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Upgrading to
Micro-Volume Dispensing Jeffrey Fugere, DL Technology, Haverhill, Mass.
T
assembly continues. For the Where manufacturers attempt
most popular electronic dot sizes below 12 mils with these
applications (PCs, pagers, pumps, “babysitting” of the
cell phones), circuit densities equipment is typically required
are increasing, while compo- for any hope of success, and
nent and package sizes are rejects can be significant.
getting smaller — all in an effort to
pack more functionality into avail- Microcomponents mandate
able real estate. For area array micro-volume dispensing
devices, such as ball grid arrays This means three things.
(BGAs), chip scale packages (CSPs), First, a pump with the elec-
and flip chips, dispensing materials Figure 1: DispenseLink control system for micro- tro/mechanical design and pro-
like conductive epoxies and solder volume pump. grammable control is needed to
paste, often calls for dot sizes approach-
ing 10 mils (0.010 in.) in diameter. Conventional dispensing pumps
Diameters less than 10-mils, in fact, are Conventional dispensing
not uncommon. pumps, regardless of the configu-
ration, needle size and technique,
are hard-pressed to achieve dot
PREVIEW sizes below 12 mils (0.012 in.). In
addition to achieving this dot size,
MICRO-VOLUME DISPENSING the challenge is to maintain upper
CAN BE ACHIEVED BY and lower limits for 3-sigma per-
formance in terms of accuracy
UPGRADING THE PLATFORM and repeatability. Conventional
pumps are acceptable for dispens-
WITH A MICRO-VALVE PUMP, ing adhesives, solder paste and
CONICALLY CHAMFERED epoxies in mounting most leaded
devices, where volumes are larger
NEEDLES AND A and some tolerance variation can
be accepted. For the precise vol-
PROGRAMMABLE, CLOSED- umes required for micro-dispens-
LOOP INTERFACE. ing (0201 devices, BGAs, CSPs Figure 2: Connection of DispenseLink control box to
and flip chips), however, such micro-volume pump and standard platform.
Upgrading to Micro-Volume Dispensing
Exp. 1-28-04 Reprinted from Electronic Packaging/Production, March 2003 by RSiCopyright. 304682
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