9.

2 GIA CNG VI C MEMS FABRICATION:

MEMS l cc h thng vi c in c kch thc cc chi tit nm trong thang o Micromet. Trong phn ny chng ta s kho st cc phng php ch to cc b phn ca MEMS nh bnh rng, dy xch, u d, thanh chn ang c s dng hin nay, gm 3 loi chnh: gia cng khi, gia cng b mt, LIGA. Ngoi ra cn c gia cng s dng tia LASER

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

y l phng php lu i nht trong k thut gia cng vi c. L cch to ra trn phin vt liu cc l su, cc rnh, cc ch lm dng cc phng php ha, l n mn (tm thc). Phng php ny ly tng t hin tng n mn ni trong t nhin to thnh hang ng v k thut ch to nh ca ngi xa.
C 2 phng php c bn: -n mn t - Chemical Wet Etching : y l phng php ph bin nht khi tin hnh gia cng vi c khi. Trong phng php ny cng chia lm 2 loi l khc ng hng v khc d hng isotropy & anisotropy. - n mn kh: n mn bng cch cho kh hoc hi ha cht tc dng, thng l nhit cao.

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Di y l m t quy trnh n mn t: 1.Ngi ta to mt lp mt n trn tm nn ging nh khun cho chi tit cn tao. 2. Dung dung dch n mon bo i phn khng c lp mt na bo v. 3. Loi bo phn mt na ta c phn chi tit nh mong mun.

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Trong ky thut n mon t s thanh cng c quyt nh bi tc n mon ca hn hp n mon i vi 2 loi vt liu lam nn va mt na. (selective)
Trong hinh 1, mau vang la lp s b n mon. Mau xanh la lp c gi li. 1: la chon khng tt mc du n mon phn trn nhng cng n mon phn vt liu nn xanh bn di. 2. La chon tt khng lam tn hi n vt kiu nn. Trong hinh 2,mau o: lp mt na, mau vang: lp cn c n mon. 1: qu trinh n mon ng hng hoan ho to ra vch bn cong. 2: qu trinh n mon di hng to ra vch bn thng.

Hinh 1

Hinh 2

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Trong phng php n mn ng hng, theo l thuyt qu trnh khc xy ra vi tc bng nhau moi hng. Nhng thc nghim cho thy qu trnh khc mt bn din ra chm hn khi khng c khuy. Do khi tin hnh khc ng hng thng tin hnh khuy mnh.

B n mon s dng cho tm wafer 4inch ca vin cng ngh LAAS Toulouse Php.

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Phng php n mn d hng c s dng ph bin hn trong phng php n mn t. Trong phng php ny ngi ta iu chnh tc n mn ngm tm nn trong hn hp ha cht theo nhng hng khc nhau. Moi qu trnh khc u yu cu s dng vt liu lm khun gn vi vt liu nn. Trong phng php n mn t ng hng v d hng u yu cu mt n cho tm nn chun xc. Silicon Nitride c tc n mn chm hn so vi Silicon Oxide nn thng c s dng trong phng php n mn t ng hng cng nh di hng. Tuy nhin trong phng php n mon di hng, SiO2 cng thng c s dng nhng cn phi kim tra day ca lp mt na khi s dng KOH lam cht n mon do khi o tc n mon ca oxit co th tng cao. Cc cht cn quang khng c s dng trong bt c loi n mon di hng nao. Nhiu kim loi bao gm TA, Au, Cr, Ag, Cu chu n mon tt vi dung mi n mon EDP va Al i vi TMAH trong mt s iu kin nht nh.

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Hnh bn l cc dng chi tit kiu kim t thp ngc v h hnh thang c tao ra bng phng php n mn d hng. Cn ch l hnh dng ca khun nh hng quyt nh n s n mn chm hn ca mt <111> v tc n mn ca n chm hn nhng mt khc khong 1000 ln. Cn chu y rng tc n mon, ti k tc n mon (100/111) va la chon vt liu phu thuc chu yu bi nhit va thanh phn hn hp cht ha hoc n mon.
Hnh bn l hnh nh chp c t knh hin vi in t qut SEMS th hin b mt ca tm nn silicon sau khi c x l bng phng php n mn t d ng

9.2.1 GIA CNG VI C KHI - Bulk Micromachining:

Thng thng khi gia cng vi c khi yu cu to nhng mang mong silicon hoc kim sot su n mon. Vi bt c qu trinh x ly ha hoc nao s c s khc nhau khi gia cng nhng tm nn khc nhau. Thi gian n mon quyt nh ti su cn n mon cng rt kho iu khin. Do o t c cht lng cao trong phng php n mon di hng, linh vc ch to MEMS a pht trin mt gii php goi la dng n mon (etch stops). Etch Stops a iu khin c qu trinh n mon va to c s ng nht v su n mon trn wafer. C 2 loi etch stop c bn c s dng: + Dopant etch stops: s dng cht bn dn pha tp nguyn t nng Boron lam lp chn n mon do c tc n mon rt chm. + electrochemical etch stops: la phng php thng c s dng nht hin nay. S dng in cc bn dn loi n to lp tip xuc p-n ngn chn s n mon.

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Gia cng vi c b mt cng la mt phng php rt ph bin trong qu trinh sn xut cc thit b MEMS. Phng php ny thc hin bng cch ph mt lp mng mong ln b mt ca tm nn to ra cu trc cho chi tit ca MEMS. N c dng ch to cc chi tit ca MEMS nh bnh rng, dy ai ca bnh rng, cc u d ...
Hnh bn l nh chp qua knh hin vi in t qut SEM ca mt bnh rng. N c kch thc rt mong xp x 2-3 micromet v kch thc b mt hng trm micromet. Kch thc 1 rng ca n nho hn ng knh ca 1 hng cu ng knh khong 8 n 10 micromet.

Microgears: hnh chp ca phng th nghim quc gia Courtesy of Sandia

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Gia cng vi c b mt to cc cu trc v chi tit bng phng php goi l Deposition photolithography NH. y cng l phng php c s dng trong ch to chip my tnh CMOS. Lp cu trc, lp hy sinh c ph ln, lm khun v n mn trn tm nn. Lp hy sinh c ph gia lp nn v lp cu trc to ra phn khng gian trng cho chi tit v khi qu trnh kt thc, lp hy sinh c loi bo i. Mt phn ca chi tit vi c c to t lp mng ph mong. Mi cu trc cn 1 lp hy sinh.

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Qu trnh ch to 1 u d: Mt lp hy sinh c ph ln tm nn, sau 1 lp cn quang c ph ln lm khun cho chi tit, s dng k thut photolithography. Sau cho n mn lp hy sinh v loi bo lp cn quang, ta c lp hy sinh hon chnh. Sau , lp cu trc li c ph ln trn phn khun bng lp hy sinh va to va lp li qu trnh lm khun cn quang, n mn c c phn chi tit. Cui cng l loi bo lp hy sinh ban u to ra chi tit u d hon chnh nh hnh bn

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Lp hy sinh c s dng khi xy dng nhng chi tit phc tp nh cc b phn chuyn ng. S dng nhiu lp hy sinh khc nhau trong qu trnh ch to. Tt c cc lp hy sinh cn c loi bo khi qu trnh ch to kt thc. Phng php s dng lp hy sinh c ly tng t vic xy dng cng Keystone. u tin ngi ta to ra khung bng g v t cc phin ln khung g , sau cng t vin Keystone ln v g bo khung g ra nhng cc vin khng m to thnh hnh cng nh hnh bn. y, khung g ng vai tr nh lp hy sinh c s dng trong qu trnh xy dng v bo i khi hon tt.

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Qu trnh kch thch ng ngng t nhit

Lp u tin c th l lp cch in hay lp hy sinh, thng lm bng SiO2 c ngng t trn b mt tm nn bng phng php kch thch nhit. dy ca lp Oxit c th c iu khin bi mc nhit v m. nhng lp tip theo cng l nhng mng mong bng silicon nitride. Nhng lp ny c ph bng phng php ha l ph t pha hi - CVD. Kim loi v hp kim c ph ln bng phng php Spider in hay Evaporation.

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

u tin l qu trinh to khun s dng phng php quang khc. Ph ln wafer 1 lp cn quang S dng tia cc tm chiu x ln tm Wafer ta c mt n cho lp ph u tin. S dng phng php n mn loi bo phn lp ph khng c mt n bo v. Loi bo lp cn quang i, ta c khun. Qu trnh ny c lp li cho cc lp tip theo to thnh chi tit cn ch to.

9.2.2 GIA CNG VI C TRN B MT Surface Micromachining:

Phng php ny c dng ch to ra nhiu chi tit s dng cho thng mi nh cc b phn ca my tnh, Iphone, xe hi, cc cm bin, b truyn ng siu nho, th RFID ...

Comb Driver

Micro Actuator

Chain and Gear

9.2.3 LIGA Lithographie Galvanofoforunning un Abformung:

LIGA l k thut c pht trin c vo u nhng nm 80. nh tn goi ca n, k thut ny da trn 3 k thut c bn l khc hnh (Lithography), m in (electroforming) v lm khun (molding). y l k thut cho php to ra h vi c 3 chiu ch khng phi 2 chiu nh cc cch khc hnh hnh thng. n c th to ra nhng chi tit m nhng k thut khc trong khi hay khc b mt khng th d dng thc hin c vi t l hnh dng cao hn hn. Hnh bn l nh ca mt cu trc a gc v mt bnh rng vi t l lch thc rt cao c th c to ra s dng k thut LIGA.

9.2.5 LIGA Lithographie Galvanofoforunning un Abformung:

HARMST- High Aspect Ratio Microstructure Technology: cho php to ra nhng chi tit c cao vi milimet trong khi b rng ch vi micromet. c dng ch to cc chi tit, khun hoc du khc. Cho php sn xut hng lot cc chi tit kch thc micro bng nhiu loi vt liu khc nhau: polyme, kim loi hay hp kim. Cu trc to ra c chiu r rng v b mt tt. Bn cnh l hnh nh bnh rng ca 1 ng c in - hnh chp ca phng th nghim quc gia Courtesy of Sandia

9.2.5 LIGA Lithographie Galvanofoforunning un Abformung:

Cc giai on ca k thut LIGA kh ging vi 2 k thut surface v bulk: Deposit Expose Develop Electroform Planarize Strip Release

9.2.5 LIGA Lithographie Galvanofoforunning un Abformung:

Vt liu nhy sng: PMMA (polymethyl methacrylacte) hay Pleaxiglass Lp mt n c lm bng ng hoc vng (vt liu khng cho tia x truyn qua) t trn tm vt liu cho tia x truyn qua (Beryllium). Ngun sng thng s dng tia X (ly t my gia tc). Deposit: ph 1 lp vt liu nhy vi tia X nh PMMA ln b mt tm bn dn. Expose: tip dng k thut quang khc to mt n khun ri dng tia X chiu ln.

9.2.5 LIGA Lithographie Galvanofoforunning un Abformung:

Develop: loi bo i phn vt liu b tia X chiu vo ta c khun ca chi tit. Electroform: tin hnh m in ln phn khun.

9.2.5 LIGA Lithographie Galvanofoforunning un Abformung:

Planarize: tin hnh CMP mi phng phn chi tit li ln. Strip: loi bo phn vt liu nhy tia X ban u (PMMA). Release: ly chi tit ra khoi tm nn. Sau y l qu trnh ch to bnh rng bng phng php LIGA

9.2.4 HN - Wafer Bonding:

Wafer Bonding l mt phng php ch to cc vi chi tit bng cch hn ni li 2 hay nhiu wafer vi nhau to ra tm wafer a lp hay cc chi tit vi c phc tp nh ng dn, b ngm. C 3 loi c bn bao gm: hn trc tip hay hn lin kt - Fusion Bonding; hn im Anodic Bonding v hn s dng lp trung gian. D l phng php no cng yu cu tm wafer cn c lm phng, nhn v sch. Hn trc tip s dng ghp 2 tm wafer hay 1 tm wafer vi 1 tm khc b oxit ha vi nhau. Phng php ny c dng to nhng chi tit nh thng ng hay b cha c su vi micro vi mt mng silicon nitride bn trn. Mt phng php ph bin khc l hn im hn 1 tm wafer vi 1 tm wafer Pyrex 7740 s dng trng in t v gia nhit. phng php ny da trn nguyn l Pyrex 7740 giu ion Na+. Mt in p dng t trn tm wafer dn ion Na+ t tm Pyrex sang tm nn. Kt hp vi gia nhit, khi cc ion tip xc ti b mt tm wafer, to ra mt lng nhit va hn dnh 2 tm wafer li. Phng php ny c li th hn phng php trc tip yu cu tm wafer cn c lm phng, nhn v sch. Ngoi ra Pyrex 7740 c h s n nhit gn vi Silicon nn to ra lp silicon sau khi hn t b bin dng khi nhit cao. y l phng php c s dng ph bin trong k thut ng gi MEMS. Cn mt phng php khc s dng trong k thut ch to MEMS l hn vi lp trung gian bng vng ph trn b mt ca mt trong hai tm wafer. Do nhit cao, vng khuych tn vo silicon rt nhanh nn lm gim nhit cn hn. Ngoi ra cn s dng 1 s cht khc nh thy tinh, polymer lm lp trung gian.

9.2.5 GIA CNG BNG TIA LASER:

C th dng tia laze to ra nhng chi tit theo kiu khot ln lt. phng php ny thng c s dng trong gia cng vi mch nhng t c s dng trong gia cng cc chi tit MEMS do gia cng chm. Do , trong cng ngh MEMS, cch ny thng ch lm khun. Lazer c s dng l loi Eximer gia cng trn Polymers. 1.19 3.14

Cu hoi trc nghim: 1. Ti sao phi thc hin tin trnh khuy khi tin hnh phng php n mn t ng hng. a. Do tc n mn ca lp mt n chm hn so vi lp nn. b. Do mt phn b cc ht trong tm nn khng ng u. c. Do tc n mn ca hn hp n mn i vi mt bn chm hn so vi hng khc. d. ha tan hn hp cht n mn. 2. Trong phng php gia cng vi c b mt, cn phi to bao nhiu lp hy sinh? a. 1 b. 2 c. 3 d. Ty theo cu trc ca chi tit cn ch to. 3. Trong k thut LIGA, c im no u th hn so vi phng php Surface v Bulk? a. C kh nng ch to chi tit c cu trc phc tp vi t l hnh dng cao. b. C chi ph sn xut r hn. c. Phng php tin hnh n gin.