Morgan 3G - 5006A - D - G L1 L2 Service Manual V2.0 EU

L1&L2 Service Manual TCL Communication Ltd.
Morgan 3G
5006A_D_G
Note:
➢ This manual describes the maintenance of the Morgan 3G series. The following operations can only be
performed by authorized repair centers;
➢ This manual can be modified without prior notice on the characteristics of described equipment. Please
download from Support website for the latest versions.
Rev. Date Modification description Prepared By Checked By Approved By
V1.0 2019-05-19 Preliminary Draft Lianqing. XU Willow Chen Eason Wang
V2.0 2020-1-10 Add code name 5006A info Lianqing. XU Willow Chen Eason Wang
Rev.: 2.0 Morgan 3G_5006A_D_G Level 1 & Level 2 Service Manual Page: 1/29
All rights reserved. Transfer, copy, use or communication of this file is prohibited without authorization.
Content
1. General Information about the product ..........................................................................3
1.1. Product Specifications .............................................................................................. 3
1.2. Product Label ........................................................................................................... 6
1.2.1. Commercial Label ........................................................................................... 6
1.2.2. CU label .......................................................................................................... 7
1.2.3. IMEI label print instruction ............................................................................... 7
1.3. Accessories .............................................................................................................. 8
2. Repair process .................................................................................................................9
2.1. L1 repair process ...................................................................................................... 9
2.2. L2 repair process .................................................................................................... 10
3. Maintenance preparation ...............................................................................................12
3.1. Handset & PC ......................................................................................................... 12
3.2. ESD safety .............................................................................................................. 12
4. Basic inspection.............................................................................................................13
4.1. Engineer functionalities ........................................................................................... 13
4.2. Warranty check ....................................................................................................... 13
4.2.1. Visual Mechanical inspection for handset and accessories ........................... 14
4.2.2. Proof of purchase .......................................................................................... 14
4.2.3. IMEI Check .................................................................................................... 15
4.2.4. Humidity sensitive label ................................................................................. 16
4.2.5. Liquid damage indicator policy ...................................................................... 17
4.3. Product test ............................................................................................................ 17
4.3.1. Recovery mode ............................................................................................. 17
4.3.2. Factory Reset ................................................................................................ 18
4.3.3. Function test (MMI test & SDT test) .............................................................. 18
4.3.4. RF test instruction ......................................................................................... 20
5. Software download ........................................................................................................20
6. Disassembly and reassembly Morgan 3G ...................................................................21
6.1. Disassembly tool..................................................................................................... 21
6.2. Disassembly process .............................................................................................. 22
6.3. Reassembly process .............................................................................................. 22
7. L2 trouble shooting........................................................................................................27
8. PCBA exchange .............................................................................................................28
9. Functional Re-test ..........................................................................................................29
1. General Information about the product
1.1. Product Specifications
Project name Morgan 3G

Code Name 5006A_D_G
Marketing name Alcatel 3C
2G Network GSM 850/900/1800/1900
EMEA/APAC: 1/2/5/8
3G Network
LATAM: 1/2/4/5/8
4G Network NA
General
5G Network NA
OS Android P (9.0)
Chipset MT8321
CPU Frequency Quad core 1.3GHz
5006A_G :173.4X83.4X7.9
Dimensions (mm)
5006D :173.4X83.4X8.1
Design Estimated Weight (g) 185
Side Keys Volume & power key & Google Assistant button
Removable battery cover No
Main LCD Size (inch) 6.7'' w/o notch
Main display resolution HD+ ; 720X1440; 18:9
Main LCD Type TFT-IPS
Display Screen to body ratio VA/TP=85%, VA/BODY=80%
LED indicator Compatible, default no
Touch Points 5
Touch Panel Material In-cell
Audio design specific 2 in 1
Number of speakers 2
3D Surround No
Audio
HD voice Yes
&Video
Dual-MIC Noise cancellation Yes
AAC, AMR, AWB, MP3, AAC+,Vorbis, FLAC,
Audio Codec Support
eAAC+, PCM playback, MIDI, Opus
1080P@ 30fps,H.263,H.264 AVC,H.265
Video Codec support
HEVC ,VP8,VP9, MPEG-4
Support headset type LRGM
5006D: 1/2 SIM + TF card;
Number of SIM/TF card slot
5006A_G: 1 SIM + TF card only
Capacity of Multiple SIM 5006D: 2 SIM + TF compatible
Card (Number) 5006A_G: 1 SIM + TF compatible
Slot1: 4FF (Nano-SIM)
Available
SIM card type Slot2: 4FF (Nano-SIM)→5006D;
Ports
N/A→5006A_G
SIM/TF 2 in 1 No
Hot swap Yes
Audio Jack 3.5mm audio jack
Charging Port Micro USB
5006D_G: 16GB(Discrete) (32+2 GB compatible)
Storage
5006A: 32GB(Discrete)
RAM 2GB(Discrete)
External storage Micro SD, up to 128GB
End User Space
Memory 5006D_G: About 9GB
(Actual space depend variant
5006A: About 25GB
customization accordingly)
SIM Slot 1 Network 2G/3G
5006D: 2G;
SIM Slot 2 Network
5006A_G: NA
/ Rear Camera Front Camera
Number of camera 1 1
5006D: 8M 5006D: 5M
Number of pixels
5006A_G: 8M(SW to 13M) 5006 A_G: 5M(SW to 8M)
Camera Focus AF FF
Flash by LCD background
Camera Flash Single tone
lighting
EIS Yes NA
Video Video Playback: Video Playback: 1080@30fps
1080@30fps Video Capture: 720@30fps
Video Capture:
1080@30fps
HDR Yes NA
Typical Capacity (mAh) 3000mAh
Battery type Soft pack
Internal battery Yes
Battery Charging Technology Normal charging, 5V1A ;
Charging Time 3.8 hours
Standby time 375 hours(data link off)
Talking time 18.5hours
IR No
Wi-Fi / WLAN 802.11b/g/n
Wi-Fi Direct Yes
NFC No
Radio Yes
Connectivity
Bluetooth/Supported version Yes, BT 4.2
USB Micro USB
USB OTG Yes
VoLTE No
VoWifi No
GPS(A-GPS) Yes
Accelerometer (G sensor) Yes
Proximity Sensor Yes
Light Sensor Yes
Sensors
E-Compass No
Gyro No
5006D : No;
Fingerprint
5006 A_G : Yes
Torch Light Yes, via rear flash
Others
HAC M3 only
1.2. Product Label
1.2.1. Commercial Label
1) Printing Zone definition (For general 52×27+11×1.5+41×1.5mm)
Signification Remark
Print “E” means Enhanced SIM Lock;
SIM Lock
Print “N” means Normal SIM Lock or No SIM Lock
DATAMATRIX Code IMEI No. / INDUS. REF. / PTH(PTM) / PTS / CU REF.
PTS Main software version
2) Commercial Label example
5006D-2AALEU1 5006D-2AALEU2
IMEI sample V02 IMEI sample V02
5006G-2AALMX1 5006A-2XTGMX1
IMEI sample V02 IMEI sample
1.2.2. CU label
1) Printing zone definition (73x38 mm)
Signification Remark
Color Refer to ERP
EAN Code Text+1D Code
CE/NOM Logos
2) CU label example
5006D-2AALEU1 5006D-2AALEU2
CU Sample V01 CU Sample V01
5006G-2AALMX1 5006A-2CTGMX1
CU Sample V01 CU sample
1.2.3. IMEI label print instruction
Please refer to < IMEI label print by Zebradesign 0.2> in support website (CSS/RSH) for details.
http://rsh.a-novo.com/modules/sections/index.php?op=viewarticle&artid=2540
1.3. Accessories
Item Picture Remark
Typical Capacity
(mAh): 3000mAh
Battery type: Softpack
Model: TLp029C7
Charging Time: 3.5
Battery
hours
Standby time: 375
hours (data link off)
Talking time: 18.5
hours
EU version
PRI: 100-
240V~50/60Hz 0.2A
SEC: 5.0V 1A
Charger
US version
PRI: 100-
240V~50/60Hz 0.2A
SEC: 5.0V 1A
USB cable
Battery test information :

2. Repair process
➢ For personal data protecting, remind customer to back up and clear personal data in handset
before repairing, otherwise user data will be cleared by default.
➢ Please upgrade the handset software to latest version systematically as per the above workflow.
➢ Perform factory reset on the device to wipe all data before return it to the customer.
2.1. L1 repair process
1) Level 1 repair: Simple maintenance and accessories replacement, such as: cleaning, casing
reassembly, accessories replacement (including data cable, headset, charger, etc.), escalation to
upper level repair centers, check the failure, SW upgrading, handset replacement, etc.
2) Level 1 RC must refer to this repair flow chart when proceeding with L1 repair.
Start GDPR notice: Personal data must be
saved by end user when possible
Remind end user to before repair, as no personal data
back up and clear will be save by RC. Otherwise user
personal data data will be deleted systematically
during repair process
Visual inspection
Warranty check
Test OK Pre test & failure confirm Test NG

Accessory test (*use Smart Diagnosis
OK tool or MMI test )
NG
Accessory replacing SW upgrading
SW upgrading
Function Retest
OK
(*use Smart Diagnosis
tool or MMI test)
NG
Factory Reset Yes

Handset
replacement?
NO
Escalate to L2 Repair
END
Center
* Smart Diagnosis tool to be used systematically (MMI to be a workaround solution when Smart
Diagnosis tool do not work properly or certain test items are not contained in Smart Diagnosis tool.
2.2. L2 repair process
1) Level 2 repair: Includes components replacement or repair around the PCBA, such as PCBA,
module, antenna spring, key-pad, dome, keypad PCB, finished flip casing, FPC, LCD, keypad LED,
signal LED, camera, TP, battery, flashlight, receiver, speaker, microphone, vibrator, keypad PCB
connector, audio jack, USB connector, battery connector, SIM connector and other connectors etc.
2) Level 2 RC must refer to this repair flow chart and L2 service document when proceeding with L2
repair.
3) If PCBA replacement is executed in L2 RC, the defect PCBA should be escalated to higher level RC
or RSH.
Start
Remind user to GDPR notice: Personal data must be

back up and clear saved by end user when possible
personal data before repair, as no personal data will
be save by RC. Otherwise user data
will be deleted systematically during
Visual inspection repair process
Warranty check
Pre test & failure confirm

(*use Smart Diagnosis tool or
MMI test )
Software upgrade
Function test
OK
tool or MMI test )
NG
Disassembly
** Do Battery test in this step.

L2 Repair
NG Fault
PCBA replacement
corrected?
OK
Reassembly
Software upgrade
RF test
NG
Function test
tool or MMI test)
OK
Factory Reset
END
* Smart Diagnosis tool to be used systematically (MMI to be a workaround solution when Smart
Diagnosis tool do not work properly or certain test items are not contained in Smart Diagnosis tool.
3. Maintenance preparation
3.1. Handset & PC
It is recommended the followings:
1) Handset with full power
2) One SIM card/SD card
3) One PC with below configurations

CPU: Equal to Pentium 1.6 GHZ or above
RAM: 2GB or above
Hard Disk: 2GB or above
Operation System: Windows / XP / Vista / Win7/Win8/Win10
USB port
Internet connection with minimum internet speed of 8Mb/s
3.2. ESD safety
Do not start the disassembly process if

without ESD protection, suggest sticking a
warning poster on the wall in the work room
ESD set up for the workbench in the work

room
1) Make sure the personal ESD protection is ready before entering the work room
ESD glove ESD smock ESD wrist strap ESD shoes
2) Detect the wrist strap is working good by using ESD wrist strap tester, as below
Low: R<800KQ
Normal: 800KQ≤R≤9MQ
High: R>9MQ
4. Basic inspection
4.1. Engineer functionalities
Click-through steps Description
Input *#06# in the dial pad To check the IMEI number
Input *#2886# in the dial pad Enter MMI test
Input *#3228# in the dial pad Check current software version
4.2. Warranty check
1. Warranty principle
Products within the warranty period and not subject to misusage or modification can be repaired
free of charge in TCL authorized Repair center.
2. Possible Out-of- warranty situations are but may not be limited to:
➢ Smart Care System warranty status is:“Out of Warranty”. the warranty period has expired.
➢ The product was modified from its original design and/or software (Software modified or rooted).
➢ Any abnormal is detected during visual inspection (refer to <Visual mechanical check> and
<Accessories inspection>).
➢ LDI (Liquid Damage Indicator) is triggered or the device shows signs of liquid ingress.
➢ Disassembly or repair tentative from a non-authorized person or repair center.
4.2.1. Visual Mechanical inspection for handset and accessories
Please refer to <Visual mechanical check flow chart>, < Accessories inspection > in support
website (CSS/RSH) for details.
4.2.2. Proof of purchase
1) Check the warranty status of the product on Proof Of Purchase (POP).
2) Check the manufacturing date, there are three ways to check:
a) Using the date code on commercial product label and match it with the date code matrix
hereafter.
Coding year
Coding month
Coding day
Note:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
1 2 3 4 5 6 7 8 9 A B C D E F G
Day
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
H I J K L M N O P Q R S T U V
Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Month
E F G H I J K L M N O P
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
T U V W X Y Z A B C D E F G H I
Year
26 27 28 29
J K L M
b) Type “*#2886#” in dial pad to enter MMI test mode->select “MANU” ->touch “Traceability”->
check the Date Code information.
c) If the phone can’t power on, please read data code by using Sugar tool. Please refer to SW
download process in chapter 3 for details.
4.2.3. IMEI Check
➢ There’re three ways to check the IMEI:
1) Power on the handset, go to ”Settings”-> “System”-> “About phone” -> “Status”-> “IMEI information”;
2) Open dial pad and type “*#06#”;
3) Use the latest sugar tool to check IMEI, refer to chapter 5 <Software download> for how to
download Sugar tool.
➢ There are two ways to distinguish single from dual SIM card for Morgan 3G(5006A_D_G):
Way1. Check the parity of the last number of CU reference, details are as follows:
Region SIM card type Single card CU Dual card CU
EU 5006D-2*****X , 5006D-2*****X,
Single and dual
(5006D) X=1,3,5,7,9 X=2,4,6,8
5006G-2*****Y ,
(5006G) Single NA
Y=1,3,5,7,9
LATAM
5006A-2*****Y ,
(5006A) Single NA
Y=1,3,5,7,9
Way2. Checks the SIM card appearance, details are as follows:
SIM card type Part Number Color Picture Sample
BQA1NE0L21C0 Metallic Rose
Single card
BQA1NE0A11C0 Anthracite Black
BQA1NE0A01C0 Volcano Black
Dual card BQA1NE0A02C0 Volcano Black
➢ There one IMEI sticker position on the battery cover and SIM tray:
On the battery cover:
On the SIM tray:
If the IMEI sticker in the back casing is readable, please ensure the IMEI number on the product
memory matches the one on the IMEI label; if not, please consider the device out of warranty as it have
been modified.
4.2.4. Humidity sensitive label
Humidity sensitive label check:
1) Liquid was detected by humidity sensitive label.
2) Position of humidity sensitive sticker
Position 1： Position 2：
You can check it after SIM tray disassembly. You can check it after battery cover disassembly.
4.2.5. Liquid damage indicator policy
1) If humidity sensitive label is triggered (becomes red), the device will be considered as out of
guarantee.
2) If humidity sensitive label is normal, but you find water damage on connectors/metallic surfaces in
the product, the device can be considered as out of guarantee.
4.3. Product test
4.3.1. Recovery mode
How to use: Long press “Power” Key + “Volume up” key in power off mode to enter recovery mode.
When to use: When you cannot start your handset or when there will be something wrong during
switch on or when cannot charge or cannot charge normally.
Consumer personal data format: It will format consumer data, and the memory and settings of your
product will return as released from factory.
Click-through steps：
1) Power off the device, long press “Volume up” 2) Press “Volume up” to select “Recovery mode”
key + “Power” key until the LCD lights on; and press “Volume down” to confirm;
3) Press “Volume” key to select “Wipe 4) Select “Yes” and press “Power” key to
data/factory reset” and press “Power” key to confirm;
confirm;
5) Select “reboot system now” and press

“Power” key to confirm;
4.3.2. Factory Reset
There are two ways to enter into factory reset when phone is powered on:
Way 1: Go to main menu → Settings → System → Reset → Factory data reset → RESET
PHONE→ERASE EVERYTHING
Way 2: Input *#2886# in the dial pad to enter MMI test mode → MANU → Factory Reset
4.3.3. Function test (MMI test & SDT test)
a) Check that the SIM card and SD card are inserted correctly.
b) Power on the Product.
c) If the product displays “input NCK code”, this means the software is Network locked or SIM locked,
and can only be used with dedicated SIM card hence use the relevant SIM card or enter the phone
code if available.
d) Power on the product to launch the auto test.
A) Using Smart Diagnosis Tool to proceed with the test. For detail instruction of test with Smart
Diagnosis Tool, please refer to < Smart Diagnosis Manual > in support (CSS/RSH) website.
Please always use the latest version which can be downloaded from support website (CSS/RSH)
Below are the test items that are not involved in Smart Diagnosis Tool, please test them in MMI
test (follow part B in this chapter) for supplementary.
 Raw Data  Keyboard
 FM  OTGTEST
 GsensorCalibration  FingerPrint Test
 GPS  Calling
NOTE: There are 2 speakers shared (top & bottom) on Morgan 3G, the top speaker can work as both
receiver and speaker; You can check the separated top & bottom speaker’s function by following ways,
check the separated bottom speaker by testing sub MIC(sub MIC must work well) and check the
separated top speaker by testing receiver.
B) Manu test
Type “*#2886#” in dial pad to enter MMI test mode, you will then see the interface displaying the SW
version. Select “Auto” to start the auto test, or select “MANU” to do the MMI test manually.
If one of the tests fails during “Auto” test mode, it will display “Failed: xxx”. In this case, either press
‘Next’ to go on test or press ‘RETEST’ to retest this item or press ‘END’ to Power off.”
For detailed instruction of each test item, please refer to <MMI Test General User Guide> video
in support (CSS/RSH) website.
4.3.4. RF test instruction
Please refer to < RF (coupling) test user guide > in support website (CSS/RSH) for details.
5. Software download
Please use the dedicated software downloading tool (DL Tool) for this product. The DL Tool version of
this product is “SUGAR_FOR_FCM_V1.2.3” or above.
Please always use the latest version of the software downloading tool in order to take advantage of the
latest improvements. This DL tool can be downloaded from support website (CSS/RSH).
Please refer to <instructions of SUGAR Tool> video in support (CSS/RSH) website.
Note: Please use the latest version of SUGAR for the SW upgrade.
6. Disassembly and reassembly Morgan 3G

6.1. Disassembly tool
You may use the following tools during the disassembly and reassembly procedure:
Plastic flake Anti ESD Tweezers Pry Bar Screws driver
   
Electric screws driver SIM card pin Suction cup Solder iron
   
Hot wind gun Heating station
 
6.2. Disassembly process
Please refer to < Disassembly Process for Morgan 3G> in support website (CSS/RSH) for details.
Video path on RSH DL center :
2. The complete disassembly guide is described in the video for your reference, you can selectively
(except disassembly and assembly method which needs to be followed carefully) do some of those
steps according to the spare part which you need to replace.
3. Actual Spare Part List depends on the CU reference. Please check with RSH website or SCS system
for the spare part list of specific CU.
6.3. Reassembly process
Please make reference to the disassembly process for assembly reverse an order of the disassembly
steps.
Attention:
1) While weld vibrator on the sub PCBA, please pay attention to the welding directions;
2) Pay attention that the 2 speakers (Top & Bottom) are shared; while assemble them on the front
casing please refer to following direction.
3) Before assemble main PCBA on the front casing, make sure that AI key FPC & sub MIC rubber had
assembled well on the front casing; and audio rubber, front camera & rear camera had assemble
well on the main PCBA.
4) While assemble main PCBA on the front casing, it is suggested to be assembled from left to right as
below:
5) While replace a new Furnished Frame WIFI Antenna, please assemble a new Up Furnished
Speaker FPC on the Furnished WIFI Antenna Frame correctly before assembly, or top speaker will
not work properly:
Note: Do not touch to dirty

the Metal area manually.
Assemble the SPK FPC on the ANT

frame via location post & frame by
using tweezers.
2
Press SPK FPC from left(right) to right(left) at least

3 times by using electrostatic finger sleeve to
ensure fully contact with the frame
Please have a check after assembly:
Status Sample pic
Note: SPK FPC must

Location post Location frame be aligned with the
OK location post and
OK frame as pic shown.
6) While replace a new Furnished Main Antenna Frame, please assemble a new Furnished SPK FPC
B on the Furnished Main Antenna Frame correctly before assembly, or Bottom speaker will not
work properly.
Location post and line
Note: Do not touch to

dirty the Metal area
manually.
Assemble the SPK FPC on the ANT

frame via location post & line by using
tweezers.
Press SPK FPC from left (right) to right(left) at

least 3 times by using electrostatic finger sleeve to
ensure fully contact with the frame.
Please have a check after assembly:
Status Sample pic
Note: SPK FPC must

Location line be aligned with the
OK location post and line
Location post
as pic shown.
OK
7. L2 trouble shooting
This chapter describes the Level 2 repair that can be done without any diagnostic equipment.
Please refer to <General L2 trouble shooting V1.2> in support (CSS/RSH) website for details.
Note:
1) As U402 chip is dispensing on 5006A_D_G, it is suggested to protect it by using High temperature

adhesive while replacing the components nearby;
PN Description
9004-010000-000S High temperature adhesive, Huaguang HGKA-105, 10mm *33mm,,,,
2) Pay attention that 5006A_D_G have 2 shared speakers (top & bottom), the top speaker can work
as both receiver and speaker; You can check the separated bottom speaker by testing sub MIC and
check the separated top speaker by testing receiver.
3) As 5006A_D_G don’t have NFC function, please just skip when doing the Level 2 repair;
4) As 5006A_D_G LCD and TP are integrated together, please pay attention the LCD connector and
the TP connector are shared when doing the LCD/TP issue;
5) While doing BT/WIFI/GPS issue, please add a welding tin dot check in the process, if the tin dot is
NOK, please weld the 2 dots together.
Status Sample pic
OK
NOK
6) In case the Level 2 repair can’t solve the problem, for L2 repair center, please exchange the PCBA.
8. PCBA exchange
For L2 repair center, if Level 2 repair does not solve the failure, it is mandatory to change the PCBA and
follow the process as below.
Please DO upgrade software and test again before exchanging the PCBA.
1) Collect the PCBA (without accessories, LCD and camera). MIC should be enclosed when you
exchange the PCBA.
2) Fill in the record sticker with IMEI number, fault code, short code, Hardware Technical Level and
software version.
3) All the defective PCBAs should be sent to RSH. If RSH send defective PCBAs for L3 repair, please
DO follow the packaging requirement mentioned in TN14011.
9. Functional Re-test
During the function re-test, the following items must be checked and validated.
1) Cosmetic aspect of the handset.
2) Upgrade software to latest version.
3) Switch on the handset, go to default welcome message.
4) Enter “*#2886#” at the dial mode to start the MMI test or using Smart Diagnosis Tool to do the test.
5) Perform a RF test according to the instruction and scripts available in the support website.
Feel free to contact your technical support should you need further information.
Thank you for your cooperation.
TCL Communication Ltd.
Global Customer Service TS Dept.

Morgan 3G - 5006A - D - G L1 L2 Service Manual V2.0 EU

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Morgan 3G - 5006A - D - G L1 L2 Service Manual V2.0 EU

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L1&L2 Service Manual TCL Communication Ltd.

Rev. Date Modification description Prepared By Checked By Approved By

V1.0 2019-05-19 Preliminary Draft Lianqing. XU Willow Chen Eason Wang

Project name Morgan 3G

1.2.1. Commercial Label

1) Printing Zone definition (For general 52×27+11×1.5+41×1.5mm)

2) Commercial Label example

1) Printing zone definition (73x38 mm)

1.2.3. IMEI label print instruction

Item Picture Remark

Battery test information :

2.1. L1 repair process

Test OK Pre test & failure confirm Test NG

Accessory replacing SW upgrading

Factory Reset Yes

2.2. L2 repair process

Remind user to GDPR notice: Personal data must be

Pre test & failure confirm

** Do Battery test in this step.

It is recommended the followings:

1) Handset with full power

2) One SIM card/SD card

3) One PC with below configurations

3.2. ESD safety

Do not start the disassembly process if

ESD set up for the workbench in the work

ESD glove ESD smock ESD wrist strap ESD shoes

Click-through steps Description

Input *#06# in the dial pad To check the IMEI number

Input *#2886# in the dial pad Enter MMI test

Input *#3228# in the dial pad Check current software version

4.2. Warranty check

free of charge in TCL authorized Repair center.

4.2.2. Proof of purchase

1) Check the warranty status of the product on Proof Of Purchase (POP).

2) Check the manufacturing date, there are three ways to check:

4.2.3. IMEI Check

➢ There’re three ways to check the IMEI:

2) Open dial pad and type “*#06#”;

Way2. Checks the SIM card appearance, details are as follows:

SIM card type Part Number Color Picture Sample

BQA1NE0L21C0 Metallic Rose

BQA1NE0A11C0 Anthracite Black

Dual card BQA1NE0A02C0 Volcano Black

On the battery cover:

On the SIM tray:

4.2.4. Humidity sensitive label

Humidity sensitive label check:

1) Liquid was detected by humidity sensitive label.

2) Position of humidity sensitive sticker

4.2.5. Liquid damage indicator policy

4.3. Product test

4.3.1. Recovery mode

5) Select “reboot system now” and press

4.3.2. Factory Reset

4.3.3. Function test (MMI test & SDT test)

b) Power on the Product.

d) Power on the product to launch the auto test.

 Raw Data  Keyboard

 GsensorCalibration  FingerPrint Test

4.3.4. RF test instruction

this product is “SUGAR_FOR_FCM_V1.2.3” or above.

Please refer to <instructions of SUGAR Tool> video in support (CSS/RSH) website.