TMES Part 2 - Heat Sinks - Modified

Thermal Management in Electronic Systems
(Class notes and lecture material- compiled from various sources) byDr.B.Raja
EXTENDED SURFACES
It is assumed that you are good at fundamentals of extended surfaces or fins. In this lecture we
will explore the optimization of the extended surface for heat, volume, mass, thickness, fin
spacing etc. Though out the study we will consider adiabatic tips. I have extensively used
“Thermal Design” by Prof. HoSung Lee for the purpose.
Some terminologies
(1) Overall thermal resistance of a finned heat sink :
Qunfin = h A
unfin (Tbase – Tamb)
Qfin=ηfinQmax possible heat transfer
= ηfin h Afinned-area (Tbase – Tamb)
That is the max possible heat transfer is the heat

that can be transferred if the entire fin is at the
base temperature. But inreality it is not possible to
have base temperature in the entire finned area.
Total heat transfer from the fin arrangement
Thermal resistance
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Problem: Specification of the PCB and Heat Sink arrangement are given below .Find the
temperature on two sides of the circuit board for (1) Without heat sink arrangement
and (2) With heat sink arrangement. Find also the overall thermal resistance with heat
sink arrangement.
Circuit Board – components on one side with Metal filled – 0.2cm * 10 cm * 15 cm ; k

plexi glass = 12 W /m C
Heat load from back side of PCB 15 W
h and Tambient on back side 45 W/m2 C and 37oC
Aluminium Fins base (kAL = 237 W / mk) 0.1 cm * 10 cm * 15 cm
Fins base fixed to PCB by epoxy Layer thickness = 0.03 cm

(kEPOXY = 1.8 W/m · °C )
Aluminium Fins (kAL = 237 W / mk) 0.2 cm * 2 cm * 15 cm ;

20 numbers in count
3|Page
Solution:
The problem requires the temperature on both side of the PCB for two conditions,
without the heat sink (That is only the PCB) and with the heat sink.
Without heat sink: (Resistance modeling) k = 12 W/m°C for the circuit board,
k = 237 W/m°C for the aluminum plate
k = 1.8 W/m°C for the epoxy adhesive
T1 T2 Q = 15 W ; h = 45 W/m2 C ; T = 38oC
Q = 15 W
h and TAMB
WITHOUT FINS Rboard =

L
=
0.002 m
= 0.011 C/W
h T kA (12 W/m.C)(0.1 m)(0.15 m)
Rboard Rconv 1 1
T1 T Rconv = = = 1.481 C/W
hA (45 W/m.C)(0.1 m)(0.15 m)
T2 Q = 15 W Rtotal = Rboard + Rconv = 0.011 + 1.481 = 1.492 C/W
Circuit
board
Then surface temperatures on the two sides of the circuit board becomes
T1 − T
Q= ⎯⎯
→ T1 = T + QRtotal = 37C + (15 W)(1.492 C/W) = 59.4C
Rtotal
T1 − T2
Q= ⎯⎯
→ T2 = T1 − QRboard = 59.4C − (15 W)(0.011 C/W) = 59.2C
Rboard
Without the fins : 59.4 and 59.2
With heat sink: (Resistance modeling)
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T1 T2
Qfin
h T Rboard Repoxy Ral-plate
T1
Q = 15 W
Qun-fin
Aluminum
Circuit fins
board Aluminum
Epoxy plate
Qfinned = fin Qfin,max = fin hAfin (Tbase − T )

Qunfinned = hAunfinned (Tbase − T )
The efficiency of these rectangular fins
hp h(2 w) 2h
a=  =
kAc k (tw) kt
2(45 )
= = 13.78
(237)(0.002 m)
tanh aL tanh(13.78  0.02)

fin = =
aL 13.78  0.02
= 0.975
L 0.001 m
Raluminum = = = 0.00028 C/W
kA (237 W/m.C)(0.1 m)(0.15 m)
L 0.00015 m
Repoxy = = = 0.00555 C/W
kA (1.8 W/m.C)(0.1 m)(0.15 m)
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Qfinned = fin Qfin,max = fin hAfin (Tbase − T )

Qunfinned = hAunfinned (Tbase − T )
Qtotal = Qunfinned + Qfinned = h(Tbase − T )(fin Afin + Aunfinned )
Qtotal = Qunfinned + Qfinned = h(Tbase − T )(fin Afin + Aunfinned ) = 15W
T1 − Tbase (T1 − 59.4)C

Q= =
Raluminum + Repoxy + Rboard (0.00028 + 0.00555 + 0.011) C/W
⎯⎯
→ T1 = 39.4C + (15 W)(0.0168 C/W) = 39.7C
T1 − T2
Q= ⎯⎯
→ T2 = T1 − QRboard = 39.7C − (15 W)(0.011 C/W) = 39.5C
Rboard
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OPTIMIZATION OF FINS
With respect to three parameters the optimization is done
A. OPTIMIZATION FOR CONSTANT PROFILE AREA (AP)
B. OPTIMIZATION – CONSTANT HEAT TRANSFER FROM FIN Qf
C. OPTIMIZATION - CONSTANT VOLUME AND MASS
A. OPTIMIZATION FOR CONSTANT PROFILE AREA (AP)
Let us try to optimize the heat transfer for a

constant profile area (ie AP = bt )
L
The perimeter P=2L;
Cross section area AC = L t
Heat from the fin surface
Q f = h P k AC b tanh ab - (1) b
AP
a = h P k AC  = T − T
Let us try to develop an equation by replacing P, AC

 2h 
= (2 h k ) L b t1/2 tanh   1/2b
1/2
h2L
Q f = h 2 L k L t b tanh b - (2)
k Lt  kt 
The above equation does not have any term called as AP = bt, exclusively specified. Now,
let us frame up equation (1) in terms of AP
 hP 
1/2
2L h
ab =   b = b  
 k AC  k Lt
Multiply and divide by AP

1/2 1/2
L  2h   2h 
ab = AP   = AP  3  (3)
Lt  k t  kt 
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Therefore equation (1) becomes eqn below

1/2
 2h 
Qf = ( 2 h k ) L b t (4)
1/2 1/2
tanh AP  3 
kt 
Does not
 2h 
Heat Transfer from a fin (Qf)
Qf = (2 h k )
show
L b t
1/2 1/2
tanh   1/2b any
 kt  optimization
1/2
 2h  Does show
Qf = (2 h k ) Lb t
1/2 1/2
tanh AP  3  Optimization w.r.t
kt  thickness
So let us optimize the
thickness
Fin Thickness (t)
Now equation 2 and 4 are basically same equation and graphically represented above.
But has a scope for optimization and the other does not have it. Optimise w.r.t to t
Q f
=0
t
Q f  1/2 d   2h  −2/3 
1/2
 2h  −3/2 d 1/2 
1/2
= (2hk ) Lb  t  tanh   t Ap  + tanh   t Ap (t ) 

1/2
t  dt   k   k  dt 
   
−1
 2h 
1/2
  2h 
1/2
 1  2h 
1/2
t   t −2/3 Ap  cosh 2   t −2/3 Ap  + t −1/2 tanh   t −3/2 Ap = 0

1/2
 k    k   2  k 
 
After simplifications,
1/2 1/2
 2h   2h 
6   t −2/3 Ap = sinh 2   t −3/2 Ap (5)
 k   k 
1/2
 2h 
Put  = ab =   t −3/2 Ap (This β is just same as the early we discussed. But the
 k 
only thing is that we have represented in form of AP
The equation (5) turns out to be above equation 6 = sinh 2
Or  = 1.4192
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tanh ab
If  = ab = 1.4192 then the  = = 62.7 %.
ab
From  = ab = 1.4192 find t and

1/2
 2h 
 = ab =   t −3/2 Ap and Ap = b0t0
 k 
1/2
 2h 
 = ab0 =   t0−3/2 b0 t0
 k 
2
 2h   b 
➔ Optimum thickness t0 t0 =   0 
 k   
1/2
➔ Optimum profile length b0 =  

k t0 

 2h 
The above are the optimum of b and t for constant Profile area.
B. OPTIMIZATION – CONSTANT HEAT TRANSFER FROM FIN Qf
Q f = h P k AC b tanh ab
 2h 
Qf = (2 h k ) L b t1/2 tanh   1/2b
1/2
 kt 
1/2
 2h 
 = ab =   Ap
 tk 
Qf = (2hk )1/2 Lb t1/2 tanh  tanh  = tanh1.4192 = 0.8894
2 2
 Qf  0.632  Q f 
Optimum thickness t0 t0 =   ➔ t0 =  
 (2hk ) L b 0.8894  h k L2  b 
1/2
1/2
 2h 
1/2
 k 
Optimum profile length. Since  = ab0 =   b0 ➔ b0 =    t01/2
 k t0   2h 
0.798 Q f
b0 =
h L b
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C. OPTIMIZATION - CONSTANT VOLUME AND MASS
Volume of the fin V = b Lt
V
We know that the profile area Ap = bt =
L
From the above it can be seen that ‘L’ is not a parameter since it is the base, which is fixed
by the surface to be cooled. Therefore, optimizing with respect to constant volume and
mass is just as similar as optimizing with respect to profile area ‘AP’.
Heat in to the fin from (4)

1/2
 2h 
Q f = ( 2 h k ) wb t tanh AP  3 
1/2 1/2
kt 
1/2
V  2h 
Q f = (2hk ) wb t tanh    3 
1/2 1/2
 w  k t 
Usual procedure that we did earlier as we attempted for ‘constant profile area’.
1/2
 2h 
1/2
b0  2h  −1/2
 = ab0 =   b0 = V   t0
 k t0  b0t0 w  k 
2/3 1/3
V  h
Optimized t0     
 w k
1/3
V k 
b0 =  
 Lh 
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FINAL THICKNESS AND PROFILE LENGTH ANSWERS
For :
Constant profile area

2
 2h   b 
1/2
kt   = 1.4192
t0 =   0  b0 =   0 
 k     2h 
L
Constant heat transfer
2
0.632  Q f  0.798 Q f
t0 =   b0 =
h k L2  b  h L b
Constant fin volume and mass b

2/3 1/3 1/3
AP
V  h V k 
t0      b0 =  
L k  Lh 
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Problem
An electronic device is to be cooled by an aluminium heat sink with

rectangular fins of width L = 2.5 cm with air at of 1.5 m/s and 22 oC. The base
temperature of the fin should not exceed 85oC with 1.2 gms permitted per
fin. Determine the thickness ‘t’ and profile length ‘b’ that maximize the heat
transfer rate.
Solution
This is a fixed mass or volume problem, So L
1/3
V k 
2/3 1/3
V  h b0 = 
t0      
L k  Lh 
The unknown are here are the volume, heat

b
transfer coefficient (h) AP
Volume = mass / density of metal

m
V= = 4.44110−7 m3

Heat transfer coefficient (h), use this correlation

1 1
hL
NuL = = 0.664 Re L Pr 3
2
kair
U L
Re L = = 1601
v
h = 26.65W / m2 K
So t0 = 0.328 mm and b0 = 54 mm
12 | P a g e
The heat flow for this‘t’and ‘b’ is
Q f = h P k AC b tanh ab
a = h P k AC b = Tb − T
Q f = 2.87 W
tanh ab = 0.627
Fin efficiency  =
ab
Finally, we should confirm Bi number, to prove that this is lumped mass
h to
Bi =  0.0625
k Al
FIN EFFECTIVENESS – SOME IMPORTANT POINTS
h P k AC b tanh ab  k  P  b
f = =    tanh ab
h AC b  h   AC 
b = Tb − T a = h P k AC
• if h is large such as water cooling, the fin is not effective.

• So small h such as with air cooling usually justifies the fin.
• increasing the perimeter and decreasing the cross-sectional area will

increase the fin effectiveness. Thin fin design is desirable.
=3
13 | P a g e
Exercise
An aluminium rectangular fin of width 30 cm is cooled by forced air at 20 C with a
velocity of 1.75 m/s. The fin base temperature is at 100 C. The heat dissipation to the
ambient air is required to be 50W. ρAL = 2702 kg/m3 and kAL = 175 W/mK.
(a) Determine the fin thickness and profile length to maximize the heat transfer rate.
(b) Determine the fin efficiency and fin effectiveness.
(c) Compute the heat transfer rate using. Q f = h P k AC b tanh ab Does the result satisfy
the 50W requirement?
(d) Compute the thermal resistance ( C/W) of the fin.
Q f = h P k AC b tanh ab a = h P k AC b = Tb − T Air
L
2 1/2
 2h   b  kt   = 1.4192  = ab
Constant profile area t0 =   0  b0 =   0 
 k     2h 
2
0.632  Q f  0.798 Q f
Constant heat transfer t0 =   b0 =
h k L2  b  h L b
b
2/3 1/3
V  h
1/3
Constant fin volume and mass t0    V k 
  b0 =   hL 1 1
L k  Lh  NuL = = 0.664 Re L2 Pr 3

kair
Air :
h P k AC b tanh ab tanh ab
f = = Therm-Res = 1 ν = 23.42 x 10 -6 m2/s
h AC b ab k = 0.0283 W /m K ; Pr = 0.703
An electronic package cooling is designed to maintain the base temperature below

80 C. The base plate has a width W = 30mm and Length L = 20 mm, as shown in Figure
Forced air is induced by a fan at a velocity of U = 1.7m/s and ambient air
temperature of 30 C. The device requires both a mass of fins less than 15 grams and
You have to make sure that the profile length less than 20 mm. Estimate the number of
fins, the fin thickness, and the profile length maximize the heat transfer rate.
ρAL=2,702 kg/m3and KAL =177 W/mK.
Q f = h P k AC b tanh ab a = h P k AC b = Tb − T
2
 2h   b 
1/2
Constant profile area t0 =   0  b =   k t0   = 1.4192  = ab
  
k  0  
 2h 
2
0.632  Q f  0.798 Q f
Constant heat transfer t0 =   b0 =
h k L2  b  h L b
2/3 1/3
V  h
1/3
Constant fin volume and mass t0    V k 
  b0 =  
L k  Lh 
h P k AC b tanh ab
f = hL 1 1
h AC b NuL = = 0.664 Re L2 Pr 3
1 kair
tanh ab Therm-Res =
= Air : ν = 23.42 x 10 -6 m2/s ; k = 0.0283 W /m K
ab
Pr = 0.703
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FORCED CONVECTION - OPTIMIZATION OF SPACING – MULTIFIN

ARRAY
In case the flow is in small spacing, the flow takes a confined parabolic flow
pattern. If the same is in a large spaced channel, the flow will behave as if
the pattern is a flat plate flow.
For a small spacing: Consider Q = mcp (DeltaT) ; In which the DeltaT is the
maximum possible temperature, which is To(uniform temperature of fins)
and Ambient temperature. In order to find the mass flow rate, the average
velocity is to be known and we use the differential form of momentum
equation to find the same.
For large spacing:Consider Q = h A (DeltaT), use h correlation to find Q.
Equate Q in small and large spacing to find optimized z
L
W
t
z
b
Air
U  , T
15 | P a g e
Small Spacing
Flow between two plates : Couette – Poiseuilli Flow

Averaging velocity profile
y,v
L
1
A A
L W
u= udA
t U  , T Z
z x,u
b
z 2 P
T0 u=
Small Channel 12 L
Integrating the Governing
Eqn Qf = mcp (To − T )
Air
U  , T  2u P
 =
 y2 L
W 
m =  Acf Acf = ( z b )   = W b
 z
 u u  P   2u  2u  Apply Boundary Condition
  u +  = − +   2 + 2 
 x y  x  x y  z u (0)
u  = 0; =0
2 y z 2 P
Boundary Condition Q f .SMALL = Wb c p (To − T )
12 L
u
 =0 = 0 u = u( y)
x Pz 2   y  
2
u= 1 −   
Pressure gradient along 8 L   z / 2   Qf .SMALL  z 2
the channel is constant
Velocity Profile
P P
=
x L
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Large Spacing
2
L
W  3
P z
y,v U=  
t  1 1 
 1.328 L v 
2 2
z
b Air
U  , T
x,u Therefore Qf after some algebra
1
 Pr PL  2 23
Q f .LARGE = 1.208Wbkair   z (To − T )
 v 
2
2
Air Q f .LARGE  z 3
U  , T
Behaves like a flat plate To find
q f .LARGE = As h (To − T ) Equate the Pressure

1 1
and Shear force
hL
NuL = = 0.664 Re L2 Pr 3 Pr  0.5 W 
kair    ( bL ) = P(Wb)
U L  z
Re L =
v We know the friction
Solve for h and find Qf coeff.
W kair 1 1

Q f .LARGE = 2 0.664Pr 3 Re (To − T ) Cf = = 1.328Re1/2
2
bL L
1
z L  U
2
1 2
2
U L 
1
W
Q f .LARGE = 1.328 bkair Pr 3    (To − T )
z  v 
Heat transfer rate (Qf)
1
 Pr PL  2 23
Q f .LARGE = 1.208Wbkair  2 
z (To − T )
 v 
1
Qf −SMALL  z 2
zopt    4
= 2.725  2 
z P
2
 P L 
c p (To − T )
L
Q f .SMALL = Wb
12 L
fL U 2 U 2 fL
P =  Assume  1
−
2 Dh 2 2 Dh
Q f .LARGE  z 3
1 −1
zopt −
Fin spacing (z)
= 3.24Re L Pr
2
Optimum ‘z’ 4
L
17 | P a g e
Forced Convection optimization problem:

Heat sink has a base temperature of 100oC, used for an avionic circuit board is to be
designed.Length = 30 mm ; Width = 50 mm. The fan produces the average velocity =1.5
m/s. Ambient temperature = 20oC, Aluminium is the material
1. Design Without Constraints: Determine the maximum optimum dimension –

number of fins, fin thickness, fin spacing, profile length, heat dissipation, overall
efficiency and thermal resistance
2. Design With Constraints : Repeat the same with15 grams , profile length less than
20 mm.
Properties of air at (25 + 75)/2
kair = 0.0274 W/mK ; Kin. Vis = 19.2 * 10-6 m2/s ;Pr = 0.7
Therm diff = 26 * 10-6 m2/s ; β = 1/323 K-1
Soln :
1 −1 1 1
zopt − hL
U L
Re L =  = 3.24 Re L Pr
2
4 NuL = = 0.664 Re L Pr 3
2
v L kair
ReL 2344
Zopt 2.19 mm
hL 27.874 W /m2 K
Without constraints
Let us take decide to design for a constant profile area AP. Thus, vary the thickness ‘t’
and find the remaining values.
Total Heat
Optimum Number of
from the fins
Length (b) fins
 kt 
1/2 W
b=  V = b Lt n= mass = n  AL V Q f = n * Qsingle fin = n * hPkAc b tanh ab
z +t
 2h 
Total Heat
from the base Effectiveness
Total Heat Efficiency = Thermal Resistance
Qfin / Qno-fin
Qw = n * hLtb
n(Qf + Qw) Qf/Qmax = 1/hAfin
18 | P a g e
Total
t b V (m3) n M (gms) Qsf * n n * Qw Effectiv Total Area
Heat
0.5 0.057 8.482E-07 18.587 42.567 88.862 2.723 91.585 142.929 0.065
1.0 0.080 2.399E-06 15.674 101.527 106.838 2.723 109.561 101.891 0.150
2.0 0.113 6.785E-06 11.933 218.626 116.872 2.723 119.595 73.201 0.157
3.0 0.139 1.247E-05 9.634 324.254 117.350 2.723 120.074 60.695 0.155
4.0 0.160 1.919E-05 8.078 418.572 115.322 2.723 118.045 53.354 0.151
5.0 0.179 2.682E-05 6.954 503.613 112.622 2.723 115.346 48.418 0.146
6.0 0.196 3.526E-05 6.105 581.184 109.844 2.723 112.567 44.826 0.142
0.250 n 20.000 700.000

b m
600.000
0.200
15.000 500.000
0.150 400.000
10.000
0.100 300.000
200.000
0.050 5.000
t 100.000
t t
0.000 0.000 0.000
0.0 2.0 4.0 6.0 8.0 0.0 2.0 4.0 6.0 8.0 0.0 2.0 4.0 6.0 8.0
Qtot 140.000
120.000
100.000
80.000
60.000 topt = 2.19
40.000
20.000 t
0.000
0.0 2.0 4.0 6.0 8.0
19 | P a g e
Design with constraints b = 20 mm (b is fixed) ; mf< 15 gms
Since ‘b’ is fixed vary ‘t’ alone and find the optimized value.
1/2
 2h 
Number of fins Volume Mass mass = n  AL V β  = b 
W V = b Lt  k ALt 
n=
z +t
Heat from the fin Q f = n * Qsingle fin = n * hPkAc b tanh ab
Heat from base
walls
Qw = n * hLtb Total Heat n(Qf + Qw)
Q - Total
t (mm) b (m) Beta V (m3) n M (gms) Qsf * n n * Qw (W)
0.050 0.020 1.5873511 3.000E-08 22.321 1.808 34.638 3.270 37.908
0.100 0.020 1.1224267 6.000E-08 21.834 3.537 42.150 2.723 44.874
0.200 0.020 0.7936756 1.200E-07 20.921 6.778 46.742 2.723 49.465
0.300 0.020 0.6480334 1.800E-07 20.080 9.759 47.527 2.723 50.250
0.400 0.020 0.5612134 2.400E-07 19.305 12.510 47.152 2.723 49.875
0.500 0.020 0.5019645 3.000E-07 18.587 15.056 46.324 2.723 49.047
0.600 0.020 0.4582288 3.600E-07 17.921 17.419 45.305 2.723 48.028
Qtot 60.000
m
50.000 20.000
40.000
15.000
30.000
0.22mm 10.000 0.22 mm optimum
20.000
optimum at corresponding mass
10.000 Q = 48 5.000 is 8 gms.
Thus less than 15 gms
0.000
0.000
0.000 0.200 0.400 0.600 0.800
0.000 0.200 0.400 0.600 0.800
25.000
t
n
20.000
15.000
0.22 mm optimum
10.000 corresponding
number of fin is 20
5.000
0.000
0.000 0.200 0.400 0.600 0.800
20 | P a g e
OPTIMIZATION OF FIN SPACING – NATURAL CONVECTION –

MULTI-FIN ARRAY
a a Bala rishnan T M ancheepuram
rashof number ( r)
Thermal expansion
oeff.
aylei h number ( r)
21 | P a g e
lenbaas Number ( l)
ar e mall Nu
hannel hannel
T T T T
l
yv
yv
xu xu
hen spacin is lar e hen spacin is small

each velocity boundary the flow behaves as
layer is isolated parabolic flow.
behaves as a fluid flow
on the sin le vertical hen it is too too close
plate no flow occurs
22 | P a g e
OPTIMUM (LARGE AND SMALL SPACING)
In case the flow is in small spacing, the flow takes a confined parabolic flow
pattern. If the same is in a large spaced channel, the flow will behave as if
the pattern is a flat plate flow.
For a small spacing: Consider Q = mcp(DeltaT) ; In which the DeltaT is the

maximum possible temperature, which is To(uniform temperature of fins)
and Ambient temperature. In order to find the mass flow rate, the average
velocity is to be known and we use the differential form of momentum
equation to find the same.
For large spacing:Consider Q = h A (DeltaT), use h

Z
correlation to find Q.
Equate Q in small and large spacing to find optimized z. T0 T0

L
a. Small Spacing
Small
W W Channel
Number of fins (n) n=  y,v
z +t z x,u
Heat from the base (For Max.Possible Temp difference)
Qf = mc p (To − T ) W 
m =  Acf Acf = ( z b )   =W b
 z 
So we need to find velocity to get mass flow rate. To find velocity ṽ in fully developed
flow Use
    P
 u + = +  2 −  g
 x y  y

Boundary conditions are u = 0, =0
y
This is something like a open channel : so Thus from the above partial differential
equation
P
= −  g
y
 2
0 = − ( −  g ) +  − g
y 2
 2 (  −  ) g
=
y 2 
23 | P a g e
The above equation can be replace by the following terms, where

1     −  =   EXP (T − T )
Thermal coefficient of expansion  EXP = −  
  T  P
The EXP is different from  = ab , which is the fin aparameter.
Since Boussinesq Approx. (T − T ) = (T − T0 )

 2 g  (T − T )
= − EXP o 
y 2

g  EXP ( To − T ) L3
Use the boundary condition we get RaL =

Integrating to find the average values we get average velocity
g  EXP (To − T ) z 2
=
12
Substituting for velocity and area we get mass flow rate we get
 g  (To − T ) z 2
m= Wb
12
Therefore heat from the base Qf = mc p (To − T )
g  EXP (To − T ) z 2
2
Q f − SMALL =  c pWb
12
Thus it can be seen during natural convection Qf −SMALL  z 2
24 | P a g e
b. Large spacing
Large Spacing
Thus, individual plate will behave like a flat plate for which the Z
following can be hypothesized
T T
1
hL L
Nu = = 0.517 Ra 4
L
k AIR
y,
Rayleigh number: ‘Ra’ Indication as to whether the natural v x,
convection boundary layer is laminar or turbulent. This is the Ratio u
between Inertial to buoyancy force: 109 is the transition for vertical plates.
Heat from the base
Q f .LARGE = As h (To − T )
W W
n= 
z +t z
W 
Heat transfer area is As = 2bLn = 2bL  
 z 
Therefore the heat transfer
1
W
Q f .LARGE = 1.034 b kair RaL4 (To − T )
z
1
Q f − LARGE 
z
Therefore to find optimized spacing
25 | P a g e
Heat transfer rate (Qf) 1

Q f −l arg e  W 1
z Q f .LARGE = 1.034 b kair RaL4 (To − T )
z
Qf −small  z 2
g  (To − T ) z 2
2
Q f − SMALL =  c pWb
12
Fin spacing (z)
Optimum ‘z’
Therefore optimized for natural convection
zOPT  g  (To − T ) L3  4 1
 2.3   = 2.3RaL
4
L   
26 | P a g e
orced onvection
lose it with
Natural onvection otate the fin a virtual lid
orced onvection
low between two plates ouette oiseuilli low

Avera in velocity profile
yv
xu
T
mall hannel
nte ratin the overnin

n
Apply Boundary ondition
Boundary ondition
ressure radient alon

the channel is constant
Velocity rofile
27 | P a g e
yv
xu Therefore Qf after some al ebra
T
ar e hannel
Behaves li e a flat plate To find

uate the ressure
and hear force
e now the friction

olve for h and find Qf coeff.

Heat transfer rate (Qf)
in spacin (z)
Optimum z
28 | P a g e
Heat from a sin le fin
One
in le One
fin base
wall
Heat from base wall
in terms of base plate
Heat from base wall

One A
in le One
fin base
Total heat per unit len th = um of the above two wall
Maximum total heat transfer w.r.t b
Maximum total heat transfer w.r.t b
f hw = = . emember this
reduces sin le fin
. Optimum is the sin le fin = . base wall

. As Biot Number = h wb diminishes Ht. Tr is mainly due to fins
and the base is small contribution
29 | P a g e
Optimum said
by lenbass
Nu = .
Heat from the fin Optimum thic ness for

constant mass and ombined
volume Nu Asymptotic model
ar e mall
hannel hannel
Heat from base wall One

in le One
fin base
Total heat per unit len th = um of the above two for n number of pairs wall
Optimum en th (b) Optimum h Optimum z spacin
Ne li ible interfin
base area
aution en th is always the distance perpendicular distance from

the heatin surface. arlier we used also a terminolo y called
30 | P a g e
Thermal resistance
Thermal fficiency
A
Total Heat
Total heat transfer area
Total heat transfer
Thermal resistance
31 | P a g e
Natural Convection optimization problem: (Solve it by yourself): Assignment

The rear wall of a plate on which electronic components are mounted is passively
cooled by natural convection using a multiple fin array. The plate geometry has W
= 50 cm and L = 18 cm with the ambient air at 25oC and the temperature in the
rear wall should not exceed 75oC. The total heat dissipated through the rear wall
is 175 W.
a. Is it possible to achieve the heat transfer without a fins arrangement
b. Design the optimum heat sink without the constraint of the heat dissipation
of 175 W for the given geometry. Represent the information in a
graph/table for t, b, z, n, efficiency and overall thermal resistance.
c. Optimize the heat sink with the constraint of 175 W of heat dissipation
a. Heat Transfer Without Fin (Only a flat surface) Properties of air at film temperature
1
Flat Plate hL
Nu = = 0.517 Ra 4
L -6 2
k AIR ν = 23.42 x 10 m /s
g  EXP ( To − T ) L3 k = 0.0283 W /m K
RaL =

Pr = 0.703
=1.773107  109 Laminar
QL = hL (W L )b = 22.982W βEXP = 1/Tfilm
Fin arrangement is essential Properties of aluminum

W = 50 cm o 3
Tambient = 25 C ρ = 2702 kg / m b
L = 18 cm o
Tbase = 75 C
k = 237 W / m K z
t
32 | P a g e
ithout onstraints air = 2 /m K

Kin is = 1 2 1 m2/s
Pr =
erm i = 2 1 m2/s
et us ta e decide to desi n for a constant profile area A
Thus vary the thic ness t and find the remainin values
Total Heat
Optimum Number of from the fins
en th (b) fins
Total Heat from

the base Total Heat ffectiveness fficiency = Thermal esistance
n(Qf Qw) Qfin Qno-fin Qf Qmax = hAfin
33 | P a g e
ith onstraints
Number of fins Volume Mass
fficiency Heat from the fin
Total Heat ffectiveness fficiency =

Heat from base
n(Qf Qw) Qfin Qno-fin Qf Qmax
walls
34 | P a g e

TMES Part 2 - Heat Sinks - Modified

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Thermal Management in Electronic Systems

(1) Overall thermal resistance of a finned heat sink :

= ηfin h Afinned-area (Tbase – Tamb)

That is the max possible heat transfer is the heat

Total heat transfer from the fin arrangement

Circuit Board – components on one side with Metal filled – 0.2cm * 10 cm * 15 cm ; k

Heat load from back side of PCB 15 W

h and Tambient on back side 45 W/m2 C and 37oC

Aluminium Fins base (kAL = 237 W / mk) 0.1 cm * 10 cm * 15 cm

Fins base fixed to PCB by epoxy Layer thickness = 0.03 cm

Aluminium Fins (kAL = 237 W / mk) 0.2 cm * 2 cm * 15 cm ;

WITHOUT FINS Rboard =

Without the fins : 59.4 and 59.2

With heat sink: (Resistance modeling)

Qfinned = fin Qfin,max = fin hAfin (Tbase − T )

The efficiency of these rectangular fins

tanh aL tanh(13.78  0.02)

Qfinned = fin Qfin,max = fin hAfin (Tbase − T )

Qtotal = Qunfinned + Qfinned = h(Tbase − T )(fin Afin + Aunfinned ) = 15W

T1 − Tbase (T1 − 59.4)C

A. OPTIMIZATION FOR CONSTANT PROFILE AREA (AP)

Let us try to optimize the heat transfer for a

Heat from the fin surface

Let us try to develop an equation by replacing P, AC

Multiply and divide by AP

Therefore equation (1) becomes eqn below

Fin Thickness (t)

= (2hk ) Lb  t  tanh   t Ap  + tanh   t Ap (t ) 

t   t −2/3 Ap  cosh 2   t −2/3 Ap  + t −1/2 tanh   t −3/2 Ap = 0

The equation (5) turns out to be above equation 6 = sinh 2

From  = ab = 1.4192 find t and

➔ Optimum profile length b0 =  

B. OPTIMIZATION – CONSTANT HEAT TRANSFER FROM FIN Qf

C. OPTIMIZATION - CONSTANT VOLUME AND MASS

Volume of the fin V = b Lt

Heat in to the fin from (4)

FINAL THICKNESS AND PROFILE LENGTH ANSWERS

Constant profile area

Constant fin volume and mass b

An electronic device is to be cooled by an aluminium heat sink with

This is a fixed mass or volume problem, So L

The unknown are here are the volume, heat

Volume = mass / density of metal

Heat transfer coefficient (h), use this correlation

The heat flow for this‘t’and ‘b’ is

FIN EFFECTIVENESS – SOME IMPORTANT POINTS

• if h is large such as water cooling, the fin is not effective.

• increasing the perimeter and decreasing the cross-sectional area will

L k  Lh  NuL = = 0.664 Re L2 Pr 3

An electronic package cooling is designed to maintain the base temperature below

FORCED CONVECTION - OPTIMIZATION OF SPACING – MULTIFIN

For large spacing:Consider Q = h A (DeltaT), use h correlation to find Q.

Equate Q in small and large spacing to find optimized z

Flow between two plates : Couette – Poiseuilli Flow

Behaves like a flat plate To find

q f .LARGE = As h (To − T ) Equate the Pressure

Forced Convection optimization problem:

1. Design Without Constraints: Determine the maximum optimum dimension –

0.250 n 20.000 700.000

Design with constraints b = 20 mm (b is fixed) ; mf< 15 gms

OPTIMIZATION OF FIN SPACING – NATURAL CONVECTION –

a a Bala rishnan T M ancheepuram

hen spacin is lar e hen spacin is small