Visvesvaraya Technological University: Submitted by

VISVESVARAYA TECHNOLOGICAL UNIVERSITY
“JNANA SANGAMA”, BELAGAVI-590018, Karnataka
Project Report on
“THERMAL STATE SENSING AND REGULATION MODULE FOR

A 100W POWER AMPLIFIER”
Submitted in the partial fulfilment for award of degree of
Bachelor of Engineering in
Electronics and Communication Engineering
Submitted by
N KOTRESH-1BI16EC089
NITHISH B M-1BI16EC112
SHRUTHI R G-1BI16EC184
Project carried out at
BEL. Bengaluru
Internal guide
Dr. C R BYRA REDDY
Professor
Department of ECE, BIT
DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

BANGALORE INSTITUTE OF TECHNOLOGY
2019-2020
BANGALOREINSTITUTEOF TECHNOLOGY
K.R.Road, V.V.Pura,Bangalore-560004
DEPARTMENTOF ELECTRONICSANDCOMMUNICATION
ENGINEERING
CERTIFICATE
This is to certify that the project work entitled “Thermal Sensing and Regulation
module for 100W Power Amplifier”, carried out by Mr.N Kotresh (1BI16EC089),
Mr.Nithish BM (1BI16EC102), Ms.Shruthi R G (1BI16EC184), bonafide students of
Bangalore Institute of Technology in partial fulfillment for the award of degree of
Bachelor of Engineering in Electronics and Communication Engineering, affiliated to
Visvesvaraya Technological University, Belagavi during the year 2019-2020. It is
certified that all corrections or suggestions indicated for internal assessment have been
incorporated in the record. The project work has been approved as it satisfies the
academic requirements in respect of project work prescribed by the said Degree.
Signature of Internal Guide Signature of HOD Signature of thePrincipal

(Dr. C R Byra Reddy) (Dr. K.V. Prasad) (Dr. Aswath.M.U)
EXTERNALVIVA
Name of Examiners Signature with Date
1.
2.
ACKNOWLEDGEMENT
The project conduction opportunity we had with BEL was a great chance for learning and professional
development. Therefore, we consider ourselvesto be very fortunate as we were provided with an
opportunity to be a part of BEL. We are also grateful for having a chance to meet so many great
personalities and professionals who led us through this project period.
We wish to express our sincere gratitude to our guide Dr. C. R. BYRA REDDY, professor, ECE
department, BIT for his patience, motivation and support throughout.
We take this opportunity to express our deepest gratitude and special thanks to our guide at BEL,
Mr.ABHINAV SONI, senior engineer, MilCom division who in spite of being busy with his schedule
andduties, took time to hear, guide and keep us on the correct path and allowing us carry out our project in
BEL.
We are thankful to Dr. K V PRASAD, HOD, Dept of ECE, Bangalore Institute of Technology,
BANGALORE for all his support and valuable suggestions.
We are thankful to Dr. ASHWATH.M.U, Principal, Bangalore Institute of Technology,

Bengaluru for all his support in completing cause.
. It is our radiant sentiment to place on record our best regards, deepest sense of gratitude to all our
senior officers, project trainee, employees and foremen for their careful and precious guidance which were
extremely valuable for my project study both theoretically and practically. I perceive this opportunity as a
big milestone in my professional career development.
We would like to thank all the staff members of Department of Electronics and Communication
Engineering for their constant support and encouragement. It would be our privilege to express our
heartfelt gratitude and respect to BANGALORE INSTITUTE OF TECHNOLOGY which has given us
an opportunity to present this project report.
N Kotresh-1BI16EC089
Nithish B M-1BI16EC112
Shruthi R G-1BI16EC184
i
ABSTRACT
Power amplifiers are critical in Radio frequency communication chain used in Commercial as
well as defense requirements. Particularly in Defense applications where the temperature variability is
huge, thermal management acquires more significance.
This 100 watts Power amplifier is used in RF communication among Indian Naval Ships along with
other sub-systems like Data link Radio unit, Power supply, GPS. This product has been designed
keeping in mind the link requirements of Indian Navy under a classified project.This power amplifier
has a pulsed power output of 100 W ±2dB over a frequency band of 970MHz-1230MHz with three
different levels of power control. It requires protection features for High load VSWR & over
temperature protection.
The mechanism for over temperature control and device protection is implemented here in this project.
It involves design of Controller card & software development which along with other things provides
for automatic thermal management.
ii
CONTENTS
Chapter 1
1.INTRODUCTION……………………………………………………………………..1
1.1 TYPES OF AMPLIFIERS………………………………………………………….....2
1.2 APPLICATIONS OF AMPLIFIERS……………………………………………….....3
1.3 PURPOSE OF STUDY…………………………………………………………….....4
Chapter 2
2.LITERATURE SURVEY……………………………………………………………..5
Chapter 3
3. REQUIREMENT ANALYSIS……………………………………………………….7
3.1 HARDWARE REQUIREMENTS……………………………………………….......7
3.2 SOFTWARE REQUIREMENTS…………………………………………………....13
Chapter 4
4. METHODOLOGY AND IMPLEMENTATION………………………………….18
4.1 BLOCK DIAGRAM………………………………………………………………...18

4.2 IMPLEMENTATION…………………………………………………………….....21
Chapter 5
5.RESULTS…………………………………………………………………………….32
Chapter 6
6.APPLICATIONS…………………………………………………………………….34
Chapter 7
7.CONCLUSION AND FUTURE WORK…………………………………………...35
Chapter 8
8.REFERENCES……………………………………………………………………….36
Chapter 9
9.APPENDIX……………………………………………………………………….......37
9.1 HARDWARE SPECIFICATIONS……………………………………………….....37
9.2 SOFTWARE SPECIFICATIONS……………………………………………….......51

9.3 SOURCE CODE........................................................................................................54
iii
LIST OF FIGURES
Figure 1.1.1:Block diagram of an audio system……………………………..1
Figure 3.1.1:San Ace 60 ............................……………………………...7
Figure 3.1.2:Pin diagram of ADT7470............……………………………...8
Figure 3.1.3:Eval-ADT7470EBZ Dev Board………………………………..9
Figure 3.1.4:TC74 ..........................……………………………………...9
Figure 3.1.5:TC74 Pin diagram…………………………………………….10
Figure 3.1.6:PIC32MZ Starter kit…………………………………………..11
Figure 3.2.1:MP LAB main window……………………………………….14
Figure 3.2.2:MP LAB Successful project built…………………………….15
Figure 3.3.1:I2C Protocol…………………………………………………..16
Figure 4.1.1:Block Diagram of hardware…………………………………..18
Figure 4.2.1:Connection of the components………………………………..21
Figure 4.2.2:Base board top view ofPIC32MZ……………………………22
Figure 4.2.3:Interfacing with the PIC board and ADT7470………………..22
Figure 4.2.4:Reading the temperature……………………………………...25
Figure 4.2.5:Setting the Fan speed…………………………………………28
Figure 4.2.6:Reading the Fan speed………………………………………..31
Figure 5.1:Working model of setup………………………………………33
Figure 5.2:Plot of temperature vs speed………………………………….34
Figure 9.1.1:PIC Starter kit………………………………………………39
Figure 9.1.2:I2C Status Register…………………………………………41
Figure 9.1.3:I2C Control Register……………………………………….43
Figure 9.1.4:Pin diagram of ADT7470……………………………………47
Figure 9.1.5:Pin diagram of TC74……………………………………….50
Figure 9.1.6:Cross section view of the fan………………………………51
Figure 9.1.7:Speed characteristics…………………………………………51
Thermal state sensing and regulation module for 100W power amplifier 2019-2020
Chapter1
INTRODUCTION
A power amplifier is an electronic device that is designed to increase the magnitude of
power of a given input signal. The power of the input signal is increased to a higher level
such that it is enough to drive loads of output devices like speakers, headphones, RF
transmitters etc. Unlike voltage or current amplifiers, power amplifiers are designed to
drive loads directly and are used as a final block in an amplifier chain.
The input signal to a power amplifier needs to be above a certain threshold value. Instead
of directly passing the raw audio or RF signal to the power amplifier, it is first pre-
amplified using current or voltage amplifiers and is sent as input to the power amplifier
after making necessary modifications. It can also be observed from the block diagram of
an audio amplifier shown below.
Figure 1.1 Block diagram of an audio system
In the above discussed case, a microphone is used as an input source and the magnitude
of signal from the microphone is not enough for the power amplifier. This calls for a need
to first pre-amplify the input signal where its voltage and current are increased slightly.
Then the signal is passed through tone and volume controls circuit which makes the
Department of Electronics and Communication, BIT Page 1

aesthetic adjustments to the audio waveform. Finally, the signal is passed through a
power amplifier and the output from power amplifier is fed to a speaker.
1.1 Types of Power Amplifiers
Depending on the type of output device that is connected, the power amplifiers are
divided into the following categories.
1.1.1 Audio Power Amplifiers
This type of power amplifiers are used for increasing the magnitude of power of a weaker
audio Signal. The amplifiers which are used in speaker driving circuitries of televisions,
mobile phones etc. come under this category.
The output of an audio power amplifier ranges from a few milli watts (like in headphone
amplifiers) to thousands of watts (like power amplifiers in Hi-Fi/Home theatre systems).
1.1.2 Radio Frequency Power Amplifiers
Wireless transmission requires modulated waves to be sent over long distances via air.
The signals are usually transmitted using antennas and the range of transmission depends
on the magnitude of power of signals fed to the antenna.
For wireless transmissions like FM broadcasting, antennas require input signals at a range
of thousands of kilowatts of power. Radio Frequency Power amplifiers here are employed
to increase the magnitude of power of modulated waves to a level high enough for
reaching required transmission span.

1.1.3 DC Power Amplifiers
DC power amplifiers are used to amplify the power of a PWM (Pulse Width Modulated)
signals. They are used in electronic control systems which need high power signals to
drive or actuators motors. They take input from microcontroller systems, increase its
power and feed the amplified signal to DC motors or Actuators.
1.2 Applications of power amplifiers:
There are wide ranges of applications of these amplifiers in the various sectors.
• These are used in variety of devices such as headphones, microwave ovens, home
theatre systems, etc. These form the most important part of the basic electronics
that comes under the category of the household needs and consumer’s range.
• To control servo motors and the specific DC motors, the power amplifiers are
widely utilized.
• As the wireless transmission requires high-frequency range for the transmission of
the signals over a long distance, the power amplification is beneficial in such areas
of work. Higher the levels of power, higher are the transfer rate of data and its
usability.
• Power amplifiers are also utilized in the types of equipment designed for the
communication of the satellites.

PURPOSE OF STUDY
Being a prime part of several setups and equipments, power amplifiers are prone to wear
and tear and their performance degrades with time. This process fastens if the temperature
within the power amplifier is more than the allowable value. The gain value of the
amplifier decreases if the temperature is high. Hence controlling the temperature within
the power amplifier is of prime importance. In this project, we intend to address the above
problem and offer an optimal solution using cost efficient and mass friendly resources.

Chapter2
LITERATURE SURVEY
The various references used:
Dr.Sudha Senthil Kumar, Dr. K. Brindha [1]
This paper describes about the working of an automatically temperature controlled DC
fan.The main objective of this paper is to device a temperature controlled fan using the
analog components and to measure the threshold temperature for which the fan works
satisfactorily. An alarm circuit is attached to indicate the fan turn on. This device can be
used in smart homes. The temperature controlled dc fan is designed to turn off and turn on
according to the temperature of the surroundings. This device majorly functioning on the
behaviour of the thermistor and has a major advantage in power saving aspect. The device
will be designed in a way that the critical temperature (the minimum temperature) to turn
on the fan will be modified in accordance to the choice of the user.
Nigade A. S, Deepanshu Verma [2]
The research paper presented here is based on automatic fan speed controller that
automatically adjusts the fan's speed according to ambient temperature of the
surroundings. The temperature flow controlled fan used or mentioned here is an
automated fan, controlled by a temperature sensor. The heart of this project comprises of
the temperature sensor circuit which senses the change in the ambient temperature of the
surrounding. Here pulse width modulation technique is used. When heat is applied to the
temperature sensor which this will indicate it to the fan automatically increasing or
decreasing in speed according to the four speed levels of a normal fan that are set to
different temperature ranges.

Shivesh, Rishabh Mishra, and Dr. E.Annie Elisabeth [3]
Usually, the traditional system fans run at high speed at high temperature and the opposite
at lower temperature. In this paper, to control the speed of the fan a circuit comprising
of microcontroller PIC16F877A, temperature sensor, ultrasonic sensor, motor and few
electronic components is used. Moreover an ultrasonic sensor is used for automatic
detection of human body in the room depending on which the fan gets operated and LCD
is used to display the temperature, number of people in the room and the speed of the fan.

CHAPTER 3
REQUIREMENT ANALYSIS
The hardware components used in this project and the different softwares used for
the development of this project is briefed below.
3.1 HARDWARE REQUIREMENTS
1. San Ace(60x60x38 PWM Controller Fan)
San Ace 60 is a DC fan which includes a PWM controller, an integrated circuit
that varies the speed and airflow of a cooling fan using a pulse width modulated
(PWM) voltage in response to temperature variations. The PWM controller
provides external speed control of PWM control function fans. This contributes to
reducing the system power consumption and the fan noise.
Figure 3.1.1 San Ace 60

2. ADT7470
The ADT7470 is a multichannel, pulse-width modulation (PWM) fan controller and
monitor for any system requiring monitoring and cooling. This device
communicates with the system through a serial system management bus.
Figure 3.1.2 Pin diagram of ADT7470
The device has a single address line for address selection, a serial data line for reading
and writing addresses and data and an input line for serial clock. All control and
programming functions of the ADT7470 are performed over the serial bus, that supports
both fast I2C and SMBus specifications. When the ADT7470 monitoring sequence is
started, it cycles through each fan tach input to measure the fan speed. Measured values
from these inputs are stored in few value registers. These can be read out through the
serial bus or can be automatically compared with programmed limits stored in the limit
registers. The results of out-of-limit comparisons are stored in the status registers, which
can be read over the serial bus to flag out-of limit conditions. If fan speeds drop below
preset levels or a fan stalls for a while, an interrupt is generated. Similarly the

ADT7470 can flag fan over speed conditions by using limits set in the fan tach registers.
Figure 3.1.3 Eval-ADT7470EBZ Development Board
3. TC74 - TEMPERATURE SENSOR
Figure 3.1.4 TC74

The TC74 is a serially accessible digital temperature sensor particularly preferable
for low cost and small form- factor applications. Temperature data is converted to
an 8-bit digital word from the onboard thermal sensing element.
Communication with the TC74 is accomplished through a 2- wire SMBus or I2C
compatible serial port.
Temperature resolution is of the sensor is 1°C. Conversion rate is a nominal 8
samples/sec. Compactness, low installed cost and ease of use make the TC74 an
ideal choice for implementing thermal management in a wide variety of systems
FEATURES
• Outputs Temperature as an 8-Bit Digital Word
• Simple SMBus or I2C™ Serial Port Interface
• Solid-State Temperature Sensing
▪ ±3°C (max.) Accuracy from 0°C to +125°C
▪ ±2°C (max.) Accuracy from +25°C to +85°C
Figure 3.1.5 TC74 Pin diagram

4. PIC32 MICROCONTROLLER
PIC stands for “Peripheral Interface Controller”. The 32-bit PIC family offers a large
range of products from the industry’s lowest point to highest-point. PIC32
microcontrollers have high performance and great memory capabilities. They are
especially designed for high performance embedded systems applications. The
manufacturer supplies computer software for development along with it known as
MPLAB X, assemblers and C/C++ compilers under the MPLAB and PICKIT series. PIC
devices are widely popular with industrial developers due to their low cost, wide
availability, extensive set of application notes,, large user base, availability of low cost or
free development tools and serial programming.
Figure 3.1.6 PIC32MZ Starter kit

Some of the salient features of the starter kit are listed below:
Operational Conditions:
1. 2.2v to 3.6v,-40c to +85c,
2. 2.2v to 3.6v,-40c to +105c.
Integrated software tools and libraries:
1. c/c++ compiler with native DSP/fractional.
2. MPLAB Harmony Integrated Software Framework.
3. TCP/IP, USB, Graphics and mTouch middleware.
Communication Interfaces:
1. Two CAN modules (with dedicated DMA channels)
2. Six UART modules (25 Mbps):
3. Supports up to LIN 2.1 and IrDA® protocols
4. Six 4-wire SPI modules (up to 50 MHz)
5. SQI configurable as additional SPI module (up to 80 MHz)
6. Five I2C modules (up to 1 Mbaud) with SMBus support
The I2C module in PIC32MZ starter kit provides complete hardware support for both
Slave and Multi-Master modes of the I2C serial communication standard.
Each I2C module of PIC32MZ offers the following key features:
• I2C interface supporting both slave and master operation
• I2C Slave and master modes support 7-bit and 10-bit addressing

• Bidirectional transfers between master and slaves are allowed by I2C port.
• Serial clock synchronization for the I2C port can be used as a handshake mechanism to
suspend and resume serial transfer
• I2C supports multi-master operation
3.2 SOFTWARE REQUIREMENT

1. MP LAB X IDE
MPLAB X IDE is a software program that is used to develop applications for Microchip
microcontrollers and digital signal controllers. This development tool is called an
Integrated Development Environment or IDE as it provides a single integrated
“environment” to develop code for embedded microcontrollers.
A development system for embedded controllers is a system of programs running on a
computer that helps to write, edit, debug and program the code which is the intelligence
of embedded systems applications into a microcontroller. MPLAB X IDE is such a
system which contains all the components needed to design and deploy embedded
systems applications.

Figure 3.2.1 MP LAB main window
With MPLAB X IDE, many tools can be selected, but they all will have a similar
interface, and the learning curve from simulator to low-cost in-circuit debugger to
powerful in-circuit emulator. Once the application has been debugged and is run in the
development environment, it needs to be tested on its own. A device can be programmed
with an in-circuit emulator, an in-circuit debugger, a development programmer, or a
device programmer.

Figure 3.2.2 MPLAB Successful project built
COMPONENTS OF MPLAB X IDE:
MPLAB X IDE includes:
• A full-featured programmer’s text editor that also serves as a window into the debugger.
• A project manager that provides integration and communication between the IDE and
the language tools.
• A number of assembler/linker suites for the development of firmware for respevtive
project’s device.
• A debugger engine that provides breakpoints, single stepping, Watches windows and all
the features of a modern debugger.

• A software simulator for all PIC MCU and ds PIC DSC devices. The simulator is
originally composed of several device-specific simulator executables. MPLAB X IDE
decides which one to use based on project’s device.
3.3 PROTOCOL USED
I2C – Inter Integrated Circuit

It is a synchronous bi-directional half duplex two wire serial bus. I2C bus comprises of
two bus lines namely serial clock (SCL) and serial data (SDA). I2C bus is a shared bus
system to which many I2C devices can be connected. The devices can be either master or
slave. The synchronized clock signal is always generated by the master.
Figure 3.3.1 I2C
The sequence of operations for communicating with an I2C slave device is as below:
1. Master device pulls SCL to ‘high’.
2. Master device pulls SDA ‘low’ when SCL is ‘high’ initiating start condition.
3. Master device sends the address of slave device with which it wants to
communicate over SDA line.
4. Master sends read or write bit according to the requirement.

5. Master waits for the acknowledgement from slave whose address is sent.
6. Upon receiving acknowledgement, master sends data to the slave over SDA line.
7. Once the data transmission is done, it waits for an acknowledgement from the
slave.
8. On receiving the acknowledgement, master device terminates the transfer by
making SDA ‘high’ when SCL is ‘high’ indicating the initiation of stop condition.

Chapter 4
METHODOLOGY AND IMPLEMENTATION

4.1 Block Diagram
FAN PIC32MZ BOARD

TC74
POWER
ADT7470
SUPPLY
Figure 4.1.1: Block Diagram of Hardware

The block diagram of the hardware of the project is given above. The various
functionality of each of the block is given briefly here.
➢ PIC32MZ - The heart of the entire project is the PIC32MZ, a 32 bit
microcontroller. PIC32MZ DA family microcontrollers provide 4GB of
unified virtual address space. The starter kit used here belongs to this family.
They have 5 I2C modules inbuilt that support the communication. The
microcontroller is written upon with the program using the I2C protocol. It
behaves as the decision making device for the temperature input received and
decides the further course of action. The communication between the
microcontroller and the sensor and also that between the microcontroller nad
the ADT7470 is established through I2C protocol.
➢ ADT7470 - The ADT7470 controller is a multichannel temperature sensor and

PWM fan controller and fan speed monitor for systems requiring active
cooling. It interfaces directly to an I2C bus. The ADT7470 monitors
temperature sensor and controls the speed of fans. Control of the ADT7470 is
carried out using the serial system management bus (SMBus). The ADT7470
is connected to the bus as a slave device under the control of a master
controller which in this case is the PIC32MZ. The temperature sensor also
behaves as a slave device. Hence the PIC microcontroller here behaves as a
single master in a multi-slave environment.
➢ Temperature Sensor (TC74) - The TC74 is a serially accessible, digital
temperature sensor. Communication with the TC74 is accomplished via a 2-
wire SMBus/I2C compatible serial port. TC74 is an ideal choice for
implementing thermal management in a wide range of systems. The TC4 sensor
is placed on the oscillator part of the power amplifier where it detects the value
of the temperature. Since the temperature sensed is analog in nature, upon
reception of the data, it is converted to an 8-bit digital data and is sent to the
microcontroller. This acts as a slave device with the PIC microcontroller as a
master.
➢ The cooling device - San Ace 60 fan is used for this purpose. The chosen
dimension of the fan is 60×60×38 mm. It is a dc fan with PWM controller.
Initially the fan has 100% duty cycle while temperature has crossed the
threshold value and upon the appropriate instructions from ADT7470 through
the microcontroller, its speed is decreased or increased and the duty cycle is
varied correspondingly. This device is placed in the exterior edge of the power
amplifier setup so that no intrusion is caused due to its presence.
➢ MPLAB X IDE - MPLAB X IDE is a software program that is used to develop

applications for Microchip microcontrollers and digital signal controllers. The
code to process the received temperature reading is written in MPLAB using
embedded C. Similarly, the code to read the speed at which the fan is rotating
and to increase or decrease its speed appropriately as per the temperature input
is written here. Upon successful compilation, the program is run.
The work flow of the project is as follows:
1) Temperature sensor TC74 is placed on the metal coated oscillator unit of the
power amplifier.
2) The sensed temperature is converted into digital format and is sent to the
PIC32MZ microcontroller. TC74 acts as a slave device wrt to the
microcontroller. The communication between them is established through
the I2C protocol.
3) ADT7470 is connected to the microcontroller as a slave device. This is in-
turn connected to the San Ace 60 fan that is placed in the exterior part of the
power amplifier case.
4) If the sensed temperature exceeds the predefined threshold value, the
indication is sent and the fan is switched on. The cooling device will have a
100% duty cycle on exceeding the critical value which means that it runs
with the highest speed.
5) The rpm of the fan is monitored and the speed can be reduced upon the
reduction of the temperature inside the equipment. This helps in utilizing the
resources optimally.

4.2 Implementation
Figure 4.2.1 Connection of the components
4.2.1 Interfacing
This section includes the representation of the connection of the components to the
microcontroller evaluation kit.
The top assembly of the PIC32MZ DA starter kit Base Board includes several key
features. The slots that are utilized for interfacing in this project are discussed below.
1) USB Micro-B power supply connector (J4).
2) To facilitate application debug and development, a MCP2221 USB-to-UART/I2C
device (U1) is available.
3) Connector for an external debugger, such as MPLAB (J12).

4) 40-pin expansion connector for adding external boards (J15).
ADT7470
TC74
Figure 4.2.2 Base board top view of PIC32MZ starter kit

VDD
U SDA
S
B PIC32MZ BOARD SCL
PC TC74
GND
USB SDA SCL GND
PWM
FAN
TACH
+24V GND TACH PWM SDA SCL GND
+12V
ADT7470
GND
+24V GND +12 GND
POWER SUPPLY
Figure 4.2.3 Interfacing with the PIC board and ADT7470

To accomplish the communication of master with a slave, the software will sequence
through the following steps:
1. Turn on the I2C module by setting the ON bit to ‘1’.
2. Assert a Start condition on SCLx and SDAx.
3. Send the I2C device address byte to the slave with a write indication.
4. Wait for an Acknowledge from the slave and verify it.
5. Send the serial memory address high byte to the slave.
7. Send the serial memory address low byte to the slave.
8. Wait for and verify an Acknowledge from the slave.
9. Assert a Repeated Start condition on SCLx and SDAx.
10. Send the device address byte to the slave with a read indication.
12. Enable master reception to receive serial memory data.
13. Generate an ACK or NACK condition at the end of a received byte of data.
14. Generate a Stop condition on SCLx and SDAx.

To transmit and receive data using I2C:
I2CxTRN is a register to which transmit data is written. This register is used when the
I2C module operates as a master transmitting data to the slave, or as a slave sending reply
data to the master. If the I2C module receives another complete byte before the software
reads the previous byte from the I2CxRCV register.
Algorithm for sensing the temperature:
1. Read I2C1 Status register and I2C1 control register. Set and reset the control register
bits appropriately.
2. Send slave device address and turn on the I2C module (I2C3CONbits.ON = 1).
3. Initiate the start condition (I2C3CONbits.SEN = 1)
4. Send slave address along with a write bit and check for the acknowledgement.
5. Set the repeat start enable bit to one (I2C3CONbits.RSEN = 1).
6. Data is sent by the slave and reception occurs at the master end.
7. Receive enable bit is set high (I2C3CONbits.RCEN = 1).
8. After the data transmission, if the acknowledgement is received, the stop enable bit is
set.
9. The received data is stored in a register.
Execution of “Read_temperature” code in DEBUG mode yields the value of temperature
(in 2’s complement format) recorded by thermal sensor. Further, varying external
temperature on metal plate of TC74 results in different values of temp which is reflected
in corresponding register bits. (this was verified with the help of soldering iron).

Figure 4.2.4 Reading the temperature
Code snippet:
reg_e = I2C3STAT; // for reading I2C1 Status register
reg_d = I2C3CON; // for reading I2C1 control register
I2C3ADD = 0x90; // slave device address
I2C3BRG = 0x091; // BRG value for 100KHz cycle, clock 30MHz
I2C3CONbits.ON = 1; // turn ON I2C3
I2C3CONbits.SEN = 1; // initiate a start condition
while(I2C3CONbits.SEN == 1);
I2C3TRN = 0x90; // send address of slave device + write bit high
I2C3CONbits.RSEN = 1; // Repeated start

I2C3TRN = 0x91; //slave transmission & master reception + READ BIT HIGH
I2C3CONbits.RCEN = 1;
while(I2C3CONbits.RCEN == 1);
while(I2C3CONbits.ACKEN == 1);
I2C3CONbits.PEN = 1;
Algorithm for setting fan speed:
1. Send slave device address and turn on the I2C module.
2. While the module is activated, initiate stop condition and then the start condition.
3. After setting start enable bit, send the slave address with write bit high.
4. Check for acknowledgement and then send device Id register address.
5. Upon receiving the acknowledgement, calculate the decimal value of duty cycle
using the formula given below with .0.39 as step size
reg_C = (float)(dutycycle)/(float)(0.39);
6. Check for the acknowledgement and set stop enable bit.
On entering the percentage value of required dutycycle in the “set_fan_speed” function,
the speed of the fan changes according to the dutycycle value. Thus, the fan speed control
can be achieved.

Code snippet:
I2C3ADD = 0x5E; // slave device address
I2C3CONbits.SEN = 1;
I2C3TRN = 0x5E; // send address of slave device + write bit high
while(I2C3STATbits.ACKSTAT == 1);
I2C3TRN = 0x34; //send address of Device ID register
I2C3TRN = reg_C; // decimal value of dutycycle is divided by step size of 0.39

Figure 4.2.5 Setting the fan speed
Algorithm for reading the fan speed:
1. Initiate a start condition and send slave device address with write bit high.
2. Check for acknowledgement and send the address of the lower byte of the tach3 slot.
3. Set the stop enable bit.
4. Initiate the start condition and send address of slave device with read bit high.
5. If the acknowledgement is received, set the receive enable bit.
6. While receive enable bit is set, check for the acknowledgement and set the stop
enable bit.
7. From the below format, calculate the value of the speed
tach_high = I2C3RCV;
reg_c = ((tach_high) << 8);
tach_value = (reg_c) | (tach_low);
rev = ((float)5400000)/((float)tach_value);
8. Return the rpm value.

Executing the” Read_fan_RPM” function outputs the value of fan revolutions/minute in
hex. Hence the data of fan RPM can be passed to other application as per requirements.
Code snippet:
I2C3TRN = 0x2E; // address of tach3 low byte
I2C3TRN = 0x5F; // send address of slave device + read bit high
while(I2C3STATbits.TRSTAT == 1);
while(I2C3CONbits.RCEN == 1;
while(I2C3CONbits.PEN == 1);

tach_low = I2C3RCV;
I2C3TRN = 0x2F; // address of tach3 low byte

Figure 4.2.6 Reading the fan speed
Algorithm for fan speed control with respect to temperature data
1. Save the current and previous sensed data.

2. If current temperature is greater than the maximum allowed value, raise an alarm.
3. Calculate the difference in temperature.
4. If temperature variation is greater than 2º, check the temperature range and
accordingly change the duty cycle.
5. If the current temperature is not exceeding 20 degrees, the fan is switched off.
Code snippet:
high_temp_limit= 80;
current_temp = Read_temperature ( );
SYS_CONSOLE_PRINT(“PA Temperature = %d\n”, current_temp);
if(current_temp > high_temp_limit)
PORTGbits.RG7 = 1; // Glow indication

SYS_CONSOLE_PRINT(“high temperature >90 degrees\n”);
diff_temp = current_temp – prev_temp;
if (diff_temp >2 || diff_temp <-2)//change the speed if there is variation of more than 2º
if ( current_temp > 45) // 100% duty cycle if temp is more than 45 deg
set_fan_speed(FAN1, 99);

Chapter 5
RESULTS
After the setup is completed, the model is now working. The following results were
achieved from the designed model.
➢ The TC74 sensor is sensing the temperature of the surrounding it is placed in.
➢ The data is sent to the PIC32MZ starter kit.
➢ If the sensed temperature is exceeding the threshold value, the ADT7470 sends an
indication to the fan initiating its movement.
➢ The fan rpm is monitored.
➢ Upon reduction in the temperature in the power amplifier, the speed of the fan is
gradually reduced.
Figure 5.1 Working model of the setup

The monitored values are plot to produce the below graph. It can be seen that the speed of
the fan increases along with the increase in temperature.
Figure 5.2 Plot of temperature vs speed

Chapter 6
APPLICATIONS
The project mainly focuses on the controlling of the excess temperature in the power
amplifier setup. Reducing the unwanted over temperature results in efficient working and
long life of the power amplifiers.
Some of the major places where the project finds its relevance and is of high importance
are listed below.
➢ Network Communication Server (NCS) – The NCS used in BEL uses a VHF or
UHF power amplifier. This power amplifier is capable of delivering 100W at the
output. This is associated with the release of enormous amount of heat and hence
in order to not have a hampered performance, the thermal state regulation module
is used.
➢ This can be used to drive a speaker of low input impedance efficiently as the
increase in temperature causes the intrusion of noise as a result of poor
performance of the power amplifier.
➢ This is also used in power amplifiers that drive high power antennas for long
range transmission.
➢ In the high-powered Radio Frequency (RF) linear power amplifier that enables
efficient, linear operation with multiple simultaneous signals across a wide
instantaneous bandwidth capable of operating in an active antenna array.
➢ Navy applications.

Chapter 7
CONCLUSION AND FUTURE WORK

The project was completed and it succeeded in controlling the temperature within
the power amplifier resulting in maintaining the temperature in ambient range.
There are numerous approaches to this cause, yet here a brilliant technique for
interfacing a sensor with the starter kit ie microcontroller using the concept of I2C
was done. The module designed is mainly used of the power amplifiers in the NCS
which are installed in the naval systems as the amplifiers are exposed to a higher
temperature and are prone to work falsely if not taken care of.
The main goal of the system is to secure the amplifier from over-temperature so
that it can work without wear and tear that helps to enhance efficiency and
decrease irregularities.
Though the claim has been made that a module has been developed to protect the
power amplifiers, future enhancements are
➢ The Units / Hardware / Sensors have to be rugged.
➢ More advancement in software processing can be implemented to rule out
any false alarms.
➢ Artificial Intelligence can be used to increase the accuracy of alerts.
➢ More advanced processors can be used.
➢ The module can be collaborated with a wifi gateway and the display can
obtained and recorded using IOT.

Chapter 8
REFERENCES
[1] Dr.Sudha Senthilkumar, Dr. K. Brindha, Prof.Rathi.R Siya Hardi
Sadhika Kataria,” TEMPERATURE CONTROLLED DC FAN”
[2] Surabhi ,Upendra Prasad , Vivek Kumar Jain “Design and Fabrication of Temperature
based DC Fan”
[3] Nigade, A. S,Deepanshu Verma, Brajesh Kumar Pandey and Pranjal Srivastav,”
TEMPERATURE BASED AUTOMATIC FAN SPEED CONTROLLER”.
[4] Shivesh, Rishabh Mishra, and Dr. E.Annie Elisabeth “SPEED CONTROL OF
CEILING FAN USING PWM TECHNIQUE”
[5] Power Amplifier Introduction and Types Available at
https://www.electronicshub.org/power-amplifier/
[6] Evaluation board ADT7470 datasheet Available at
https://www.analog.com/en/products/adt7470.html
[7] Temperature Sensor TC74 datasheet Available at
https://www.analog.com/en/products/adt7470.html
[8] PIC32MZ Starter kit datasheet Available at
https://www.microchip.com/DevelopmentTools/ProductDetails/PartNO/DM320010

CHAPTER 9
APPENDIX
The component layouts, component specification of the different components used,
brief introduction about the different software’s used in this project are explained in
this section.
9.1 HARDWARE SPECIFICATION
The various components used and their working have been briefly explained in the above
sections. The details of all these components are explained below.
1. PICMZ32 STARTER KIT
The PIC32MZ DA Starter Kit contains the following items:
• One PIC32MZ Embedded Graphics (DA) Starter Kit
• One LAN8740A Ethernet PHY Daughter Board
• One Type-A male to Micro-B USB cable (to communicate with the PIC32 DEBUG
port)
• One ETH cable
• Information sheet

Figure 9.1.1 PIC starter kit
There are four ways to supply power to the starter kit:
• Through USB Micro-B connector (J4) – This enables using a wall adapter to supply
more power than traditional USB as needed by the most applications.
• Through USB Micro-B DEBUG connector (J19). This connector supports
debugging/programming by MPLAB tools through PKOB® interface.
• Through USB Micro-USB connector (J6).
• An external application board with a regulated DC power supply that provides +5V
can be connected to the application board connector that is provided on the bottom
side of the board (J3).
Salient features:
Operating Conditions
•2.2V to 3.6V, -40ºC to +85ºC, DC to 200 MHz
•2.2V to 3.6V, -40ºC to +105ºC (Planned)

Core: 200 MHz / 330 DMIPS MIPS32® microAptiv™
•32 KB I-Cache, 32 KB D-Cache
•MMU for optimum embedded OS execution
•microMIPS™ mode for up to 35% smaller code size
•DSP-enhanced core:
-Four 64-bit accumulators
-Single-cycle MAC, saturating and fractional math
•Code-efficient (C and Assembly) architecture
Communication Interfaces
•Two CAN modules (with dedicated DMA channels):
-2.0B Active with DeviceNet™ addressing support
•Six UART modules (25 Mbps):
-Supports up to LIN 2.1 and IrDA® protocols
•Six 4-wire SPI modules (up to 50 MHz)
•SQI configurable as additional SPI module (up to 80 MHz)
•Five I2C modules (up to 1 Mbaud) with SMBus support
•Parallel Master Port (PMP)
•Peripheral Pin Select (PPS) to enable function remap
Integrated Software Libraries and Tools
•C/C++ compiler with native DSP/fractional support
•MPLAB® Harmony Integrated Software Framework
•TCP/IP, USB, Graphics, and mTouch™ middleware
•MFi, Android™, and Bluetooth® audio frameworks

•RTOS Kernels: Express Logic ThreadX, FreeRTOS™, OPENRTOS®, Micriμm®
μC/OS™, and SEGGER embOS®
Figure 9.1.2 I2CXSTAT: I2C Status Register
• bit 31-16 Unimplemented: Read as ‘0’
• bit 15 ACKSTAT: Acknowledge Status bit (when operating as I2C master,
applicable to master transmit operation) 1 = NACK received from slave 0 = ACK
received from slave Hardware set or clear at end of slave Acknowledge.
• bit 14 TRSTAT: Transmit Status bit (when operating as I2C master, applicable
to master transmit operation) 1 = Master transmit is in progress (8 bits + ACK) 0
= Master transmit is not in progress Hardware set at beginning of master
transmission. Hardware clear at end of slave Acknowledge.
• bit 13 ACKTIM: Acknowledge Time Status bit (Valid in I2C Slave mode only)
1 = I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9th rising edge of SCL clock
• bit 10 BCL: Master Bus Collision Detect bit 1 = A bus collision has been
detected during a master operation 0 = No collision Hardware set at detection of
bus collision.

• bit 9 GCSTAT: General Call Status bit 1 = General call address was received 0 =
General call address was not received Hardware set when address matches
general call address. Hardware clear at Stop detection.
• bit 8 ADD10: 10-bit Address Status bit 1 = 10-bit address was matched 0 = 10-
bit address was not matched Hardware set at match of 2nd byte of matched 10-bit
address. Hardware clear at Stop detection.
• bit 7 IWCOL: Write Collision Detect bit 1 = An attempt to write the I2CxTRN
register failed because the I2C module is busy 0 = No collision Hardware set at
occurrence of write to I2CxTRN while busy (cleared by software).
• bit 6 I2COV: Receive Overflow Flag bit 1 = A byte was received while the
I2CxRCV register is still holding the previous byte 0 = No overflow Hardware
set at attempt to transfer I2CxRSR to I2CxRCV (cleared by software).
• bit 5 D_A: Data/Address bit (when operating as I2C slave) 1 = Indicates that the
last byte received was data 0 = Indicates that the last byte received was device
address Hardware clear at device address match. Hardware set by reception of
slave byte.
• bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit
was not detected last Hardware set or clear when Start, Repeated Start or Stop
detected.
• bit 3 S: Start bit 1 = Indicates that a Start (or Repeated Start) bit has been
detected last 0 = Start bit was not detected last Hardware set or clear when Start,
Repeated Start or Stop detected.
• bit 2 R_W: Read/Write Information bit (when operating as I2C slave) 1 = Read –
indicates data transfer is output from slave 0 = Write – indicates data transfer is
input to slave Hardware set or clear after reception of I2C device address byte. bit

1 RBF: Receive Buffer Full Status
• bit 1 = Receive complete, I2CxRCV is full 0 = Receive not complete, I2CxRCV
is empty Hardware set when I2CxRCV is written with received byte. Hardware
clear when software reads I2CxRCV.
• bit 0 TBF: Transmit Buffer Full Status bit 1 = Transmit in progress, I2CxTRN is
full 0 = Transmit complete, I2CxTRN is empty Hardware set when software
writes I2CxTRN. Hardware clear at completion of data transmission.
Figure 9.1.3 I2CXCON: I2C Control Register
• bit 22 PCIE: Stop Condition Interrupt Enable bit (I2C Slave mode only) 1 =
Enable interrupt on detection of Stop condition 0 = Stop detection interrupts are
disabled
• bit 21 SCIE: Start Condition Interrupt Enable bit (I2C Slave mode only) 1 =
Enable interrupt on detection of Start or Restart conditions 0 = Start detection
interrupts are disabled
• bit 20 BOEN: Buffer Overwrite Enable bit (I2C Slave mode only) 1 = I2CxRCV
is updated and ACK is generated for a received address/data byte, ignoring the

state of the I2COV bit (I2CxSTAT<6>)only if the RBF bit (I2CxSTAT<2>) = 0 0
= I2CxRCV is only updated when the I2COV bit (I2CxSTAT<6>) is clear
• bit 19 SDAHT: SDA Hold Time Selection bit 1 = Minimum of 300 ns hold time
on SDA after the falling edge of SCL 0 = Minimum of 100 ns hold time on SDA
after the falling edge of SCL
• bit 18 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode
only) 1 = Enable slave bus collision interrupts 0 = Slave bus collision interrupts
are disabled bit 18 AHEN: Address Hold Enable bit (Slave mode only) 1 =
Following the 8th falling edge of SCL for a matching received address byte;
SCKREL bit will be cleared and the SCL will be held low. 0 = Address holding is
disabled
• bit 16 DHEN: Data Hold Enable bit (I2C Slave mode only) 1 = Following the 8th
falling edge of SCL for a received data byte; slave hardware clears the SCKREL
bit and SCL is held low 0 = Data holding is disabled
• bit 15 ON: I2C Enable bit 1 = Enables the I2C module and configures the SDA
and SCL pins as serial port pins 0 = Disables the I2C module; all I2C pins are
controlled by PORT functions
• bit 14 Unimplemented: Read as ‘0’
• bit 13 SIDL: Stop in Idle Mode bit 1 = Discontinue module operation when device
enters Idle mode 0 = Continue module operation in Idle mode
• bit 12 SCLREL: SCLx Release Control bit (when operating as I2C slave) 1 =
Release SCLx clock 0 = Hold SCLx clock low (clock stretch) If STREN = 1: Bit
is R/W (i.e., software can write ‘0’ to initiate stretch and write ‘1’ to release
clock). Hardware clear at beginning of slave transmission. Hardware clear at end
of slave reception. If STREN = 0: Bit is R/S (i.e., software can only write ‘1’ to

release clock). Hardware clear at beginning of slave transmission.
• bit 11 STRICT: Strict I2C Reserved Address Rule Enable bit 1 = Strict reserved
addressing is enforced. Device does not respond to reserved address space or
generate addresses in reserved address space. 0 = Strict I2C Reserved Address
Rule not enabled
• bit 10 A10M: 10-bit Slave Address bit 1 = I2CxADD is a 10-bit slave address 0 =
I2CxADD is a 7-bit slave address
• bit 9 DISSLW: Disable Slew Rate Control bit 1 = Slew rate control disabled 0 =
Slew rate control enabled
• bit 8 SMEN: SMBus Input Levels bit 1 = Enable I/O pin thresholds compliant
with SMBus specification 0 = Disable SMBus input thresholds
• bit 7 GCEN: General Call Enable bit (when operating as I2C slave) 1 = Enable
interrupt when a general call address is received in the I2CxRSR (module is
enabled for reception) 0 = General call address disabled
• bit 6 STREN: SCLx Clock Stretch Enable bit (when operating as I2C slave) Used
in conjunction with SCLREL bit. 1 = Enable software or receive clock stretching
0 = Disable software or receive clock stretching
• bit 5 ACKDT: Acknowledge Data bit (when operating as I2C master, applicable
during master receive) Value that is transmitted when the software initiates an
Acknowledge sequence. 1 = Send NACK during Acknowledge 0 = Send ACK
during Acknowledge
• bit 4 ACKEN: Acknowledge Sequence Enable bit (when operating as I2C
master, applicable during master receive) 1 = Initiate Acknowledge sequence on
SDAx and SCLx pins and transmit ACKDT data bit. Hardware clear at end of
master Acknowledge sequence. 0 = Acknowledge sequence not in progress

• bit 3 RCEN: Receive Enable bit (when operating as I2C master) 1 = Enables
Receive mode for I2C. Hardware clear at end of eighth bit of master receive data
byte. 0 = Receive sequence not in progress
• bit 2 PEN: Stop Condition Enable bit (when operating as I2C master) 1 = Initiate
Stop condition on SDAx and SCLx pins. Hardware clear at end of master Stop
sequence. 0 = Stop condition not in progress
• bit 1 RSEN: Repeated Start Condition Enable bit (when operating as I2C master)
1 = Initiate Repeated Start condition on SDAx and SCLx pins. Hardware clear at
end of master Repeated Start sequence. 0 = Repeated Start condition not in
progress
• bit 0 SEN: Start Condition Enable bit (when operating as I2C master) 1 = Initiate
Start condition on SDAx and SCLx pins. Hardware clear at end of master Start
sequence. 0 = Start condition not in progress
2. ADT7470 evaluation kit
The ADT74701 controller is a multichannel temperature sensor and PWM fan
controller and fan speed monitor for systems requiring active cooling. It is designed to
interface directly to an I2C® bus. The ADT7470 can monitor up to 10 daisy-chained
TMP05 temperature sensors. It can also monitor and control the speed of four fans, in
automatic or in manual control loops.
A FULL_SPEED input is provided to allow the fans to be blasted to maximum speed,
via external hardware control, under extreme thermal conditions or on system startup.
An SMBALERT interrupt communicates error conditions such as fan under speed and
over temperature measurements to the system service processor. Individual error
conditions can then be read from status registers over the I2C bus.

Figure 9.1.4 Pin diagram of ADT7470
Pin No. Mnemonic Description
1 SCL Digital Input (Open Drain). SMBus serial clock input.
Requires SMBus pull-up, typically 2k2Ω.
2 GND Ground Pin.
3 VCC Power Supply Pin.
4 TACH3 Digital Input (Open Drain). Fan tachometer input to
measure
the speed of Fan 3.
5 PWM2 Digital I/O (Open Drain). Requires 10 kΩ typical
pull-up.
Pulse-width modulated output to control the speed of
Fan 2.
Can be configured as GPIO by setting Bit 0x7F[2] = 1.
measure

the speed of Fan 1.
measure
the speed of Fan 2.
8 PWM3 Digital I/O (Open Drain). Pulse-width modulated
output to
control the speed of Fan 3. Requires 10 kΩ typical
pull-up.
measure
the speed of Fan 4.
output to
control the speed of Fan 4. Requires 10 kΩ typical
pull-up.
11 ADDR Three-state Input. Used to set the SMBus device
address.
12 TMP_IN Digital Input (Open Drain). PWM input to PWM
processing engine that interprets daisy-chained output
from multiple TMP05 temperature sensors. Readings
from individual TMP05 temperature sensors are
available by reading the temperature reading registers
over the SMBus.

13 FULL_SPEED Digital Input Active Low (Open Drain). This input
blasts the fans to maximum speed when the pin is
pulled low externally. Do not leave pin 13 open
when not I use, tie to VCC.
13 TMP_START Digital Output (Open Drain). This pin can be used
as an output to start daisy-chained temperature
measurements from TMP05 or TMP06 temperature
sensors. Requires 10 kΩ typical pull-up.
14 SMBALERT Digital Output Active Low (Open Drain). This pin
can be reconfigured as an SMBALERT interrupt
output to signal out-of-limit conditions such as fan
failures.
output to control the speed of Fan 1. Requires 10 kΩ
typical pull-up. Can be configured as GPIO by setting
Bit 0x7F[3] = 1.
16 SDA Digital I/O (Open Drain). SMBus bidirectional serial
data. Requires SMBus pull-up, typically 2k2Ω.
Table 9.1.1 Pin description of ADT7470
3. TC74
The TC74 is a serially accessible, digital temperature sensor particularly suited for low
cost and small form factor applications. Temperature data is converted from the onboard
thermal sensing element and made available as an 8-bit digital word.

Figure 9.1.5 Pin diagram of TC74
Pin description
Ground (GND) - Input. Ground return for all TC74 functions.
Power Supply Input (VDD) - Power supply input. See Electrical Specifications.
SMBus/I2C Serial Clock (SCLK) - Input. SMBus/I2C serial clock. Clocks data into and
out of the TC74.
Serial Data (SDA) - Bidirectional. Serial data is transferred on the SMBus/I2C in both
directions using this pin.
Actual Temperature Registered Temperature Binary Hex
+130.00°C +127°C 0111 1111
+127.00°C +127°C 0111 1111
+126.50°C +126°C 0111 1110
+25.25°C +25°C 0001 1001
+0.50°C 0°C 0000 0000
+0.25°C 0°C 0000 0000
Table 9.1.2 TEMPERATURE-TO-DIGITAL VALUE CONVERSION

4. SAN ACE 60
Figure 9.1.6 Cross section view of the fan
General Specification:
· Material - Frame: Plastic (Flammability: UL 94V-0), Impeller: Plastic
· Motor protection function - Locked rotor burnout protection, Reverse polarity

protection .
· Insulation resistance - 10 MΩ or more with a 500 VDC megger (between lead wire
conductors and frame)
· Sound pressure level (SPL) - At 1 m away from the air inlet
· Storage temperature - -30 to +70˚C (Non-condensing)
· Lead wire - Red Black Sensor Yellow Control Brown
· Mass - 130 g
Figure 9.1.7 Speed characteristics

9.2 SOFTWARE SPECIFICATION
MPLAB X IDE is a software program that is used to develop applications for Microchip
microcontrollers and digital signal controllers.
This development tool is called an Integrated Development Environment, or IDE, because
it provides a single integrated “environment” to develop code for embedded
microcontrollers.
The typical tasks for developing an embedded controller application are:
1. Create the high level design. From the features and performance desired, decide
which PIC MCU or dsPIC DSC device is best suited to the application, then design
the associated hardware circuitry. After determining which peripherals and pins
control the hardware, write the firmware – the software that will control the hardware
aspects of the embedded application. A language tool such as an assembler, which is
directly translatable into machine code, or a compiler that allows a more natural
language for creating programs, should be used to write and edit code. Assemblers
and compilers help make the code understandable, allowing function labels to
identify code routines with variables that have names associated with their use, and
with constructs that help organize the code in a maintainable structure.
2. Compile, assemble and link the software using the assembler and/or compiler and
linker to convert your code into “ones and zeros” – machine code for the PIC MCUs.
This machine code will eventually become the firmware (the code programmed into
the microcontroller).
3. Test your code. Usually a complex program does not work exactly the way imagined,
and “bugs” need to be removed from the design to get proper results. The debugger
allows you to see the “ones and zeros” execute, related to the source code you wrote,

with the symbols and function names from your program. Debugging allows you to
experiment with your code to see the value of variables at various points in the
program, and to do “what if” checks, changing variable values and stepping through
routines.
4. “Burn” the code into a microcontroller and verify that it executes correctly in the
finished application.
Optional components can be acquired or purchased to work with the MPLAB X IDE:
• Compiler Language Tools
MPLAB XC C compilers from Microchip provide fully integrated, optimized code for
PIC MCUs and dsPIC DSCs. Along with compilers from microEngineering Labs, CCS
and SDCC, they are invoked by the MPLAB X IDE project manager to compile code that
is automatically loaded into the target debugger for instant testing and verification.
• Programmers
MPLAB ICD 3 in-circuit debugger, MPLAB REAL ICE in-circuit emulator, and MPLAB
PM3 programmer are capable of the production programming of code into target devices.
PICkit 3 in-circuit debugger is capable of the development programming of code into
target devices.
All of these tools may be used with MPLAB X IDE to control programming of both code
and data, as well as the Configuration bits to set the various operating modes of the target
microcontrollers or digital signal controllers.
In addition, all of these tools may be used with MPLAB IPE to program code, data and
configuration bits. MPLAB IPE is designed more for production programming, and its
interface is simplified to do just that.
• In-Circuit Debuggers and Emulators

PICkit 3 and MPLAB ICD 3 in-circuit debuggers, and MPLAB REAL ICE in-circuit
emulator can be used to debug application code on target devices. By using some of the
on-chip resources, these can download code into a target microcontroller inserted in the
application, set breakpoints, single step and monitor registers and variables. The emulator
includes additional debug features, such as trace.
• Plugin Tools
Several plugins are available to add to the capabilities for MPLAB X IDE. For example,
the Data Monitor and Control Interface (DMCI) provides a mechanism to view and
control variables in code and change their values real-time. It also allows you to view
output data in a graphical format.
9.3 SOURCE CODE
#include <stdio.h>
#include <math.h>
#include <stdlib.h>
#include <xc.h>
#include <stdint.h> /* For uint32_t definition */
#include <stdbool.h> /* For true/false definition */
void set_fan_speed(unsigned short dutycycle)
float reg_C ;
I2C3CONbits.SIDL = 0;

I2C3CONbits.SCLREL = 1;
I2C3CONbits.A10M = 0;
I2C3CONbits.DISSLW = 1;
I2C3ADD = 0x5E; // slave device address
while(I2C3CONbits.ON == 0);
I2C3CONbits.PEN = 0; // initiate a stop condition
I2C3TRN = 0x34; //send address of Device ID register
I2C3TRN = reg_C; // decimal value of dutycycle is divided by step size of 0.39

return (EXIT_SUCCESS);
//for reading Tach3 low byte
//step1: writing to address pointer (in this case 0x2E)
unsigned short Read_fan_RPM(void)
unsigned int reg_A,reg_B;
unsigned short reg_c,tach_high,tach_low,tach_value,rev;
I2C3TRN = 0x2E; // address of tach3 low byte

//step2:reading from address pointer (in this case 0x2E)
I2C3CONbits.RCEN = 0; // Receive enable
I2C3CONbits.RSEN = 0;
I2C3CONbits.ACKEN = 0;
I2C3CONbits.ACKDT = 1;

tach_low = I2C3RCV;
//for reading Tach3 high byte
//step1: writing to address pointer (in this case 0x2F)
I2C3TRN = 0x2F; // address of tach3 low byte
//step2:reading from address pointer (in this case 0x2F)

return(rev);

unsigned short Read_temperature(void)
unsigned int reg_d,reg_e;
short reg_f;
reg_e = I2C3STAT; // for reading I2C1 Status register
reg_d = I2C3CON; // for reading I2C1 control register
I2C3CONbits.SIDL = 0;
I2C3CONbits.SCLREL = 1;
I2C3CONbits.A10M = 0;
I2C3CONbits.DISSLW = 1;
I2C3ADD = 0x90; // slave device address
while(I2C3CONbits.ON == 0);
I2C3CONbits.PEN = 0; // initiate a stop condition
I2C3TRN = 0x90; // send address of slave device + write bit high

I2C3TRN = 0x00; //send address of TEMP register
I2C3CONbits.RSEN = 1; // Repeated start
while(I2C3CONbits.RSEN == 1);
I2C3TRN = 0x91; //slave transmission & master reception+READ BIT HIGH

reg_f = I2C3RCV;
while(I2C3STATbits.RBF == 0);
return (reg_f);
unsigned char current_temp,prev_temp;
short diff_temp;
void temperature_loop (void)
high_temp_limit= 80;
current_temp = Read_temperature ( );
SYS_CONSOLE_PRINT(“PA Temperature = %d\n”, current_temp);
if(current_temp > high_temp_limit)
PORTGbits.RG7 = 1; // Glow indication
general_error_status |= 0x20;
SYS_CONSOLE_PRINT(“high temperature >90 degrees\n”);

diff_temp = current_temp – prev_temp;
if (diff_temp >2 || diff_temp <-2)//change the speed if there is variation of more than 2º
if ( current_temp > 45) // 100% duty cycle if temp is more than 45 deg
else if ( current_temp > 40) // 70% duty cycle if temp is more than 40 deg
else if (current_temp >35)


else
prev_temp = current_temp;
SYS_CONSOLE_PRINT(“the speed is \n”, Read_fan_RPM()) ;
temperature_loop (void);

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VISVESVARAYA TECHNOLOGICAL UNIVERSITY

“JNANA SANGAMA”, BELAGAVI-590018, Karnataka

“THERMAL STATE SENSING AND REGULATION MODULE FOR

Electronics and Communication Engineering

Project carried out at

DEPARTMENT OF ELECTRONICS AND COMMUNICATION ENGINEERING

Signature of Internal Guide Signature of HOD Signature of thePrincipal

Name of Examiners Signature with Date

We are thankful to Dr. ASHWATH.M.U, Principal, Bangalore Institute of Technology,

4.1 BLOCK DIAGRAM………………………………………………………………...18

9.2 SOFTWARE SPECIFICATIONS……………………………………………….......51

A power amplifier is an electronic device that is designed to increase the magnitude of

an audio amplifier shown below.

Figure 1.1 Block diagram of an audio system

Department of Electronics and Communication, BIT Page 1

1.1 Types of Power Amplifiers

divided into the following categories.

1.1.1 Audio Power Amplifiers

mobile phones etc. come under this category.

amplifiers) to thousands of watts (like power amplifiers in Hi-Fi/Home theatre systems).

1.1.2 Radio Frequency Power Amplifiers

on the magnitude of power of signals fed to the antenna.

reaching required transmission span.

Department of Electronics and Communication, BIT Page 2

1.1.3 DC Power Amplifiers

power and feed the amplified signal to DC motors or Actuators.

1.2 Applications of power amplifiers:

• As the wireless transmission requires high-frequency range for the transmission of

communication of the satellites.

Department of Electronics and Communication, BIT Page 3

Department of Electronics and Communication, BIT Page 4

Dr.Sudha Senthil Kumar, Dr. K. Brindha [1]

This paper describes about the working of an automatically temperature controlled DC

on the fan will be modified in accordance to the choice of the user.

Nigade A. S, Deepanshu Verma [2]

automatically adjusts the fan's speed according to ambient temperature of the

surroundings. The temperature flow controlled fan used or mentioned here is an

different temperature ranges.

Department of Electronics and Communication, BIT Page 5

Shivesh, Rishabh Mishra, and Dr. E.Annie Elisabeth [3]

of microcontroller PIC16F877A, temperature sensor, ultrasonic sensor, motor and few

electronic components is used. Moreover an ultrasonic sensor is used for automatic

Department of Electronics and Communication, BIT Page 6

the development of this project is briefed below.

3.1 HARDWARE REQUIREMENTS

1. San Ace(60x60x38 PWM Controller Fan)

San Ace 60 is a DC fan which includes a PWM controller, an integrated circuit

(PWM) voltage in response to temperature variations. The PWM controller

reducing the system power consumption and the fan noise.

Figure 3.1.1 San Ace 60

Department of Electronics and Communication, BIT Page 7

The ADT7470 is a multichannel, pulse-width modulation (PWM) fan controller and

communicates with the system through a serial system management bus.

Figure 3.1.2 Pin diagram of ADT7470

Department of Electronics and Communication, BIT Page 8

Figure 3.1.3 Eval-ADT7470EBZ Development Board

3. TC74 - TEMPERATURE SENSOR

Figure 3.1.4 TC74

Department of Electronics and Communication, BIT Page 9

The TC74 is a serially accessible digital temperature sensor particularly preferable

an 8-bit digital word from the onboard thermal sensing element.

Communication with the TC74 is accomplished through a 2- wire SMBus or I2C

compatible serial port.