Professional Documents
Culture Documents
Certified that the candidate was examined by using the Project Viva-Voce examination
Held on _____________
ABSTRACT
ACKNOWLEDGEMENT
convey our sincere thanks and gratitude to the management of our college and our beloved
Chairman Mr. V.NARAYANASAMY, who has provided all the facilities to us.
We would like to express our sincere thanks to our beloved Vice Chairman
We are also grateful to the Head of Department Mr. P. THIRUMOORTHY M.E., for
his constructive suggestions & encouragement during our project which leads to the successful
With deep sense of gratitude, we extend our earnest & sincere thanks to our guide
We also express our indebt thanks to our Teaching and Non-Teaching Staff
TABLE OF CONTENTS
LIST OF ABBREVATIONS x
1 INTRODUCTION 1
2 PROPOSED SYSTEM 3
3 BLOCK DIAGRAM 5
4 COMPONENTS DESCRIPTION 7
4.4 TRANSFORMER 15
4.6 LCD 21
4.7 LED 22
4.12 WI-FI 28
4.13 DC MOTOR 29
5 CIRCUIT DIAGRAM 33
6 PROGRAM 36
7 SOFTWARE 45
7.5 C COMPILER 52
7.6 MP LAB 52
8 CONCLUSION 55
9 BIBLIOGRAPHY 57
10 PHOTO GRAPHY 59
11 PROJECT ESTIMATION 61
viii
LIST OF FIGURES
4.12 WI-FI 28
4.13 DC Motor 29
10.1 Photography 60
x
LIST OF ABBREVIATIONS
DC - DIRECT CURRENT
AC - ALTERNATING CURRENT
SCR - SILICON CONTROLLER RECTIFIER
METAL–OXIDE–SEMICONDUCTOR FIELD-EFFECT
MOSFET -
TRANSISTOR
IGBT - INSULATED GATE BIPOLAR TRANSISTOR
V - VOLTAGE
PIV - PEAK INVERSE VOLTAGE
D - DIODE
IC - INTEGRATED CIRCUIT
VI - INPUT VOLTAGE
VO - OUTPUT VOLTAGE
GND - GROUND
IN - INPUT
OU - OUTPUT
PIC - PERIPHERAL INTERFACE CONTROLLER
CPU - CENTRAL PROCESSING UNIT
RISC - REDUCED INSTRUCTION SET COMPUTER
MHZ - MEGA HERTZ
RAM - RANDOM ACCESS MEMORY
MA - MICRO AMPS
PWM - PULSE WITH MODULATION
CCP - CAPTURE, COMPARE, PULSE WITH MODULATION
SSP - SYNCHRONOUS SERIAL PORT
BOR - BROWN-OUT RESET
POR - POWER-ON RESET
PWRT - POWER-UP TIMER
xi
2
CHAPTER – 2
PROPOSED SYSTEM
3
2.1 PROPOSED SYSTEM
In our project, we have proposed an idea that would control the
parameters automatically. Also, the cultivators can know the conditions of the
plant growth and control the parameters remotely using IoT technology. The
hydroponics cultivator can only monitor the necessary conditions required for
plant growth such as humidity, temperature, water level, and light intensity. The
cultivator can know the increase or decrease in necessary parameters and
control it. This system has a disadvantage because the user controls these
parameters if he is at a distance, since the system needs constant monitoring and
control the existing system doesn’t satisfy the control of this agriculture
completely.
4
CHAPTER – 3
BLOCK DIAGRAM
5
3.1 BLOCK DIAGRAM
6
CHAPTER – 4
COMPONENTS DESCRIPTION
7
4.1 POWER SUPPLY
A power supply is an electronic device that supplies electric energy to
an electrical load. The primary function of a power supply is to convert one
form of electrical energy to another and, as a result, power supplies are
sometimes referred to as electric power converters. Some power supplies are
discrete, stand-alone devices, whereas others are built into larger devices along
with their loads. Examples of the latter include power supplies found in desktop
computers and consumer electronics devices.
Every power supply must obtain the energy it supplies to its load, as well
as any energy it consumes while performing that task, from an energy source.
Depending on its design, a power supply may obtain energy from various types
of energy sources, including electrical energy transmission systems, energy
storage devices such as batteries and fuel cells, electromechanical systems such
as generators and alternators, solar power converters, or other power supply.
8
Bridge Rectifier Circuit with Working Operation and Their Types A
bridge rectifier circuit is a common part of the electronic power supplies. Many
electronic circuits require rectified DC power supply for powering the various
electronic basic components from available AC mains supply. We can find this
rectifier in a wide variety of electronic AC power devices like home appliances,
motor controllers, modulation process, welding applications, etc.
9
4.2 TYPES OF BRIDGE RECTIFIERS
Bride rectifiers are classified into several types based on these factors:
type of supply, controlling capability, bride circuit’s configurations, etc. Bridge
rectifiers are mainly classified into single and three phase rectifiers. Both these
types are further classified into uncontrolled, half controlled and full controlled
rectifiers. Some of these types of rectifiers are described below.
1. Single Phase and Three Phase Rectifiers
10
This bridge rectifier uses diodes for rectifying the input as shown in the
figure. Since the diode is a unidirectional device that allows the current flow in
one direction only. With this configuration of diodes in the rectifier, it doesn’t
allow the power to vary depending on the load requirement. So this type of
rectifier is used in constant or fixed power supplies.
3. Controlled Bridge Rectifier
11
The first stage of the circuit is a transformer which is a step-down type that
changes the amplitude of the input voltage. Most of the electronic projects uses
230/12V transformer to step-down the AC mains 230V to 12V AC supply.
12
Bridge Rectifier Operation
As we discussed above, a single-phase bridge rectifier consists of four
diodes and this configuration is connected across the load. For understanding
the bridge rectifier’s working principle, we have to consider the below circuit
for demonstration purpose. During the Positive half cycle of the input AC
waveform diodes D1 and D2 are forward biased and D3 and D4 are reverse
biased. When the voltage, more than the threshold level of the diodesD1 and
D2, starts conducting – the load current starts flowing through it, as shown as
red lines path in the diagram below.
13
4.3.1 TREE-TERMINAL VOLTAGE REGULATORS
Fig shows the basic connection of a three-terminal voltage regulator IC to
load. The fixed voltage regulator has on unregulated DC input voltage, VI,
applied to one input terminal, a regulator output DC voltage, VO, from a second
terminal, with the third terminal connected to ground.
For a selected regulator, IC device specifications list a voltage range over
which the input voltage can vary to maintain a regulator output voltage over a
range of load current. The specification also lists the amount of output voltage
change resulting from a change in load current (load regulator) or in input
voltage (line regulator).
15
4.5 PIC 16F877A MICROCONTROLLER
16
PERIPHERAL FEATURES
High sink/source current: 25mA
Timer0: 8-bit timer/counter with 8-bit pre scalar
Timer1: 16-bit timer/counter with pre scalar, can be incremented during
SLEEP via external crystal/clock
Timer2: 8-bit timer/counter with 8-bit period register, pre scalar and post
scalar
Capture, compare, PWM (CCP) module
Capture is 16-bit, max. Resolution is 12.5 ns
Compare is 16-bit, max. Resolution is 200 ns
PWM max. Resolution is 10-bit
8-bit, 5-channel analog-to-digital converter
Synchronous Serial Port (SSP) with SPI tm (slave)
Brown-out detection circuitry for Brown-out Reset (BOR)
17
SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by the CPU and
peripheral modules for controlling the desired operation of the device. These
registers are implemented as static RAM. The Special Function Registers can be
classified into two sets core (CPU) and peripheral. Those registers associated
with the core functions are described in detail in this section. Those related to
the operation of the peripheral features are described in detail in the peripheral
feature section.
TIMER0 MODULE
The Timer0 module timer/counter has the following features:
8-bit timer/counter
Readable and writable
8-bit software programmable pre scale
Internal or external clock select
Interrupt on overflow from FFH to 00H
Edge select for external clock
TIMER1 MODULE
The timer1 module timer/counter has the following features:
16-bit timer/counter (Two 8-bit registers; TMR1H and TMR1L)
Readable and writable (both registers)
Internal or external clock select
Interrupt on overflow from FFFFH to 0000H
RESET from CCP module trigger
Timer1 can be enabled/disabled by setting/clearing control bit TMR1ON
(T1CON<0>)
18
TIMER1 MODULE
The timer2 module timer has the following features:
8-bit timer (TMR@ register)
8-bit period register (both register)
Readable and writable (both registers)
Software programmable pre scalar (1:1, 1:4, 1:16)
Software programmable pre scalar (1:1, to 1:16)
Interrupt on TMR2 match of PR2
SSP module optional use of TMR2 output to generate clock shift timer2
can by shut-off by clearing control bit TMR2ON (T2CON<2>) to
minimize power consumption.
19
SPECIAL FEATURES OF THE CPU
These devices have a host of features intended to maximize system
reliability, minimize cost through elimination of external components, and
provide power saving operation modes and offer code protection:
Oscillator selection
RESET
Power-on reset (POR)
Power-up timer (PWRT)
Oscillator start-up timer (OST)
Brown-out reset (BOR)
Interrupts
Watchdog timer (WDT)
Sleep
Code protection
ID Locations
In-Circuit serial Programming
These devices have a watchdog timer. Which can be enabled or disable
using a configuration bit. It runs off its own RC oscillator for added reliability.
There are two timers that offer necessary delays on power-up. One is the
oscillator start-up Timer (OST), intended to keep the chip in RESET until the
crystal oscillator is stable. The other is the power-up Timer (PWRT), which
provides a fixed delay of 72ms (nominal) on power-up only. It is designed to
keep the part in RESET while the power supply stabilizes, and is enabled or
disabled using a configuration bit. With these two timers on-chip, most
applications need no external RESET circuitry. SLEEP mode is designed to
offer a very low current power-down mode. The user can wake-up from SLEEP
through external RESET, watchdog Timer wake-up, or through an interrupt.
Several oscillator options are also made available to allow the part to fit the
application.
20
4.6 LCD
A liquid-crystal display (LCD) is a flat panel display, electronic visual
display, or video display that uses the light modulating properties of liquid
crystals. Liquid crystals do not emit light directly.
LCDs are available to display arbitrary images (as in a general-purpose
computer display) or fixed images which can be displayed or hidden, such as
preset words, digits, and 7-segment displays as in a digital clock. They use the
same basic technology, except that arbitrary images are made up of a large
number of small pixels, while other displays have larger elements.
21
4.7 LED
A light-emitting diode (LED) is a two-lead semiconductor light source. It
is a pn-junction diode, which emits light when activated.]When a suitable
voltage is applied to the leads, electrons are able to recombine with electron
holes within the device, releasing energy in the form of photons. This effect is
called electroluminescence, and the color of the light (corresponding to the
energy of the photon) is determined by the energy band gap of the
semiconductor.
22
Each DHT11 sensors features extremely accurate calibration of humidity
calibration chamber. The calibration coefficients stored in the OTP program
memory. Internal sensors detect signals in the process in accordance with their
calibration coefficients. The single-wire serial interface system is integrated to
become quick and easy to use. The small size, low power, and signal
transmission distance up to 20 meters makes it useful in a variety of
applications and even the most demanding applications. The product is 4-pin
single row pin package. Convenient connections and special packages can be
provided according to users need.
Specification
Supply Voltage: +5 V
Temperature range :0-50 °C error of ± 2 °C
Humidity :20-90% RH ± 5% RH error
Interface: Digital
24
Noise spectrum: The intrinsic noise voltage or current as a function of
frequency. This can be represented in the form of a noise spectral density.
Nonlinearity: The RF-output is limited by the nonlinearity of the
Photodetector
4.10 RELAY
A relay is an electrically operated switch. Many relays use
an electromagnet to mechanically operate a switch, but other operating
principles are also used, such as solid-state relays. Relays are used where it is
necessary to control a circuit by a separate low-power signal, or where several
circuits must be controlled by one signal. The first relays were used in long
distance telegraph circuits as amplifiers: they repeated the signal coming in
from one circuit and re-transmitted it on another circuit. Relays were used
extensively in telephone exchanges and early computers to perform logical
operations. A small cradle relay often used in electronics. The "cradle" term
refers to the shape of the relay's armature. When an electric current is passed
through the coil it generates a magnetic field that activates the armature and the
consequent movement of the movable contact either makes or breaks
(depending upon construction) a connection with a fixed contact. If the set of
contacts was closed when the relay was de-energized, then the movement opens
the contacts and breaks the connection, and vice versa if the contacts were open.
When the current to the coil is switched off, the armature is returned by a force,
approximately half as strong as the magnetic force, to its relaxed position.
Usually this force is provided by a spring, but gravity is also used commonly in
industrial motor starters. Most relays are manufactured to operate quickly. In a
low-voltage application this reduces noise; in a high voltage or current
application it reduces arcing.
Relays with calibrated operating characteristics and sometimes multiple
operating Automotive-style miniature relay, dust cover is taken off. If the coil is
25
designed to be energized with alternating current (AC), some method is used to
split the flux into two out-of-phase components which add together, increasing
the minimum pull on the armature during the AC cycle. Typically, this is done
with a small copper "shading ring" crimped around a portion of the core that
creates the delayed, out-of-phase component, which holds the contacts during
the zero crossings of the control voltage.
26
SPDT (Single-Pole Double-Throw) relays have a single set of Form
C, break before make or transfer contacts. That is, a common terminal connects
to either of two others, never connecting to both at the same time. Including two
for the coil, such a relay has a total of five terminals.
DPST – Double-Pole Single-Throw relays are equivalent to a pair of
SPST switches or relays actuated by a single coil. Including two for the coil,
such a relay has a total of six terminals. The poles may be Form A or Form
B (or one of each; the designations NO and NC should be used to resolve the
ambiguity).
DPDT – Double-Pole Double-Throw relays have two sets of Form
C contacts. These are equivalent to two SPDT switches or relays actuated by a
single coil.
27
Then the output signal is given to filter section in which the noise signal
in the output is filtered. The filter section is constructed by the LM324
operational amplifier and the capacitor C1 and C2. Then the noise free signal is
given to comparator in which the PH level is compared with reference level then
the final voltage given to gain amplifier in which the variable resistor is
connected in the feedback path. Then final gain voltage is given to related
circuit in order to find the PH level in the water.
4.12 WI-FI
Wi-Fi is wireless communication devices based on IEEE 802.11
standards, most commonly used Wi-Fi module are ESP8266, which is a low-
cost Wi-Fi microchip with full TCP/IP stack and microcontroller capability.
This module can be integrated with any mobility devices. Wi-Fi can be used to
connect to the internet and send data to cloud reliably.
28
makes it hugely powerful and flexible. The ESP8266 was launched in 2014 and
is rapidly growing in popularity. There is only one ESP8266 processor but it is
found on many different breakout boards. These all differ in terms of which pins
are exposed and the size of the flash memory etc. These breakout boards have
evolved rapidly over the years and there is a lot of information to be found on
the web. This is both a blessing and a curse as some of the advice is outdated or
just plain wrong. As a result it took me 3 days before I could get it to do
anything! Some people are lucky but for me it was a battle to get anything
working.
4.13 DC MOTOR
A DC motor is any of a class of rotary electrical machines that converts
direct current electrical energy into mechanical energy. The most common types
rely on the forces produced by magnetic fields. Nearly all types of DC motors
have some internal mechanism, either electromechanical or electronic; to
periodically change the direction of current flow in part of the motor.
29
speed can be controlled over a wide range, using either a variable supply
voltage or by changing the strength of current in its field windings. Small DC
motors are used in tools, toys, and appliances. The universal motor can operate
on direct current but is a lightweight brushed motor used for portable power
tools and appliances. Larger DC motors are used in propulsion of electric
vehicles, elevator and hoists, or in drives for steel rolling mills. The advent of
power electronics has made replacement of DC motors with AC motors possible
in many applications.
30
1) L293D IC
2) 4 1 microfarad capacitor
3) 6 Header Male pins
Add Tip Ask Question Comment Download
5) Wires or female sockets
6) 2 Motors
7) Arduino (Any) to test the Driver
8) Computer with arduino IDE
9) Misc itmes like soldering iron, soldering Wire etc.
The L293D is a 16 pin IC, with eight pins, on each side, dedicated to the
controlling a motor. There are 2 INPUT pins, 2 OUTPUT pins and 1 ENABLE
pin for each motor L293D consist of two H-bridge. H-bridge is the simplest
circuit for controlling a low current rated motor.
Pin No. - Pin Characteristics
1 - Enable 1-2, when this is HIGH the left part of the IC will work and when it
is low the left part won’t work.
2 INPUT 1 HIGH 1
3 - OUTPUT 1, this pin should be connected to one of the terminals of motor
4, 5 - GND, ground pins
6 - OUTPUT 2, this pin should be connected to one of the terminals of motor
7 - INPUT 2, when this pin is HIGH the current will flow though output 2
8 - VCC2, this is the voltage which will be supplied to the motor.
16 - VCC1, this is the power source to the IC. So, this pin should be supplied
with V
15 - INPUT 4, when this pin is HIGH the current will flow though output 4
14 - OUTPUT 4, this pin should be connected to one of the terminals of motor
13, 12 - GND, ground pins
11 - OUTPUT 3, this pin should be connected to one of the terminal of motor
10 - INPUT 3, when this pin is HIGH the current will flow though output 3
31
9 - Enable 3-4, when this is HIGH the right part of the IC will work and when it
is l the right part won’t work.
The motor driver IC deals with heavy currents. Due to so much current
flows the IC gets heated. So, we need a heat sink to reduce the heating.
Therefore, there are 4 ground pins. When we solder the pins on PCB, we get a
huge metallic area between the grounds where the heat can be released.
The DC motor is an inductive load. So, it develops a back EMF when
supplied by a voltage. There can be fluctuations of voltage while using the
motor say when sudden we take a reverse while the motor was moving in some
direction. At this point the fluctuation in voltage is quite high and this can
damage the IC. Thus, we use four capacitors that help to dampen the extreme
variation in current. Now depending upon the values of the Input and Enable the
motors will rotate in either clockwise or anticlockwise direction with full speed
(when Enable is HIGH) or with less speed (when Enable is provided with
PWM).Let us assume for Left Motor when Enable is HIGH and Input 1 and
Input 2 are HIGH and LOW respectively then the motor will move in clockwise
direction.
32
CHAPTER – 5
CIRCUIT DIAGRAM
33
5.1 CIRCUIT DIAGRAM
There are three main parts in a vertical hydroponics farm: sensor
interface, microcontroller and hardware. In the sensor interface section, there
are four sensors: pH sensor, water level sensor, air temperature and humidity
sensor and light sensor. This sensor interface section is connected to ESP32
microcontroller through GPIO port. A four-channeled relay is also connected
with the ESP32 microcontroller. Hardware section consists of a fan, a nutrient
pump, a lighting system and a water pump. The hardware components are
connected to the four-channeled relay as an output. There is a display connected
to the ESP32 microcontroller. By using a router gateway, data can be stored in a
cloud server. By using a mobile application, the data can be shown on the
display and the owner can control the hardware components with his/her mobile
phone.
34
Firstly, on the circuit an LCD is connected to ESP32 microcontroller.
SCL and SDA of the LCD 12v system are connected to ESP32 through data
pins D22 and D21 respectively. Two resistors R8 (4.7 K) and R9 (4.7 K) are
used here for pull up. Secondly, an LDR is connected to data pin D19 of ESP32
board and a resistor R7 (10 K) is used for pull down. Thirdly, there is a buzzer
in the circuit for alarm system. The negative pole of the buzzer is connected to
the ground of ESP32 through VIN pin and positive pole is connected to D4 pin
of ESP32. The D4 pin has been pulled down by a resistor R6 (1 K). For the
buzzer, a T1 2N2222 amplifier is used to amplify the sound. Fourthly, a DHT11
censor is used in the system which is connected to ESP32 through D15 pin.
Fifthly, there is a water level censor here which is connected to D34 pin of
ESP32 board.
The negative pole of the water level censor is connected to the ground of
ESP32 through a GND pin and positive pole is connected to 3.3 V pin of
ESP32. Sixthly, there are 4 buttons (S1, S2, S3 and S4) used in the system for
the controlling of different devices i.e., S1 for fan, S2 for nutrient pump, S3 for
lighting system, and S4 for water pump. These 4 buttons are connected to
ESP32 through 4 pins: S1 through D35, S2 through D32, S3 through D33 and
S4 through D25. To pull down these pins, 4 resistors are used: R1 (10 K) for
D35, R2 (10 K) for D32, R3 (10 K) for D33 and R4 (10 K) for D36. Seventhly,
a 4 channeled (ln1, ln2, ln3 and ln4) relay is used in the system which is
connected to ESP32 through 4 pins: ln1 through D27, ln2 through D14, ln3
through D12 and ln4 through D13. Two pumps, one fan and a lighting system
are connected to the relay each of which has a potential of 12 V.
35
CHAPTER – 6
PROGRAM
36
6.1 PROGRAM
#include <ESP8266WiFi.h>
#include <DallasTemperature.h>
#include <OneWire.h>
#include "DHT.h"
#include "Adafruit_MQTT.h"
#include "Adafruit_MQTT_Client.h"
#include <ArduinoJson.h>
WiFiClient client;
String text;
int jsonend = 0;
37
boolean startJson = false;
#define dht_dpin D4
OneWire oneWire(ONE_WIRE_BUS);
DallasTemperature sensors(&oneWire);
38
Adafruit_MQTT_Client mqtt(&client, MQTT_SERV, MQTT_PORT,
MQTT_NAME, MQTT_PASS);
Adafruit_MQTT_Publish Moisture =
Adafruit_MQTT_Publish(&mqtt,MQTT_NAME "/f/Moisture"); // Moisture is
the feed name where you will publish your data
Adafruit_MQTT_Publish Temperature =
Adafruit_MQTT_Publish(&mqtt,MQTT_NAME "/f/Temperature");
Adafruit_MQTT_Publish Humidity =
Adafruit_MQTT_Publish(&mqtt,MQTT_NAME "/f/Humidity");
Adafruit_MQTT_Publish SoilTemp =
Adafruit_MQTT_Publish(&mqtt,MQTT_NAME "/f/SoilTemp");
Adafruit_MQTT_Publish WeatherData =
Adafruit_MQTT_Publish(&mqtt,MQTT_NAME "/f/WeatherData");
void setup()
Serial.begin(9600);
delay(10);
dht.begin();
sensors.begin();
mqtt.subscribe(&LED);
mqtt.subscribe(&Pump);
39
pinMode(motorPin, OUTPUT);
pinMode(ledPin, OUTPUT);
pinMode(ldrPin, INPUT);
digitalWrite(ledPin, HIGH);
text.reserve(JSON_BUFF_DIMENSION);
Serial.println("Connecting to ");
Serial.println(ssid);
WiFi.begin(ssid, pass);
delay(500);
Serial.println("");
Serial.println("WiFi connected");
void loop()
MQTT_connect();
40
if (millis() - lastConnectionTime > postInterval) {
lastConnectionTime = millis();
makehttpRequest();
//}
digitalWrite(ledPin, HIGH);
Serial.println(ldrStatus);
else {
digitalWrite(ledPin, LOW);
Serial.println(ldrStatus);
Serial.print(moisturePercentage);
Serial.println("%");
41
if (moisturePercentage < 35) {
temperature = dht.readTemperature();
humidity = dht.readHumidity();
//Serial.print("Temperature: ");
//Serial.print(temperature);
//Serial.println();
//Serial.print("Humidity: ");
//Serial.print(humidity);
//Serial.println();
sensors.requestTemperatures();
soiltemp = sensors.getTempCByIndex(0);
// Serial.println(soiltemp);
42
const size_t bufferSize = 2*JSON_ARRAY_SIZE(1) +
JSON_ARRAY_SIZE(2) + 4*JSON_OBJECT_SIZE(1) +
3*JSON_OBJECT_SIZE(2) + 3*JSON_OBJECT_SIZE(4) +
JSON_OBJECT_SIZE(5) + 2*JSON_OBJECT_SIZE(7) +
2*JSON_OBJECT_SIZE(8) + 720;
DynamicJsonBuffer jsonBuffer(bufferSize);
// DynamicJsonDocument(bufferSize);
if (!root.success()) {
Serial.println("parseObject() failed");
return;
// including temperature and humidity for those who may wish to hack it in
43
Serial.println(list12);
Serial.println(weatherLater);
Serial.print(icon);
icon = "Rain";
Serial.print(icon);
Serial.print(icon);
else {
icon = "Sunny";
44
CHAPTER – 7
SOFTWARE
45
7.1 PCB DESIGN
A printed circuit board (PCB) mechanically supports and electrically
connects electronic components or electrical components using conductive
tracks, pads and other features etched from one or more sheet layers of copper
laminated onto and/or between sheet layers of a non-conductive substrate.
Components are generally soldered onto the PCB to both electrically connect
and mechanically fasten them to it. Printed circuit boards are used in all but the
simplest electronic products. They are also used in some electrical products,
such as passive switch boxes. Alternatives to PCBs include wire wrap and
point-to-point construction, both once popular but now rarely used. PCBs
require additional design effort to layout the circuit, but manufacturing and
assembly can be automated. Specialized CAD software is available to do much
of the work of layout. Mass-producing circuits with PCBs is cheaper and faster
than with other wiring methods, as components are mounted and wired in one
operation. Large numbers of PCBs can be fabricated at the same time, and the
layout only has to be done once. PCBs can also be made manually in small
quantities, with reduced benefits. PCBs can be single-sided (one copper layer),
double-sided (two copper layers on both sides of one substrate layer), or multi-
layer (outer and inner layers of copper, alternating with layers of substrate).
Multi-layer PCBs allow for much higher component density, because circuit
traces on the inner layers would otherwise take up surface space between
components. The rise in popularity of multilayer PCBs with more than two, and
especially with more than four, copper planes was concurrent with the adoption
of surface mount technology. However, multilayer PCBs make repair, analysis,
and field modification of circuits much more difficult and usually impractical.
A basic PCB consists of a flat sheet of insulating material and a layer of
copper foil, laminated to the substrate. Chemical etching divides the copper into
separate conducting lines called tracks or circuit traces, pads for connections,
visa to pass connections between layers of copper, and features such as solid
46
conductive areas for EM shielding or other purposes. The tracks function as
wires fixed in place, and are insulated from each other by air and the board
substrate material. The surface of a PCB may have a coating that protects the
copper from corrosion and reduces the chances of solder shorts between traces
or undesired electrical contact with stray bare wires. For its function in helping
to prevent solder shorts, the coating is called solder resist. A printed circuit
board can have multiple copper layers. A two-layer board has copper on both
sides; boards sandwich additional copper layers between layers of insulating
material. Conductors on different layers are connected with visas, which are
copper-plated holes that function as electrical tunnels through the insulating
substrate. Through-hole component leads sometimes also effectively function as
After two-layer PCBs, the next step up is usually four-layer. Often two layers
are dedicated as power supply and ground planes, and the other two are used for
signal wiring between components.
"Through hole" components are mounted by their wire leads passing
through the board and soldered to traces on the other side. "Surface mount"
components are attached by their leads to copper on the same side of the board.
A board may use both methods for mounting components. PCBs with only
through-hole mounted components are now uncommon. Surface mounting is
used for transistors, diodes, IC chips, resistors and capacitors. Through-hole
mounting may be used for some large components such as electrolytic
capacitors and connectors. The pattern to be etched into each copper layer of a
PCB is called the "artwork". The etching is usually done using is coated onto
the PCB, then exposed to light projected in the pattern of the artwork. The resist
material protects the copper from dissolution into the etching solution. The
etched board is then cleaned.
A PCB design can be mass-reproduced in a way similar to the way
photographs can be mass-duplicated from film negatives using a photographic
printer. In multi-layer boards, the layers of material are laminated together in an
47
alternating sandwich: copper, substrate, copper, substrate, copper, etc.; each
plane of copper is etched, and any internal are plated-through, before the layers
are laminated together. Only the outer layers need be coated; the inner copper
layers are protected by the adjacent substrate layers. FR-4 glass epoxy is the
most common insulating substrate. Another substrate material is cotton paper
impregnated with phenolic resin, often tan or brown.
When a PCB has no components installed, it is less ambiguously called a
printed wiring board (PWB) or etched wiring board. However, the term "printed
Wiring board" has fallen into disuse. A PCB populated with electronic
components is called a printed circuit assembly (PCA), printed circuit board
assembly or PCB assembly (PCBA). In informal usage, the term "printed circuit
board" most commonly means "printed circuit assembly" (with components).
48
7.2 PCB Board Design
Initially PCBs were designed manually by creating a photo mask on a
clear Mylar sheet, usually at two or four times the true size. Starting from the
schematic diagram the component pin pads were laid out on the Mylar and then
traces were routed to connect the pads. Rub-on dry transfers of common
component footprints increased efficiency. Traces were made with self-adhesive
Tape. Pre-printed non-reproducing grids on the assisted in layout. The finished
was onto a photoresist coating on the blank copper-clad boards. Modern PCBs
are designed with dedicated layout software, generally in the following steps:
1. Schematic capture through an electronic design automation (EDA) tool.
2. Card dimensions and template are decided based on required circuitry and
case of the PCB.
3. The positions of the components and heat sinks are determined.
4. Layer stack of the PCB is decided, with one to tens of layers depending on
complexity. Ground and power planes are decided. A power plane is the
5. Counterpart to a ground plane and behaves as an AC signal ground while
providing DC power to the circuits mounted on the PCB. Signal
interconnections are traced on signal planes. Signal planes can be on the outer
as well as inner layers. For optimal EMI performance high frequency signals are
routed in internal layers between power or ground planes.
6. Line impedance is determined using dielectric layer thickness, routing copper
thickness and trace-width. Trace separation is also taken into account in case of
differential signals. Micro strip, strapline or dual strip line can be used to route
signals.
7. Components are placed. Thermal considerations and geometry are taken into
account. Visa and lands are marked.
8. Signal traces are routed. Electronic design automation tools usually create
clearances and connections in power and ground planes automatically.
9. Gerber files are generated for manufacturing.
49
7.3 PROTEUS DESIGN SUITE
The Proteus Design Suite is a proprietary software tool suite used
primarily for electronic design automation. The software is used mainly by
electronic design engineers and technicians to create schematics and electronic
prints for manufacturing printed circuit boards. It was developed in Yorkshire,
England by Labcenter Electronics Ltd and is available in English, French,
Spanish and Chinese languages.
Product Modules
The Proteus Design Suite is a Windows application for schematic
capture, simulation, and PCB (Printed Circuit Board) layout design. It can be
purchased in many configurations, depending on the size of designs being
produced and the requirements for microcontroller simulation. All PCB Design
products include an auto router and basic mixed mode SPICE simulation
capabilities.
Schematic Capture
Schematic capture in the Proteus Design Suite is used for both the
simulation of designs and as the design phase of a PCB layout project. It is
therefore a core component and is included with all product configurations.
Microcontroller Simulation
The micro-controller simulation in Proteus works by applying either a hex
file or a debug file to the microcontroller part on the schematic. It is then co-
simulated along with any analog and digital electronics connected to it. This
enables its use in a broad spectrum of project prototyping in areas such as motor
control, temperature control and user interface design. It also finds use in the
50
general hobbyist community and, since no hardware is required, is convenient
to use as a training or teaching tool. Support is available for co-simulation of:
Microchip Technologies PIC10, PIC12, PIC16, PIC18, PIC24, dsPIC33
Microcontrollers.
Atmel AVR (and Arduino), 8051 and ARM Cortex-M3 Microcontrollers
NXP 8051, ARM7, ARM Cortex-M0 and ARM Cortex-M3
Microcontrollers.
Texas Instruments MSP430, PICCOLO DSP and ARM Cortex-M3
Microcontrollers.
Parallax Basic Stamp, Freescale HC11, 8086 Microcontrollers.
PCB Design
The PCB Layout module is automatically given connectivity information
in the form of a net list from the schematic capture module. It applies this
information, together with the user specified design rules and various design
automation tools, to assist with error free board design. PCB's of up to 16
copper layers can be produced with design size limited by product
configuration.
3D Verification
The 3D Viewer module allows the board under development to be viewed
in 3D together with a semi-transparent height plane that represents the boards
enclosure. STEP output can then be used to transfer to mechanical CAD
software such as Solid works or Autodesk for accurate mounting and
positioning of the board.
51
7.4 PIC C COMPILE
MPLAB is official software developed by Microchip
for PIC Microcontroller. ... In MPLAB you can work on assembly language as
well but using the C18 compiler you can write your code in C Language.
MPLAB is the most flexible compiler for PIC Microcontroller as you can do
anything in it with you PIC Microcontroller.
7.5 C COMPILER
A compiler is a special program that processes statements written in a
particular programming language and turns them into machine language or
"code" that a computer's processor uses. Typically, a programmer writes
language statements in a language such as Pascal or C one line at a time using
an editor.
Software is used for PIC microcontroller PIC Pgm is a PC-Software to
program PIC microcontrollers using external programmer hardware connected
to the PC. It allows to: Program a HEX file into a PIC microcontroller.
7.6 MPLAB
MPLAB is a proprietary freeware integrated development
environment for the development of embedded applications on PIC and ds
PIC microcontrollers, and is developed by Microchip Technology. MPLAB X is
52
the latest edition of MPLAB, and is developed on the Net Beans platform.
MPLAB and MPLAB X support project management, code editing, debugging
and programming of Microchip 8-bit PIC and AVR (including ATMEGA)
microcontrollers, 16-bit PIC24 and ds PIC microcontrollers, as well as 32-bit
SAM (ARM) and PIC32 (MIPS) microcontrollers.
MPLAB is designed to work with MPLAB-certified devices such as
the MPLAB ICD 3 and MPLAB REAL ICE, for programming and debugging
PIC microcontrollers using a personal computer. PICK it programmers are also
supported by MPLAB.
MPLAB X supports automatic code generation with the MPLAB Code
Configurator and the MPLAB Harmony Configuration plugins.
MPLAB 8.X
MPLAB 8.X is the last version of the legacy MPLAB IDE technology,
custom built by Microchip Technology in Microsoft Visual C++. MPLAB
supports project management, editing, debugging and programming of
Microchip 8-bit, 16-bit and 32-bit PIC microcontrollers. MPLAB only works
on Microsoft Windows. MPLAB is still available from Microchip's archives,
but is not recommended for new projects.
MPLAB supports the following compilers:
53
MPLAB MPASM Assembler
MPLAB ASM30 Assembler
MPLAB C Compiler for PIC18
MPLAB C Compiler for PIC24 and dsPIC DSCs
MPLAB C Compiler for PIC32
HI-TECH C
MPLAB X
MPLAB X is the latest version of the MPLAB IDE built by Microchip
Technology, and is based on the open-source NetBeans platform. MPLAB X
supports editing, debugging and programming of Microchip 8-bit, 16-bit and
32-bit PIC microcontrollers.
MPLAB X is the first version of the IDE to include cross-platform
support for Mac OS X and Linux operating systems, in addition to Microsoft
Windows.
MPLAB X supports the following compilers:
MPLAB XC8 — C compiler for 8-bit PIC and AVR devices
MPLAB XC16 — C compiler for 16-bit PIC devices
MPLAB XC32 — C/C++ compiler for 32-bit MIPS-based PIC32 and
ARM-based SAM devices
HI-TECH C — C compiler for 8-bit PIC devices (discontinued)
SDCC — open-source C compiler
54
CHAPTER – 8
CONCLUSION
55
8.1 CONCLUSION
IoT will help to enhance smart farming. Using IoT the system can predict
the soil moisture level and humidity so that the irrigation system can be
monitored and controlled. IoT works in different domains of farming to improve
time efficiency, water management, crop monitoring, soil management and
control of insecticides and pesticides. This system also minimizes human
efforts, simplifies techniques of farming and helps to gain smart farming.
Besides the advantages provided by this system, smart farming can also help to
grow the market for farmer with single touch and minimum effort.
56
CHAPTER – 9
BIBLIOGRAPHY
57
9.1 BIBLIOGRAPHY
[1] S. Prabhakar, S. Pankanti, and A. K. Jain, “Biometric recognition: Security
and privacy concerns,” IEEE Security Privacy Mag., vol. 1, no. 2,pp. 33–42,
2003.
[2] D. Maltoni, D. Maio, A. K. Jain, and S. Prabhakar, Handbook of Fingerprint
[3] Recognition. New York: Springer-Verlag, 2003.
[4] A. K. Jain, R. Bolle, and S. Pankanti, Eds., Biometrics: Personal
Identificationin Networked Society. Norwell, MA: Kluwer, 1999.
[5] Moses Okechukwu Onyesolu, Ignatius Majesty Ezeani, “ATM Security
Using Fingerprint Biometric Identifer: An Investigative Study”, (IJACSA)
International Journal of Advanced Computer Science and Applications, Vol. 3,
No.4, 2012, pp. 68-72
58
CHAPTER – 10
PHOTO GRAPHY
59
10.1 PHOTO GRAPHY
60
CHAPTER – 11
PROJECT ESTIMATION
61
11.1 PROJECT ESTIMATION
S.NO. DESCRIPTION SPECIFICATION UNIT COST IN RS.
Resistor 1Kohm, connecting wires
(single lead), capacitors
1 Raw material As required Rs. 300
100microfarad, 22 microfarad, LED
(red)
Microcontroller 01 Rs.210
LCD 01 Rs.250
LDR light sensor 01 Rs.300
Standard Items
2 Temperature & humidity sensor 01 Rs.350
Relays 01 Rs.200
Water level sensor 01 Rs.1,200
WiFi module 01 Rs.350
3 Machining Cost PCB board 01 Rs.550
TOTAL COST Rs.3,710
62
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,
ii
iii
BONAFIDE CERTIFICATE
Signature of the Guide with date Signature of the HOD with date
Mr.P.THIRUMOORTHY M.E., Mr.P.THIRUMOORTHY M.E.,