SOLDERING TEMPERATURE PROFILE

FL-ENG-SW-F-10-Rev02

MACHINE NO : DATE:
MACHINE SETTING CONDITION
1) CONVEYOR SPEED (SEC) : 1.1 ̴ 1.6 m/min

2) CONVEYOR ANGLE (DEGREE) : 4° ̴ 7°

3) PRE-HEATING BOARD TEMP : 100°c ± 20°c

4) PRE-HEATER SETTING
ZONE 1 ZONE 2 ZONE 3 ZONE 4

5) SOLDER POT TEMPERATURE : 255°c ± 5°c

6) WAVE HEIGHT TO PCBA :

pcb
1/3

7) FINGER HEIGHT TO NOZZLE :

8) DIPPING TIME : < 5 sec

PREPARED BY CHECKED BY