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✓ Cdbp
D
Vin Cgdp Vout
✓
Cgdn
✓ ✓
D Cdbn
G B
✓ ✓
Cint Cgb
S
Cgsn Csbn
✓ + C ✓ + C ✓ + C ✓ + C ✓ + C✓
Cload = Cgdn gdp dbn dbp int gb
G B
iC= iDp- iDn
D iDp
Vin Vout
iDn iC
D
G B
Cload
S
VOH
VOL
t
τPHL= t1 - t0 τPLH = t3 - t2
Vout
VOH
V50% Avg Prop Delay
τ PHL + τ PLH
τP =
2
VOL
t0 t1 t t
t2 3
V50% = VOL +0.5 [VOH - VOL] = 0.5 [VOL +VOH]
Kenneth R. Laker, University of Pennsylvania
OUTPUT VOLTAGE RISE & FALL TIMES 5
V10%
VOL
tA t
tB tC tD
V10% = VOL +0.1 [VOH - VOL]
V90% = VOL +0.9 [VOH - VOL]
Vin
QUICK ESTIMATES: VOH
VDD
S
G B
VOH τPHL= t1 - t0 2 dt
VOH - VT0n
V50%
for VOH − VT 0 n < Vout ≤≥ VOH
VOL
t
t0 t1’ t1
t = t1
Vout = V50%
1
∫ dt = −2 C load ∫ 2 dVout
t = t '1 Vout =VOH −VT 0 n k n [ 2(VOH − VT 0 n )Vout − Vout ]
t1 − t = −
'
C load 2 VT 0 n 2(VOH − VT 0 n )
= + ln − 1
k n (VOH − VT 0 n ) VOH − VT 0 n V50%
C load 2 VT 0 n 2(VOH − VT 0 n )
= + ln − 1
k n (VOH − VT 0 n ) VOH − VT 0 n V50%
C load 2 VT 0 n 4(VOH − VT 0 n )
τ PHL = + ln − 1
k n (VOH − VT 0 n ) VOH − VT 0 n VOH + VOL
C load 2 VT 0 n 4(VDD − VT 0 n )
τ PHL = + ln − 1
k n (VDD − VT 0 n ) VDD − VT 0 n VDD
(VGS − VT 0 n )2 (4V) 2
VOH - VT0n = 4 V
VOH = 5 V
dt 2 V10%
VOH = 5 V t
t0 tsat t2
dVout kn 20 x10 −6 A/V2 (10)
=− ( Vin − VT 0 n ) = −
2
(5 − 1) 2
dt 2 Cload 2(1x10−12 F)
= −1.6 x10 −9 V/s
VOH = 5 V
C load 1 2(Vin − VT 0 n ) − V10%
t 2 − t sat = ln
k n (Vin − VT 0 n ) V10%
VOH = 5 V
1x10 −12 F 1 2(5 − 1) − 0.5
= ln = 3.385 ns
20 x10 A/V (10) (5 − 1)V
−6 2
0.5
C load 2 VT 0 n 2(VOH − VT 0 n )
τPHL = + ln − 1
k n (VOH − VT 0 n ) VOH − VT 0 n V50%
FOR CMOS INV: VOL = 0, VOH = VDD
C load 2 VT 0 n 4(VDD − VT 0 n )
τ PHL = + ln − 1
k n (VDD − VT 0 n ) VDD − VT 0 n VDD
C load 2 | VT 0 p | 4(VDD − | VT 0 p |)
τ PLH = + ln − 1
k p (VDD − | VT 0 p |) VDD − | VT 0 p | VDD
C load 2 VT 0 n 4(VDD − VT 0 n )
τ PHL = + ln − 1
k n (VDD − VT 0 n ) VDD − VT 0 n VDD
where &
SAT: VDS,L = VDD - Vout > 0 - VT,L => Vout < VDD + VT,L
kn,L
[ − VT,L (Vout )]
2
ID , L =
2
LIN: VDS,L = VDD - Vout < 0 - VT,L => Vout > VDD + VT,L
kn,L
ID , L =
2
[ T,L out DD out
2(− V (V ))(V − V ) − (VDD − Vout ) 2
]
Kenneth R. Laker, University of Pennsylvania
22
Vout,Vin
iDp Vout VDD
Vin Vin,90%
iDn iC
Cload Vin,10% t
τf τr
EMPERICAL DELAY
VDD CORRECTIONS FOR INPUT τr, τf:
τ
2
τ PHL (actual) = τ P HL 2 (step− input) + r
2
Vin iDp Vout
τ
2
where
C load 2 | VT 0 p | 4(VDD − | VT 0 p |)
τ PLH = + ln − 1
k p (VDD − | VT 0 p |) VDD − | VT 0 p | VDD
where
EXAMPLE 6.3 25
dt 2 Ln
Vout =1
−9 1 dVout
τ delay = 2.0 x10 s = −2 Cload Wn Vout∫ =4 [ 2(VOH − VT 0 n )Vout − Vout
2
]
µ n C ox
Ln
1 1 Vout Vout =1
= −2 C load Wn 2(VOH − VT 0 n ) ln 2(VOH − VT 0 n ) − Vout Vout =4
µ n C ox
Ln
Wn 1x10−12 F 1
= −9 −6 2 ln(7) = ln(7) = 8.108
L n (2.0 x10 s)(30 x10 A/V )(4) (2.0)(0.03)(4)
Kenneth R. Laker, University of Pennsylvania
27
Wn
= 8.108 , Ln = 1µm => Wn = 8.108 (1 µm) = 8.1 µm
Ln From τdelay spec.
STEP #2: Satisfy the Vth constraint, where:
VT 0 n +
1
kR
( VDD + VT 0 p ) 1.0 V+
1
kR
( 5 + (−1.5)) V
Vth = =
1 1
1 + 1 +
kR kR
1
1.0 V+ (3.5) V 9
kR => k = (1.5) 2
=
= = 2V R
1 4
1 +
kR
µ n C ox ( W/L )n 30 Wn Wn 9 4
kR = = =3 = => Wp = (3)Wn
µ p C ox ( W/L )p 10 Wp Wp 4 9
4
with Lp = 1 µm Wp = (3)8.1µ m = 10.8µ m
Kenneth R. Laker, University of Pennsylvania 9
CMOS RING OSCILLATOR 28
1 V1 2 V2 3 V3
V50%
VOL t
τPHL2 τPHL1 τPLH3
τPLH3 τ τPHL1
PHL2
V50%
VOL t
τPHL2 τPHL1 τPLH3
τPLH3 τ τPHL1
PHL2
T
Cload,1 = Cload,2 = Cload,3 and INV1 = INV2 = INV3
T = τPHL2 + τPLH3 + τPHL1 + τPHL2 + τPLH3 + τPHL1 = 6τP
1 1 1
f= = = Oscillation FREQ
T 2(3)τ P 6τ P
For n INVERTERS:
1 1 1
f= = or τP =
T 2 n τP 2 nf
Kenneth R. Laker, University of Pennsylvania
ESTIMATION OF INTERCONECT PARASITICS 30
MET
L
Current
W Flow
t
h SIO2
SUB
PARASITIC RESISTANCE:
L L
R metal = ρ = R sheet
Wt W
CPP
FF = Ctotal/CPP -> FRINGING-FIELD FACTOR
FF -> INC as t/h -> INC, W/h <- DEC, and W/L -> INC
(SEE PLOT FF in FIG. 6.18 of TEXT)
t
W− 2π
C total = ε 2+ pF/µm L for W > t/2
h 2h 2 h 2 h
ln1 + + +2
t t t
t
W π 1 − 0.0543
2h
C total = ε + + 1.47 pF/µm L
h ln1 + 2 h + 2 h 2 h + 2 for W < t/2
t t t
Kenneth R. Laker, University of Pennsylvania
32
W
L
C
int
W
int
t
oxF
C C
p-sub oxFt oxFt C
pa
substrate field ox
Layer Cap Ox Thickness Typ Value
A Poly-substrate Cp 3000 Å 50 aF/µm2 1 µm CMOS
B Metal2-sub Cm2 9000 Å 20 aF/µm2 Capacitances
C Poly-metal2 Cm2p 6000 Å 30 aF/µm2 tox = 200Å
D Metal1-sub Cm1 6000 Å 30 aF/µm2 Cg = 1800 aF/µm2
E Metal1-poly Cm1p 3000 Å 60 aF/µm2 aF = 10-18 F
E Metal1-metal2 Cm2m1 6000 Å 50 aF/µm2
F Metal1-diffusion Cm1d 3000 Å 60 aF/µm2
G Metal2-diffusion Passivation 6000 Å 30 aF/µm2
Kenneth R. Laker, University of Pennsylvania
32
A B
Zout Zc
VA
τdelay
t
VB |Zout| << |Zc|
τbuffer + τflight τrise τsettle
t
Kenneth R. Laker, University of Pennsylvania
35
ROUTE-LENGTH DESIGN GUIDE
To ignore the RC delay of interconnect, τW << τPgate
emperical formula
L = length of route
r = sheet resistance
c = cap per unit length
EXAMPLE: Consider a minimum width metal1 route to a node
with an associated gate delay of 200 ps.
GUIDELINES FOR IGNORING
RC DELAYS (Weste, pp 205)
Layer Max Length (LW)
metal3 10,000 λ
metal2 8000 λ
metal1 5000 λ
Conservatively, LW < 5000λ
silicide 600 λ
λ = design rule parameter
poly 200 λ
Kenneth R. Laker, University of Pennsylvania diffusion 60 λ
36
POWER DISSIPATION
Vin, Vout
S VOH
G B
VOL t
iC T/2 T
nMOS nMOS
ON ON
t
pMOS
ON
1 0 1 VDD
Pd = ∫ − C load Vout (t)dVout + ∫ C load ( VDD − Vout (t)) dVout
T VDD T 0
1 Vout2
Vout =0 V 2
Vout = VDD
= − C load Vout =VDD + C load VDD Vout −
out
Vout = 0
T 2 2
Kenneth R. Laker, University of Pennsylvania
1
2 2 39
Vout Vout =0 Vout Vout =VDD
Pd = − C load + C load VDD Vout −
Vout =VDD Vout =0
T 2 2
1
= 2
C load VDD
T
Pd = C load VDD
2
f
pMOS
Logic
iDp Vout
iDn iC
nMOS Cload
Logic
&
VDD
iDD(t) Power Meter
+
Cy Vy
is βis
Ry
Vs = 0 +
−
−
is(t) = iDD(t) Vy(0) = 0
Periodic Input DEVICE dVy Vy
or Cy = β iS −
T = Period dt Ry
CIRCUIT Cload