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Pulsed Drain Current TA = 25°C, tp = 10 ms IDM 128 A NTTFS4C10NTAG WDFN8 1500 / Tape &
(Pb−Free) Reel
Operating Junction and Storage Temperature TJ, −55 to °C
Tstg +150 NTTFS4C10NTWG WDFN8 5000 / Tape &
Source Current (Body Diode) IS 20 A (Pb−Free) Reel
Drain to Source dV/dt dV/dt 6.0 V/ns †For information on tape and reel specifications,
including part orientation and tape sizes, please
Single Pulse Drain−to−Source Avalanche Energy EAS 31 mJ refer to our Tape and Reel Packaging Specification
(TJ = 25°C, VDD = 50 V, VGS = 10 V, IL = 25 Apk, Brochure, BRD8011/D.
L = 0.1 mH, RG = 25 W) (Note 3)
Lead Temperature for Soldering Purposes TL 260 °C
(1/8″ from case for 10 s)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
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TYPICAL CHARACTERISTICS
65 80
4.0 V TJ = 25°C 3.8 V VDS = 5 V
60
4.2 V to 10 V 70
55 3.6 V
ID, DRAIN CURRENT (A)
0.020 0.020
TJ = 25°C
0.018 ID = 30 A 0.018
0.016 0.016
0.014 0.014
0.012 0.012
0.010 0.010 VGS = 4.5 V
0.008 0.008
VGS = 10 V
0.006 0.006
0.004 0.004
0.002 0.002
3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 10 20 30 40 50 60 70
VGS, GATE−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. VGS Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
1.7 10000
ID = 30 A VGS = 0 V
1.6
VGS = 10 V TJ = 150°C
RESISTANCE (NORMALIZED)
RDS(on), DRAIN−TO−SOURCE
1.5
IDSS, LEAKAGE (nA)
1.4
1000 TJ = 125°C
1.3
1.2
1.1
1.0 100
TJ = 85°C
0.9
0.8
0.7 10
−50 −25 0 25 50 75 100 125 150 5 10 15 20 25 30
TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with Figure 6. Drain−to−Source Leakage Current
Temperature vs. Voltage
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TYPICAL CHARACTERISTICS
1200 10
7
800
Coss 6
600 5
Qgs
4 Qgd
400
3 TJ = 25°C
Crss 2 VDD = 15 V
200 VGS = 10 V
1
ID = 30 A
0 0
0 5 10 15 20 25 30 0 2 4 6 8 10 12 14 16 18 20
VDS, DRAIN−TO−SOURCE VOLTAGE (V) Qg, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
1000 20
VGS = 0 V
VDD = 15 V 18
ID = 15 A
IS, SOURCE CURRENT (A)
16
VGS = 10 V
td(on) 14
100 tr
t, TIME (ns)
12
td(off)
10
tf 8
10 6
4 TJ = 125°C
2 TJ = 25°C
1 0
1 10 100 0.4 0.5 0.6 0.7 0.8 0.9 1.0
RG, GATE RESISTANCE (W) VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation Figure 10. Diode Forward Voltage vs. Current
vs. Gate Resistance
1000 14
SOURCE AVALANCHE ENERGY (mJ)
ID = 17 A
EAS, SINGLE PULSE DRAIN−TO−
12
100
ID, DRAIN CURRENT (A)
10 ms 10
10 100 ms
8
1 ms
1 0 V < VGS < 10 V 10 ms 6
Single Pulse
TC = 25°C 4
0.1 RDS(on) Limit dc
Thermal Limit 2
Package Limit
0.01 0
0.01 0.1 1 10 100 25 50 75 100 125 150
VDS, DRAIN−TO−SOURCE VOLTAGE (V) TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 11. Maximum Rated Forward Biased Figure 12. Maximum Avalanche Energy vs.
Safe Operating Area Starting Junction Temperature
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TYPICAL CHARACTERISTICS
100
2%
1
1%
0.1
Single Pulse
0.01
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
PULSE TIME (sec)
Figure 13. Thermal Response
60
100
50
ID, DRAIN CURRENT (A)
40
TA = 25°C
GFS (S)
30 TA = 85°C
10
20
10
0 1
0 10 20 30 40 50 60 70 80 1.E−08 1.E−07 1.E−06 1.E−05 1.E−04 1.E−03
ID (A) PULSE WIDTH (SECONDS)
Figure 14. GFS vs. ID Figure 15. Avalanche Characteristics
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GENERIC
MARKING DIAGRAM* 0.47 2.37
1 3.46
XXXXX DIMENSION: MILLIMETERS
AYWWG
*For additional information on our Pb−Free strategy and soldering
G details, please download the ON Semiconductor Soldering and
XXXXX = Specific Device Code Mounting Techniques Reference Manual, SOLDERRM/D.
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98AON30561E Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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