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Lesson04 - Gioi Thieu Ve COMSOL Multiphysics - v03
Lesson04 - Gioi Thieu Ve COMSOL Multiphysics - v03
Chng 4
Ni dung
M hnh hnh hc: 1, 2 v 3 chiu. Thng s, hm s v bin s. Tnh cht vt liu ca m hnh. Thit lp mesh. Thit lp cc tnh cht vt l ca m hnh v iu kin bin. 6. Thit lp cch gii. 7. nh gi v biu din kt qu. 1. 2. 3. 4. 5.
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4.1
M hnh hnh hc
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M Hnh 2D
Domain: 0.6 m x 1.0 m. iu kin bin (Boundary conditions): Bin tri: bo n (insulated). Bin di: 100 C. Bin trn v bin phi: nhit mi trng l 0 C vi h s truyn nhit l 750 W/(m2C). H s dn nhit: 52 W/(mC).
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M Hnh 2D - Geometry
M Hnh 2D - Geometry
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M Hnh 2D - Geometry
M Hnh 2D - Geometry
10
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11
M Hnh 3D - Geometry
12
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M Hnh 3D - Geometry
13
4.2
Thng s, hm s v bin s
14
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Thng s, hm s v bin s
Thng s: Parameters Hm s: Functions Bin s: Variables
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Step function
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Bin s (Variables)
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4.3
Tnh cht vt liu ca m hnh
18
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19
20
10
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4.4
Thit lp mesh
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Cc Dng Mesh
Free meshing
Structured meshing
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11
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Cc Dng Mesh
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4.5
Thit lp cc tnh cht vt l ca m hnh
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12
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Add Physics
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26
13
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4.6
Thit lp cch gii
27
Adding study
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14
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Adding study
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4.7
nh gi v biu din kt qu
30
15
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32
16
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33
17