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L2 Repair Process - v1.5
L2 Repair Process - v1.5
L2 Repair Process - v1.5
5 Page : 1/3
V1.1 2016-04-25 Modified according to region comment Jennifer Zhang TS team Jennifer Zhang
Warranty check
Software upgrade
Function test
OK
(*use Smart Diagnosis
tool or MMI test )
NG
Disassembly
NG Fault
PCBA replacement
corrected?
OK
Reassembly
Software upgrade
RF test
NG
Function test
(*use Smart Diagnosis
tool or MMI test)
OK
Factory Reset
END
* Smart Diagnosis tool to be used systematically (MMI to be a workaround solution when Smart
Diagnosis tool do not work properly or certain test items are not contained in Smart Diagnosis tool.
Version : 1.5 Page : 3/3
NOTE:
1) Level 2 repair: Includes components replacement or repair around the PCBA, such as PCBA,
module, antenna spring, key-pad, dome, keypad PCB, finished flip casing, FPC, LCD, keypad
LED, signal LED, camera, TP, battery, flashlight, receiver, speaker, microphone, vibrator,
keypad PCB connector, audio jack, USB connector, battery connector, SIM connector and other
connectors etc.
2) Level 2 RC must refer to this repair flow chart and L2 service document when proceeding
with L2 repair.
3) If PCBA replacement is executed in L2 RC, the defect PCBA should be escalated to higher
level RC or RSH.
4) Please upgrade the handset software to latest version systematically as per the above
workflow.
5) Perform factory reset on the device to wipe all data before return it to the customer.