Status Report for MAVBB_COM MF-SRM-230-v1.

Project Name MAVBB_COM Reported by P. Srinivas

Reporting Period From 30/Sep/21 Date of Reporting 27/Oct/21

To 26/Oct/21 < dd/mmm/yy >

Quantitative Project Management (QPM) Objectives**:

Objective Target Frequency Actual Achieved Remarks

(Upto now)
Agile_Sprint Mean: Sprint Wise Mean: Metric Report
Productivity SD: SD: Path

% Task Completion Mean: Monthly Mean: Metric Report

SD: SD: Path

% of Rework Due to Mean: Each Phase (After V&V) Mean: Metric Report
V&V SD: SD: Path

V&V_Code Review Mean: After V&V Implement ion Mean: Metric Report
Defect Density SD: Phase SD: Path

V&V_System Testing Mean: After V&V Testing Phase Mean: Metric Report
Defect Density SD: SD: Path

Milestones:

S. Project Planned Actual Delay

No Milestones Start End Start End (Days) Status( Remarks
Date Date Date Date %)
1 Implementation , 05 Dec 05 Jul 05 05 50 100 PCB received and
PCB design and 2020 2021 Dec Sep testing completed.
testing of ARINC 2020 2021 LS1043 interface in
429, MIL 1553
progress.
2 LS1043A Board 20 Dec 31 20 05 26 100 Board received and
bring up 2020 Mar Dec May is UP. Board
2021 2020 2021 received in March.
3 PCIe RP-EP 20 Sep 30 20 25 Test setup
testing 2021 Nov Sep identified. RC test
2021 2021 cases preparation in
progress.
4 OpenVPX based 12 Aug 15 2 Aug 45 SOM schematic
MPC design Nov 21 completed. Carrier
21
2021 board to be
initiated.
5
6

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 Status Report for MAVBB_COM MF-SRM-230-v1.3

Status of Planned Tasks for the reporting period:

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 Status Report for MAVBB_COM MF-SRM-230-v1.3

S. No/ Description of Planned Planned Actual Actual Status /

Task Task Start End Start End Remarks
ID
1 SI for AFDX 20 Sep 21 30 Sep 20 Sep 21 Oct General
EP board and 21 21 21 guidelines
MPC SOM prepared for
pre-layout
stage.
2 Main Processor 12 Aug 21 14 Oct 12 Aug Schematic is
Card (MPC) 21 21 completed on
SOM 26th Oct.
Schematic Internal
review in
progress.
Will be
completed by
30th Oct.

Tentative
floor
planning
completed.
PCB stack up
support
discussed
with
Micropack.
Review in
progress.

3 Thermal 02 Aug 21 15 Nov 02 Aug For

Analysis of 21 21 conduction
MPC cooled
mechanical
design as per
VPX,
forwarded
standards for
study. Mech.
team
resources to
be allocated
for design
support.

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 Status Report for MAVBB_COM MF-SRM-230-v1.3

4 PCB level 20 Oct 21 05 Nov 20 Oct Case study to

thermal 21 21 evaluate Hypl
analysis tool Thermalsim
comparison Vs Accusolve
is taken up.

Discussed
with Altair
on PollEx
and Electrflo
tools.
5 PCIe RC – EP 08 Oct 21 10 Nov 08 Oct TI processor
test setup 21 21 AM5728
identification based
Beagleboard
procurement
in process.
Interface
adapter
design is in
progress.
6 MPC Carrier 28 Oct 21 05 Nov Will be taken
Board design 21 up in this
week.

Major Activities Planned for next month:

S. No/ Task Description of Tasks Target Date of

ID Closure
< dd/mmm/yy >
1 Main Processor Card Layout 22nd Nov 2021
2 Main Processor Card Post-layout analysis 22nd Nov 2021
2 Thermal design of MPC with SOM 15th Nov 2021
3 RC – EP PCIe testing 30st Nov 2021
4 Carrier Board Schematic 19th Nov 2021

Open issues/ Areas of concern DDR4 interface and HS Serial I/O PCB design

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 Status Report for MAVBB_COM MF-SRM-230-v1.3

**QPM Objectives Operational Definitions: http://mis/wiki/tiki-index.php?page=Operational%2BDefinitions

Design Team:
1. Agile_Sprint Productivity = Actual Sprint Efforts/Story Points
2. %Task Completion = Actual finished tasks in a Month*100 / No.of tasks planned to be finished in a
month
3. % of Rework Due to V&V = (A+B)*100/(A+B+C)
A: V&V Closures Efforts by Design team
B: Closures Verification Efforts by V&V team
C: Design team Actual Efforts upto Internal Testing Phase
4. V&V_Code Review Defect Density=(No. of defects found in V&V Code Review)/(Modified
ELOC/1000)
5. V&V_System Testing Defect Density=(No. of defects found in V&V System Testing)/(Modified
ELOC/1000)

V&V: V&V QPM Monitoring data will be presented along with department specific V&V status report

Mean: Average
SD: Standard Deviation

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