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• Power Managerment in Telecom., Industrial Automation, CE
TO-263-3L
D
D
G
G
S S
Ordering Information
Device Package # of Pins Marking MSL TJ (°C) Media Quantity (pcs)
JMSH0804AE-13 TO-263-3L 3 SH0804A 1 -55 to 150 13-inch Reel 800
6 6
RDS(ON) (m)
VGS (V)
4 4
2 2
0 0
2 4 6 8 10 0 20 40 60 80
VGS (V) Qg (nC)
Thermal Performance
Parameter Symbol Typ. Max. Unit
Thermal Resistance, Junction-to-Ambient RJA 45 55 °C/W
Thermal Resistance, Junction-to-Case RJC 0.65 0.80 °C/W
Notes:
1. Computed continuous current assumes the condition of TJ_Max while the actual continuous current depends on the thermal & electro-mechanical
application board design.
2. This single-pulse measurement was taken under TJ_Max = 150°C.
3. This single-pulse measurement was taken under the following condition [L = 100H, VGS = 10V, VDS = 40V] while its value is limited by
TJ_Max = 150°C.
4. The power dissipation PD is based on TJ_Max = 150°C.
5. This value is guaranteed by design hence it is not included in the production test.
150 30
VGS = 10V VDS = 5.0V
VGS = 6.0V
120 VGS = 5.5V 24
VGS = 5.0V VGS = 4.5V
90 18
ID (A)
ID (A)
TJ = 125°C
60 12
VGS = 4.0V
TJ = 25°C
VGS = 3.8V
30 6
0 0
0 0.4 0.8 1.2 1.6 2 1 2 3 4 5
VDS (V) VGS (V)
8 3
VGS = 10V
2.5 ID = 20A
6
Normalized RDS(ON)
2
RDS(ON) (m)
VGS = 10V
4 1.5
1
2
0.5
0 0
0 10 20 30 40 50 60 -100 -50 0 50 100 150 200
ID (A) Temperature (C)
Figure 3: RDS(ON) vs. Drain Current Figure 4: RDS(ON) vs. Junction Temperature
100 10000
Ciss
10 Coss
1000
Capacitance (pF)
TJ = 125°C
1
IS (A)
100
0.1
TJ = 25°C
Crss
10
0.01
0.001 1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 20 40 60 80
VSD (V) VDS (V)
150 180
150
120
120
90
ID (A)
PD (W)
90
60
60
30
30
0 0
0 25 50 75 100 125 150 0 25 50 75 100 125 150
TCASE (C) TCASE (C)
1000.0 500
Limited by
1.0s
RDS(ON)
100.0 400
10s
10.0 300
PD (W)
ID (A)
100s
1.0 200
1.0ms
10ms
TJ_Max = 150°C DC
0.1 100
TC = 25°C
0.0 0
0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100
VDS (V) Pulse Width (s)
Figure 9: Maximum Safe Operating Area Figure 10: Single Pulse Power Rating, Junction-to-Case
10
Duty Cycle = Ton/TPeak
TJ = TC + PD x ZJC x RJC
Thermal Resistance, ZJC
Normalized Transient
RJC = 0.65°C/W
0.1
Duty = 0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100
Pulse Width (s)
Package Outline
Package Outline
MILLIMETER
DIM.
MIN. NOM. MAX.
A 4.24 4.77
A1 2.30 2.89
E A2 0.00 0.10 0.25
C1
b 0.70 0.96
b1 1.17 1.70
C 0.30 0.60
C1 1.15 1.42
A
D1
D 14.10 15.88
D
A2
D1 8.50 9.60
A1 E 9.78 10.36
L1
b1
L 1.78 2.79
L1 1.75
L
e b C e 2.54
Recommend
Recommended Soldering Footprint
Footprint
10.41
7.01
15.99
1.10
3.50
5.08
DIMENSIONS: MILLIMETERS