). The inputs and outputs
under test shall be in an electrical steady state condition no later than t = 5 s.
4 GMW3172 Default: “At t = 15 s, apply a short circuit to battery to LVDS Shield each applicable I/O
for a duration of 1 minute and then remove the short circuit for a duration of 45 s (the combination
of steps (3) and (4) shall equal 2 minutes).” See following Notes for further explanations.
5 Switch the Operating Type from 2.2/3.2 (ON) to 2.1/3.1 (OFF).
6 Repeat steps (3) through (5) until 15 cycles are complete.
7 Confirm the correct operation of the outputs with normal loads.
8 Adjust the battery voltage to Umin and repeat steps (3) through (7).
9 Repeat steps (2) to (8) for short circuit to ground.
10 Stabilize the chamber temperature to Tmax and repeat steps (1) through (9 8).
Notes:
• In step (4), multiple shorts may be applied simultaneously (e.g., to reduce test time), but the
supplier shall make sure that the test is valid for single shorts as well (by design or analysis).
The hardware engineer has analyzed each simultaneous short configuration and has determined that
shorting any one of these signals will not cause any other signals to turn off or otherwise be under-
tested, as compared with individual signal short circuit testing:
HW Engineer Name:
• In step (4), the durations for short circuit condition and normal condition shall be modified in order
to ensure activation/deactivation of short circuit protection.
☒ The default values are appropriate for this device.
☐ This device requires the following modified durations:
At t = ___ s, apply a short circuit to battery to each applicable I/O for a duration of ___ minute and
then remove the short circuit for a duration of ___ s (the combination of steps (3) and (4) shall
equal ___ minutes).
• Care has to be taken that the power supply has a current limitation (set to 50A 3A, if not otherwise
specified) and that test setup withstands the maximum current. (main connector maximum
current allowed is 3A)
• This is a test variation required by GM, ignoring the short to ground but executing the short
to battery only as if the shield is I/O.
Criteria: Functional Status Classification shall be C. During the short circuit event, a short on one or
several I/O lines shall not lead to an undefined behavior of the component. Additionally, during the
Visual Inspection and Dissection – DRBTR, there shall be no evidence of overheating.
6.1.7 Continuous Short Circuit to Battery and to Ground for Input/Output

Operating Type:
Internal
3.2 (with steady-state loads continuously on, PWM loads at minimum duty cycle for 5 minutes, 50%
duty cycle for 5 minutes and maximum duty cycle for 5 minutes). (See Continuous Short Circuits test
mode)
The following steady-state loads will be: 1.2A
The following PWM loads will be: This HUD application has not PWM input or outputs

Test Voltage Umin +9 ± 0.1 V
Test Voltage Umax +16 ± 0.1V
Signal Name Pin Short to
Inputs to be shorted
LVDS Shield LVDS Braid Battery
LVDS Harness:
To reduce test time, the signals will be simultaneously shorted in the following groups:
Signal Name
Pin Ground Battery

Signal Name
Pin Ground Battery
Procedure:
1 Lower and stabilize the chamber temperature to Tmin.
2 Apply Umax to the component.
3 Apply a continuous short circuit to battery voltage to LVDS Shield each applicable I/O. The short
circuit duration is defaulted to 15 minutes, but may be shorter or longer depending on the protection
design.
Internal
4 Remove the short circuit condition for battery voltage.

5 Confirm the correct operation of the outputs with normal loads.
6 Repeat steps (2) through (5) for Umin.
7 Repeat steps (2) through (6) for short to ground.
8 Raise and stabilize the chamber temperature to Tmax and repeat steps (2) through (7 6).
Note:
• In step (3), multiple shorts may be applied simultaneously (e.g., to reduce test time), but the supplier
shall make sure that the test is valid for single shorts as well (by design or analysis).
The hardware engineer has analyzed each simultaneous short configuration and has determined
that shorting any one of these signals will not cause any other signals to turn off or otherwise be
under-tested, as compared with individual signal short circuit testing:
HW Engineer Name:
• Care shall be taken that the power supply has a current limitation (set to 50A 3A if not otherwise
specified) and that test setup withstands the maximum current. (main connector maximum
current allowed is 3A)
• This is a test variation required by GM, ignoring the short to ground but executing the short
to battery only as if the shield is I/O.
•
Criteria: Functional Status Classification shall be C. During the short circuit event, a short on one or
several I/O lines shall not lead to an undefined behavior of the component. Additionally, during the
Visual Inspection and Dissection – DRBTR, there shall be no evidence of overheating.
6.1.8 Multiple Power and Multiple Ground Short Circuits Including Pass
Through(Non-applicable)
Operating Type: 3.2
Parameters: Umax
Number of samples required: TBD
Note: 6 or 12 samples are required for this test, depending on how many signals are being tested.
Samples from the Low Resistive Sort test cannot be reused for the High Resistive Short test.
Power and Ground lines to be tested:
Signal Name Connector Pin Fuse Rating
TBD TBD TBD

Note: Due to the destructive nature of this test (FSC = E), additional samples may be needed in order
to complete the Test Leg.
Note: Prior to test with FSC = E, perform a 5-Point Functional/Parametric Check. This shall be shown
in the Test Flow, if applicable.
Procedure:
Low Resistive Short Circuit:
Internal
1 Set up a power supply to Umax with a current limit at 250% of the anticipated fuse rating. The wires
used shall have a resistance < 35 mΩ and be capable of handling the rated current. All
inputs/outputs have to be connected to their specified loads.
• For power lines, consider the largest anticipated fuse rating in vehicle applications (default
value: 15 A for input ratings ≤ 10 A, 30 A for input ratings > 10 A).
• For ground lines, consider a 30 A fuse rating.
2 At t = 0 s, turn on the component and operate it for 300 s.
3 At t = 300 s:
• For power lines, apply a short to ground according to Figure 17 for a duration of 300 ms and
set resistance to 0 Ω (e.g., a shunt).
• For ground lines, apply a short to battery according to Figure 18 for a duration of 300 ms and
set resistance to 0 Ω (e.g., a shunt).
4 Repeat steps 1 thru 3 for all applicable lines.
Note: The tested samples are not allowed to perform the High Resistive Short Circuit test. New
samples shall be used for the High Resistive Short Circuit test.
High Resistive Short Circuit:
1 Set up a power supply to Umax with a current limit above 130% of the anticipated fuse rating. The
wires used shall have a resistance < 35 mΩ and be capable of handling the rated current. All
inputs/outputs shall be connected to their specified loads.
• For power lines, consider the largest anticipated fuse rating in vehicle applications (default
value: 15 A for input ratings ≤ 10 A, 30 A for input ratings > 10 A).
• For ground lines, consider a 30 A fuse rating.
2 At t = 0 s, turn on the component and operate it for 300 s.
3 At t = 300 s:
• For power lines, apply a short to ground according to Figure 17 for a duration of 10 minutes
and set resistance to > 0 Ω to obtain a current of 130% of fuse rating.
• For ground lines, apply a short to battery according to Figure 18 for a duration of 10 minutes
and set resistance to > 0 Ω to obtain a current of 130% of fuse rating.
4 Repeat steps 1 to 3 for all applicable lines.
Note: The same sample may be used repeatedly if damage does not invalidate the test on other pass
through circuits.
Figure 17: Power Pass Through Short Circuit Setups
Internal
Figure 18: Ground Pass Through Short Circuit Setups
Criteria:
For the Low Resistive Short Circuit test, Functional Status Classification shall be D. Additionally, during
the Visual Inspection and Dissection – DRBTR, there shall be no evidence of overheating.
For the High Resistive Short Circuit test, Functional Status Classification shall be E. Additionally, during
the Visual Inspection and Dissection – DRBTR, minor amounts of carbon may appear near the open
circuit. A safety critical behavior (e.g., smoke, fire, melted plastics, etc.) is not allowed.
Internal
6.1.9 Open Circuit – Single Line Interruption

Operating Type: 3.2 (outputs have to be operated at maximum specified load)
(See Single Line Interruptions test mode)

Parameters: Troom
I/O to be tested:
10 Seconds 15 Minutes
Duration Duration
Battery 1 (Main ☐ ☒
connector)
Ground 2 (Main ☐ ☒
connector)
Procedure:
Use the test methods according to ISO 16750-2, Single line interruption. Apply this procedure for all
I/O circuits, one circuit at a time.
For supply power and ground lines, the interruption duration shall be 15 minutes, for all other I/O circuits
the interruption duration shall be 10 s.
Note:
• In the case of multiple supply power lines, they shall be treated both as a single line (interrupted
simultaneously) and as separate lines.
• In the case of multiple ground lines, they shall be treated both as a single line (interrupted
simultaneously) and as separate lines.
Criteria: Functional Status Classification shall be C. Additionally, during the Visual Inspection and
Dissection – DRBTR, evidence of overheating is not allowed.
6.1.10 Open Circuit – Multiple Line Interruption

Operating Type: 3.2
Parameters: Troom
Connectors to be tested:
Disconnect Disconnect Connector
Connector Name
Connector at DUT at Loadbox
Main connector ☒ ☐
LVDS connector ☒ ☐
Internal
Procedure:
Use the test methods according to ISO 16750-2, Multiple line interruption. Disconnect and reconnect
the connector of the component. In the case of multiple connectors, they shall be disconnected and
reconnected separately.
Dissection – DRBTR, evidence of overheating is not allowed.
6.1.11 Ground Offset (Non-applicble)

Operating Type: 3.2
Parameters: Umin, Umax, Troom
I/O to apply offset to:
TBD TBD
Breakout box must be constructed to ensure that a jumper can be removed to break the connection
between the load and ground. If the module has several ground lines that are electrically isolated from
each other, then those also need to be individually tested, so there needs to be a breakout for each
ground line as well.
Procedure:
As shown in the test setup in Figure 19, the offset shall be applied to each ground line of the I/O
simulation device separately and simultaneously. The simulation device shall be constructed according
to the CTS/CTRS interface documentation of the component. If this information is not available, refer
to GMW14082 for Global A (or GB14082 for Global B) for defining I/O circuits of the simulation device.
1 Apply Umin to the component.
2 Subject the applicable ground line of one representative I/O simulation device to a +1.0 V offset
relative to the component ground.
3 Repeat step (2) for the next applicable I/O simulation device.
4 Repeat step (2) for all I/O simulation devices simultaneously.
5 Repeat steps (2) through (4) for a -1.0 V offset relative to the component ground.
6 Repeat steps (2) through (5) with Umax instead of Umin.
Internal
Figure 19: Ground Offset Setup
Note 1: If a component has several ground lines that are electrically isolated from each other, this test
has to be performed for each ground line.
Note 2: This test is also applicable for inputs that are switched to ground (i.e., Input Digital Low).
6.1.12 Power Offset (Non-applicable)

Operating Type: 3.2
Parameters: Umin, Umax, Troom
I/O to apply offset to:
TBD TBD
Breakout box must be constructed to ensure that a jumper can be removed to break the connection
between the load and battery. In order to test all loads simultaneously, there needs to be a breakout
jumper for load power, separate from DUT power lines. There needs to be a breakout for each battery
input line to the module as well.
Procedure:
As shown in the test setup in Figure 20, the offset shall be applied to each power line of the I/O
simulation device separately and simultaneously. The simulation device shall be constructed according
to the CTS/CTRS interface documentation of the component.
1 Apply Umin to the component.
2 Subject the applicable power line of one representative I/O simulation device to a +1.0 V offset
relative to the component power.
3 Repeat step (2) for the next applicable I/O simulation device.
4 Repeat step (2) for all I/O simulation devices simultaneously.
Internal
5 Repeat steps (2) through (4) for each applicable power line individually if the component has more
than one battery input.
6 Repeat steps (2) through (5) for a -1.0 V offset relative to the component power.
7 Repeat steps (2) through (6) with Umax instead of Umin.
Figure 20: Power Offset Setup
Note: This test is also applicable for inputs that are switched to power (i.e., Input Digital High).
6.1.13 Discrete Digital Input Threshold Voltage (Non-applicable)

Operating Type: 3.2
(See Discrete Digital Input Threshold Voltage test mode)
Monitoring: Continuous Monitoring. Additionally, readout of logic state and current.

Parameters: Tmin, Tmax, Troom
Discrete digital inputs to be tested:
TBD TBD
Procedure:
Connect the component to the Us supply and power ground. Refer to Figure 21, and follow the given
sequence.
Figure 21: Threshold Voltage Setup
Internal
1 At Troom perform the following sequence (see Figure 22).

2 Adjust Us to Umin for the component.
3 Adjust Ustep to 0 V.
4 Adjust Usin to 50 Hz sinusoidal with an amplitude of 200 mV peak-peak.
5 Read logic output state and store.
6 Step Ustep by 250 mV increments from 0 to Umin while recording the output logic state. Keep each
step for 5 s and sample output with a 100 ms repetition rate until all 50 recorded logic states in a
row have changed to the new value.
7 Store input value of Ustep when this occurs to the name Uih_rise. Continue until Umin is reached.
8 While at Umin start to decrease Ustep by 250 mV steps from Umin down to 0 V. Use the same procedure
as in step (6) to detect a logic state change.
9 Store input value of Ustep when this occurs to the name Uil_fall. Continue until 0 V is reached.
10 Rise voltage Ustep to (Uih_rise+Uil_fall)/2 and record the number of state changes during a 5 s time
period as Nth_Umin (see Figure 23).
11 Repeat steps (2) to (10) by replacing Umin with Umax and store the new Uih_rise and Uil_fall.
12 Repeat steps (2) to (11) at Tmax and Tmin for the component.
13 Write a report including:
• At Troom and Umin: Uih_rise, Uil_fall and Nth_Umin
• At Troom and Umax: Uih_rise, Uil_fall and Nth_Umin
• At Tmax and Umin: Uih_rise, Uil_fall
• At Tmax and Umax: Uih_rise, Uil_fall
Internal
• At Tmin and Umin: Uih_rise, Uil_fall

• At Tmin and Umax: Uih_rise, Uil_fall
Figure 22: Threshold Voltage Waveform – All Steps
Figure 23: Threshold Voltage Waveform – Step (10)
Internal
Criteria: Functional Status Classification is not applicable to this test. All discrete digital input
interfaces shall be able to correctly detect the logic levels stated by by CTRS or (CTS/SSTS and
GMW14082 for Global A or GB14082 for Global B):
Logic Low: -1 V < Uil < 2 V
Logic High: 4.5 V < Uih < Umax + 1 V
This then requires that the Uih_rise and Uil_fall both fall into the range (2.0 to 4.5) V over the full operating
temperature and voltage range. The interface hysteresis is included in this requirement. The current
shall not increase significantly (> 5 mA) during the ( Uih_rise+Uil_fall)/2 range.
6.1.14 Over Load – All Circuits (Non-applicable)

Operating Type: 3.2
Parameters: Tmin, Tmax, Unom
Outputs to be tested:
Imax Is this output over-current Return Line for
protected? (Yes or No) Pin Under Test
TBD TBD TBD TBD TBD

Note: Due to the destructive nature of this test (FSC = E), additional samples may be needed in order
to complete the Test Leg.
Note: Prior to test with FSC = E, perform a 5-Point Functional/Parametric Check. This shall be shown
in the Test Flow, if applicable.
Procedure:
Internal
1 Raise and stabilize the test chamber temperature to Tmax.

2 Apply Unom to the component.
3 With variable resistor, load each output to draw a maximum operating load current (Imax) for 10
minutes.
4 Using a variable power supply, increase the current in increments of 10% of I max by changing the
variable resistor load. Hold each current increase for a 10 minutes dwell period.
5 Continue to increase the current in 10 % increments until an open circuit conditions exists or a
component with built-in protection begins to limit current. For all other cases, increase current until
3 x Imax, but ≤ 50 A, is reached.
6 Identify the current level in Amperes when the open circuit condition exists. Pay special attention
for the generation of smoke or thermal activity near the time of failure. Document observations in
the test report.
7 Return the component to full function by performing all required re-initializations conditions and
confirm the correct operation with normal loads.
Note: Output circuits without current protection may not return to correct operation for the output
under test.
8 Repeat steps (1) to (7) at Tmin.
Criteria: If an output is over-current protected, then Functional Status Classification shall be D for the
associated function(s).
If an output is not over-current protected, then Functional Status Classification shall be E for the
associated function(s). Additionally, during the Visual Inspection and Dissection – DRBTR, minor
amounts of carbon are allowed near the open circuit; however, amounts beyond this on the circuit
board are not permitted.
For critical functions, the Functional Status Classification shall be A.
Functional Status Functional Status Functional Status
Function Output Classification A Classification D Classification E
(Critical Functions – Y/N) (Over-Current Protected – Y/N) (Not Over-Current Protected – Y/N)
TBD TBD TBD TBD TBD
6.1.15 Over Load – Fuse Protected Circuits (Non-applicable)

Operating Type: 3.2
Parameters: Tmax, Unom
Outputs to be tested:
Connector 1.35 X Irp 2.0 X Irp 3.5 X Irp

Signal Name Irp Current and Current and Current and Return Line
Pin
Duration Duration Duration
Procedure:
Internal
Test all circuits that are protected with the approved application circuit protection feature as detailed
on the component drawing or specification (fuse, circuit breaker, etc.) according to the following
procedure:
1 Raise and stabilize the chamber temperature to Tmax.
2 Apply Unom to the component.
3 Put a shunt (i.e., short circuit) in place of the circuit protection feature.
4 Apply an overload circuit condition to the circuit so that the load current is 1.35 x Irp (nominal current
of the circuit protection feature) for the required test duration. Use the test duration as defined in
ISO 8820-1, Operating time rating, considering the upper tolerance + 10%
5 Repeat step (4) with an overload circuit condition so that the load current is 2 x I rp. Adjust the test
duration accordingly as defined in ISO 8820-1, Operating time rating.
6 Repeat step (4) with an overload circuit condition so that the load current is 3.5 x Irp. Adjust the test
duration accordingly as defined in ISO 8820-1, Operating time rating.
Dissection – DRBTR, there shall be no evidence of discoloration from overheating.
6.1.16 Insulation Resistance (Non-applicable)

Operating Type: 1.1
Monitoring: Measure isolation resistance in procedure, step (2).
Parameters: Troom
Measurement Points: TBD
Procedure:
1 Use the test methods according to ISO 16750-2, Insulation resistance. For situations where the
standard test voltage of 500 V does not fit the part’s rating voltage, a modified voltage will be
necessary as noted as follows:
a. ☐ Use standard test voltage = 500V.
b. ☐ Use non-standard test voltage = __________
i. Reason:_____________________________________________________
2 After the test, perform a 1-Point Functional/Parametric Check.
Note:
• Circuit boards with inductive loads: Less voltage (< 100 V) can be used with electronic components
to prevent damage to susceptible parts such as capacitors.
• Inductive components: A test voltage > 300 V is suitable for components such as motors.
• Power Converter: Legal insulation requirements exceed 500 V.
• Optionally, the humidity preconditioning of the ISO-test shall be replaced by the HHC test in Leg 2
of the Test Flow (use a minimum of 3 samples).
Criteria: Functional Status Classification shall be C. The insulation resistance shall be > 10 x 106 Ω.
Internal
6.1.17 Crank Pulse Capability and Durability

Operating Type: 2.2 (during stop) / 3.2 (after start) for waveform #1 and #2 (stop/start
scenario).
2.1 (off mode) / 3.2 (after start) for waveform #3 and ISO 7637-2 Pulse
4 waveforms (initial start scenario).
Monitoring: Continuous Monitoring throughout the entire waveform.
Parameters: Troom for the Functional Test.
Troom, Tmin, and Tmax for the Durability Test.
Signal Name Pin
Qty.
a 3 DV
Durability Test required: No
Procedure:
Subject the component to the waveforms defined in Table 23 and Table 24:
Table 23: Stop/Start Crank Waveforms
Waveform 1 Waveform 2 Waveform 3

t (ms) U (V) t (ms) U (V) t (ms) U (V)
0.00 12.00 0.00 12.00 0.00 12.00
100.00 12.00 100.00 12.00 100.00 12.00
105.00 6.00 101.00 6.00 140.00 4.00
150.00 6.00 102.00 6.00 155.00 4.00
280.00 9.25 202.00 9.00 175.00 9.25
410.00 8.50 702.00 10.00 305.00 7.65
480.00 9.50 703.00 12.00 375.00 8.55
600.00 8.75 1000.00 12.00 495.00 7.88
670.00 9.55 565.00 8.60
780.00 8.75 675.00 7.88
840.00 9.76 735.00 8.78
930.00 9.00 825.00 8.10
Internal
1010.00 10.00 905.00 9.00

1030.00 9.50 925.00 8.55
1110.00 11.00 1005.00 9.90
1530.00 12.00 1425.00 12.00
1930.00 12.00 1825.00 12.00
Table 24: Requirements Levels for the Immunity to ISO 7637-2 (6/2004) Pulse 4: Crank Pulse
Pulse Severity US Note 1 Ua Note 1 t9 Note 1 t11 Note 1
I 4V 2.5 V 1s 40 ms
II 5V 3 V, 2.5 V 2s 60 ms
III 6V 4 V, 3 V, 2.5 V 5s 80 ms
IV 7V 5 V, 4 V, 3 V, 2.5 V 10 s 100 ms
t10, t8 and t7 as defined in ISO 7637-2 (6/2004). Default value for t7 shall be 15 ms. Default value for t8 shall be 50 ms. All severity
levels shall be tested.
Note 1: As defined in ISO 7637-2 (6/2004).
Table 25 provides the default number of cycles. The required number of cycles may be modified in
agreement with the GMW3172 ENV SME.
If modifications are made to the number of cycles in Table 25, provide the reason below:
The Crank Waveform Functional Test cycles are required for all components.
The Crank Waveform Durability Test cycles are required only where there is a durability concern (i.e.,
electromechanical movement due to crank) and when it is not covered by another component specific
test procedure.
10% of the Durability Test cycles shall be performed at T min and 10% of the Durability Test cycles shall
be performed at Tmax.
The cycle time between pulses shall be adequate to verify function after each functional cycle and
adequate to not create any failures due to an unrealistic pulse frequency.

a. ☒ Functional Test Cycles Only.
b. ☐ Functional and Durability Test Cycles
i. Durability Concern Reason: ______________________________________
Internal
Table 25: Crank Waveform Cycles

Note 1
Crank Waveform Crank Waveform Crank Waveform
Functional Test cycles Durability Test cycles
Waveform 1 10 20 000
ISO 7637-2 (6/2004) pulse 4 severity I Ua = 2.5 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity II Ua = 3 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity II Ua = 2.5 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity III Ua = 4 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity III Ua = 3 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity III Ua = 2.5 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity IV Ua = 5 V 10 4000
ISO 7637-2 (6/2004) pulse 4 severity IV Ua = 2.5 V 10 4000
Total 130 100 000
Note 1: The initial fall rate for all waveforms shall be adjusted to 15 V/ms for components that are not allowed to reset during
any one of the crank pulse waveforms.
1 Perform all the Durability Test Cycles first, if applicable.

2 Perform a 1-Point Functional/Parametric Check after the completion of all Durability Test Cycles
for each waveform. (total of 13 Functional Checks).
3 Perform the Functional Test Cycles.
4 After each individual Functional Test Cycle for each waveform, an abbreviated Functional Check
shall be performed. (total of 130 Functional Checks)
Describe the abbreviated Functional Check that will be performed after each individual
Functional Test Cycle: (TBD: i.e., abbreviated test to assure functionality)
Note: The time between durability test cycles shall be such that the internal voltages in the component
shall have had time to stabilize.
Note: While the waveform voltage is at 12 V, the component shall be in Operating Type 3.2. When at
12 V after the pulse, a functional test shall be performed.
Criteria: Functional Status Classification shall be A. Temporary functional deviations are only accepted
if defined by the CTS/CTRS.
Internal
6.1.18 Switched Battery Lines (Non-applicable)

Operating Type: Transition between 2.1 and 2.2.
Monitoring: Continuous Monitoring. Special attention shall be given to the behavior
of outputs, including regulated output voltages.
Parameters: Troom
Switched battery lines to apply the disturbance:
TBD TBD
Permanent battery lines to be connected per Figure 24:

TBD TBD
Procedure:
Power supply shall be provided by an automotive battery representing as well as possible the
production configuration (UB ≥ 12.0 V). Connect the component to the power supply through a
controllable switch with a switching time ≤ 200 ns. Control the switch with a signal as shown in Figure
24.
Figure 24: Switched Battery Lines Setup
Parameter values:
Internal
• TPRE = pre-energizing period = 25 µs, 50 µs, 125 µs, 500 µs, 1 ms

• TPWM = relay emulated bouncing period = 50 µs, 100 µs, 250 µs, 500 µs, 1 ms
• PWM frequency = 5 kHz, 10 kHz, 20 kHz, 50 kHz, 100 kHz
• PWM duty cycle = 2%, 50%, 80%
• TIDLE ≥ 100 ms: transient completed, component in stable state and enough time for abbreviated
functional check
• TOFF ≥ 5 s: off state time
• Number of PWM cycles ≥ 5
The switch shall conduct only unidirectional current and shall be high impedance when off.
1 Stabilize the component at Tmin.
2 Apply test pulse waveform sweeping timing and frequency parameters using listed values.
This test shall be performed in each parameter combination that leads to a minimum of 5 PWM
cycles which is defined by TPWM ≥ 5*(1/PWM frequency). This results in 15 pairs of the T PWM and
PWM frequency values. These pairs are combined with the 15 permutations of the T PRE and PWM
Duty Cycle. This results in a total of 225 different required parameter combinations, as shown in
Table 26.
Each parameter combination shall be repeated 180 times.
An abbreviated functional check (which verifies the component completed power up initialization) shall
be performed during TIDLE after each parameter combination.
Describe the Functional Check below: (TBD: i.e., abbreviated test to verify the component
completed power up initialization)
3 Repeat step (2) at Troom and Tmax.
Internal
Table 26: Switched Battery Lines Parameter Combinations

TPRE TPWM / PWM Frequency Duty Cycle Combinations
25 µs 50 µs / 100 kHz 20 %, 50 %, 80 % 3
25 µs 100 µs / 100, 50 kHz 20 %, 50 %, 80 % 6
25 µs 250 µs / 100, 50, 20 kHz 20 %, 50 %, 80 % 9
25 µs 500 µs / 100, 50, 20, 10 kHz 20 %, 50 %, 80 % 12
25 µs 1 ms / 100, 50, 20, 10, 5 kHz 20 %, 50 %, 80 % 15
50 µs 50 µs / 100 kHz 20 %, 50 %, 80 % 3
50 µs 100 µs / 100, 50 kHz 20 %, 50 %, 80 % 6
50 µs 250 µs / 100, 50, 20 kHz 20 %, 50 %, 80 % 9
50 µs 500 µs / 100, 50, 20, 10 kHz 20 %, 50 %, 80 % 12
50 µs 1ms / 100, 50, 20, 10, 5 kHz 20 %, 50 %, 80 % 15
125 µs 50 µs / 100 kHz 20 %, 50 %, 80 % 3
125 µs 100 µs / 100, 50 kHz 20 %, 50 %, 80 % 6
125 µs 250 µs / 100, 50, 20 kHz 20 %, 50 %, 80 % 9
125 µs 500 µs / 100, 50, 20, 10 kHz 20 %, 50 %, 80 % 12
125 µs 1 ms / 100, 50, 20, 10, 5 kHz 20 %, 50 %, 80 % 15
500 µs 50 µs / 100 kHz 20 %, 50 %, 80 % 3
500 µs 100 µs / 100, 50 kHz 20 %, 50 %, 80 % 6
500 µs 250 µs / 100, 50, 20 kHz 20 %, 50 %, 80 % 9
500 µs 500 µs / 100, 50, 20, 10 kHz 20 %, 50 %, 80 % 12
500 µs 1 ms / 100, 50, 20, 10, 5 kHz 20 %, 50 %, 80 % 15
1 ms 50 µs / 100 kHz 20 %, 50 %, 80 % 3
1 ms 100 µs / 100, 50 kHz 20 %, 50 %, 80 % 6
1 ms 250 µs / 100, 50, 20 kHz 20 %, 50 %, 80 % 9
1 ms 500 µs / 100, 50, 20, 10 kHz 20 %, 50 %, 80 % 12
1 ms 1 ms / 100, 50, 20, 10, 5 kHz 20 %, 50 %, 80 % 15
225
Internal
6.1.19 Battery Line Transients

Operating Type: 2.2
Parameters: Troom
Battery lines to apply the disturbance:
Permanent Switch Battery
Battery Line Line
Battery 1 (Main ☒ ☐
connector)
Ground 2 (Main ☒ ☐
connector)
Procedure:
Connect the component to the power supply through an electronically controllable switching unit with
a switching time ≤ 1 µs. The switches of the switching unit shall be high impedance when opened.
Control the switching unit with a signal as shown in Figure 25.
The switching unit consists of two switches which are controlled by the same pulse signal. Switch 2 is
synchronized with Switch 1, but is negated to it (i.e., Switch 2 closes after Switch 1 is opened
completely, and Switch 1 closes after Switch 2 is opened completely). This simulates transients on all
battery lines that occur during relay switching.
Figure 25: Battery Line Transients Setup
Internal
Parameter values:
• TPRE = pre-energizing period = 5 s (Switch 1 closed, Switch 2 opened)
• TDOWN = 100 µs (Switch 1 opened, Switch 2 closed)
• TIDLE = 5 s: transient completed, component in stable state and enough time for abbreviated
functional check (Switch 1 closed, Switch 2 opened)
• Number of cycles = 5
• Short to ground resistance including Switch 2 ≤ 100 mΩ
If the component has both Switched Battery and Permanent Battery lines the test shall be repeated in
three (3) different scenarios:
1 Apply the switching only to permanent battery lines (the switched battery lines being connected
to constant power supply).
2 Apply the switching only to switched battery lines (the permanent battery lines being connected
to constant power supply).
3 Apply the switching to permanent and switched battery lines simultaneously.
Criteria: Functional Status Classification shall be A when required by the CTS/CTRS, otherwise
Functional Status Classification C.
Functional Status Classification shall be C.
6.2 Mechanical
6.2.1 Vibration With Thermal Cycling

Applicable Standard: GMW3172, April 2018, § 9.3.1 – Car sprung mass
Operating Type: 3.2
Parameters: Tmin = -40 ± 3 °C, Tmax = +85 ± 3 °C
Duration:
27 hrs (X-Axis)
27 hrs (Y-Axis)
27 hrs (Z-Axis)
Functional Cycling: as defined in Section 3.4 of CG3043
Random Vibration Profile:
Internal
Random Vibration Table:
Reference GMW3172 item 6.8 “Vibration Transmissibility Demonstration”.

The component mounting orientation, the fixing points, and the attachment methods of the component
and other mechanical interfaces shall be reviewed and approved by the GMW3172 ENV SME prior to
starting the test.
Sample Mounting Orientation. Insert a picture/drawing/3D CAD rendering of the actual test fixture,
showing how the samples will be mounted in the x, y, and z directions prior to beginning the test. The
samples should be mounted in the vehicle mounting x, y, and z directions as defined in Section 2.3
Component Physical Description of CG3043. If the mounting angles are different than as defined in
Section 2.3 Component Physical Description of CG3043, or if multiple mounting angles are used,
describe that here.
Internal
Include a picture/drawing/3D CAD rendering of the location of each accelerometer on the test
fixture:
Refer to section 3.9 Vibration Transmissibility Demonstration for fixture description.
The data collected (i.e., the PSD for each accelerometer for each axis for each sample) from the
Vibration Transmissibility Demonstration shall be reviewed and approved by the GMW3172 ENV
SME prior to starting the test. The data shall meet the Criteria stated in Section 3.9 Vibration
Transmissibility Demonstration of CG3043.
Note: GM must approve the test set-up prior to beginning the test.
Shown below is the default Thermal Cycle Profile. Any modifications shall be included in the Test Plan.
Figure31: Thermal Cycle Profile Used During All Vibration Tests
Table 34: Thermal Cycle Profile Used During All Vibration Tests
Time Temperature
0 minutes 20º C
60 minutes Tmin
150 minutes Tmin
210 minutes 20º C
300 minutes Tmax
Internal
410 minutes Tmax

480 minutes 20º C
Note: If the required number of vibration hours is < 480 minutes per axis, then the Thermal Cycle
Profile shall be customized to match the duration of the vibration test in each axis. This shall be
documented in the GMW3172 Component Environmental Test Plan (CG3043).
Procedure:
Use the test methods according to IEC 60068-2-64, Test Fh, Vibration, broad-band random (digital
control) and guidance.
The vibration test shall have a superimposed thermal cycle as defined in the Parameters above.
Dissection – DRBTR, there shall be no evidence of structural damage to the component.
6.2.2 Mechanical Shock – Pothole

Operating Type: 3.2
Acceleration: 12 G
Shock Duration: 20 ms
Shock Shape: Half Sine
Total number of Shocks:
400 in +X Axis
400 in -X Axis
400 in +Y Axis
400 in -Y Axis
400 in +Z Axis
400 in -Z Axis
Functional Cycling: as defined in Section 3.4 of CG3043
shock duration 20 ms
shock shape half sine
Acceleration 12 G
+x-axis: 400 shocks
-x-axis: 400 shocks
+y-axis: 400 shocks
Test Duration & sequence
-y-axis: 400 shocks
+z-axis: 400 shocks
-z-axis: 400 shocks
Internal

Qty.
a 6 DV

starting the test.
Sample Mounting Orientation. Insert a picture of the actual test fixture, showing how the samples
will be mounted in the x, y, and z directions prior to beginning the test. The samples should be mounted
in the vehicle mounting x, y, and z directions as defined in Section 2.3 Component Physical Description
of CG3043. If the mounting angles are different than as defined in Section 2.3 Component Physical
Description of CG3043, or if multiple mounting angles are used, describe that here.
fixture:
The sample will be tested in vehicle position. Refer to section 3.9 Vibration Transmissibility
Demonstration for fixture details. In-vehicle orientation
The data collected from the vibration transmissibility demonstration shall be reviewed and approved
by the GMW3172 ENV SME prior to starting the test. The data shall meet the Criteria stated in Section
3.9 Vibration Transmissibility Demonstration of CG3043.
Procedure:
Use the test methods according to IEC 60068-2-27, Test Ea, Shock. Refer to Table 35 for details.
Use a half sine shock pulse.
Table 35: Mechanical Shock – Pothole
Component Location Peak Duration Number of Impacts
Unsprung Masses 100 G 11 ms 20 x 6 = 120
Sprung Masses 25 G 10 ms 400 x 6 = 2400
Internal
Sprung Masses (Passenger 12 G 20 ms 400 x 6 = 2400

Compartment, if agreed upon by
GM Engineering)
Note: The multiplier of six (6) as noted in Table 35 refers to the six Cartesian directions of possible
motion.
instructions.
Dissection – DRBTR, there shall be no evidence of structural damage to the component.
6.2.3 Mechanical Shock – Collision

Operating Type: 3.2
Acceleration: 50G
Total number of Shocks:
6 in +X Axis
6 in -X Axis
6 in +Y Axis
6 in -Y Axis
6 in +Z Axis
6 in -Z Axis

shock duration 11 ms
shock shape half sine
Acceleration 12 G
+x-axis:6 shocks
-x-axis: 6 shocks
Test Duration & Sequence
+y-axis: 6 shocks
-y-axis: 6 shocks
Functional Status Classification C
Qty.
A 6 DV
Internal
Since the Head Up Display is always installed in the same orientation, collision testing need
only be executed in the Fore/Aft and Right/Left directions of the vehicle. Up/Down is not
required.
starting the test.
fixture:
The sample will be tested in vehicle position. Refer to section 3.9 Vibration Transmissibility for
fixture details. In-vehicle orientation
Procedure:
Use the test methods according to IEC 60068-2-27, Test Ea, Shock. Refer to Table 36 for details.
Perform a 1-Point Functional/Parametric Check.
Table 36: Mechanical Shock - Collision
Description Value
Acceleration 50 G
Nominal shock duration 11 ms
Nominal shock shape half sine
Total Number of shocks 6 x 6 directions (±X, ±Y,

±Z) = 36
Internal
instructions.
Criteria: Functional Status Classification shall be A. Functional Status Classification shall be C if
permitted by the CTS/CTRS. Additionally, during the Visual Inspection and Dissection – DRBTR, there
shall be no evidence of structural damage to the component.
6.2.4 Mechanical Shock – Closure Slam – (Non-applicable)

Operating Type: 3.2
Parameters: Temperature: Ambient (i.e., Troom), -30 ºC, +80 ºC
Acceleration: TBD G
Type of Closure: TBD
Number of Shocks: TBD

starting the test.
Description of CG3043, or if multiple mounting angles are used, describe that here.)
fixture:
Procedure:
Use the test methods according to IEC 60068-2-27, Test Ea, Shock. Refer to Tables 37, 38, and 39
for details.
Table 37: Slam Based Mechanical Shock Loads
Description Value
Side Door or Liftgate < 1m in length 40 G
Internal
Side Door or Liftgate ≥ 1m in length, or Rear back door 90 G
Decklid, Endgate, or Hood Latch Ajar Switch 40 G
Touch pads or side door latches 90 G
Nominal shock duration 6 ms
Nominal shock shape half sine
Table 38: Total Quantity of Mechanical Shocks for Closures
Closure Number of Shocks
Driver and Passenger Front Door and Rear Back Door 200 000
Decklid 51 600
Rear Side Door 100 000
Liftgate 50 000
Endgate 30 000
Hood 3000
Internal
Table 39: Shock Direction and Temperature for Closure Slam Cycles
Shock Percent of Total Environment
Direction Cycles
+Z 10 % Ambient
-Z 10 % Ambient
+Z 5% Cold (-30 °C)
-Z 5% Cold (-30 °C)
+Z 5% Hot (+80 °C)
-Z 5% Hot (+80 °C)
+X 5% Ambient
-X 5% Ambient
+X 5% Cold (-30 °C)
-X 5% Cold (-30 °C)
+X 5% Hot (+80 °C)
-X 5% Hot (+80 °C)
+Y 5% Ambient
-Y 5% Ambient
+Y 5% Cold (-30 °C)
-Y 5% Cold (-30 °C)
+Y 5% Hot (+80 °C)
-Y 5% Hot (+80 °C)
Note: The test shall be performed in all six Cartesian directions, where the Z direction is perpendicular
to the plane of the closure when the slam occurs.
Notes:
1 The acceleration values for 40 G and 90 G are based on measured acceleration data on vehicles
with the same or similar closure panel architecture. This test was developed from actual measured
vehicle data of slam events. This level represents the worst case shock, as measured from a
collection of different vehicles and mounting locations.
2 The cycle counts are based on the requirements in the GM Closures SSTS specifications.
3 Refer to GMW3172 item 6.8 “Vibration Transmissibility Demonstration” for component mounting
instructions.
Criteria: Functional Status Classification shall be A. No structural damage to the component is
permitted. Additionally, during the Visual Inspection and Dissection – DRBTR, there shall be no
evidence of structural damage to the component.
Internal
6.2.5 Crush for Housing – Elbow Load (Non-applicable)

Operating Type: 1.1
Monitoring: Observe physical case deflection during loading.
Load Application Location(s). Insert a picture/drawing of where the load(s) will be applied to the
component housing. If more than one surface of the test sample is tested, then provide one
picture/drawing for each surface.)
Procedure:
The component shall be set up to allow testing on all external surfaces with a ≥ 13.0 mm diameter
area. Subject the component to an evenly distributed 110 N force about any 13.0 mm diameter area
for 1.0 s as shown in Figure 32 (this represents the force applied by a person’s elbow).
Test Plan, as negotiated between the supplier and GM. Plan to include load locations in various areas
on the housing, including on top of the highest profile parts on the circuit board and on top of parts that
have the least clearance to the housing. Also, focus on the areas of the housing that are the weakest
and will deflect the most.
Perform a 1-Point Functional/Parametric Check after all surfaces have been tested.
Figure 32: Elbow Load Applied to Component Housing.
Internal
Criteria:
1 Functional Status Classification shall be C.
2 The component shall be opened and inspected for any evidence of contact and signs of damage,
including the housing, connector, and PCB assembly, as part of the Visual Inspection and
Dissection – DRBTR. No contact between the case, PCB assembly, and other electrical parts shall
be allowed. No damage to the housing, connector, PCB assembly, other electrical parts, and
mechanical parts shall be allowed.
3 The deflection forces must not cause the cover to detach or “open up”.
6.2.6 Crush for Housing – Foot Load – (Non-applicable)

Operating Type: 1.1
Monitoring: Observe physical case deflection during loading.
Parameters: Troom
Load Application Location(s). Insert a picture of where the load(s) will be applied to the component
housing. If more than one surface of the test sample is tested, then provide one picture for each
surface.
Procedure:
Locate a 50 mm x 50 mm (or appropriately sized) rigid steel plate on all applicable surface(s) of the
component. Subject the component to an evenly distributed 890 N force applied normally to the
applicable surface(s) of the component through the steel plate for 1 minute as shown in Figure 33.
Test Plan, as negotiated between the supplier and GM. Plan to include load locations in various areas
on the housing, including on top of the highest profile parts on the circuit board and on top of parts that
have the least clearance to the housing. Also, focus on the areas of the housing that are the weakest
and will deflect the most.
Perform a 1-Point Functional/Parametric Check after the test.
Figure 33: Foot Load Applied to Applicable Surface of Component Housing
Internal
Criteria:
1 Functional Status Classification shall be C.
2 The component shall be opened and inspected for any evidence of contact and signs of damage,
including the housing, connector, and PCB assembly, as part of the Visual Inspection and
Dissection – DRBTR. No contact between the case, PCB assembly, and other electrical parts shall
be allowed. No damage to the housing, connector, PCB assembly, other electrical parts, and
mechanical parts shall be allowed.
3 The deflection forces must not cause the cover to detach or “open up”.
6.2.7 GMW3191 Connector Tests: Terminal Push-out Force
Applicable Standard: GMW3172, April 2018, § 9.3.7, GMW3191, Jun. 2012, § 4.5.2
Operating Type: 1.1
Monitoring: Per Procedure Below
Parameters:
All test samples shall be production intent. For designs where pins are closely spaced, pins or
terminals may need to be selectively removed or cut to allow space for attachment of jaws, collets or
mandrels. Refer to GMW3191 to determine the number of test samples required.
Note: This test will damage the component.
List the width of each terminal, and the connector reference designator, to be tested:
• Pull test number of samples: 5
• Push test number of samples: 5
• Number of samples for moisture conditioning tests, if applicable: NA
Procedure:
1 Measurements shall be taken in the following directions, if possible:
a Forward pushing force to dislodge the pin into the header (as if mating a female connector).
b A rearward pulling force to dislodge the terminal out of the header (as when removing a female
connector from the header).
Note: Depending on individual design, “pushing” or “pulling” may be reversed in order to get the
proper reading. It may also be appropriate to apply the loads from the back of the connector on
certain designs.
2 Secure the header body to an appropriate fixture.
3 Using the force tester, apply pressure to the male terminal pin at rate of (50 ± 10) mm/min. Record
the peak force required to displace the terminal a distance of 0.20 mm. Repeat for each pin
location.
Note: Where resultant damage to the connector housing would affect readings on adjacent
cavities, move to an undamaged pin or use a fresh connector.
4 Using new test samples as needed, reverse force direction and repeat steps 2 and 3.
5 Repeat Steps 1 thru 4 using headers that are moisture conditioned by being exposing to 95% to
98% Relative Humidity at +40 ºC for 6 hours. The push/pull tests shall be performed immediately
following removal of the headers from the temperature/humidity chamber.
Note: Step 5 is not required for designs where soldering, welding, or metal-to-metal mechanical
crimping is the primary terminal retention method.
Criteria: The force required to displace a male terminal 0.20 mm in either direction shall be at least
the values specified in the table below.
Internal
Push-out Force
Terminal Width Push Force (Engage) Pull Force (Disengage)
≤ 0.80 mm 15 N 15 N
≤ 1.5 mm 50 N 50 N
≤ 2.8 mm 60 N 60 N
≥ 2.8 mm 70 N 70 N
6.2.8 GMW3191 Connector Tests: Connector-to-Connector Engagement Force

Operating Type: 1.1
Parameters:
Test samples: Mating pairs of connectors with a full complement of terminals and wires.
Number of test samples: 10 pairs minimum
Note: This test should not damage the component.
List all Connectors to be tested: (Main connector and LVDS connector only)
Procedure: Refer to USCAR 25 (as referenced in GMW3191, June 2012)
Criteria: Refer to USCAR 25 (as referenced in GMW3191, June 2012)
6.2.9 GMW3191 Connector Tests: Locked Connector Disengagement Force

Operating Type: 1.1
Parameters:
Test samples: Minimum 10 mated connector pairs without wires and terminals.
Note: This test will damage the connector housing.
List all connectors and the terminal sizes to be tested: (Main connector and LVDS connector
only)
Procedure:
1 Make a fixture that will secure the connectors to be tested without distorting any of the parts either
before or during the test.
2 Mount the mated connector housings in the fixture with the locking feature engaged. Ensure that
all secondary locks and/or CPA’s are either removed or disengaged.
3 Pull the mated connectors apart at a rate of (50 ± 10) mm/min. For Slider/Lever Assist connectors,
pull on the slider/lever at a rate of (50 ± 10) mm/minute.
4 Record the force at which the connectors disengage.
Criteria: The force to defeat the primary locking mechanism shall exceed the disengagement force
specified in the table below.
Locked Connector Disengage Force
Terminal Size Note Force
Internal
0.5 mm to 1.2 mm 80 N
>1.2 mm 120 N
Note: For mixed terminal size connectors, use the row for the largest terminal size.
6.2.10 GMW3191 Connector Tests: Unlocked Connector Disengagement Force

Operating Type: 1.1
Parameters:
Test sample size: 10 mating connector pairs with all terminals, wires, TPAs, and seals.
On 5 of the test samples, physically remove or otherwise disable the connector locks.
Note: This test will damage the connector housing.
List all connectors to be tested: (Main connector and LVDS connector only)
Procedure:
1 Make a fixture that will secure the connectors to be tested without distorting any of the parts either
before or during the test.
2 Mount 5 of the mated connector housings in the fixture with the locking feature disengaged. Ensure
that all secondary locks and/or CPA’s are either removed or disengaged.
3 Pull the mated connectors apart at a rate of (50 ± 10) mm/min.
4 Record the force at which the connectors disengage.
5 Mount five (5) of the mated connector housings in the fixture with the locking feature engaged.
6 Measure the force required to disengage the primary locking feature.
7 Record the force required to disengage the lock.
Criteria:
1 The maximum force required to disconnect the connector pairs with the locks properly disengaged
shall be < 100 N.
2 The maximum force required to disengage the primary lock shall be < 70 N.
Note: In the case of connector housings without locking features the disengagement force shall
be 20 N min.
6.2.11 Connector Installation Abuse – Side Force

Operating Type: 1.2
Monitoring: N/A
Parameters:
Connectors to be tested: TBD
Procedure:
The component shall be set up to allow testing on the connector surface with a 13.0 mm or larger
diameter area. Subject the connector to an evenly distributed 110 N force about each 13.0 mm
diameter area for 1.0 s, as shown in Figure 34. Repeat this test for all applicable surfaces and
connectors.
Perform a 1-Point Functional/Parametric Check after all surfaces have been tested
Internal
Figure 34: Side Force Connector Setup
Load Application Description: Insert a picture/drawing of where the load(s) will be applied to the
component connector(s). If more than one surface of the test sample is tested, then provide one picture
for each surface.
Dissection – DRBTR, the connector(s), housing, and circuit board to which the connector is attached
shall not show any damage.
6.2.12 Connector Installation Abuse – Foot Load – N/A, module not exposed to
foot loads during assembly (Non-applicable)
Operating Type: 1.2
Monitoring: N/A
Parameters: Connectors to be tested: TBD
Procedure:
A simulated foot load of 890 N of a distributed force shall be applied normally through a (50 x 50) mm
(or appropriately sized) rigid steel plate for 1 minute to the connector and connector header as shown
in Figure 35. This plate represents the sole of a person’s shoe. Repeat this test for all applicable
directions and connectors.
Perform a 1-Point Functional/Parametric Check after all surfaces have been tested.
Figure 35: Foot Load Connector Setup
Internal
Load Application Description. Insert a picture/drawing of the test fixture that shows how the load will
be applied.
Dissection – DRBTR, the connector(s), housing, and circuit board to which the connector is attached
shall not show any damage.
6.2.13 Free Fall

Operating Type: 1.1
Monitoring: N/A
Parameters: N/A
Procedure:
1 Perform the test using the following parameters:
• Number of test samples: 3
• Drops per test sample: 2
• Troom
• Drop Height: 1 m
• Drop Surface: Concrete
2 Choose the X-axis for the first drop. Following the drop, perform a 1-Point Functional/Parametric
Check.
3 Repeat the drop with the same axis, but in the opposite direction. Following the drop, perform a 1-
Point Functional/Parametric Check.
4 Repeat steps (2) and (3) with the second sample in the Y-axis.
5 Repeat steps (2) and (3) with the third sample in the Z-axis.
6 Document all visual damage by pictures and add them to the test report.
Note: If significant damage occurs in the first of a drop in a given axis, then a new sample needs to be
used for the drop in the opposite direction of that axis
Internal
Criteria: Minor visible external damage to the component is permitted as long as it does not affect the
performance, the attachment interface to the vehicle, or the surfaces visible to the customer. The
component shall pass the 5-Point Functional/Parametric Check at the end of the test. Functional Status
Classification shall be C. Additionally, during the Visual Inspection and Dissection – DRBTR, there
shall be no internal damage.
If there is significant visible external damage to the component as judged by the GM Component
Validation Engineer, then the component does not have to meet the performance and functional
requirements.
The 1-Point Functional/Parametric Check shall still be executed for engineering judgment. Functional
Status Classification shall be E. Additionally, during the Visual Inspection and Dissection – DRBTR,
any internal damage shall be reported.
6.2.14 Fretting Corrosion Degradation

Operating Type: N/A
Monitoring: N/A
Parameters: Connection(s) to be measured: PGU (LED PCB) to PCB connection,
ambient light to PCB, motor to PCB
Functional Status Classification N/A

Qty.
PGU 18 3 test samples, 6 terminals
terms
AMB 12 3 test samples, 4 terminals
Light terms
motor 18 3 test samples, 6 terminals
terms
Motor to main PCB
Internal
PGU (LED PCB) to main PCB
Procedure:
Note: All Dry Circuit Resistance measurements shall be taken with the samples stabilized at T room for
2h minimum.
1 Prepare a minimum of 10 mated contacts. The contacts shall be isolated from the internal circuitry
to allow the measurement of the contact resistance without any influence from the internal circuitry.
2 Measure the contact resistance per the Dry Circuit Resistance measurement test procedure as
specified in GMW3191.
3 Subject the components to 4 h of random vibration using the Random Vibration Test according to
the mounting location of this component. The default axis of vibration is parallel to the direction of
the contact.
5 Subject the components to the environmental conditions stated in the Humid Heat Constant test
(HHCO) for a duration of 1 day.
7 Subject the components to 4 h of random vibration using the Random Vibration Test according to
the mounting location of this component. The default axis of vibration is parallel to the direction of
the contact.
Internal
Criteria:
• Functional Status Classification is not applicable to this test.
• The resistance measured shall always meet the value as required by GMW3191 Dry Circuit
Resistance Acceptance Criteria.
• The resistance measured in steps (4), (6), and (8) shall not increase more than 2 times the original
resistive value measured in step (2).
Explanation for test execution:
The contacts are connected with short lines according to the picture scheme below. The contacts from
the connectors shall be disconnected from any connections on the PCB. The resistance of each contact
pair RCAX (resistance ambient-light PCB connector), RCMX (resistance motor unit PCB connector) and
RCPX (resistance PGU PCB connector) will be measured each individually.
The resistance of each connection pair, including wires to allow contacting outside the housing, is
measured in advance and taken as initial reference value. During the following resistance
measurements, the measured resistance shall not increase more than 15mOhm compared to the
reference value.
6.3 Climatic
6.3.1 High Temperature Degradation

Operating Type: 2.1 during testing at TRPS; 2.1/3.2 during all remaining portions of the
test.
Parameters: TRPS = +95 ± 3 °C
TPH = N/A
Tmax = +85 ± 3 °C
Unom, where Unom is UB = 12.0 ± 0.1 V for Operating Type 2.1,
and UA = 14.0 ± 0.1 V for Operating Type 3.2
Umin = 9.0 ± 0.1 V
Umax = 16.0 ± 0.1 V
Test Temperature Tmax RPS + 95 ± 3 °C (1 h)
Test Voltage Unom +12 ± 0.1 V @ OT 2.1 12+ 14 ± 0.1 V @ OT 3.2
Test Voltage Umin + 9 ± 0.1 V
Testvoltage Umax + 16 ± 0.1 V
Supply Voltage Profile
Supply Voltage Percent of Operational Cycles
Unom 80% (400 h)
Umax 10% (50 h)
Umin 10% (50 h)
Test Duration 500 hours
Internal
Operational Mode Profile

Power Moding The component shall be transitioned to OFF long enough to ensure
Sleep/OFF mode then return back to ON. As a default, this shall occur
once every 6 hours.
Qty.
a 6 DV
Procedure:
The test duration of components that are Climatic coded as A, B, C, K, or L shall be 2000 h. All others
shall be tested to 500 h. This product has a climate code of “D”, test duration = 500 h.
Note: Components required to be exposed to 2000 h of high temperature reflects the longer operational
time at high temperature as opposed to other areas of the vehicle.
Note: For components that contain internal fluids, grease, oil, coolant, etc., the component shall be
mounted in vehicle orientation during the test.
Sample Mounting Orientation. Insert a description of the sample orientation. The samples should be
mounted in the vehicle orientation as defined in Section 2.3 Component Physical Description of
CG3043. If the mounting angle is different than as defined in Section 2.3 Component Physical
In-vehicle orientation
Note: The mounting angle for this test shall be in vehicle orientation if the component has viscous
materials inside for lubrication or some other reason (e.g., liquids, coolants, greases, oils, etc). The
mounting angle for this test shall be in vehicle orientation if there are concerns with self-heating and
component cooling capability.
Use the test methods according to ISO 16750-4, High-temperature tests, Operation, with the following
exceptions:
1 Components that are Temperature coded as A, B, C, or D shall be tested to an elevated
temperature level of +95 °C (TRPS) for one additional hour at the beginning of the test, in Operating
Type 2.1. This product has a climate code of “D”
2 The duration of the test, as indicated in the Climatic Load Code (i.e., 500 h or 2000 h), at Tmax shall
be performed with the operating voltages in the following order: U max for 10%, Umin for 10%, and
Unom for 80% of the total time.
Internal
Test operating voltage during the remaining portions of the test, using Operating Type 2.1/3.2:
• Umax = 16.0 ± 0.1 V for 10% (50 hrs)
• Umin = 9.0 ± 0.1 V for 10% (50 hrs)
• Unom (where Unom is UB = 12.0 ± 0.1 V for Operating Type 2.1, and UA = 14.0 ± 0.1 V for
Operating Type 3.2) for 80% (400 hrs)
• Components that are Temperature coded as F or H shall be tested to an elevated post heating
temperature level (TPH) for 5% of the entire test duration, applied during the beginning of the
Unom portion of the test.
• Functional Cycling, as defined in the item 3.4 of the GMW3172 Component Environmental
Test Plan (CG3043), shall be applied during all voltage levels.
• The component shall be transitioned to Sleep/OFF mode (Operating Type 2.1) long enough to
ensure Sleep/OFF mode, then return back to Operating Type 3.2. As a default, this shall occur
once every 4 h.
6.3.2 Thermal Shock Air-To-Air (TS)

Operating Type: 1.1
Monitoring: N/A
Parameters:
• Number of Thermal Shock Cycles: 339
• Temperature Range: Tmin = -40 ± 3 °C to TBD (Tmax = +85 ± 3 °C + self heating, as
determined according to the Thermal Cycle Profile Development section in GMW3172)
Storage time at Tmax 45 min
Storage time at Tmin 45 min
Transition Time ≤ 30 s
Number of cycles 339
Qty.
a 18 DV
Procedure:
Use the test methods according to ISO 16750-4, Temperature cycling – Rapid change of temperature
with specified transition duration, with the following requirements:
• Manual transfer methods between chambers shall not be used.
• The thermal test profiles shall be determined according to the Thermal Cycle Profile
Development section in GMW3172. This information shall be approved by GM prior to
starting the test.
Internal
The Thermal Shock Temperature Cycle Profile is shown below in Figure 35. The actual
values of Tmin and Tmax TS and stabilization times are determined from the Temperature
Code and the Thermal Cycle Profile Development procedure.
1 Perform the required number of Thermal Shock cycles as specified in the Parameters.
Note: Optionally, since Thermal Shock Air-to-Air is not monitored, it is acceptable to periodically
stop the test to verify functionality.
• Test Plan specific information: If periodic monitoring is applicable, this shall occur
every: N/A – period monitoring not applicable
Note: To check for specific failure mechanisms of a material other than Lead-Free solder (e.g.,
copper windings, aluminum wire bonds, etc.) that has a higher accelerated fatigue rate (i.e., higher
S-N slope) it is acceptable to perform a 5-Point Functional/Parametric Check at the point when the
required reliability has been demonstrated for that material.
• Test Plan specific item: If applicable per the above note, a 5-Point Functional/Parametric
Check shall occur after TBD cycles of the Thermal Shock cycles have been performed.
This is based on the S-N slope = TBD which is used to evaluate (1 point
Functional/Parametric test will be done at the conclusion of the test leg.
• Note: If a component needs to be permanently removed during the test, it should be replaced with
a dummy component in order to maintain the same thermal characteristics in the chamber.
2 After the completion of the Thermal Shock Air-to-Air cycles, a 1-Point Functional/Parametric Check
is required unless the GMW3172 ENV SME requires a 5-Point Functional/Parametric Check based
on the component complexity, history, etc.
Select test for Functional/Parametric Check

Step 2
Applicable 1-Point Functional/Parametric Check is
required
☐ 5-Point Functional/Parametric Check is
required
Figure 35: Thermal Shock Profile (THIS IS ONLY AN EXAMPLE)
Internal
6.3.3 Power Temperature Cycle (PTC)

Operating Type: 1.2/3.1/3.2 (refer to Table 41, Power Moding)
Parameters:
• Number of PTC cycles: 339
• Temperature Range: Tmin = -40 ± 3 °C to Tmax = +85 ± 3 °C
• Test operating voltage:
• Unom for 80% (271 cycles), where Unom is UB = 12.0 ± 0.1 V for Oper. Type 2.1,
and UA = 14.0 ± 0.1 V for Oper. Type 3.2
• Umin for 10% (34 cycles)
• Umax for 10% (34 cycles)
• Functional Cycling: as defined in Section 3.4 of CG3043
Test Voltage Unom + 12.0 ± 0.1 V @ OT 2.1 + 14.0 ± 0.1 V @ OT 3.2

Test Voltage Vmax 16.0 ± 0.1 V
Test Voltage Vmin 9.0 ± 0.1 V
Test Temperature Tmin -40°C
Test Temperature Tmax +85°C
Temperature Ramp Rate 6K
Internal
Thermal Cycle Count 399

Test Cycle Duration 132 min
Total Test Duration 746 h
Temperature Cycle Profile
Temperature Storage Times
Level Thermal Stabilization Dwell Time Total
Tmin 30 min 15 min 45 min
Tmax 30 min 15 min 45 min
Power Moding Power OFF starting with the negative thermal transition
Once Tmin + 3°C is reached, by default, begin cycling ON 100 s and OFF 20
s until the next negative thermal transition begins
Supply Voltage Profile
Supply Voltage Percent of Operational Cycles
Unom 80 %
Umax 10 %
Umin 10 %
Qty.
a 18 DV
Sample Mounting Orientation. Insert a description of the sample orientation. The samples should
be mounted in the vehicle orientation as defined in Section 2.3 Component Physical Description of
In-vehicle orientation (picture)
Note: The mounting angle for this test shall be in vehicle orientation if the component has viscous
materials inside for lubrication or some other reason (e.g., liquids, coolants, greases, oils, etc). The
mounting angle for this test shall be in vehicle orientation if there are concerns with self-heating and
component cooling capability.
Procedure:
Use the test methods according to IEC 60068-2-14, Test Nb, with the parameters from Table 41, along
with the following requirements:
• For components that contain internal fluids, grease, oil, coolant, etc. the component shall be
mounted in vehicle orientation during the PTC test.
• The thermal test profiles shall be determined according to the Thermal Cycle Profile Development
section in GMW3172. This information shall be approved by GM prior to starting the test.
The PTC Temperature Cycle Profile is shown below in Figure 37. The actual values of
Tmin and Tmax are determined from the Temperature Code.
Internal
• The electrical/mechanical loading shall reflect the normal usage in the vehicle application.
Perform the required number of PTC cycles per Table 40 according to the Code Letter for Temperature
using either a sample size of 18 or 24. Refer to Figure 37 regarding the definition of a Power
Temperature cycle.
Note: If a component needs to be permanently removed during the test, it should be replaced with a
dummy component in order to maintain the same thermal characteristics in the chamber.
Figure 37: Power Temperature Cycle Profile
Internal
Table 41: Power Temperature Cycle Requirements

Description Value
Chamber Temperature Tmin = -40 ± 3 °C to Tmax = +85 ± 3 °C
Range
Chamber Temperature (1 to 15) K/minute
Change Rate
Power Moding Power OFF (Operating Type 1.2) starting with the negative thermal
transition.
At the beginning of the final minute of the 15-minute dwell at Tmin, by
default, begin cycling ON (Operating Type 3.2) for 100 s and Sleep/OFF
(Operating Type 3.1) for 20 s until the next negative thermal transition
begins.
Functional Cycling Functional Cycling, as defined in 3.4 of the GMW3172 Component
Environmental Test Plan (CG3043), shall be applied during all voltage
levels.
Supply Voltage The test operating voltage shall be performed in the following order: Umax
for 10%, Unom for 80%, and Umin for 10% of the cycles.
6.3.4 Thermal Shock/Water Splash – N/A per Climatic Code Letter “D” (Non-
applicable)
Parameters: Tmax
Time at Tmax: 1h or until component temperature is stabilized.
Number of Cycles: 100
Transition duration: < 20 s
Water Temp: 0 to 4 °C de-ionized water
Water Flow/Splash Duration: (3 L to 4 L) / 3 s
Procedure:
Use the test methods according to ISO 16750-4, Ice water shock test, using the Splash water test
method.
The water solution shall include a soluble Ultraviolet dye that can be detected with a UVA lamp (black
light).
Note: The component shall be mounted in vehicle orientation and receive the splash in the same
direction(s) as seen in the vehicle.
Sample Mounting Orientation: Insert a picture/drawing of the sample orientation. e.g., refer to the
vehicle orientation as defined in Section 2.3 Component Physical Description of CG3043. Or specify
Internal
the mounting orientation if different than defined in Section 2.3 Component Physical Description of
CG3043, or if multiple mounting angles are used. Indicate the direction(s) of the water splash.
Criteria: Functional Status Classification shall be A. The component shall be opened and inspected
for signs of water ingress as a part of the Visual Inspection and Dissection – DRBTR. An internal
inspection using a UV light shall be performed. No water ingress shall be permitted inside the
component and the connector.
6.3.5 Humid Heat Cyclic (HHC)

Operating Type:
• 2.1/3.2.
• For Power Mode Cycle, the component shall be cycled between ON (Operating Type 3.2,
operated in such a manner to minimize power dissipation) for (60 minutes) and Sleep/OFF
(Operating Type 2.1) for (60 minutes) to avoid local drying. As a default, the component shall be
cycled between ON for 1 h and Sleep/OFF for 1 h continuously during the 10-day test.
• A supply voltage of UA shall be used during Operating Type 3.2 and a supply voltage of U B during
Operating Type 2.1
Monitoring: During the ON state, Continuous Monitoring is required. During the Sleep/OFF state,
continuous parasitic current is monitored and recorded over the 10-day test period to detect
malfunctions during the test.
Parameters:
• Duration: Five 2-day cycles (total 10 days)
• Temperature: -10 °C to +65 °C
• Humidity: The humidity during high temperature is (93 ± 3) % and drops to 80 % during the
transition from +65 °C to +25 °C. At +25 °C, the humidity shall increase to (93 ± 3) %. The
humidity is uncontrolled when < +25 °C.
• Functional Cycling (during Operating Type 3.2): as defined in Section 3.4 of CG3043
Temperature Cycle Profile
Minimum Chamber Temperature - 10 ± 3 °C
Maximum Chamber Temperature + 65 ± 3 °C
Relative Humidity 93 ± 3%
Test Voltage Unom + 12.0 ± 0.1 V @ OT 2.1 + 14.0 ± 0.1 V OT 3.2
Test Cycle Count 5
Test Cycle Duration 2
Total Test Duration 240 hours / 10 days
Power Moding Cycled between ON (operated in such a manner to minimize power
dissipation) and OFF to avoid local drying. As a default, the component
shall be cycled between ON for 1 h and OFF for 1 h continuously during
the test.
Internal

Qty.
a 7 DV
Procedure:
Use test equipment according to IEC 60068-2-38, Test Z/AD, Composite temperature/ humidity cyclic
test, and then perform the test as stated in Table 42.
Sample Mounting Orientation: Insert a picture/drawing of the sample orientation. e.g., refer to the
CG3043, or if multiple mounting angles are used.
Note: This profile is not intended to cause water drops to form or fall onto the circuit board. If this
occurs, an adjustment in the profile according to IEC 60068-2-38 to slow down the ramp rate is allowed.
This will result in shorter dwell times, in accordance to the IEC, in order to keep the overall 48 h cycle
time.
Table 42: Cyclic Humidity Requirements
Description Value
High Temperature +65 °C ± 2 °C
Middle Temperature +25 °C ± 2 °C
Low Temperature -10 ºC ± 2 °C
Duration 10 d
Figure 38 and Table 43 show a two-day cycle that shall be repeated a total of five times (2 x 5 = 10 d).
The humidity shall be maintained at (93 ± 3)% except during the following conditions:
• during the transition from (+65 to +25) °C, the humidity shall be reduced to 80%,
• when the temperature cycle drops below +25 °C, the humidity is uncontrolled.
Internal
Figure 38: Cyclic Humidity Profile
Internal
Table 43: Cyclic Humidity Profile

Time Temperature
0h +25 °C
1.5 h +65 °C
5.5 h +65 °C
7h +25 °C
8h +25 °C
9.5 h +65 °C
13.5 h +65 °C
15 h +25 °C
24 h +25 °C
25.5 h +65 °C
29.5 h +65 °C
31 h +25 °C
32 h +25 °C
33.5 h +65 °C
37.5 h +65 °C
39 h +25 °C
41.5 h +25 °C
42 h -10 °C
45 h -10 °C
46.5 h +25 °C
48 h +25 °C
Criteria: Functional Status Classification shall be A. The parasitic current shall not exceed the required
limit or increase by > 50% from the beginning of this test. Additionally, during the Visual Inspection and
Dissection – DRBTR, there shall be no evidence of electromigration or dendritic growth.
6.3.6 Humid Heat Constant (HHCO)

Operating Type:
• 2.1/3.2.
• For Power Mode Cycle, the component shall be cycled between ON (Operating Type 3.2,
operated in such a manner to minimize power dissipation) for (60 minutes) and Sleep/OFF
(Operating Type 2.1) for (60 minutes) to avoid local drying. As a default, the component shall
be cycled between ON for 1 h and Sleep/OFF for 1 h continuously during the 10-day test.
Internal
• A supply voltage of UA shall be used during Operating Type 3.2 and a supply voltage of U B
during Operating Type 2.1.
Monitoring: During the ON state, Continuous Monitoring is required. During the Sleep/OFF state,
continuous parasitic current is monitored and recorded over the 10-day test period to detect
malfunctions during the test.
Parameters:
• Temperature, Duration, and Relative Humidity as shown in procedure.
• Functional Cycling (during Operating Type 3.2): as defined in Section 3.4 of CG3043
Chamber Temperature + 65 ± 3 °C
Relative Humidity 90 ± 5%
Total Test Duration 240 hours / 10 days
Power Moding Cycled between ON (operated in such a manner to minimize power
dissipation) and OFF to avoid local drying. As a default, the component
shall be cycled between ON for 1 h and Sleep/OFF for 1 h continuously
during the test.
Qty.
a 7 DV
Procedure:
Use test equipment according to IEC 60068-2-78, Damp heat, steady state, and then perform the test
as stated in Table 44.
Table 44: Constant Humidity Requirements
Description Value
Temperature (+65 ± 3) °C
Duration 10 d
Relative Humidity (90 ± 5)%
Note: The component shall be mounted in vehicle orientation to simulate the condensation drip path.
Internal
Sample Mounting Orientation. Insert a picture/drawing of the sample orientation, e.g., refer to the
CG3043, or if multiple mounting angles are used.
Criteria: Functional Status Classification shall be A. The parasitic current shall not exceed the required
limit or increase by > 50-% from the beginning of this test. Additionally, during the Visual Inspection
and Dissection – DRBTR, there shall be no evidence of electromigration or dendritic growth.
6.3.7 Salt Mist

Operating Type: 1.2/2.1/3.2
Monitoring: Continuous Monitoring during the time that the component is
energized.
Parameters: Reference Table 45 for applicability and test parameters
Component type = Non-sealed components without vent openings
Is the Operating Test applicable? Yes
• Duration: 2 hours
• Mist level: 0.25 - 0.5 ml/h on 80 cm2
Is the Material Degradation Test applicable? Yes

• Number of Cycles: 3
• Operating Type during Cycle: 1.2
• Cycle = 2 hrs Salt, 22 hrs Humidity
• Mist level: 1.0 - 2.0 ml/h on 80 cm2
Test Temperature + 35 ± 3 °C
Test Solution 5% saline
pH Level 6.5 - 7.2
Test profile
Test name Operating test Material Degradation
Mist Level 0.25 - 0.5 ml/h on 80 cm² 1.0 - 2.0 ml/h on 80 cm²
Cycle Time 2 h spray 2 h spray, 22 h Humidity
Cycle Count 1 3
Total Test Duration 2 hours 72 hours
Functional Status Classification A during operating test, C for material degradation
Internal

Qty.
a 4 DV
Procedure:
For the Operating Test and Material Degradation Test, use the test setup and test methods according
to IEC 60068-2-52, Test Kb, Salt mist, cyclic. Use applicable tests, durations, and number of cycles as
defined in Table 45. Use the salt mist levels as defined for each test as follows. Perform tests with
enclosure simulating vehicle mounting.
Sample Mounting Orientation. Insert a picture/drawing of the sample orientation with enclosure (if
used), e.g., refer to the vehicle orientation as defined in Section 2.3 Component Physical Description
of CG3043. Or specify the mounting orientation if different than defined in Section 2.3 Component
Physical Description of CG3043, or if multiple mounting angles are used.
In-vehicle orientation (Picture)
Table 45: Salt Mist Test Requirements
Component Type Operating Test Material Degradation Test
Non-sealed components Operating Type 3.2 (with Not Applicable

with vent openings internal fans turned off)
(IP Water Code 2)
1 cycle. Each cycle
equals 2 h salt.
(FSC A)
Non-sealed components Operating Type 3.2 Operating Type 1.2

without vent openings
1 cycle. Each cycle 3 cycles. Each cycle equals
(IP Water Code 2)
equals 2 h salt. 2 h salt, 22 h humidity.
(FSC A) (FSC C)
Non-sealed components Operating Type 3.2 Operating Type 2.1

without vent openings
1 cycle. Each cycle 6 cycles. Each cycle equals
(IP Water Code 3 or 4K)
equals 2 h salt. 8 h salt, 16 h humidity.
(FSC A) (FSC C)
Sealed components with Not applicable Operating Type 3.2

or without a pressure
Internal
exchange membrane 10 cycles. Each cycle equals

(IP Water Code 8) 8 h salt, 16 h humidity.
(FSC A)
Operating Test:
Use a mist level of (0.25 to 0.5) ml/h on 80 cm2.
Note: This test is a measure of the degradation of function resulting from a salty air environment with
expectations of proper function of the component.
Material Degradation Test:
Use a mist level of (1.0 to 2.0) ml/h on 80 cm2.
For FSC C, perform a 1-Point Functional Check following the Material Degradation Test.
Final Inspection (after completion of all tests):
Document the appearance of the component following the test. Perform a detailed inspection of
damaged interior electronics. Inspect for loss of parent metal that may lead to loss of internal or external
electrical connections. Also inspect for concentrated pitting corrosion. Inspect the integrity of all seals.
Criteria: Functional Status Classification shall be A or C, according to Table 45. Additionally, during
the Visual Inspection and Dissection – DRBTR, there shall be no liquid ingress and/or internal
dendrites.
Based on the level of corrosion, GM Engineering will decide as to the necessity of corrective action.
Internal
6.3.8 Salt Spray (Non-applicable)

Operating Type: 1.2
Monitoring: N/A
Parameters: Test Duration: TBD
Sample Mounting Orientation. Insert a picture/drawing of the sample orientation with enclosure (if
used), e.g., refer to the vehicle orientation as defined in Section 2.3 Component Physical Description
of CG3043. Or specify the mounting orientation if different than defined in Section 2.3 Component
Physical Description of CG3043, or if multiple mounting angles are used.)
Note: The samples shall be oriented in the vehicle orientation to test for the effects of moisture run-off,
accumulation on the circuit board, as well as spray direction as seen in the vehicle.
Procedure:
1 A minimum of six (6)* units shall be subjected to a 100% salt spray cycling test to emulate the
vehicle mission.
2 The salt spray test shall comply with GMW3286 only for the salt solution and monitoring during the
test.
3 A salt spray chamber of sufficient size is used which will permit test samples, each to be positioned
at a distance of (40 to 60) cm (11.8 to 23.6) inches mounted away from directed salt-spray nozzles.
4 The test sample shall have production intent harness connectors installed, properly assembled
with the correct wire sizes, terminals, and seals.
5 The wire harness shall contain no splices, and shall exit the chamber such that the wire ends are
protected from the salt spray.
6 The wire harness shall allow functional testing after completion of this corrosion test to verify
electrical performance (Operating Type 1.2/3.2) without disturbing the connection system interface.
7 Test samples shall be oriented in the chamber in front of adequate number of spray nozzles to wet
the complete area of the test samples.
8 Minimum of at least two samples shall be oriented in the major vehicle orientation (upward/
downward) and one with the connectors facing the nozzles which will spray a salt solution directly
at the samples.
9 The salt water solution shall be five (5) parts NaCl (±1 part) by weight in 95 parts de-ionized water.
The salt water solution measured during the test shall have a pH range of 6.5 - 7.2.
10 One cycle of 24 h test consists of the following:
a The unpowered test samples (Operating Type 1.2) are heated in the test chamber for 1 h
to 70° C (±5° C).
b With the heat turned OFF, the salt spray solution at room temperature is sprayed for 1 h.
c Allow units to dry 1 h in 25° C (±5° C) still air.
d Repeat steps (a), (b) and (c).
e Repeat steps (a) and (b). Then allow the units to dry in room temperature still air for 16 h.
For components with appearance requirements, repeat the cycle and inspect the components to verify
compliance to appearance section of the CTS/CTRS.
Repeat the cycle to complete the cycles as mentioned in Table 46.
11 After the completion of the Salt Spray cycles, a 1-Point Functional/Parametric Check is required
unless the GMW3172 ENV SME requires a 5-Point Functional/Parametric Check based on the
component complexity, history, etc.
Internal
Select test for Functional/Parametric Check

Step 11
required
required
Table 46: Salt Spray Test Duration Requirements based on Location

Location Test Duration Test for
Appearance
Wet side of Door Interior 20 d = 480 h Not applicable
(IP Water Code 3 or 6K)
Non-Interior component with indirect exposure 30 d = 720 h Between day 4 and
to salt spray (IP Water code 6K or 8 or 9K) day 5
Non-Interior component with direct exposure to 40 d = 960 h Between day 4 and
salt spray ( IP Water code 6K or 8K or 9K) day 5
Criteria: Functional Status Classification shall be C

All inspections shall be performed and documented, including photographs during the Visual Inspection
and Dissection – DRBTR. Inspect for loss of parent metal that may lead to loss of internal or external
electrical connections. Also inspect for concentrated pitting corrosion. Inspect the integrity of all seals.
There shall be no liquid ingress and/or internal dendrites. Based on the level of corrosion which impacts
appearance, external mounting or electrical connections, GM Engineering will decide as to the
necessity of corrective action.
Two (2) units may be removed at 50% and 75% of the total cycles to verify performance. There shall
be no evidence of salt water beyond the sealing surfaces at the end of the test. There shall be no
electrical performance degradation at the end of test.
Note: When units are planned to be removed at 50% and 75%, more than six minimum units need to
be in the test procedure.
6.3.9 Minimum Non-Operating Temperature

Monitoring: Continuous Monitoring during Operating Type 3.2.
Parameters: Unom (where Unom is UB = 12.0 ± 0.1 V for Operating Type 2.1,
and UA = 14.0 ± 0.1 V for Operating Type 3.2),
Tmin = -40 ± 3 °C, Tmin-NonOp = -55 +2/-0°C
Procedure:
1 Soak the components at TMIN for one hour at Operating Type 2.1, then transition to Operating Type
3.2 at Unom long enough to confirm FSC A. Transition back to Operating Type 2.1.
Internal
2 Cycle the test chamber between Tmin and Minimum Non-Operating Temperature (Tmin-NonOp) 15
times as shown in Figure 39. The components shall be maintained at Operating Type 2.1 during
this time. FSC is not applicable.
3 On the 15th cycle, after one hour of Operating Type 2.1 at T min, transition to Operating Type 3.2 at
Unom long enough to confirm FSC A.
Figure 39: Minimum Non-Operating Temperature Profile
Criteria: Functional Status Classification shall be A during Operating Type 3.2 .
6.4 Enclosure
6.4.1 Dust
Operating Type: 1.2
Monitoring: N/A
Parameters: Dust Protection Code: IP5
Test Duration: 8 hrs

Dust Type ISO 12103-1 Arizona test dust, A2 fine test dust
Dust Concentration 2 kg/m3 of chamber volume
Total Test Duration 8 hours
Qty.
A 3 DV
Internal
Procedure:
1 Use the test methods according to ISO 20653, Protection of electrical equipment against foreign
objects, water and access. This test shall be performed using the dust in ISO 12103-1, Arizona test
dust, A2 fine test dust. The test duration shall be 8 h. For some electromechanical components, the
duration may be extended beyond 8 h where appropriate. The component can be tested in an
enclosure simulating vehicle mounting.
2 Perform the 1-Point Functional/Parametric Check.
Criteria: Functional Status Classification shall be C. The component shall be opened and inspected
as a part of the Visual Inspection and Dissection – DRBTR. For dust rating of 6K, no dust ingress is
allowed. For a dust rating of 5K, the quantity and location of dust shall be evaluated for potential risk.
6.4.2 Water
Operating Type: 3.2
Parameters: Water Protection Code: IPX2
Temperature of the DUT +23 ± 5° C

Water Temperature +23 ± 5° C
Water Flow Rate 3.0 – 3.5 mm/min
Distance to Drip Box 200 mm
Test profile
Test 15° Tilt about the In the direction Test Duration
Position of the
1 + X axis
Y - Axis
2 - X axis
2.5 min
3 + Y axis
X - Axis
4 - Y axis
Qty.
a 3 DV
Sample Mounting Orientation. Insert a picture/drawing of the sample orientation(s) with enclosure (if
used) and direction of water application, e.g., refer to the vehicle orientation as defined in Section 2.3
Component Physical Description of CG3043. Or specify the mounting orientation if different than
defined in Section 2.3 Component Physical Description of CG3043, or if multiple mounting angles are
used.
In-vehicle orientation
Internal
Note: The samples shall be oriented in the vehicle orientation to test for the effects of moisture run-
off, accumulation on the circuit board, as well as spray direction as seen in the vehicle.
Procedure:
Use the test methods according to ISO 20653, Protection of electrical equipment against foreign
objects, water and access.
The water solution shall include a soluble Ultraviolet dye that can be detected with a UVA lamp (black
light).
The component can be tested in an enclosure simulating vehicle mounting/orientation.
Following the procedure, a detailed dissection and inspection of the component shall be performed.
for signs of water ingress as a part of the Visual Inspection and Dissecption – DRBTR. An internal
inspection using a UV light shall be performed.
For non-sealed components, water shall never reach electric/electronic parts or connector terminals.
There shall be no drops of water on the circuit board. Additionally, water shall not accumulate within
the component housing and reach the electric/electronic parts or connector terminals.
For sealed components, no water shall pass any seal. Component is not sealed
6.4.3 Seal (Non-applicable)

Operating Type: 3.2
Parameters: Tmax
Component Test Setup to be used:
Without Ground Wires or Splices With a Ground Wire With a Splice
☐ ☐ ☐
Procedure:
1 Prepare a test solution consisting of 5 % saline in 0 °C water. The water solution shall include a
soluble Ultraviolet dye that can be detected with a UVA lamp (black light).
2 Place the component in a temperature chamber at Tmax for at least 30 minutes or long enough to
ensure that Tmax has been reached within the component.
3 Remove the component from the temperature chamber.
Internal
4 Immediately immerse the component in the test solution such that the top of the component is at a
depth of (76 ± 5.0) mm. See Figure 40 for details.
5 After the component has been submerged for 30 minutes, remove the component from the test
solution.
6 Repeat steps (2) to (5) until 15 submerging cycles have occurred.
Figure 40: Seal Test Setup for Components without Ground Wires or Splices
For a component that is connected to a vehicle wiring harness containing a ground wire terminal or
any wiring splice that is exposed to water, the following test shall be performed:
1 Reconfigure the test set-up as shown in Figure 41 or Figure 42 with the production-intent ground
connection or splice submerged to a depth of (76 ± 5.0) mm.
2 Use new component(s).
3 Repeat steps (1) to (6) from the previous test.
Figure 41: Seal Test Setup for Components with a Ground Wire
Internal
Figure 42: Seal Test Setup for Components with a Splice
for signs of water ingress as a part of the Visual Inspection and Dissection – DRBTR. An internal
inspection using an UV light shall be performed. No water ingress shall be permitted inside the
component and the connector.
6.4.4 Leakage Check (Non-applicable)

Operating Type: 1.2
Internal
Monitoring: N/A
Parameters: Troom
Leakage rate limit: TBD
Procedure:
Select Component Type Test Method
method
☐ For a component that can be pressurized Test Method 1: The sample shall be
without damaging the component (e.g., pressurized [default value 48 kPa (7 psi)
has a vented header connector, etc.) and above the ambient pressure] at room
has a leak rate defined as zero. temperature and submerged under room
temperature water for a minimum of 5
minutes total while examining every face for
bubble flow.
☐ For a component that cannot be Test Method 2: This test shall be conducted
pressurized without damaging the with a minimum pressure differential of 48
component and/or has a non-zero leak kPa (7psi). TBD: provide details for
rate. alternate method to determine the actual
rate (e.g., Air Vacuum Meter Method,
Vacuum Chamber Method, etc.).
Test Method 1: Use this Test Method for a component that can be pressurized without damaging the
component (e.g., has a vented header connector, etc.) and has a leak rate defined as zero. The sample
shall be pressurized (default value 48 kPa (7 psi) above the ambient pressure) at room temperature
and submerged under room temperature water for a minimum of 5 minutes total while examining every
face for bubble flow.
Test Method 2: For a component that cannot be pressurized without damaging the component and/or
has a non-zero leak rate, other methods are available to determine the actual rate (e.g., Air Vacuum
Meter Method, Vacuum Chamber Method, etc.). This test shall be performed with a minimum pressure
differential of 48 kPa (7 psi).
Criteria: The leakage rate limit shall be defined in advance and shall not be exceeded. As a default,
the leakage rate shall be zero or as defined in the CTS/CTRS/SSTS.
6.4.5 Water Freeze (Non-applicable)

Monitoring: Continuous Monitoring during Operating Type 3.2.
Parameters: Troom, Tmin
Procedure:
Internal
If this test is applied to a component which provides mechanical movement, the test shall be set up in
a simulated vehicle environment with all mechanical attachments in place.
1 Apply the Water test at Troom according to the IP Code in Operating Type 3.2, then also gradually
pour 2 L of water on the component at a rate of  2 L/per minute to allow water pooling.
2 Within 5 minutes, transfer the component while maintaining the vehicle position to a cold chamber
and soak at Tmin for 24h at Operating Type 2.1.
3 At the end of 24 h, and while still at Tmin, the component shall demonstrate proper function for 1 h
at Operating Type 3.2.
4 Repeat steps (1) to (3) five times.
6.4.6 Sugar Water Function Impairment (Non-applicable)

Operating Type: 3.2
Parameters: Troom
Procedure:
1 The component shall be mounted in its intended orientation with all bezels and covers in place.
2 Sugar water is defined as 200 ml of water with 10 g of sugar fully dissolved.
3 Apply the sugar water onto the component from a distance of 30 cm and wipe away any standing
or surface liquid.
4 The sugar water liquid shall be applied (as a single splash) onto horizontal components from the
vertical direction, and onto vertical components from a horizontal direction.
5 The component shall remain powered, undisturbed, and allowed to dry at (+23 ± 5) ºC for 24 h
prior to the evaluation of function.
Criteria: Functional Status Classification shall be A for electrical functions. Degradation in operational
forces or torque shall meet the CTS/CTRS requirements.
7 Product Validation (PV)
7.1 Mechanical
7.1.1 Shipping Vibration
Internal
Container design responsibility:

Supplier GM
☐ ☐
Note: When the supplier is design responsible, the GMW3172 procedure is applicable and shall be
performed by the supplier. When GM is design responsible the Validation Engineer shall assure that
the GM Container Group will perform shipping vibration validation testing.
Operating Type: 1.1
Monitoring: N/A
Parameters: Effective Acceleration = 9.81 m/s2 = 1.0 GRMS
Figure 43: Random Vibration Profile for Shipping

Table 47: Random Vibration Profile for Shipping
Frequency Power Spectral Density
10 Hz 0.096170 (m/s2)2/Hz = 0.00100 g2/Hz
12 Hz 0.963627 (m/s2)2/Hz = 0.01002 g2/Hz
100 Hz 0.963627(m/s2)2/Hz = 0.01002 g2/Hz
200 Hz 0.000962 (m/s2)2/Hz = 0.00001 g2/Hz
300 Hz 0.000962 (m/s2)2/Hz = 0.00001 g2/Hz
Note: This test is not a life fatigue test for vibration, but rather an evaluation of the ability of the shipping
container to provide adequate transport of the component(s) without damaging them. The Vibration
with Thermal Cycle test is the life test for the component to demonstrate reliability and confidence for
vibration fatigue. This test does not prove vibration fatigue reliability.
Procedure:
Internal
Use a vibration test fixture that allows the shipping container to move freely in the vertical axis of the
vibration table. One possible fixture consists of a base plate with four upright posts that are slightly
larger than the shipping container. Provisions shall be made to allow placement of the shipping
container in all three directions.
1 Perform the production End-Of-Line (EOL) test.
2 This test shall be performed on one fully-populated final shipping container of production
components. The shipping container shall include all interior packing material.
3 Vibrate the shipping container for 24 h in each of the three mutually perpendicular directions using
the methods outlined in ASTM D4728, Standard Test Method for Random Vibration Testing of
Shipping Containers. If a supplier can use a vibration table with 6 Degrees Of Freedom, then the
test can be run for 24 h only once. Use the Random Vibration Profile shown in Table 47 and Figure
43.
Describe how many samples and include a diagram of how the samples will be placed in
the final shipping container:
(TBD: provide details to address the item described above)
4 Inspect all components for structural damage, degradation of surfaces visible to customers, and
for debris from the packaging materials both inside and outside of the component.
5 Select components (6 samples as a default) from the highest stress area of the shipping container
to perform the 5-Point Functional/Parametric Check.
Describe how many samples and describe the locations of these samples in the final
shipping container that will be tested in the 5-Point Functional/Parametric Check:
(TBD: provide details to address the item described above)
Dissection – DRBTR, there shall be no external visible damage to any of the components. And there
shall be no internal damage to the 6 selected components that were functionally tested. Additionally,
report any debris from the packaging materials either inside or outside the components.
8 Additional Activities
In Section 8 of CG3043, add any additional Environmental, Durability, or Functional requirements that
were not explicitly tested in previous sections of the Test Plan. For example, include procedures to test
functional requirements that are specific to the CTS, CTRS, or SSTS for this component. Also, include
any additional Environmental or Durability-related requirements from the CTS/CTRS. This section shall
be reviewed and approved by the Component Validation Engineer.
8.1 Squeak and Rattle

Applicable Standard: CTRS 14.2.5.1
Objective Test Requirements
1) All configurations and operating positions of the HUD shall have an Instationary Zwicker
Loudness of less than or equal to 3.0 sones N10 when evaluated in the Vertical, Fore-Aft and
Lateral directions per the test procedure GMW 14011 Subsystem/Component Squeak and
Internal
Rattle Test using the vibration input frequencies and amplitudes defined in the following
tables.
Head Up Display (HUD) Head Up Display (HUD) Head Up Display (HUD)

Vertical Acceleration Fore - Aft Acceleration Lateral Acceleration
Frequency Acceleration Frequency Acceleration Frequency Acceleration
(Hertz) ((m/s2)2/Hz) (Hertz) ((m/s2)2/Hz) (Hertz) ((m/s2)2/Hz)
8 0.39505 8 0.10690 8 0.34530
12 2.40196 11 0.80990 10 1.09843
19 0.39267 12 0.91809 12 1.30177
38 0.08028 14 0.26051 15 0.39274
61 0.03877 19 0.30001 39 0.07968
88 0.00309 24 0.15013 73 0.01613
100 0.00030 35 0.05013 100 0.00031
m/s2 RMS 4.13 57 0.03106 m/s2 RMS 3.39
85 0.00352
100 0.00035
m/s2 RMS 2.76
B) Subjective Test Requirements

1) The subjective rating of the S&R performance of the HUD contains the following elements:
a) rate S&R performance during adjusting/operating subsystem/component according to
GMW8518
b) rate S&R performance during hand impacts, hand flexures and passenger motion where
the customer would normally interface with the subsystem/component, and in a manner
consistent with expected average customer behavior.
C) The minimum subjective rating under all conditions for any individual complaint and the overall rating
for the subsystem determined according to GMW 14264 is 8.0.
D) Passing the above requirements does not negate the no audible noise requirements in the Image
Position Adjustment Mechanism section of the CTRS. Those requirements must also be met.
8.2 Image Position Motor Noise

Applicable Standard: CTRS 15.7
Noise:
The HUD shall meet the following sound levels when measured at a distance of 10 cm from the top of
the HUD (over the glare trap):
1. Normal operating conditions: 20 dB Maximum (this is the +3 sigma value/limit)
Internal
2. Image movement mechanism: 38 dB Maximum (this is the +3 sigma value/limit)

a. The test procedure shall follow the HUD noise test procedure found in the validation appendix
of the SOR (section 4.10.4 – copied below)
HUD NOISE LEVEL MEASUREMENT PROCEDURE

The HUD Noise Level Measurement Procedure shall be conducted at pre and post-functional checks
for mechanical fatigue, thermal fatigue, enclosure and corrosion test in DV and PV. Sample size of 10
should be used: 2 samples - mechanical fatigue( Leg 1) , 6 samples - thermal fatigue (Leg 2 with 3
parts Cyclic/3 parts Constant), 1 samples - enclosure tests ( Leg 3) , and 1 sample - Corrosion test
(Leg 4).
TESTING EQUIPMENT
Unless stated otherwise all listed equipment (or equivalent) is required.
1. Capable anechoic or semi anechoic chamber (IAC)

2. HUD (device under test)
3. Wire harness
4. Function generator
5. Power supply
6. HUD switch box
7. PC/laptop containing HUD software
8. Meter stick
9. HEAD Binaural Head (HMS III.1) with dual random incidence microphones (with amplification, power,
conditioning and DAT recorder)
9. Acoustic Analyzer/Recorder (Head Acoustics SQLab and included software V5.02.200)
10. Acoustic Post Processing Software (Head Acoustics Artemis V6.00.200)
11. Headphones (Sony MDR CD30 or equivalent)
12. A 20 Hz high pass filter (often built into microphone power supply and/or analyzer).
Internal
HUD LEVEL TESTING SERVOS
Internal
CALIBRATION
1. Calibrate the binaural system.
SET UP
1. Place the HUD on a stand in the acoustic chamber in body position.
2. Attach the HUD wire harness to the HUD and pass it out through the chamber.
3. Place the binaural head in the chamber directly above the HUD.
4. Place the binaural head microphone should be placed 100 mm (See HUD CTS) above the center of the
HUD lens to be tested.
PRE TEST AMBIENT MEASUREMENT

1) SET UP the Artemis recorder:
• Sampling rate: 44.1 kHz.
• Duration: 30 Seconds
• Time weighting: S (slow)
• Averaging: rms average
• Data type: Level vs. Time
2) RECORD a 30 second pre ambient background measurement.
3) REPLAY the pre ambient recording while listening with headphones. Listen to file to be sure
background is free from extraneous noises.
4) POST PROCESS the pre ambient file (overall Sound Pressure Level in dB(A))
5) NOTE 1: Acoustic chambers and testing environments are not alike. Verify that the overall chamber
ambient background, A-weighted sound pressure level is at or below 20 dB(A) (ref. 20 µPa), across
the band of 100 Hz to 20 kHz.
6) SAVE the ambient background noise file (raw file and data).
NOISE MEASUREMENTS
Record the noise from the component for the 4 different gage-operating conditions.
CONDITION 1 – ZEROING / HOMING

1. SET UP the Artemis recorder and gage software on computer/laptop.
2. Artemis recorder:
• Time weighting: F (Fast)
• Averaging: none, use Peak
3. HUD Software:
• Angular velocity: production intent homing mirror speed
• Set Mirror at the top position of its total travel, drive the mirror at the specified homing angular
velocity in the direction of the internal stop.
4. RECORD the measurement.
5. REPLAY the zeroing recording while listening with headphones. Listen to the noise file to be sure the
file is free from extraneous noises.
6. POST PROCESS the zeroing noise file.
• Center the 3-second cursored window on the peak value in the Level vs. Time file.
• Use the following 5 noise metrics
Internal
1. Sound Pressure Level dB(A)

2. Zwicker Loudness (sones) N(10)
3. Sharpness (acum)
4. Roughness (asper)
5. Fluctuation Strength (vacil)
7. SAVE the noise file (raw file and data).
CONDITION 2 – MIRROR ROTATION – IMAGE ASCENDING

1) SET UP the Artemis recorder and gage software on computer/laptop.
2) Artemis recorder:
• Time weighting: F (fast)
3) Gage Software:
• Set up for the mirror to travel between the full up position and the full down position in the normal
mirror travel speed.
4) 2. RECORD the movement.
5) 3. REPLAY the recording while listening with headphones. Listen to the file to be sure the file is free
from extraneous noises.
6) POST PROCESS the gage descending noise file.
3. Sharpness (acum)
7) SAVE the noise file (raw file and data).
CONDITION 3 – MIRROR ROTATION – IMAGE DESCENDING

1) SET UP the Artemis recorder and gage software on computer/laptop.
2) Artemis recorder:
• Time weighting: F (fast)
3) Gage Software:
• Set up for the mirror to travel between the full up position and the full down position in the normal
mirror travel speed.
4) 2. RECORD the movement.
5) 3. REPLAY the recording while listening with headphones. Listen to the file to be sure the file is free
from extraneous noises.
6) POST PROCESS the gage descending noise file.
3. Sharpness (acum)
Internal
7) SAVE the noise file (raw file and data).
POST TEST AMBIENT

1) SET UP the Artemis recorder:
• Time weighting: slow
• Averaging: rms average
2) RECORD a 30 second post-ambient background measurement.
3) REPLAY the post ambient recording while listening with headphones. Listen to file to be sure
background is free from extraneous noises.
4) POST PROCESS the post ambient file (overall Sound Pressure Level in dB(A))
NOTE 1: Again acoustic chambers and testing environments are not alike. Verify that the overall chamber
ambient background, A-weighted sound pressure level is at or below 20 dB(A) (ref. 20 µPa), across the
band of 100 Hz to 20 kHz.
5) SAVE the ambient background noise file (raw file and data).
Test Pass/Fail Criteria

The maximum measured noise level shall be less than the requirement:
1. Normal operating conditions: 20 dB Maximum (this is the +3 sigma value/limit)
2. Image movement mechanism: 38 dB Maximum (this is the +3 sigma value/limit)
Internal
9 Appendix
9.1 Appendix Test Summary for QL Technicians
For internal use (Tests summary for QL Technician)

See Special Electrical Test Modes on next table.
Special
Base GMW
Electrical
3172 Special Test Requirements or Considerations
Test Mode
Modes
Name
Test requires application of 26V for 1 minute in Mode 3.1 before
transitioning to Mode 3.2 with Voltage Levels Unchanged during
Jump Start 3.1/3.2
the transition. Remain in mode 3.2 for 1 minute. Remain in
Operating Type 3.2 and transition voltage from 26.0 V to U A..
Test requires application of -13.5V for 2 minutes in Mode 3.1
before transitioning to Mode 3.2 with the Voltage Levels
Reverse
3.1/3.2 Unchanged during the transition. Remain in Mode 3.2 for 2
Polarity
minutes. Remain in mode 3.2 and transition voltage from -13.5
V to UA.
Test requires transitioning between all possible operating types,
State Change
including internal state changes. Test requires operator to
Waveform All
“Record all waveforms of output signals during the entire
Characterization
transition phase (before, during, and after state changes).”
Test requires to operate the component to create the maximum
Ground Path
current change rate at the highest frequency possible in the
Inductance 3.2
ground path. This is achieved by simultaneously activating Wake
Sensitivity
CMD ON, Stepper motor and backlight at 80%.
Test exposes DUTs to voltages below the minimum operating
Battery Voltage threshold as long as 28 800 seconds. Special consideration
3.2/2.1/3.2
Dropout should be given to Test Software to ensure the capability of the
DUT to wake up after 10 hours.
This test requires superimposing a 4VP-P sine wave over the 3.2
Sinusoidal mode. Special consideration should be given to this voltage
Superimposed 3.2 fluctuation when determining appropriate test limits. Test
Voltage methods according to ISO 16750-2, superimposed alternating
voltage, Severity Level 2 (4 Vp-p)
This test requires superimposing a 2Vp-p square wave over two
Pulse separate DC voltage levels, while sweeping the frequency of the
Superimposed 3.2 square wave from 1Hz to 4kHz. As a result the DUT can be
Voltage exposed to voltages ranging from Umax-2v to as low as
Umin+2V.
Test requires Outputs to be operated at maximum specified
Single Line
3.2 load. This test involves the momentary “opening up” of
Interruptions
individual lines.
Internal
9.2 Appendix HUD Mirror Position

Considerations:
a) In case of Under-/Overvoltage conditions the Functionality of mirror can be restricted.
b) During not operational voltage and cranking voltage (<6V at the HUD connector), the HUD shall turn off the stepper
motor. (No pwm shall be driven to the motor driver)
c) During autostart cranking voltage (6V < Voltage at HUD connector < 9V), the HUD should function normally, including
the stepper motor should be able to move.
d) During normal voltage (9V < Voltage at HUD connector < 16V), the HUD should function normally, including the
stepper motor should be able to move.
e) During generator over voltage (16V < Voltage at HUD connector < 18V), the HUD can turn off the stepper motor.
d) During jump start voltage (18V < Voltage at HUD connector < 26.5V), the HUD turns off the stepper motor.
Internal

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GM WORLDWIDE ENGINEERING STANDARDS GMW3172 Component

Environmental Test Plan

GMW3172 Component Environmental Test Plan (CG3043)

Component Name (no abbreviations): Revision Date: Revision Number:

CEMENT Family Name: Component Manufacturer:

Mounting Location in Vehicle: Dash

Prepared by (Supplier): Test Plan Approved by GM Responsible

April 2018 v2 Page 1 of 160

12/15/ 0.1 DV01 Initial draft ER

19/01/ 0.2 DV01 Added Visual Change Document ER

28/06/ 0.4 DV01 Updated according QL comments ER

April 2018 v2 Page 2 of 160

Test Plan Purpose:

Example: Description of changes between DV and PV

April 2018 v2 Page 3 of 160

April 2018 v2 Page 4 of 160

4.4 MATERIAL ............................................................................................................................ 62

April 2018 v2 Page 5 of 160

6.2.3 MECHANICAL SHOCK – COLLISION ........................................................................ 112

April 2018 v2 Page 6 of 160

1.2 Guidelines for Test Descriptions

6.2.6 Crush for Housing – Foot Load

April 2018 v2 Page 7 of 160

1.3 Quoting Requirements

Electrical Mechanical Temperature Climatic Chemical Dust and Water

The Code Letter definitions are referenced in GMW3172 (April 2018).

This Classification results in following Parameters:

April 2018 v2 Page 8 of 160

1.4 Parameter and Tolerance Requirements

April 2018 v2 Page 9 of 160

1.5 Test Requirements

Test Setup and Component Verification

April 2018 v2 Page 10 of 160

Analysis Development Design Validation Product Validation

Design Validation (DV)

Insulation Resistance N/A (TBD)

April 2018 v2 Page 11 of 160

Analysis Development Design Validation Product Validation

Product Validation (PV)

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1.5.2 Procedure Planning Tools

1.5.2.1 DV01 Procedure Planning Tool

1.5.2.2 PV01 Procedure Planning Tool

April 2018 v2 Page 13 of 160

1.6 Test Flows

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1.6.2 Design Validation DV01

April 2018 v2 Page 15 of 160

Product Validation PV01

April 2018 v2 Page 16 of 160

2.1 Component Family Description

2.2 Environmental Hardware Design Review Checklist

April 2018 v2 Page 17 of 160

2.3 Component Physical Description

Component Mounting in Vehicle. Include a CAD drawing/photos/component orientation showing X-

Figure 1 Component orientation C1YX-2

April 2018 v2 Page 18 of 160

Exploded view GM HUD C1YX-2

GM HUD C1YX-2 BOM

Pos. Designation Quantity Material Comments

April 2018 v2 Page 19 of 160

Pos. Designation Quantity Material Comments

April 2018 v2 Page 20 of 160