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Swapna Sarker
Roll No:194571
Abstract
Reliability is a concern in every semiconductor device. The Commercial success of a
semiconductor device supplier rests largely on his ability to develop a robust manufacturing
process that consistently produces reliable devices combined with the quantitative
assurance he can provide to his customers proving the reliability of his devices. Various
reliability effects can happen under circuit operating conditions where one particular effect
usually dominates over the others in certain operating regions. They include HCI (Hot-Carrier
Instability), NBTI (Negative Bias Temperature Instability), PBTI (Positive Bias Temperature
Instability) and NCS (Non-conductive stress). The most important phenomena are HCI and
NBTI since they are two major contributors to the device degradation in advanced
technologies. In this project, the hypothesis is the higher temperature, the more active the
BJT. However, after a certain temperature, the BJT would fail. Besides, the higher frequency,
the BJT performance would be affected. Then, the higher voltage (or current), the easier the
BJT would fail. In this project, I’ll discuss the temperature effect on BJT and model it by using
TCAD.
Procedure
1.To Build a simple BJT test circuit
2.To analysis the current gain of a BJT at various temperature
3.Model it by using Cadence
Bipolar Junction Transistor
BJT is so called bipolar junction transistor is because it contains both flow of
majority carriers and minority carriers .
The input controlling variable for a BJT transistor is a current level.