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Power Transistors

2SD1264, 2SD1264A
Silicon NPN triple diffusion planar type

For low-frequency power amplification Unit: mm


For TV vertical deflection output 10.0±0.2 4.2±0.2

0.7±0.1
5.5±0.2 2.7±0.2
Complementary to 2SB0940, 2S0940A

4.2±0.2
7.5±0.2
φ 3.1±0.1
■ Features

16.7±0.3
• High collector-emitter voltage (Base open) VCEO
• Large collector power dissipation PC
• Full-pack package which can be installed to the heat sink with one screw 1.4±0.1
1.3±0.2

Solder Dip
14.0±0.5

(4.0)
0.5+0.2
■ Absolute Maximum Ratings Ta = 25°C
–0.1
0.8±0.1

Parameter Symbol Rating Unit 2.54±0.3


Collector-base voltage (Emitter open) VCBO 200 V 5.08±0.5
1: Base
Collector-emitter voltage 2SD1264 VCEO 150 V 2: Collector
(Base open) 2SD1264A 180 1 2 3 3: Emitter
EIAJ: SC-67
Emitter-base voltage (Collector open) VEBO 6 V TO-220F-A1 Package
Collector current IC 2 A
Peak collector current ICP 3 A
Collector power TC = 25°C PC 30 W
dissipation 2.0
Junction temperature Tj 150 °C
Storage temperature Tstg −55 to +150 °C

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC = 50 µA, IE = 0 200 V
Collector-emitter voltage 2SD1264 VCEO IC = 5 mA, IB = 0 150 V
(Base open) 2SD1264A 180
Emitter-base voltage (Collector open) VEBO IE = 500 µA, IC = 0 6 V
Base-emitter voltage VBE VCE = 10 V, IC = 400 mA 1.0 V
Collector-base cutoff current (Emitter open) ICBO VCB = 200 V, IE = 0 50 µA
Emitter-base cutoff current (Collector open) IEBO VEB = 4 V, IC = 0 50 µA
Forward current transfer ratio hFE1 * VCE = 10 V, IC = 150 mA 60 240 
hFE2 VCE = 10 V, IC = 400 mA 50
Collector-emitter saturation voltage VCE(sat) IC = 500 mA, IB = 50 mA 1.0 V
Transition frequency fT VCE = 10 V, IC = 0.5 A, f = 1 MHz 20 MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank Q P
hFE1 60 to 140 100 to 240

Publication date: April 2003 SJD00180BED 1


2SD1264, 2SD1264A

PC  Ta IC  VCE IC  VBE
50 1.2 1.2
(1)TC=Ta TC=25˚C
(2)With a 100×100×2mm
Collector power dissipation PC (W)

Al heat sink IB=7mA 25˚C


(3)With a 50×50×2mm 1.0 1.0
40
6mA TC=100˚C –25˚C
Al heat sink

Collector current IC (A)

Collector current IC (A)


(4)Without heat sink
(PC=2W) 0.8 5mA 0.8
(1)
30
4mA
0.6 0.6

20 3mA

0.4 0.4
2mA
(2)
10
0.2 1mA 0.2
(3)
(4)
0 0 0
0 40 80 120 160 0 4 8 12 16 20 24 0 0.2 0.4 0.6 0.8 1.0 1.2
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Base-emitter voltage VBE (V)

VCE(sat)  IC hFE  IC fT  I C
10 104 1 000
Collector-emitter saturation voltage VCE(sat) (V)

IC/IB=10 VCE=10V VCE=5V


f=1MHz
TC=25˚C
Forward current transfer ratio hFE

Transition frequency fT (MHz)


103 100
1
TC=100˚C TC=100˚C
25˚C
2
10 10
25˚C
–25˚C

–25˚C
0.1
10 1

0.01 1 0.1
0.01 0.1 1 0.01 0.1 1 10 0.01 0.1 1 10
Collector current IC (A) Collector current IC (A) Collector current IC (A)

Safe operation area Rth  t


10 103 (1)Without heat sink
Non repetitive pulse
TC=25˚C (2)With a 100×100×2mm Al heat sink
ICP
Thermal resistance Rth (°C/W)

IC t=0.5ms
102 (1)
1
Collector current IC (A)

t=5ms
t=1ms (2)
10
DC
0.1

0.01
10−1
2SD1264A
2SD1264

0.001 10−2
1 10 100 1 000 10−4 10−3 10−2 10−1 1 10 102 103 104
Collector-emitter voltage VCE (V) Time t (s)

2 SJD00180BED
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL

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