GOVERNMENT POLYTECHNIC COLLEGE

PALAKKAD

MINI PROJECT REPORT

IR PROXIMITY SENSOR

HEAD OF DEPT PRESENTED BY

C.K BINDHU HASHIR H

GUIDED BY

DEPARTMENT OF ELECTRONICS ENGINEERING 2021-

2022
 GOVERNMENT POLYTECHNIC
COLLEGE PALAKKAD

DEPARTMENT OF ELECTRONICS
ENGINEERING
CERTIFICATE

This is to certify that the mini project entitled “IR PROXIMITY SENSOR ” is
a bonafide record of the project work done by HASHIR H second year
Electronics Engineering, Government Polytechnic College, Palakkad. In
partial fulfilment of the requirement of the award of Diploma in Electronics
Engineering under the Directorate of Technical Education, Kerala state during
the year 2020-2023

Place:
Date: Staff-In-Charge

Head of the Department

External Examiner Internal Examiner

ACKNOWLEDGEMENT
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 First and foremost we thank God Almighty for showering his blessing
upon us and for giving us the auspices and grace to make the right
decision with dignity.

We owe our sincere thanks to Mrs.Seema K N , Principal, Govt

Polytechnic College, Palakkad for granting the permission to do this
project.

We pleased our indebtedness to Mrs. C K Bindhu, Head of the

Department, Department of Electronics Engineering, Govt Polytechnic
College, Palakkad for her gracious encouragement.

We are obliged to the All teaching staff for being helpful and co-
operative during the period of project. We extend our heartfelt thankful
to parents, friends and well wishes for their support and timely help.

GOVERNMENT POLYTECHNIC COLLEGE,

PALAKKAD

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 THE VISION
“To be a centre of excellence in engineering education for providing valuable
resources to industries and society.”

THE MISSION
• Providing quality education in engineering and technology.
• Involving in the development of society through technology
transfer entrepreneurship and industry interaction.
• To inculcate social responsibility and ethical values among students through
value of education.

DEPARTMENT OF ELECTRONICS
ENGINEERING

THE VISION
“To be a centre of academic excellence imparting necessary knowledge and skills in
the field of Electronics to enable students for higher education, employment and
entrepreneurship.”
THE MISSION

 Grooming students with strong foundation of electronics engineering and facilitating

them to pursue higher education.
 Imparting knowledge and training for current and advanced technology in the field
of Electronics.
 Providing facilities to students for familiarizing with employment and
entrepreneurship opportunities.

TABLE OF CONTENT
1. STANDARDISATION OF LABORATORIES………...06
2. INTRODUCTION............................................................07
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 3. COMPONENTS USED………………………………….08
4. CIRCUIT DIAGRAM……………………………………09
5. COMPONENTS DETAILS……………………………...10
6. WORKING PRINCIPLE…………………………….…..15
7. APPLICATIONS………………………………………....16
8. ADVANTAGES & DISADVANTAGES………………..17
9. PRICE LIST ……………………………………………..18
10.CONCLUSION……………. . ……………….. ……....19
11.REFERENCE……………………………………………..20

1.STANDARDISATION OF LABORATORIES

Special dedicated team should be formed for sorting, organizing and sustaining the
organized work culture at the machine shop. The 5s team works on the Japanese principle
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of organization, which have been successfully implemented at various shopfloors around
the world. The 5 pillars of organization that we aim at are:
SORT(SEIRI)
Sort means that you move all items from the workplace that are not needed forcurrent
Machine shop activities.
SET IN ORDER(SEITION)
Setting in order whatever has been “sorted ”. Labeling and marking down required items
of usage. Creating designated areas for frequently used tool and arranging them so that
they are easy to find.
SHINE(SEISO)
Cleaning up after the work is over. Putting tools and used material back in their
designated place, the way they were “set in order”. Cleaning the workplaces , so as to
avoid any hazardous materials spills and other accidents at workplace.
STANDARDIZE(SEIKETSU)
Standardize whatever has been achieve so far using the first three pillars. Marking ita part
of the daily routine and setting aside time to sort, set in order, and shine repeatedly.

2.INTRODUCTION
Infrared technology addresses a wide variety of wireless applications. The main areas are
sensing and remote controls. In the electromagnetic spectrum, the infrared portion is divided
into three regions: near infra. region, mid infrared region and far infrared region.

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For optical sensing and optical communication, photo optics technologies are used in the near
infrared region as the light is less complex than RF when implemented as a source of signal.
Optical wireless communication is done with IR data transmission for short range
applications. An infrared sensor emits and/or detects infrared radiation to sense its
surroundings.

The working of any Infrared sensor is governed by three laws: Planck's .radiation law,
Stephen - Bohzmann law and Wien's Displacement law.
Planck's law states that -every object emits ra.at ion at a temperature not equal to 00K,
Stephen - Boltzmann law states that at all wavelengths, the total energy emitted by a black
body is proportional to the fourth power of the absolute temperature-. According to Wien,
Displacement law, `the radiation curve of a black body for different temperatures will reach
its peak at a wavelength inversely proportional to the temperature-.

The basic concept of an Infra. Sensor which is used as Obstacle detector is to transmit an
infrared signal, infrared signal bollixes from the surface of an object and the signal is
received at the infrared receiver
There are five basic elements used in a typical infrared detection system: an infrared source, a
transmission medium, optical component, infrared detectors or receivers and signal
processing. Infrared lasers and Infrared LED's of specific %wavelength can be used as
infrared sources.

3.COMPONENTS USED

1. LM358 IC
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2. Zero PCB Board

3. IR Transmitter Receiver Pair

4. LED

5. 10K ohm Variable Resistor

6. Resistor(100ohm, 220ohm, 10K)

7.Battery

4.CIRCUIT DIAGRAM

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5.COMPONENTS DETAILS
● LM358IC

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LM358 is a dual op-amp IC integrated with two op-amps powered by a common power
supply. It can be considered as one half of LM324 Quad op-amp which contains four op-
amps with common power supply. The differential input voltage range can be equal to that of
power supply voltage.

 ZERO PCB BOARD

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Zero PCB is basically a general-purpose printed circuit board (PCB), also known as
perfboard or DOT PCB. It is a thin rigid copper sheet with holes pre-drilled at standard
intervals across a grid with 2.54mm (0.1-inch) spacing between holes

 IR Transmitter Receiver Pair

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IR Transmitter and IR Receiver are commonly used to control electronic devices wirelessly,
mainly through a remote. TV remotes and AC remotes are the best example of IR
transmitters. TV generally consists of TSOP1738 as the IR receiver, which senses modulated
IR pulses and convert them into electrical signal.

 LED

A light-emitting diode is a semiconductor light source that emits light when current flows
through it. Electrons in the semiconductor recombine with electron holes, releasing energy in
the form of photons

● 10k OHM VARIABLE RESISTOR

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It is a single turn 10k Potentiometer with a rotating knob. These potentiometers are also
commonly called as a rotary potentiometer or just POT in short. These three-terminal devices
can be used to vary the resistance between 0 to 10k ohms by simply rotating the knob.

 BATTERY

 RESISTOR (100 &220 ohm ,10k )

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A resistor is a passive two-terminal electrical component that implements
electrical resistance as a circuit element. In electronic circuits, resistors are used
to reduce current flow, adjust signal levels, to divide voltages, bias active
elements, and terminate transmission lines, among other uses.

6.WORKING PRINCIPLE

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An IR proximity sensor works by applying a voltage to a pair of IR light emitting diodes
(LEDs) which in turn, emit infrared light. This light propagates through the air and once it
hits an object it is reflected back towards the sensor. If the object is close, the reflected light
will be stronger than if the object is further away.

The sensing unit (for this experiment a Sharp IS471FE will be used), in the form of an
integrated circuit (IC), detects the reflected infrared light, and if its intensity is strong enough,
the circuit becomes active. When the sensing unit becomes active, it sends a corresponding
signal to the output terminal which can then be used to activate any number of devices. For
the purpose of this exercise, a small Red LED will turn on when the sensor becomes active

7.APPLICATIONS
● Proximity sensors have a wide range of applications in real life like
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 ● Parking assistance for car bumpers that sense the distance of other nearby cars and
helps in parking procedure
● Sheet break sensing in paper machine Conveyer systems
● In smartphones that come in close proximity with user’s
● Automatic water tap
● Door security It provides secured communication due to line of sight or point to
point mode of communication

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8.ADVANTAGES & DISADVANTAGES

• ADVANTAGES:
*It Provides secured communication due to line of sight or point to point mode of
communication
*The battery used in infrared devices last for long duration due to low power consumption

•DISADVANTAGES
*Infrared frequencies are affected by hard objects.It does not works through doors and walls
*IR waves with high power can damage eyes

9. PRICE LIST
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SL COMPONENTS QUANTITY PRICE
NO
1 LM358 IC 1 10
2 PCB BOARD 1 40
3 RESISTOR 10K POT 1 8
4 RESISTOR 100 ohm 1 5
5 RESISTOR 220 ohm 1 5
6 RESISTOR 10 K 1 6
7 IR TRANSMITTER 1 EACH 16
RECEIVER PAIR
8 LED 1 2
9 BATTERY 1 20
TOTAL 112

10.CONCLUSION
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There are five basic elements used in a typical infrared detection system: an infrared source, a
transmission medium, optical component, infrared detectors or receivers and signal
processing. Infrared lasers and Infrared LED’s of specific wavelength can be used as infrared
sources. The three main types of media used for infrared transmission are vacuum,
atmosphere and optical fibers. Optical components are used to focus the infrared radiation or
to limit the spectral response. Optical lenses made of Quartz, Germanium and Silicon are u to
focus the infrared radiation. Infrared receivers can be photodiodes, phototransistors etc. some
important specifications of infrared receivers are photosensitivity, detectivity and noise
equivalent power. Signal processing is done by amplifiers as the output of infrared detector is
very small.

11.REFERENECES
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 ● www.slideshare.net
● www.wikipedia.org
● www.electronishub.com

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