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PE Chap 2.basic Power Semiconductor Devices
PE Chap 2.basic Power Semiconductor Devices
3/21/2023
EE3410E POWER ELECTRONICS
BASIC POWER
SEMICONDUCTOR DEVICES
Dr. Nguyen Kien Trung
Dept. of IA, School of EE
Advance Power Electronic Systems Laboratory (APES Lab.)
Types of semiconductor devices
3/21/2023 4
EE3410E POWER ELECTRONICS
DIODE
Diode
•Forward biased
𝑢𝐴𝐾 > 0 → 𝑖𝐴𝐾 > 0
•Reverse biased
𝑢𝐴𝐾 < 0 → 𝑖𝐴𝐾 ≈ 0
•Conduction loss
Δ𝑝𝑐𝑜𝑛𝑑 = 𝑢𝐷 𝑖𝐷 = 𝑢𝐷0 𝑖𝐷 + 𝑟𝐷 𝑖𝐷2
1 𝑇
Δ𝑃𝑐𝑜𝑛𝑑 = න 𝑢𝐷0 𝑖𝐷 + 𝑟𝐷 𝑖𝐷2 𝑑𝑡
𝑇 0
2
= 𝑢𝐷0 𝑖𝐷,𝑎𝑣𝑔 + 𝑟𝐷 𝑖𝐷,𝑟𝑚𝑠 (W)
I-V characteristics
Đặc tính Volt-ampere
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Diode: dynamic characteristics
• Reverse Recovery Phenomenon → Diode
continues to conduct after reverse biased
• Parameters:
• 𝑄𝑟𝑟 [nC] : Reverse recovery charge
• 𝑡𝑟𝑟 [ns] : reverse recovery time
• 𝐼𝑅𝑀 [A] : max reverse recovery current
• 𝑉𝑅 [V] : blocking voltage
• Problems
• High voltage spike
• More EMI emission
• Additional loss Reverse recovery
characteristics
Đặc tính phục hồi tính chất khóa
3/21/2023 8
Diode: dynamic characteristics
• Turn-off loss:
1 𝑡𝑟𝑟 1
𝑃𝑠𝑤 = න 𝑢𝑑 𝑖𝑑 𝑑𝑡 ≈ 𝑉𝑅 𝐼𝑟𝑟 𝑡𝑟𝑟 𝑓𝑠𝑤
𝑇 0 4
1
≈ 𝑉𝑅 𝑄𝑟𝑟 𝑓𝑠𝑤 𝑊
4
• Total loss:
Δ𝑃𝐷 = Δ𝑃𝑐𝑜𝑛𝑑 + Δ𝑃𝑠𝑤
2
1
= 𝑢𝐷0 𝑖𝐷,𝑎𝑣𝑔 + 𝑟𝐷 𝑖𝐷,𝑟𝑚𝑠 + 𝑉𝑅 𝐼𝑟𝑟 𝑡𝑟𝑟 𝑓𝑠𝑤
4
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Types of diode
• General purpose diodes 𝑡𝑟𝑟 = ~25 𝜇s
• Fast recovery diodes 𝑡𝑟𝑟 = ~5 𝜇s
• Ultra-fast recovery diodes 𝑡𝑟𝑟 = 50~200 ns
• Schottky barrier diodes 𝑡𝑟𝑟 ≈ 0 ns
• Silicon-carbide diodes 𝑡𝑟𝑟 < 20 ns
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Diode: thermal management
• Cooling types: natural cooling, forced-air cooling
and liquid cooling
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Diode: thermal management
• Temperature rise
Δ𝑇 = Δ𝑃𝐷 × 𝑅𝜃𝑗𝑐 + 𝑅𝑐𝑠 + 𝑅𝑠𝑎
20 𝐴
𝑡
0 10 20 30 40 50 60 70 80
Time [ns]
20 𝐴
𝑡 Δ𝑉
0 10 20 30 40 50 60 70 80 𝑟𝐷 ≈ = 55.6 (mΩ)
Δ𝐼
Time [𝜇s]
•Equivalent diode resistance
Δ𝑉𝑓
𝑟𝐷 ≈ ≈ 55.56 mΩ Δ𝐼 = 3.6 𝐴
Δ𝐼𝑓
• Average current:
1 𝑇 𝐼𝑝𝑘
𝐼𝐷,𝑎𝑣𝑔 = න 𝑖 𝑡 𝑑𝑡 = 𝐷 = 4 (𝐴)
𝑇 0 2 Δ𝑉 = 0.2 𝑉
•Root-mean-square current:
1 𝑇2 𝐷
𝑈𝐷0 = 0.5 𝑉
𝐼𝐷,𝑟𝑚𝑠 = න 𝑖 𝑡 𝑑𝑡 = 𝐼𝑝𝑘 = 7.3 (𝐴)
𝑇 0 3
Thermal resistance
Heat distribution simulation depends on air flow
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Diode: selection guide
• Step 1: determine the working condition
determine the average and RMS currents, reverse voltage, frequency, etc.
THYRISTOR - SCR
Thyristor or SCR
• Forward conducting mode
𝑢𝐴𝐾 > 0
ቊ 𝑖 > 0 → 𝑖𝐴𝐾 > 0
𝑔
I-V characteristics
Equivilent circuit Symbol
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Thyristor: static characteristics
•Voltage drop
𝑢 𝑇 = 𝑢 𝑇0 + 𝑟𝑇 𝑖 𝑇
where: 𝑢𝐷0 : “knee” voltage,
𝑖𝐷 : forward current,
𝑟𝐷 : diode resistance,
•Conduction loss
𝑝𝑐𝑜𝑛𝑑 = 𝑢𝐷 𝑖𝐷 = 𝑢𝐷0 𝑖𝐷 + 𝑟𝐷 𝑖𝐷2
1 𝑇
𝑃𝑐𝑜𝑛𝑑 = න 𝑢𝐷0 𝑖𝐷 + 𝑟𝐷 𝑖𝐷2 𝑑𝑡
𝑇 0
2
= 𝑢𝐷0 𝑖𝐷,𝑎𝑣𝑔 + 𝑟𝐷 𝑖𝐷,𝑟𝑚𝑠 (W)
Repetitive gate pulse to ensure 𝐼𝑎 > 𝐼𝑙𝑎𝑡𝑐ℎ Current spike due to discharge of
parasitic capacitor
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Thyristor: stray inductor
• Voltage spike and voltage ringing occurs
when turn-off due to stray inductance
• Rule of thumb:
A 1 inch length ≈ 22 nH
• Maximum allowable slew rate [dI/dt] Stray inductance due to
long lead
𝑉𝑎𝑘 𝑑𝐼𝑎𝑘 -It4 Vt4
= 𝑉/𝜇𝑠
𝐿𝑎𝑘 𝑑𝑡 250
200
Δ𝑈𝑎𝑘
2 2
100
Harmed bus
Fuse bar due to arc
Gate
drive cir.
Heatsink Cap. is
damaged due
to heat
Bus bar
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Thyristor: cooling types
• Passive cooling
• Active cooling with forced air
• Active cooling with liquid
• Important parameters
• Total power loss
• Thermal resistance(s)
• Air flow or liquid flow
• Temperature rise
Typical cooling types for SCR
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Applications
• Rectifiers, soft-starter
• Relay-replacement circuit
• Chopper (DC/DC) circuit
• HVDC grid
• etc.
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TRIAC
• TRIAC = TRIode Alternating Current switch
• Equivalent to two SCR in anti-parallel
→ Bidirectional switch
• Current direction depends
on gate current
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EE3410E POWER ELECTRONICS
NTBL070N65S3-D
NTBL070N65S3-D
Soft-switching waveform
37
MOSFET: parasitics
• Parasitics capacitance (given in datasheet)
• Feedback Capacitance 𝐶𝑟𝑠𝑠 = 𝐶𝑔𝑑
• Input Capacitance 𝐶𝑖𝑠𝑠 = 𝐶𝑔𝑠 + 𝐶𝑔𝑑 (almost constant)
• Output Capacitance 𝐶𝑜𝑠𝑠 = 𝐶𝑑𝑠 + 𝐶𝑔𝑑 (highly nonlinear)
• Turn-OFF condition:
𝑉𝑔𝑒 > 𝑉𝑔𝑒,𝑡ℎ
Volt-ampere characteristics
IXGH50N120C3
Δ𝐼𝑐𝑒
Δ𝑉𝑐𝑒
𝑅𝑐𝑒 ≈
Δ𝐼𝑐𝑒
Δ𝑉𝑐𝑒
𝑉𝑐𝑒0
43
IGBT: parasitics
• Parasitics capacitance (given in datasheet)
• Feedback Capacitance 𝐶𝑟𝑒𝑠 = 𝐶𝑔𝑐
• Input Capacitance 𝐶𝑖𝑒𝑠 = 𝐶𝑔𝑒 + 𝐶𝑔𝑐 (almost constant)
• Output Capacitance 𝐶𝑜𝑒𝑠 = 𝐶𝑐𝑒 + 𝐶𝑔𝑐 (highly nonlinear)
• Workaround:
• RC/RCD snubber
• Miller-clamp driver
• Negative bias
46
Summary
• Discriminate semiconductor devices
• Working principle of Diode, Thyristor, MOSFET
and IGBT
• Understand the effect of parasitic components
• Discriminate between soft- and hard-switching
• Basic parameters of devices
• Calculate the conduction loss and switching loss
• Calculate the temperature rise of devices
• Basic gate drive circuit design
47
THANKS
FOR
ATTENTIONS
3/21/2023 48